JPH0621164A - Ic wire bonder - Google Patents

Ic wire bonder

Info

Publication number
JPH0621164A
JPH0621164A JP4175139A JP17513992A JPH0621164A JP H0621164 A JPH0621164 A JP H0621164A JP 4175139 A JP4175139 A JP 4175139A JP 17513992 A JP17513992 A JP 17513992A JP H0621164 A JPH0621164 A JP H0621164A
Authority
JP
Japan
Prior art keywords
wire
clamper
bonding
case
bonder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4175139A
Other languages
Japanese (ja)
Inventor
Osamu Takasaki
修 高崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP4175139A priority Critical patent/JPH0621164A/en
Publication of JPH0621164A publication Critical patent/JPH0621164A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide an IC wire bonder, in which a wire clamper is prevented from getting in contact with an outer lead of a PGA-type IC case during a wire bonding step. CONSTITUTION:In an IC wire bonder, an IC device 9 and an inner lead 10 in an IC case are bonded with a wire-bonding wire 3. A wire clamper 4 or the top part of the wire clamper 4 is provided in parallel with a bonding tool 6 and an outer lead 7 situated vertically outside the IC case.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はＩＣ用ワイヤボンダに関
し、特にＡｌワイヤを用いてボンディングする超音波ワ
イヤボンダに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC wire bonder, and more particularly to an ultrasonic wire bonder for bonding using an Al wire.

【０００２】[0002]

【従来の技術】従来、この種のＩＣ用ワイヤボンダは、
図４の右側面図に示すように、ワイヤクランパ４及びク
ランパ支持部２がボンディングツール６の右側（正面か
ら見た場合は後方）に位置し、かつクランパ４は、垂直
に位置するボンディングツール６及びＩＣケース外部リ
ード７に対し傾斜している。ワイヤクランパ４は、ＩＣ
素子９とＩＣケース内部リード１０をボンディング用ワ
イヤ３にて結線した後、上方のボンディング用ワイヤ３
をクランプして下方に引張り切断する。その後、次のボ
ンディングの為にクランパ支持部２はリニアウェイベア
リングに沿って前方へ動き、ボンディングツール６の先
端へボンディング用ワイヤ３を送り出す機構を有してい
る。2. Description of the Related Art Conventionally, this type of wire bonder for IC is
As shown in the right side view of FIG. 4, the wire clamper 4 and the clamper support portion 2 are located on the right side (rear side when viewed from the front) of the bonding tool 6, and the clamper 4 is positioned vertically. And the IC case external leads 7 are inclined. The wire clamper 4 is an IC
After connecting the element 9 and the IC case internal lead 10 with the bonding wire 3, the upper bonding wire 3 is connected.
Clamp and pull downward to cut. After that, the clamper support portion 2 has a mechanism that moves forward along the linear way bearing and sends out the bonding wire 3 to the tip of the bonding tool 6 for the next bonding.

【０００３】[0003]

【発明が解決しようとする課題】この従来のＩＣワイヤ
ボンダは、ワイヤクランパ及びクランパ支持部がボンデ
ィングツールの後方に位置し、かつワイヤクランパは垂
直に位置するボンディングツールに対して傾いている
為、ＰＧＡ（ＰＩＮ ＧＲＩＤ ＡＲＲＡＹ）ＦＡＣＥ
ＤＯＷＮ パッケージのワイヤボンディングでは、ワ
イヤクランパが垂直に突出するＩＣケース外部リードと
接触（図４のＡ部）してワイヤボンディングできないと
いう問題点があった。In this conventional IC wire bonder, since the wire clamper and the clamper supporting portion are located behind the bonding tool, and the wire clamper is tilted with respect to the bonding tool which is vertically positioned, the PGA. (PIN GRID ARRAY) FACE
In the wire bonding of the DOWN package, there is a problem that the wire clamper cannot contact the outer leads of the IC case protruding vertically (A portion in FIG. 4) to perform the wire bonding.

【０００４】[0004]

【課題を解決するための手段】本発明のＩＣ用ワイヤボ
ンダは、ワイヤクランパ又はワイヤクランパ先端部が、
垂直に位置するボンディングツール及びＩＣケース外部
リードに対し平行に設けられている為、ワイヤクランパ
とＩＣケース外部リードとは接触しなくなる。In the wire bonder for IC of the present invention, the wire clamper or the tip of the wire clamper is
Since it is provided parallel to the bonding tool and the IC case external lead which are positioned vertically, the wire clamper and the IC case external lead do not come into contact with each other.

【０００５】[0005]

【実施例】次に本発明について図面を参照して説明す
る。図１は本発明の第一実施例のＩＣワイヤボンダの正
面図、図２はその右側面図である。本実施例はリニアウ
ェイベアリング１，クランパ支持部２，ワイヤクランパ
４，超音波振動子５，ボンディングツール６，ボンディ
ング用ワイヤ３より構成される。従来と異なる点は、リ
ニアウェイベアリング１，クランパ支持部２，ワイヤク
ランパ４がボンディングツール６の真上に位置し、かつ
ワイヤクランパ４の先端部に曲りがなく（ストレー
ト）、垂直に位置するボンディングツール６及びＩＣケ
ース外部リード７に対し平行に取付けられている点であ
る。The present invention will be described below with reference to the drawings. FIG. 1 is a front view of an IC wire bonder of a first embodiment of the present invention, and FIG. 2 is a right side view thereof. This embodiment comprises a linear way bearing 1, a clamper support 2, a wire clamper 4, an ultrasonic vibrator 5, a bonding tool 6, and a bonding wire 3. The point different from the conventional method is that the linear way bearing 1, the clamper support portion 2, and the wire clamper 4 are located right above the bonding tool 6, and the tip of the wire clamper 4 is not bent (straight) and is positioned vertically. The point is that they are attached in parallel to the tool 6 and the IC case external leads 7.

【０００６】次に図３は本発明の第２実施例のＩＣワイ
ヤボンダの右側面図である。第一実施例との相違点は、
ワイヤクランパ４の本体は傾斜しているが先端部のみが
垂直でボンディングツール６及びＩＣケース外部リード
７に対し平行である点である。Next, FIG. 3 is a right side view of the IC wire bonder of the second embodiment of the present invention. The difference from the first embodiment is that
The main body of the wire clamper 4 is inclined, but only the tip is vertical and parallel to the bonding tool 6 and the IC case external leads 7.

【０００７】[0007]

【発明の効果】以上説明したように本発明は、ワイヤク
ランパ又はワイヤクランパ先端部が垂直でボンディング
ツールと平行に取付けられている為、ワイヤクランパと
ＰＧＡ型ＩＣケース外部リードとは接触しないという効
果を有する。As described above, according to the present invention, since the wire clamper or the tip of the wire clamper is mounted vertically and in parallel with the bonding tool, the wire clamper does not come into contact with the external leads of the PGA type IC case. Have.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の第一実施例の正面図である。FIG. 1 is a front view of a first embodiment of the present invention.

【図２】図１の右側面図である。FIG. 2 is a right side view of FIG.

【図３】本発明の第二実施例の右側面図である。FIG. 3 is a right side view of the second embodiment of the present invention.

【図４】従来のＩＣ用ワイヤボンダの右側面図である。FIG. 4 is a right side view of a conventional IC wire bonder.

【符号の説明】[Explanation of symbols]

１ リニアウェイベアリング ２ クランパ支持部 ３ ボンディング用ワイヤ ４ ワイヤクランパ ５ 超音波振動子 ６ ボンディングツール ７ ＩＣケース外部リード ８ ＩＣケース ９ ＩＣ素子 １０ ＩＣケース内部リード Ａ部 接触部 1 Linear Way Bearing 2 Clamper Support 3 Bonding Wire 4 Wire Clamper 5 Ultrasonic Transducer 6 Bonding Tool 7 IC Case External Lead 8 IC Case 9 IC Element 10 IC Case Internal Lead A Section Contact Part

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 ＩＣ素子とＩＣケース内部リードとをボ
ンディング用ワイヤで結線するＩＣ用ワイヤボンダにお
いて、ワイヤクランパ又はワイヤクランパ先端部が、垂
直に位置するボンディングツール及びＩＣケース外部リ
ードに対し平行に設けられていることを特徴とするＩＣ
用ワイヤボンダ。1. In an IC wire bonder for connecting an IC element and an IC case inner lead with a bonding wire, a wire clamper or a tip of the wire clamper is provided parallel to a vertically positioned bonding tool and an IC case outer lead. ICs that are characterized by
Wire bonder for.
JP4175139A 1992-07-02 1992-07-02 Ic wire bonder Pending JPH0621164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4175139A JPH0621164A (en) 1992-07-02 1992-07-02 Ic wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4175139A JPH0621164A (en) 1992-07-02 1992-07-02 Ic wire bonder

Publications (1)

Publication Number Publication Date
JPH0621164A true JPH0621164A (en) 1994-01-28

Family

ID=15990974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4175139A Pending JPH0621164A (en) 1992-07-02 1992-07-02 Ic wire bonder

Country Status (1)

Country Link
JP (1) JPH0621164A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791533A (en) * 1980-11-29 1982-06-07 Shinkawa Ltd Wire bonding method and apparatus therefor
JPS63127543A (en) * 1986-11-18 1988-05-31 Toshiba Corp Wire bonding equipment

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791533A (en) * 1980-11-29 1982-06-07 Shinkawa Ltd Wire bonding method and apparatus therefor
JPS63127543A (en) * 1986-11-18 1988-05-31 Toshiba Corp Wire bonding equipment

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Effective date: 19980324