JPH062140A - Device for coating inside wall of furnace core pipe - Google Patents

Device for coating inside wall of furnace core pipe

Info

Publication number
JPH062140A
JPH062140A JP16517992A JP16517992A JPH062140A JP H062140 A JPH062140 A JP H062140A JP 16517992 A JP16517992 A JP 16517992A JP 16517992 A JP16517992 A JP 16517992A JP H062140 A JPH062140 A JP H062140A
Authority
JP
Japan
Prior art keywords
furnace core
silicon
core pipe
gas
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16517992A
Other languages
Japanese (ja)
Inventor
Hideaki Hayano
秀明 早野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP16517992A priority Critical patent/JPH062140A/en
Publication of JPH062140A publication Critical patent/JPH062140A/en
Pending legal-status Critical Current

Links

Landscapes

  • Chemical Vapour Deposition (AREA)

Abstract

PURPOSE:To minimize impurities conc. in a silicon carbide by providing a gas supply mechanism part and a plasma reaction mechanism part, carbonizing silicon in the inside wall of a silicon furnace core pipe by plasma reaction under low temp. and low pressure and suppressing the intrusion of impurities and thermal diffusion of impurities. CONSTITUTION:A reactant gas (CH4, H2) is supplied to the silicon furnace core pipe 8 in the plasma reaction mechanism part C from gas sources 1, 2 in the reaction gas supply mechanism part A. A silicon carbide furnace core pipe is formed by carbonizing silicon by sputtering the ionized gas with plasma reaction to the inside wall of the furnace core pipe 8. In this way, silicon is carbonized at a low temp. and a low pressure and the inside wall of the furnace core pipe is coated with high purity silicon carbide.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は炉芯管内壁コーティング
装置に関し、特にプラズマ反応を用い低温,低圧化でケ
イ素を炭化し、高純度の炭化ケイ素を炉芯管内壁にコー
ティングする装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a furnace core tube inner wall coating apparatus, and more particularly to a furnace core tube inner wall coating apparatus that carbonizes silicon at a low temperature and low pressure by using a plasma reaction and coats the furnace core tube inner wall with high purity silicon carbide.

【0002】[0002]

【従来の技術】従来、炭化ケイ素炉芯管の製造は、コー
クスとケイ砂とを電気炉中で1800〜1900℃の高
温下に置くことによって下記反応が進行し、炭化ケイ素
が合成される。
2. Description of the Related Art Conventionally, in the manufacture of a silicon carbide furnace core tube, the following reaction proceeds by placing coke and silica sand at a high temperature of 1800 to 1900 ° C. in an electric furnace to synthesize silicon carbide.

【0003】C+Si→SiC(炭化ケイ素) 合成された炭化ケイ素は、次に所定の形状に加工する為
に粉末状に粉砕される。この粉砕工程において重金属不
純物が混入する。そして、炭化ケイ素の粉末を高温高圧
下で所定の形状に加工した炭化ケイ素炉芯管を半導体製
造工程に使用していた。
C + Si → SiC (Silicon Carbide) The synthesized silicon carbide is then pulverized into powder for processing into a predetermined shape. Heavy metal impurities are mixed in this crushing process. Then, a silicon carbide furnace core tube obtained by processing silicon carbide powder into a predetermined shape under high temperature and high pressure has been used in a semiconductor manufacturing process.

【0004】[0004]

【発明が解決しようとする課題】上述した従来の炉芯管
製造に用いる炭化ケイ素製造装置は、高温での炭化ケイ
素合成さらには高温高圧下での成形加工であり、炭化ケ
イ素の原料となるコークス並びにケイ砂の純度に関わら
ず、外部要因からの重金属不純物の浸入により、高純度
の炭化ケイ素の合成が難しいという欠点を有していた。
The above-described conventional apparatus for producing silicon carbide used for producing a furnace core tube is a process for synthesizing silicon carbide at high temperature and further for forming under high temperature and high pressure, and is a coke which is a raw material of silicon carbide. In addition, regardless of the purity of silica sand, there is a drawback that it is difficult to synthesize high-purity silicon carbide due to infiltration of heavy metal impurities from external factors.

【0005】本発明の目的は、前記課題を解決する為に
ケイ素から成る炉芯管内壁に炭化ケイ素をコーティング
する装置を提供する事にある。
An object of the present invention is to provide an apparatus for coating the inner wall of a furnace core tube made of silicon with silicon carbide in order to solve the above problems.

【0006】[0006]

【課題を解決するための手段】本発明に係る炉芯管内壁
コーティング装置は、CH4 −H2 系プラズマ用のガス
を供給するガス供給機構部と、このガス供給機構部から
のガスをケイ素炉芯管にてプラズマ化し、そのプラズマ
反応による前記ケイ素炉芯管の内壁へのスパッタリング
により、ケイ素を炭化させて炭化ケイ素炉芯管を形成さ
せるプラズマ反応機後部とを有するものである。
A furnace core tube inner wall coating apparatus according to the present invention includes a gas supply mechanism section for supplying a gas for CH 4 —H 2 system plasma, and a gas supplied from this gas supply mechanism section to silicon. And a plasma reactor rear part for carbonizing silicon to form a silicon carbide furnace core tube by forming plasma in the furnace core tube and performing sputtering on the inner wall of the silicon furnace core tube by the plasma reaction.

【0007】[0007]

【実施例】次に本発明について図面を参照して説明す
る。
The present invention will be described below with reference to the drawings.

【0008】図1は本発明の炉芯管内壁コーティング装
置の一実施例を示す構成図である。
FIG. 1 is a block diagram showing an embodiment of a furnace core tube inner wall coating apparatus of the present invention.

【0009】本実施例に係る炉芯管内壁コーティング装
置は、CH4 ガス源1及びH2 ガス源2を備えたガス供
給機構部Aと、ガスラインフィルタ4及びマスフローコ
ントローラ5並びに圧力計6を備えガス供給機構部Aか
らのガス流量を制御する制御部Bと、電力計11及び高
周波発振器10並びに誘導コイル9を備えたプラズマ反
応機構部Cと、液体窒素トラップ12及び真空ポンプ1
3を備えた排気部Dとから構成されている。3はニード
ルバルブ,7はストップバルブである。
The furnace core tube inner wall coating apparatus according to this embodiment includes a gas supply mechanism section A having a CH 4 gas source 1 and an H 2 gas source 2, a gas line filter 4, a mass flow controller 5 and a pressure gauge 6. A control unit B for controlling the gas flow rate from the gas supply mechanism unit A provided, a plasma reaction mechanism unit C provided with a power meter 11, a high-frequency oscillator 10, and an induction coil 9, a liquid nitrogen trap 12, and a vacuum pump 1.
3 and an exhaust portion D provided with 3. 3 is a needle valve, and 7 is a stop valve.

【0010】本実施例においては、反応に際して反応系
内を10-5〜10-6Torr前後まで液体窒素トラップ
13を通して排気し、反応ガスとしてのCH4 ガス,H
2 ガスをガス源1,2よりマスフローコントローラ5を
通し所定の流量にてプラズマ反応機構部Cにある加工済
のケイ素炉芯管8へ導入する。ガス混合比は、グラファ
イト及びカーボンの析出を抑える為にCH4 ガスは5V
ol%以下とする。ガス圧力は圧力計6にて所定の圧力
に設定する。電力は周波数13.56MHz,出力20
0Wの高周波発振器10より誘導結合方式により移送す
る。放電によって生成された炭素イオンによるケイ素炉
芯管8の内壁へのスパッタリングによりケイ素が炭化
し、炭化ケイ素炉芯管が合成される。反応の際に用いら
れるH2 ガスは、ケイ素の炭化においての反応促進剤
(触媒)となる。
In this embodiment, during the reaction, the inside of the reaction system was evacuated to around 10 -5 to 10 -6 Torr through the liquid nitrogen trap 13, and CH 4 gas and H as reaction gases were used.
2 Gases are introduced from the gas sources 1 and 2 through the mass flow controller 5 into the processed silicon furnace core tube 8 in the plasma reaction mechanism C at a predetermined flow rate. The gas mixing ratio is 5 V for CH 4 gas to suppress the precipitation of graphite and carbon.
ol% or less. The gas pressure is set to a predetermined pressure by the pressure gauge 6. Electric power frequency 13.56MHz, output 20
It is transferred from the 0 W high frequency oscillator 10 by the inductive coupling method. The carbon ions generated by the discharge sputter on the inner wall of the silicon furnace core tube 8 to carbonize silicon to synthesize the silicon carbide core tube. The H 2 gas used during the reaction serves as a reaction promoter (catalyst) in the carbonization of silicon.

【0011】[0011]

【発明の効果】以上説明したように本発明は、プラズマ
反応を用いる事によりケイ素を低温低圧下で炭化する事
ができ、外部からの不純物混入及び不純物の熱拡散を最
小限に抑え、高純度の炭化ケイ素炉芯管を製造できる効
果がある。従来技術による炭化ケイ素製造装置にて得た
炭化ケイ素中の重金属不純物濃度は1012atoms/
cm2 であるのに対し、本発明により得た炭化ケイ素中
の重金属不純物濃度は、109 atoms/cm2 程度
と分析技術における検出限界値となっている。
As described above, according to the present invention, it is possible to carbonize silicon at a low temperature and a low pressure by using a plasma reaction, to minimize the contamination of impurities from the outside and the thermal diffusion of impurities, and to obtain a high purity. There is an effect that the silicon carbide furnace core tube can be manufactured. The concentration of heavy metal impurities in silicon carbide obtained by a conventional silicon carbide manufacturing apparatus is 10 12 atoms /
In contrast to cm 2 , the concentration of heavy metal impurities in the silicon carbide obtained according to the present invention is about 10 9 atoms / cm 2, which is a detection limit value in analytical techniques.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の構成図である。FIG. 1 is a configuration diagram of an embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1 CH4 ガス源 2 H2 ガス源 3 ニードルバルブ 4 ガスラインフィルタ 5 マスフローコントローラ 6 圧力計 7 ストップバルブ 8 ケイ素炉芯管 9 誘導コイル 10 高周波発振器 11 電力計 12 液体窒素トラップ 13 真空ポンプ1 CH 4 Gas Source 2 H 2 Gas Source 3 Needle Valve 4 Gas Line Filter 5 Mass Flow Controller 6 Pressure Gauge 7 Stop Valve 8 Silicon Furnace Core Tube 9 Induction Coil 10 High Frequency Oscillator 11 Power Meter 12 Liquid Nitrogen Trap 13 Vacuum Pump

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 反応ガスを供給するガス供給機構部と、
このガス供給機構部からのガスをケイ素炉芯管内にてイ
オン化し、そのプラズマ反応による前記ケイ素炉芯管内
壁へのスパッタリングによりケイ素を炭化させて炭化ケ
イ素炉芯管を形成させるプラズマ反応機構部とを有する
ことを特徴とする炉芯管内壁コーティング装置。
1. A gas supply mechanism section for supplying a reaction gas,
A plasma reaction mechanism portion for ionizing the gas from this gas supply mechanism portion in the silicon furnace core tube and carbonizing silicon by sputtering on the inner wall of the silicon furnace core tube by the plasma reaction to form a silicon carbide furnace core tube. A furnace core tube inner wall coating apparatus comprising:
JP16517992A 1992-06-24 1992-06-24 Device for coating inside wall of furnace core pipe Pending JPH062140A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16517992A JPH062140A (en) 1992-06-24 1992-06-24 Device for coating inside wall of furnace core pipe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16517992A JPH062140A (en) 1992-06-24 1992-06-24 Device for coating inside wall of furnace core pipe

Publications (1)

Publication Number Publication Date
JPH062140A true JPH062140A (en) 1994-01-11

Family

ID=15807354

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16517992A Pending JPH062140A (en) 1992-06-24 1992-06-24 Device for coating inside wall of furnace core pipe

Country Status (1)

Country Link
JP (1) JPH062140A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02279598A (en) * 1989-04-18 1990-11-15 Nec Corp Furnace core tube

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02279598A (en) * 1989-04-18 1990-11-15 Nec Corp Furnace core tube

Similar Documents

Publication Publication Date Title
US4556416A (en) Process and apparatus for manufacturing fine powder
JPS6311401B2 (en)
JPS5963732A (en) Thin film forming device
JPS63225517A (en) Manufacture of disilane from monosilane
JPH062140A (en) Device for coating inside wall of furnace core pipe
CN1045658A (en) A kind of preparation method of metal oxide superconducting film
JPS62120B2 (en)
KR20010049398A (en) Method of synthesizing carbon nanotubes using low pressure chemical vapor deposition
JPS5935092A (en) Vapor-phase synthesis of diamond
JPH02279598A (en) Furnace core tube
JPS5950014A (en) Manufacture of silicon powder
JPH0649566B2 (en) Method for synthesizing aluminum nitride
JPS63252997A (en) Production of diamond single crystal
JPH03229872A (en) Boron nitride synthesizing device using plasma reaction on semiconductor substrate
JPS6353159B2 (en)
JPS6265997A (en) Method and apparatus for synthesizing diamond
JPS5825045B2 (en) Method for producing SiC ultrafine particles
JP5337700B2 (en) Method for producing silicon carbide powder
JPH035314A (en) Synthesis method of diamond powder
JPH0380192A (en) Device for synthesizing diamond film by microwave plasma cvd
JPS593098A (en) Synthesizing method of diamond
JP2001085341A (en) Method for producing p-type cubic silicon carbide single crystal thin film
JPH0532489A (en) Diamond synthesis method using plasma
JP2003300711A (en) Method for producing high-purity silicon nitride fine powder
CN115142124A (en) A silicon carbide crystal growing device, method and electronic equipment

Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19980616