JPH06216214A - Package test method, package alignment method, probe contact state determination device, and brazing device - Google Patents

Abstract

PURPOSE:To enable easy discrimination between defective and non-defective by recognizing positions of 4 vertexes of a testing package, by obtaining a length of 4 sides and a length of a diagonal by an operation and by comparing the result with a pre-set standard value. CONSTITUTION:(S1) A ceramic package is set in a first jig. (S2) An image is processed. (S3) Discrimination is made for the multi-pin prober whether a test is possible or impossible. (S4) When it is judged as impossible, the processing is finished. When it is judged as possible, discrimination is made for a pin of the multi-pin prober whether or not sure contact is possible. (S5) When it is possible, a wiring test is carried out. (S6) A brazing process is performed. When contact defective is generated, the processing is finished. In the brazing process, after a lead frame is set to a second jig, the second jig is moved to an optimum position by using the results of the image processing of (S2), and brazing of a lead frame is performed for a package.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a test technology and a package assembly technology for a package that houses a semiconductor device such as an LSI, and more particularly to a ceramic QF having a fine pitch.
P (Quad Flat Package) test technology and assembly technology.

With the recent development of high integration technology of semiconductor devices, miniaturization and increase in the number of pins of a package for housing the semiconductor device are also desired, and high reliability is required accordingly.

[0003]

2. Description of the Related Art Conventionally, in a ceramic QFP, a product is set by an outer shape guide or a cavity guide, and a prober having a plurality of test pins (hereinafter referred to as probes) is brought into contact with a wiring pattern (pad) to short-circuit. A wiring test was performed to detect disconnection, and only good products were transferred to the brazing process.

Here, the wiring test will be described. The wiring test is a continuity test between the inner pad IP and the outer pad OP provided at both ends of the wiring pattern PT on the ceramic QFP substrate Q shown in FIG. 10. By simultaneously testing a plurality of pads, This is a test for checking whether a certain wiring pattern is short-circuited with an adjacent wiring pattern or whether the wiring pattern is not broken, and discriminating good products from defective products.

[0005]

However, as the number of pins increases and the pitch of each lead of the ceramic QFP becomes narrower (fine pitch), shrinkage (shrinkage), deformation, etc. at the time of firing the ceramic will be described later. There was a problem. Problem 1) Since the pitch of the plurality of test probes provided on the prober is also narrow, there is a problem that the package outside dimension after firing the ceramic cannot be tested unless it is within the standard.

Specifically, in the case of a conventional pitch package, as shown in FIGS. 11 (a) and (i), each probe is brought into contact with the center position of each pad when the outer dimension is a reference value. If set, if the external dimensions become large due to the difference in shrinkage rate during ceramic firing (Fig. 11).
Even in the case of (a) (ii)), the probe was able to abut against each pad, and the test could be performed.

However, in the case of a fine pitch package, as shown in FIGS. 11 (b) and (i), it is set so that each probe comes into contact with the center position of each corresponding pad when the external dimension is a reference value. Even so, if the outer dimensions increase due to the difference in shrinkage rate during ceramic firing (see FIGS. 11 (b) and (ii)), the probe abuts between the pads, and the test can be performed. I couldn't do it. Problem 2) Even if the external dimensions are within the standard, if the ceramic package is deformed and the originally square package becomes a rhombus, parallelogram, etc., the pad position becomes the normal position. However, there was a problem in that the probe could not normally abut and the test could not be performed. Problem 3) As the pitch of ceramic packages becomes finer, the probe diameter becomes smaller and becomes easier to deform, resulting in contact defects due to irregularities and warpage of the package surface, and metallization (conductor material: W, Mo
The probe may not be able to come into contact with the pad due to wear due to repeated contact with the probe etc.), and a good package may be identified as a defective product. There was a problem that it was necessary to confirm the contact of the. Problem 4) Further, since the wiring pattern of the package has a fine pitch, there is a problem that it is difficult to perform alignment when brazing the lead frame to the wiring pattern.

Therefore, an object of the present invention is to provide a package tester for automatically confirming the pad position of the ceramic package before the test and then an assembly technique for brazing the leads to the wiring pattern. Especially.

[0009]

In order to solve the above-mentioned problems, a first invention is a package test method for discriminating a good product or a defective product of a package in which a shape of a storage surface of a semiconductor device is substantially rectangular by image processing. , A vertex recognition step of recognizing the positions of the four vertices of the rectangle of the package under test, an edge length calculation step of obtaining four side lengths based on the recognized positions of the four vertices, and a position of the recognized four vertices. On the basis of,
Diagonal line length calculation step for determining the diagonal line length and comparing the four side lengths and the diagonal line lengths obtained by the calculation with preset reference four side lengths and reference diagonal line lengths to determine whether the package under test is good or defective. And a discriminating step.

A second aspect of the present invention is a package alignment method for aligning a package in which the shape of the storage surface of the semiconductor device is substantially rectangular by using image processing, and a reference plane parallel to the storage surface is assumed. Then, the vertex recognition step of recognizing the positions of the four vertices of the rectangle of the package under test projected on the reference plane, and the center-of-gravity position calculation for obtaining the center-of-gravity position of the rectangle based on the recognized positions of the four vertices. Each of the four sides forming the rectangle is obtained from the step and the four vertices obtained by calculation, and the package under test is rotated about the center of gravity parallel to the reference plane to form the rectangle. A narrow-angle calculation step of obtaining an angle formed by a straight line including the side projected on the reference plane for each side and a reference straight line on the reference plane which is preset corresponding to the side, A rotation control step of serial sum of the four narrow-angle determined by the narrow angle calculation step for controlling the rotation in the most smallest position, configured with a.

A third aspect of the present invention is a probe contact state determination device for a multi-pin prober having a plurality of pins for testing, which is depressed as the multi-pin prober abuts in the same manner as in the actual use state, and the depressed state. A test auxiliary body having a test plane that plastically deforms so as to hold, and a state after contact of the multi-pin prober on the test plane of the test auxiliary body is captured as image data, and the image data is stored in advance. Image processing means for determining the contact state of each probe of the multi-pin prober by comparing with data corresponding to the reference state.

Still further, a fourth invention is a probe of a multi-pin prober having a plurality of pins for electrically contacting a wiring pattern formed on a substrate of a package housing a semiconductor device for testing the wiring pattern. In the contact state determination device, the multi-pin prober is placed on the wiring pattern surface of the package to be tested, and the multi-pin prober abuts in the same manner as in the actual test state, causing a depression and plastic deformation so as to maintain the depressed state. The test auxiliary sheet to be used and the multi-pin prober of the test auxiliary sheet are brought into contact with each other after the deformation state of the test auxiliary sheet is captured as image data, and the multi-pin prober is compared by comparing the data with the previously stored reference state. And image processing means for determining the contact state of each probe.

A fifth aspect of the present invention is a contact state of a multi-pin prober having a plurality of pins for electrically contacting a wiring pattern formed on a substrate of a package housing a semiconductor device, for testing the wiring pattern. In the discriminating device, the pin extends from the side of the substrate to the wiring pattern forming surface side, and the tip thereof is formed so as to be electrically contactable with the wiring pattern, and is oriented toward the wiring pattern surface. Image pickup means for picking up the image of the pattern surface and outputting image data; and image processing means for judging the contact state by comparing the image data and reference data corresponding to the reference contact state of the pin stored in advance. , And are configured.

Further, a sixth aspect of the present invention is a contact state of a multi-pin prober having a plurality of pins for electrically contacting a wiring pattern formed on a substrate of a package housing a semiconductor device for testing. In the discriminating device, the pin is composed of two electrically isolated sub-pins, and the tip of each sub-pin is formed so as to be able to make electrical contact with the wiring pattern. In order to confirm that the sub pins are in contact with the wiring pattern, a continuity test means for conducting a continuity test between the sub pins is provided.

Furthermore, a seventh invention is a brazing device for brazing a lead frame to a wiring pattern formed on a substrate of a package which houses a semiconductor device, wherein the first substrate holds the substrate of the package. A holding means, a second holding means for holding the lead frame, an image pickup means for pointing the wiring pattern surface to pick up the wiring pattern surface, and outputting image data, and the image data and previously stored. By comparing reference data corresponding to the reference position of the wiring pattern position, the first data
Drive means for changing the relative position of the holding means and the second holding means to drive the wiring pattern and the lead frame to a position where the positional deviation between them is minimized.

[0016]

According to the first invention, the vertex recognition step recognizes the positions of the four vertices of the rectangle of the package under test.

Thus, the side length calculating step obtains the four side lengths based on the recognized positions of the four vertices, and the diagonal length calculating step obtains the diagonal length based on the recognized positions of the four vertices. .

As a result, the discriminating step discriminates the non-defective product or defective product of the package under test by comparing the four side lengths and the diagonal line lengths obtained by the calculation with the preset reference four side lengths and the reference diagonal line lengths.

Therefore, it is possible to easily and quickly discriminate between the good product and the defective product by recognizing the package outer dimension by the image processing. According to the second aspect of the invention, the vertex recognition step assumes the reference plane parallel to the storage surface of the semiconductor device and recognizes the positions of the four vertices of the rectangle of the package under test projected on the reference plane.

Thus, the center-of-gravity position recognizing step obtains the center-of-gravity position of the rectangle based on the recognized positions of the four vertices. Further, in the narrow angle calculation step, the four sides forming the rectangle are obtained from the four vertices obtained by the calculation, and the package under test is rotated about the center of gravity parallel to the reference plane to form each rectangle. For each side, an angle between a straight line obtained by projecting a straight line including the side on the reference plane and a reference straight line on the reference plane which is set in advance and corresponds to the side is obtained.

As a result, the rotation control step controls the rotation to a position where the sum of the four narrow angles obtained in the narrow angle calculation step is the smallest. Therefore, the package can be aligned easily, quickly and accurately.

According to the third aspect of the present invention, the test auxiliary body is plastically deformed so that the test plane is depressed by the contact of the multi-pin prober in the same manner as in the actual use state, and the depressed state is maintained.

Thus, the image processing means captures the state of the test plane after the abutment of the multi-pin prober as image data, and compares the image data with the data corresponding to the reference state stored in advance to determine each of the multi-pin probers. Determine the contact state of the probe.

Therefore, it is possible to easily discriminate the contact state of the plurality of test pins of the multi-pin prober and prevent unnecessary rejection of the object to be tested due to the defect of the multi-pin prober.

According to the fourth aspect of the present invention, the test auxiliary sheet is placed on the wiring pattern surface of the package to be tested, and the multi-pin prober abuts in the same manner as in the actual test state, causing a depression and a depression. Plastically deforms to hold.

Accordingly, the image processing means takes in the deformation state of the test auxiliary sheet as image data after the contact of the multi-pin prober of the test auxiliary sheet, and compares it with the data corresponding to the reference state stored in advance. Determine the contact status of each probe on the pin prober.

Therefore, the contact state of the multi-pin prober with the package under test in the actual test state can be determined before the test, and a reliable test can be performed. According to the fifth aspect, the test pin extends from the side of the substrate toward the wiring pattern formation surface side, and the tip thereof electrically contacts the wiring pattern.

At this time, the image pickup means points the wiring pattern surface, picks up the image of the pattern surface, and outputs image data. Thereby, the image processing means determines the contact state by comparing the image data and the reference data corresponding to the reference contact state of the pin stored in advance.

Therefore, the contact state of the multi-pin prober can be determined in real time, and a reliable test can be performed. According to the sixth aspect of the invention, the test pin is composed of two electrically isolated sub-pins, and the tip of each sub-pin electrically contacts the wiring pattern.

As a result, the continuity test means conducts a continuity test between the sub-pins in order to confirm that the two sub-pins forming the pin are in contact with the wiring pattern prior to the actual test.

As a result, if a current flows between both sub-pins,
It can be confirmed that the pin is surely in contact with the wiring pattern, and a reliable test can be performed. According to the seventh invention, the first holding means holds the substrate of the package, and the second holding means holds the lead frame.

Further, the image pickup means is directed to the wiring pattern surface, picks up the wiring pattern surface, and outputs image data. Accordingly, the driving unit changes the relative position of the first holding unit and the second holding unit by comparing the image data and the reference data corresponding to the previously stored reference position of the wiring pattern position, and the wiring pattern The lead frame is driven to a position where the positional deviation is minimized.

Therefore, the wiring pattern and the lead frame can be easily and quickly aligned, and the brazing can be reliably performed.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will now be described with reference to the drawings. First, a schematic process of a package test and a lead frame brazing process will be described with reference to FIG.

First, the ceramic package is set on the first jig (see FIG. 2) (step S1). As a result, the package test apparatus performs image processing (step S2).

More specifically, pattern recognition is performed to check the external dimensions of the package as viewed from the wiring pattern surface of the package, the degree of deformation, etc., and the alignment position for contacting the multi-pin prober is calculated.

Next, as a result of the image processing in step S2, it is determined whether or not a multi-pin prober test is possible (step S2).
3) If the multi-pin prober test cannot be performed, the process is terminated.

If it is determined in step S3 that the multi-pin prober test can be performed, it is determined whether or not the pins of the multi-pin prober can be reliably contacted (step S4).

If it is determined in step S4 that the pins of the multi-pin prober can be reliably contacted, a wiring test is performed (step S5), and the brazing process is started.
When the contact failure of the probe of the multi-pin prober occurs in the determination in step S4, the process ends.

In the brazing process, the second jig (see FIG.
After setting the lead frame to (see), using the result of the image processing in step S2, move the second jig to the optimum position,
The lead frame is brazed to the package (step S6).

Next, each process will be described in more detail. a) External dimension / shape recognition processing by pattern recognition ... Step S2 First, the image processing apparatus 1 shown in FIG. 2 takes in the patterns of the alignable areas AR _{1 to} AR ₄ shown in FIG. The coordinates of the edge portions A to D, that is, A = (x
₀ , y ₀ ), B = (x ₁ , y ₁ ), C = (x ₂ ,
y ₂ ), D = (x ₃ , y ₃ ).

Next, the lengths L _{AB to} L _{DA of} the sides AB, BC, CD, and _DA and the lengths of the diagonal line AC and the diagonal line L _AC and L _BD are obtained. Further, it is determined whether or not the obtained lengths L _{AB to} L _DA and the lengths L _AC and L _BD are included in preset reference value ranges, and if all the lengths are included in the reference value range, Move to the next process as a non-defective product.

If any length is not included in the reference value range, it is rejected (rejected) as a defective product. next,
The position of the center of gravity of the rectangle ABCD is calculated, and alignment processing is performed.

As shown in FIG. 3, the alignment processing is performed by the obtained coordinates of the edge portions A to D, that is, A = (x ₀ ,
y ₀ ), B = (x ₁ , y ₁ ), C = (x ₂ , y ₂ ), D
= (X ₃ , y ₃ ). In this case,
l: reference pitch between each measurement point, a: position range of alignable area, each alignable area AR ₁ , AR ₂ , AR
The center coordinates of AR ₃ and AR ₄ are (a / 2, a /
2), (a / 2 + 1, a / 2), (a / 2, a / 2 +
l) and (a / 2 + 1, a / 2 + 1).

Next, the coordinates of the edge portion A are A = (x ₀ , y
₀ ) to A = (x ₀₀ , y ₀₀ ) [= initial value (0, 0)], and the coordinates of the edge portion B are changed from B = (x ₁ , y ₁ ) to B.
= (X ₁₁ , y ₁₁ ) [= initial value (x ₁₁ , 0)],
Starting from this coordinate, turn counterclockwise at a constant angle (dθ
₀ ) Rotate (see Fig. 4).

The specific coordinates at this time are: x ₀₀ = 0 y ₀₀ = 0

[0047]

[Equation 1]

It becomes Similarly, a constant rotation angle is dθ
And each coordinate rotated to θ ₀₀₁₁ is

[0049]

[Equation 2]

It becomes Next, the coordinate A of the edge portion A =
(X _00, y ₀₀₎ a certain amount of movement has been preset in the x direction and y direction, and the above processing is repeated.

Further, with respect to the coordinates of the respective edge portions A to D moved by the above processing, the distances from the center coordinates of the alignable areas AR ₁ , AR ₂ , AR ₃ , AR ₄ in which the respective edge portions A to D exist ( L) Calculate.

[0052]

[Equation 3]

In this case, the position alignable areas AR ₁ , AR ₂ , AR corresponding to the coordinates of the respective edge portions A to D are arranged.
₃ , check whether it exists in AR ₄ by the following equation,

[0054]

[Equation 4]

Distances are calculated for those satisfying the conditions of these expressions. c) Prober pin contact position confirmation processing (pre-processing of step S4) When performing a wiring test, in order to reliably determine whether the probe of the multi-pin prober can contact the pad portion of the package, the multi-pin prober 5 It is necessary to check the contact position of the probe in advance.

C-1) In this case, as shown in FIG. 5, the probe 4A extends from the side of the package to be tested to the side of the wiring pattern surface, and its tip is formed so as to be able to electrically contact the wiring pattern. when the reference position AR _{RE F} of each probe 4A of a prober reference plate shown (including tolerances.) (or the wiring pattern surface of the reference package)
10, the probe 4A is brought into contact with the probe 10, and an image is taken by the camera 2 from the direction pointing to the reference plate 10.
The contact position of is captured as image data.

Next, the image processing apparatus 1 compares it with the reference data corresponding to the reference contact position stored in advance, and confirms how much the contact position is displaced (positional displacement). If the contact position of is within the reference position (reference range), the multi-pin prober 5 is considered to be a good product. c-2) In the process of (c-1) above, the probe 4A extends from the side of the package substrate to the wiring pattern surface, but as shown in FIG. 6, the prober 4B is a so-called pogo pin. In the method (the method in which the probe 4B is formed so as to be able to freely project and retract in the vertical direction on the test surface), it is difficult to take a picture even if the camera 2 is provided so as to be directed to the wiring pattern surface.

Therefore, in order to confirm the contact position of the probe 4B of such a multi-pin prober, FIG.
As shown in the cross-sectional view of FIG. 1, for example, the test surface (front surface) 16 is an aluminum foil, the intermediate layer 17 is a double-sided adhesive tape, and the substrate 18 is an aluminum plate. The probe of the multi-pin prober 5 is brought into contact with the same as in the test, the test surface is depressed, and the depression mark is photographed by the camera 2. The image processing apparatus 1 captures the position of the depression mark as image data and It may be compared with preset reference data.

As a result, the displacement of the probe 4B can be easily detected. In addition, the package wiring pattern surface coated with a transparent resist or a transparent film such as triacetate is placed, and a multi-pin prober is brought into contact with the package, and the depression mark is confirmed by a microscope or the image processing apparatus 1 described above. It is also possible to do so. d) Contact Confirmation Process for Other Prober Probe Packages Next, a contact confirmation process for another pin prober probe of another configuration will be described.

Each probe 4C of the multi-pin prober 5 is composed of two subprobes a and a'as shown in FIG. 8, and the two subprobes a and a'are outer pads of the wiring pattern of the package. By conducting a continuity test that both of them are in contact with the OP, the first sub-probe a →
Confirm that the current flows from the outer pad to the second sub-probe a '.

That is, if a current flows between the first sub-probe a and the second sub-probe a ', it is judged that the probe is surely in contact with the outer pad. As a result, it is possible to easily prevent an erroneous reject of a non-defective package due to poor contact, and it is possible to accurately carry out a wiring test performed thereafter. e) Positioning in Brazing Process Using Wiring Test Data (Step S6) First, as shown in FIG. 9, the ceramic package 7A is set on the first jig 8 and the lead frame 20 is set on the second jig 2.
Set to 1.

At this time, since the pad position of the ceramic package 7A is already known by the process (a) described above, the second jig 21 is optimally moved and rotated by the driving device 22 such as a step motor. The lead frame 20 is moved to the brazing position and brazing is performed.

This ensures brazing.
It is also possible to fix the second jig 21 and move and rotate the first jig 8 by the driving device 3 such as a step motor.

[0064]

According to the first aspect of the invention, the positions of the four vertices of the surface under test of the package under test are recognized, the four side lengths and the diagonal line lengths are calculated, and the four side lengths and the predetermined four side lengths are set. By comparing with the reference diagonal length, it is possible to easily and quickly discriminate between a good package and a defective package by recognizing the package outer dimension.

According to the second aspect of the invention, the deformation of the package and the like can be easily detected and the package can be rotationally driven to the position with the least displacement, so that the package can be aligned easily, quickly and accurately. be able to.

According to the third aspect of the present invention, the test auxiliary body is deformed so that its test plane is depressed by the contact of the multi-pin prober in the same manner as in the actual use state, and the depressed state is maintained. The depressed state is captured by the image processing means and the contact state of each probe of the multi-pin prober is determined, so that the contact state of the plurality of test pins of the multi-pin prober can be easily determined and the defective state of the multi-pin prober can be detected. It is possible to prevent unnecessary rejection of the test object.

According to the fourth aspect of the invention, the test auxiliary sheet is placed on the wiring pattern surface of the package to be tested, and the multi-pin prober abuts in the same manner as in the actual test state to cause the depression and the depression state. Plastic deformation so as to hold, and the depressed state is captured by the image processing means to determine the contact state of each probe of the multi-pin prober, so the contact state of the multi-pin prober to the package under test in the actual test state It can be discriminated before the test, and a reliable test can be performed.

According to the fifth aspect of the invention, the test pin extends from the side of the substrate to the side of the wiring pattern forming surface, and its tip electrically contacts the wiring pattern. Since the image processing means captures image data that is picked up and output and determines the contact state, the contact state of the multi-pin prober can be determined in real time, and a reliable test can be performed.

According to the sixth aspect of the invention, the test pin is composed of two electrically isolated sub-pins, the tip of each sub-pin electrically contacts the wiring pattern, and the continuity test means is Prior to the actual test, a continuity test between the sub pins is performed in order to confirm that the two sub pins forming the pin are in contact with the wiring pattern. As a result, it can be confirmed that the pin is surely in contact with the wiring pattern, and a reliable test can be performed.

According to the seventh invention, the first holding means holds the substrate of the package, the second holding means holds the lead frame, and the image pickup means is oriented toward the wiring pattern surface. The driving means changes the relative positions of the first holding means and the second holding means based on the output image data, and drives the wiring pattern and the lead frame to a position where the positional deviation is minimum, The wiring pattern and the lead frame can be easily and quickly aligned, and brazing can be reliably performed.

[Brief description of drawings]

FIG. 1 is a processing flowchart showing a schematic operation.

FIG. 2 is a block diagram showing a schematic configuration of the entire test apparatus.

FIG. 3 is an explanatory diagram (1) of the alignment processing.

FIG. 4 is an explanatory diagram (2) of the alignment processing.

FIG. 5 is an explanatory diagram (1) of the contact position confirmation method of the multi-pin prober.

FIG. 6 is an explanatory view (2) of the contact position confirmation method of the multi-pin prober.

FIG. 7 is a diagram showing a configuration example of a test auxiliary body.

FIG. 8 is an explanatory view (3) of the contact position confirmation method of the multi-pin prober.

FIG. 9 is an explanatory diagram of alignment in a brazing process.

FIG. 10 is a diagram illustrating a wiring pattern of a ceramic QFP substrate.

FIG. 11 is an explanatory diagram of a conventional problem.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Image processing device 2 ... Camera 3 ... Driving device 4, 4A, 4B, 4C ... Probe 5 ... Multi-pin prober 6 ... Testing device 7 ... Package 8 ... First jig 10 ... Reference plate 15 ... Test auxiliary body 16 ... Test Surface (aluminum foil) 17 ... Intermediate layer (double-sided adhesive tape) 18 ... Substrate (aluminum plate) 20 ... Lead frame 21 ... Second jig a, a '... Sub probe

Claims (7)

[Claims] 1. In a package test method for discriminating a good product or a defective product of a package in which a shape of a storage surface of a semiconductor device is substantially rectangular by image processing, vertex recognition for recognizing positions of four vertices of the rectangle of a package under test. And a step of calculating a side length based on the recognized positions of the four vertices, and a step of calculating a diagonal length based on the recognized positions of the four vertices. A package for determining whether the package under test is a good product or a defective product by comparing the four side lengths and the diagonal line length with preset reference four side lengths and reference diagonal line lengths. Test method. 2. A package alignment method for aligning a package in which the shape of a storage surface of a semiconductor device is substantially rectangular by using image processing, wherein a reference plane parallel to the storage surface is assumed and A vertex recognition step of recognizing the positions of the four vertices of the rectangle of the package under test projected onto the package, a center of gravity position calculation step of obtaining the center of gravity position of the rectangle based on the recognized positions of the four vertices, The four sides forming the rectangle are obtained from the four vertices, and the package under test is rotated about the center of gravity in parallel with the reference plane, and the sides are formed for each side forming the rectangle. A narrow angle calculation step of obtaining an angle formed by a straight line obtained by projecting a straight line including the straight line onto the reference surface and a reference straight line on the reference surface which is preset and respectively corresponding to the sides; Package alignment method a rotation control step of sum total of four narrow angle determined to control the rotation in the most smallest position, comprising the to. 3. A probe contact state determination device for a multi-pin prober having a plurality of pins for testing, wherein the multi-pin prober abuts in the same manner as in the actual use state so as to be depressed and maintain the depressed state. A test auxiliary body having a test plane that plastically deforms, and a state after the contact of the multi-pin prober on the test plane of the test auxiliary body is captured as image data, and the image data corresponds to a reference state that is stored in advance. An image processing unit that determines the contact state of each probe of the multi-pin prober by comparing with data, and a probe contact state determination device of the multi-pin prober. 4. A probe contact state determination device for a multi-pin prober having a plurality of pins for making electrical contact with a wiring pattern for testing the wiring pattern formed on a substrate of a package housing a semiconductor device, Placed on the wiring pattern surface of the package to be tested, by contacting the multi-pin prober in the same manner as in the actual test state, it is depressed, and a test auxiliary sheet that plastically deforms so as to maintain the depressed state, After the contact of the multi-pin prober of the test auxiliary sheet, the deformation state of the test auxiliary sheet is captured as image data, and the contact state of each probe of the multi-pin prober is compared by comparing with the data corresponding to the reference state stored in advance. A multi-pin prober probe contact state determination, comprising: an image processing unit for determining apparatus. 5. A contact state determination device for a multi-pin prober having a plurality of pins for electrically contacting a wiring pattern formed on a substrate of a package housing a semiconductor device in order to test the wiring pattern. Is extended from the side of the substrate to the wiring pattern forming surface side, the tip of which is formed so as to be capable of electrically contacting the wiring pattern, and is directed to the wiring pattern surface to image the pattern surface. An image processing unit that outputs image data, and an image processing unit that determines the contact state by comparing the image data and reference data corresponding to the reference contact state of the pin stored in advance. Characteristic multi-pin prober contact state determination device. 6. A contact state determination device for a multi-pin prober having a plurality of pins for making electrical contact with a wiring pattern for testing a wiring pattern formed on a substrate of a package housing a semiconductor device, Consists of two auxiliary pins that are electrically separated,
The tip of each sub-pin is formed so as to be able to electrically contact the wiring pattern, and in order to confirm that the two sub-pins forming the pin are in contact with the wiring pattern, the sub-pin A contact state determination device for a multi-pin prober, comprising a continuity test means for conducting a continuity test between the two. 7. A brazing device for brazing a lead frame to a wiring pattern formed on a substrate of a package housing a semiconductor device, comprising: first holding means for holding the substrate of the package; and the lead frame. A second holding means for holding the wiring pattern surface, an imaging means for imaging the wiring pattern surface directed to the wiring pattern surface, and outputting image data; and a reference position of the image data and the wiring pattern position stored in advance. Drive means for changing the relative position of the first holding means and the second holding means by comparing the reference data corresponding to, and driving to a position where the positional deviation between the wiring pattern and the lead frame is minimized. A brazing device comprising: