JPH06217331A - Solid-state imaging device - Google Patents

Abstract

(57) [Summary] [Structure] The first metal fitting 24 fixed to the light exit surface of the spectral prism 21 and the second metal fitting 25 facing the first metal fitting and having the solid-state image sensor fixed thereto. In a mounting device provided, when the leg portions 24A, 25A for joining the first and second metal fittings are welded and fixed by, for example, solder or the like, the welding surface of the leg portion is formed by a solder resist layer or the like. limit. As a result, the workability of assembling when positioning and fixing the solid-state image sensor is improved, and the bonding strength can be increased.

Description

Detailed Description of the Invention

[0001]

This invention relates to a CCD (Charge Cou
color using a solid-state image sensor such as a pled device)
The present invention relates to a mounting device for a solid-state image sensor in a video camera.

[0002]

2. Description of the Related Art Since a solid-state image pickup device such as a CCD is lightweight and small in size, when a color video camera is constructed with such a solid-state image pickup device, an image of a subject incident from an image pickup lens is detected. It becomes possible to directly attach the solid-state image pickup device to the spectral prism that splits light into colors.

FIG. 3 is a perspective view showing a mounting device for a solid-state image pickup device (Japanese Patent Application No. 59-257068) previously proposed by the applicant of the present invention. Reference numeral 1 denotes R, G light incident from the direction of arrow P. ，
3 shows a spectral prism for splitting light in three directions along line B. The spectroscopic prism 1 is composed of, for example, three prisms, and these prisms are fixed to a predetermined position by a support base 2. The light split in the G direction is received by the solid-state image sensor 3G for shooting a green image placed on the light exit surface of the spectral prism.

Reference numerals 4G and 5G denote first and second fittings for mounting the solid-state image pickup device 3G on the light exit surface of the spectral prism 1. The first and second fittings 4G and 5G are
As well shown in the exploded perspective view of the metal fitting shown on the light emitting surface in the R direction, a dowel for positioning a solid-state image sensor (not shown) on one surface of the first metal fitting 4R. 6
R and a screw hole 7R for mounting are formed, and a leg portion 8R for joining with a leg portion 9R of the second metal fitting 5R is formed in the peripheral portion,
8R ......... is provided. Reference numerals 10R and 11R denote the light output from the light exit surface of the spectral prism 1 to the first metal fitting 4
An opening window for receiving light by the solid-state imaging device screwed to R is shown, and 12R is the first and second fittings 4R and 5R.
2 shows a packing member for filling the gap. In addition, B
Although the solid-state image sensor and the mounting bracket in the direction are omitted, the mounting bracket as described above is also included in this portion.
And a solid-state image sensor.

According to such a solid-state image pickup device mounting structure, as shown in FIG. 4, the first metal fittings 4G, 4R, 4B are provided.
When the standard test image is incident on the spectral prism 1, the solid-state image pickup devices 3G, 3R, and 3B mounted on the solid-state image pickup device 3R are fixed to the jigs 13R, 13G, and 13B that are movably supported. Jigs 13R and 3G so that the chroma image signals obtained from 3G and 3R match.
13G and 13B are moved to adjust the registration, and the joint position of the first metal fittings 4G, 4R, 4B and the second metal fittings 5G, 5R, 5B is determined at this adjustment position, and the leg portion of each metal fitting is determined. 8R, 9R, 8G, 9G, 8B, 9B are welded by soldering or the like to fix each solid-state imaging device 3R, 3G, 3B at a position where the registration registration is best with respect to the light emission surface of the spectral prism 1. can do.

[0006]

However, the first
Since the second metal fittings 4 (R, G, B) and 5 (R, G, B) are made of metal and distributed in three directions in the mounting direction, the leg portions 8 (R, G, When soldering or brazing B), 9 (R, G, B), for example, as shown in FIG. 5, the molten metal S hangs down from the joint and the leg 8 (R,
G, B), 9 (R, G, B) have a drawback that the molten metal is not surely welded to the facing surfaces, and there is a problem that workability and adhesion are poor.

[0007]

The present invention has been made to solve the above problems, and the legs of the first and second fittings are arranged so as to face each other, and the legs are opposed to each other. The portion other than the surface to be covered is covered with a solder resist layer.

[0008]

In order to join the first and second fittings, the legs are drawn out in the horizontal direction, and the opposite parts of the drawn-out legs are subjected to, for example, pre-soldering, and the other parts are covered with the solder resist layer. Therefore, when the first and second metal fittings are welded by the cream solder or the like, the solder is welded only at a predetermined portion of the leg portion and can be securely fixed.

[0009]

1 is an exploded perspective view of a solid-state image pickup device mounting apparatus according to an embodiment of the present invention, in which 21 is a spectral prism and 22 is a plurality of prisms fixed at predetermined positions. To form a spectral prism 21, and a supporting base for fixing the spectral prism 21 to a housing or the like, 23 a solid-state image sensor fixed to the first metal fitting 24, and 25 fixed to a light emitting surface of the spectral prism 21. 2nd metal fitting is shown.

As described above, the first and second metal fittings 24 and 25 have four legs 2 for connecting them to each other.
4A and 25A project in a substantially horizontal direction, and opening windows 24B and 25B for passing light are formed in the central portion. 26 is the first and second metal fittings 24, 25
2 shows a packing member for light shielding and dust prevention which is arranged so as to be sandwiched by the joint surface of No. 2, and 27 shows a screw for fixing the solid-state image pickup device 23 to the first metal fitting 24. In addition, when these are fixed to the spectral prism 21, the spectral prism 2
It is designated by the reference numeral 28, which is located on one of the other optical paths.

The leg portion 2 of the first and second metal fittings 24, 25
As shown in FIG. 1 and FIG. 2, pre-solders 4A and 25A are provided with pre-solders as shown by diagonal lines so that the wettability of the solder is improved, as shown in FIGS. A solder resist layer is applied to the portion so that excess solder does not adhere.

As described above, the first and second metal fittings 24 and 25 employed in the solid-state image pickup device mounting apparatus of the present invention have solder wettability on the joint surfaces of the leg portions 24A and 25A facing each other. Of the solid-state image pickup device 23 with respect to the spectroscopic prism 21 by adjusting the resist rate as described above. After the positioning is performed, the legs 24A,
When the joint surface of 25A is welded with a cream solder or the like, the first,
The second metal fittings 24, 25 are fixed at predetermined positions. In this case, the joint surfaces of the first and second metal fittings 24, 25 are opposed to each other, and sufficient solder welding is performed only in this portion, so that the fixing can be surely performed, and at the same time, the surplus solder is not supported by the legs. It is possible to prevent sagging around the portions 24A and 25A and causing a defective solder.

Although brazing with solder as the welding material has been described, it goes without saying that brazing with a copper-based hard solder may be applied. Also, if the material of the metal fitting has good wettability for brazing, omit the pre-solder,
You may apply only a solder resist layer.

[0014]

As described above, the mounting device for a solid-state image pickup device according to the present invention includes the first metal fitting attached to the light exit surface of the spectral prism and the second metal fitting to which the solid-state image pickup device is fixed. Since the solder resist layer is provided so that the molten metal adheres only to the opposite surfaces of the legs formed in the peripheral portions of the first and second fittings, When fixing at a predetermined position with respect to the light emitting surface of the prism, the welding is surely performed, and
The workability is also improved.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of an embodiment showing a mounting device for a solid-state image sensor.

FIG. 2 is a perspective view showing a leg portion of a first fitting.

FIG. 3 is a perspective view showing a mounting device of a solid-state image pickup device previously proposed by the applicant.

FIG. 4 is a perspective view of a spectral prism for explaining attachment adjustment.

FIG. 5 is an explanatory diagram showing a soldering state.

[Explanation of symbols]

 21 Spectral Prism 22 Support Base 23 Solid-state Image Sensor 24 First Metal Fitting 25 Second Metal Fitting 24A, 25A Leg 26 Packing Member

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[Procedure amendment]

[Submission date] January 20, 1993

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be amended] Title of invention

[Correction method] Change

[Correction content]

Title: Solid-state imaging device

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be amended] Claims

[Correction method] Change

[Correction content]

[Claims]

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0001

[Correction method] Change

[Correction content]

[0001]

This invention relates to a CCD (Charge Cou
color using a solid-state image sensor such as a pled device)
The present invention relates to a solid-state image pickup device in a video camera.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0014

[Correction method] Change

[Correction content]

[0014]

As described above, the solid-state image pickup of the present invention is performed.
The image device includes a first metal fitting attached to the light exit surface of the spectral prism, and a second metal fitting to which the solid-state image sensor is fixed. The first metal fitting is formed around the first and second metal fittings. Since the solder resist layer is applied so that the molten metal adheres only to the facing surfaces of the legs, the welding is reliable when the solid-state image sensor is fixed at a predetermined position with respect to the light exit surface of the spectral prism. It has been effective in improving the workability.

Claims (1)

[Claims] 1. A first fitting fixed to a light exit surface of the spectral prism for mounting a plurality of solid-state imaging elements on a light exit portion of the spectral prism, and a second fitting to which the solid-state image sensor is fixed. The first and second metal fittings are provided.
Forming a plurality of legs close to each other on the periphery of the metal fitting, and applying a solder resist to the portions of the legs excluding the surfaces facing each other to form the first and second legs. An attachment device for a solid-state image pickup device, characterized in that they are joined together by a molten metal in a predetermined positional relationship.