JPH0622085B2 - Manufacturing method of shielded wire for insulation displacement connection - Google Patents

Manufacturing method of shielded wire for insulation displacement connection

Info

Publication number
JPH0622085B2
JPH0622085B2 JP63218761A JP21876188A JPH0622085B2 JP H0622085 B2 JPH0622085 B2 JP H0622085B2 JP 63218761 A JP63218761 A JP 63218761A JP 21876188 A JP21876188 A JP 21876188A JP H0622085 B2 JPH0622085 B2 JP H0622085B2
Authority
JP
Japan
Prior art keywords
cores
insulating
conductive
manufacturing
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63218761A
Other languages
Japanese (ja)
Other versions
JPH0268815A (en
Inventor
満男 紀本
英見 佐々木
薫 荒川
敏夫 鳴沢
光一 中島
英夫 松尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP63218761A priority Critical patent/JPH0622085B2/en
Publication of JPH0268815A publication Critical patent/JPH0268815A/en
Publication of JPH0622085B2 publication Critical patent/JPH0622085B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、圧接接続用シールド線の製造方法に関し、特
に端末加工性が改善された圧接接続用シールド線の製造
方法に関するものである。
Description: TECHNICAL FIELD The present invention relates to a method for manufacturing a shielded wire for pressure contact connection, and more particularly to a method for manufacturing a shielded wire for pressure contact connection with improved end workability.

[従来の技術] 従来、圧接接続用シールド線としては、導体外周に絶縁
体を被覆した絶縁コアの2本を並列配置した片側に接地
導体外周に導電性プラスチックを被覆した導電コアの1
本を並列配置し、それらの外周に1枚の金属テープを一
方の絶縁コア上でその両側部が接触するように縦添え被
覆してシールド層を形成し、そのシールド層の外周にプ
ラスチックを押出し被覆してジャケットを設けたものが
知られている。
[Prior Art] Conventionally, as a shielded wire for pressure contact connection, one of conductive cores in which two conductors of an insulating core coated with an insulator are arranged in parallel and one side of which is coated with conductive plastic on the outer periphery of a ground conductor is used.
Books are arranged side by side, and one metal tape is vertically attached to one of the insulating cores so that both sides of the insulating tape come into contact with each other to form a shield layer, and plastic is extruded on the outer periphery of the shield layer. It is known to cover and provide a jacket.

しかし、前記した従来の圧接接続用シールド線では、絶
縁コア間及び絶縁コアと導電コア間のシールド層の金属
テープ同志は単に重なり合って接触している状態の構造
であるため、その圧接接続用シールド線端末部のジャケ
ットを剥ぎ取る端末処理を行うと金属テープ同志が離れ
て隙間が発生し、各コア間のピッチが乱れその端末部に
圧接コネクタを接続できないという問題がある。
However, in the above-mentioned conventional shielded wire for pressure contact connection, since the metal tapes of the shield layers between the insulating cores and between the insulating core and the conductive core are in a state of simply overlapping and in contact with each other, the shield wire for pressure contact connection is provided. When the terminal treatment for stripping off the jacket of the wire end portion is performed, there is a problem that the metal tapes are separated from each other to form a gap, the pitch between the cores is disturbed, and the pressure contact connector cannot be connected to the end portion.

絶縁コア間及び絶縁コアと導電コア間のシールド層の金
属テープ同志の密着性を得るために、金属テープの重ね
合わせ部に打ち抜きローラを用いて所定間隔で打ち抜き
孔を形成し、この打ち抜き孔を介してプラスチックシー
スを連通一体化させることが提案されている。(特開昭
63−239712号公報)。
To obtain the adhesion of the metal tapes between the insulating cores and between the insulating cores and the conductive cores, the punching rollers are used to form punching holes at predetermined intervals in the overlapping parts of the metal tapes. It has been proposed to integrate and integrate a plastic sheath via the. (JP-A-63-239712).

[発明が解決しようとする課題] しかしながら、ローラを用いて打ち抜き孔を形成する方
法では、単に打ち抜き孔が形成されるだけであって、金
属テープ同志間の密着力は不十分であり、端末処理時に
おける金属テープ同志の離れを防止することは困難であ
ることが本発明者の検討結果、判明した。
[Problems to be Solved by the Invention] However, in the method of forming a punching hole by using a roller, the punching hole is simply formed, and the adhesive force between the metal tapes is not sufficient. As a result of the study by the present inventor, it was found that it is difficult to prevent the metal tapes from being separated from each other.

本発明は、前記した従来技術の欠点を改善し、金属テー
プ同志の密着性を向上させて端末加工性を大幅に改善す
ることができる圧接接続用シールド線の製造方法の提供
を目的とするものである。
It is an object of the present invention to provide a method for manufacturing a shielded wire for pressure contact connection, which is capable of improving the above-mentioned drawbacks of the prior art and improving the adhesiveness of metal tapes to each other and greatly improving the terminal processability. Is.

[課題を解決するための手段] 本発明の圧接接続用シールド線の製造方法は、シールド
層が絶縁コア間及び絶縁コアと導電コア間で金属テープ
を重ね合わせると共に、その重ね合わせ部にレーザー光
の投射により孔を設け、その孔にプラスチックを充填し
て構成したものである。
[Means for Solving the Problems] In the method for manufacturing a shielded wire for pressure contact connection according to the present invention, a shield layer overlaps metal tapes between insulating cores and between insulating cores and conductive cores, and a laser beam is applied to the overlapping portion. It is configured by forming a hole by the projection of and filling the hole with plastic.

シールド層は、厚さ18μm以下、伸び15%以上の銅
箔テープ、アルミ箔テープ等の金属テープを用いて形成
される。
The shield layer is formed using a metal tape such as a copper foil tape or an aluminum foil tape having a thickness of 18 μm or less and an elongation of 15% or more.

[作 用] 本発明は、金属テープの重ね合わせ部にレーザー光の投
射により孔を設けるものであるため、孔の周縁部はレー
ザー光の投射による熱によって金属テープ同志が溶着一
体化しており、この溶着一体化と孔へのプラスチック充
填とにより金属テープ間の密着力は大きく向上し、端末
部のジャケットを剥離する端末処理時でも金属テープ同
志の離れを防止でき、各コア間のピッチが乱れず圧接コ
ネクタを容易に接続することが可能となり、端末加工性
を大幅に改善することができる。
[Operation] In the present invention, since holes are provided in the overlapping portion of the metal tapes by projecting laser light, the metal tapes are welded and integrated at the peripheral portion of the holes by the heat generated by the laser light projections. This welding integration and the filling of the holes with plastic greatly improve the adhesion between the metal tapes, preventing the metal tapes from separating from each other even during terminal processing for peeling the jacket of the terminal part, and the pitch between cores is disturbed. It is possible to easily connect the press-connecting connector without using it, and the workability of the terminal can be greatly improved.

[実施例] 第1図は本発明によって得られる圧接接続用シールド線
の一例を示すものであり、第2図は本発明の圧接接続用
シールド線の製造方法の一実施例を示すものである。
[Examples] FIG. 1 shows an example of a pressure-welding shielded wire obtained by the present invention, and FIG. 2 shows an embodiment of a method for producing a pressure-contacting shielded wire of the present invention. .

1は導体、2は絶縁体、3、4は絶縁コア、5は接地導
体、6は導電性プラスチック、7は導電コア、8は銅箔
テープ、9はシールド層、10は孔、11はジャケッ
ト、11は圧接接続用シールド線、13、14、15、
16は送出機、17はガイドロール、18は銅箔フォー
ミング器、19はレーザー孔開装置、20はレーザー発
振器、21、23はレーザー投射器、22はYAGレー
ザー光、24は押出機、25は引取機、26は巻取機で
ある。
1 is a conductor, 2 is an insulator, 3 and 4 is an insulating core, 5 is a ground conductor, 6 is a conductive plastic, 7 is a conductive core, 8 is a copper foil tape, 9 is a shield layer, 10 is a hole, and 11 is a jacket. , 11 are shielded wires for pressure contact connection, 13, 14, 15,
16 is a feeder, 17 is a guide roll, 18 is a copper foil forming device, 19 is a laser hole punching device, 20 is a laser oscillator, 21 and 23 are laser projectors, 22 is YAG laser light, 24 is an extruder, and 25 is The take-up machine and 26 are take-up machines.

導体1は錫メッキ軟銅線からなり、この導体1の外周に
はポリエチレン等の絶縁体2が押出被覆され、絶縁コア
3、4が形成される。接地導体5は錫メッキ軟銅線から
なり、この接地導体5の外周には導電性ポリ塩化ビニル
等の導電性プラスチック6がその接地導体5表面の一部
を露出するように押出被覆され、導電コア7が設けられ
る。シールド層9は厚さ18μm以下、伸び15%以上
の銅箔テープ8からなり、並列配置した2本の絶縁コア
3、4とその絶縁コア4に片側に設けた導電コア7との
外周にその銅箔テープ8の両側部が絶縁コア3上で接触
するように縦添え被覆し、かつ、絶縁コア3、4間及び
絶縁コア4と導電コア7間でその銅箔テープ8を重ね合
わせると共に、その重ね合わせ部に孔10を設け、その
孔10にはポリ塩化ビニル等のプラスチックを充填し銅
箔テープ8同志を密着一体化している。このとき、この
孔10へのプラスチックの充填はシールド層9の外周に
ジャケット11を被覆するのと同時に行われる。更に、
露出された接地導体5はシールド層9の銅箔テープ8と
接触するように設けられる。ジャケット11はポリ塩化
ビニル等のプラスチックからなり、シールド層9の外周
に押出し被覆して設けられる。
The conductor 1 is made of tin-plated annealed copper wire, and the outer periphery of the conductor 1 is extrusion-coated with an insulator 2 such as polyethylene to form insulating cores 3 and 4. The ground conductor 5 is made of tin-plated annealed copper wire, and a conductive plastic 6 such as conductive polyvinyl chloride is extrusion-coated on the outer periphery of the ground conductor 5 so as to expose a part of the surface of the ground conductor 5 to form a conductive core. 7 is provided. The shield layer 9 is made of a copper foil tape 8 having a thickness of 18 μm or less and an elongation of 15% or more, and is provided on the outer periphery of two insulating cores 3 and 4 arranged in parallel and a conductive core 7 provided on one side of the insulating core 4. The copper foil tape 8 is vertically covered so that both sides contact with each other on the insulating core 3, and the copper foil tape 8 is overlapped between the insulating cores 3 and 4 and between the insulating core 4 and the conductive core 7. A hole 10 is provided in the overlapping portion, and the hole 10 is filled with a plastic such as polyvinyl chloride so that the copper foil tapes 8 are closely adhered to each other. At this time, the filling of the plastic into the holes 10 is carried out at the same time as the outer circumference of the shield layer 9 is covered with the jacket 11. Furthermore,
The exposed ground conductor 5 is provided so as to come into contact with the copper foil tape 8 of the shield layer 9. The jacket 11 is made of plastic such as polyvinyl chloride, and is provided by extrusion coating on the outer periphery of the shield layer 9.

各々の送出機13、14、15から繰り出された2本の
絶縁コア3、4とその絶縁コア4の片側の導電コア7は
ガイドロール17により長手方向に並列に配置され、銅
箔フォーミング器18に導かれる。銅箔フォーミング器
18は送出機16から繰り出されガイドロール17を通
った1枚の銅箔テープ8をその並列配置された絶縁コア
3、4と導電コア7との外周にその銅箔テープ8の両側
部がその絶縁コア3上で接触するように縦添え被覆する
と共に、その絶縁コア3、4間及び絶縁コア4と導電コ
ア7間でその銅箔テープ8を重ね合わせる。このとき、
導電性プラスチック6から露出された接地導体5は銅箔
テープ8と接触するように被覆される。そして、その銅
箔テープ8で被覆され、重ね合わせ部を有する絶縁コア
3、4と導電コア7は初めに、ガイドロール17を通り
レーザー孔開装置19のレーザー発振器20から発振さ
れレーザー投射器21から投射されたYAGレーザー光
22により、その絶縁コア4と導電コア7間の重ね合わ
せ部及び絶縁コア3と4間の重ね合わせ部の銅箔テープ
8に間歇的に孔10が設けられ、ガイドロール17を通
過する。次に、孔10が設けられたシールド層9の外周
にポリ塩化ビニル等のプラスチックを押出機24で押出
し、ジャケット11が被覆される。このとき、その孔1
0にジャケット11のプラスチックが充填される。ジャ
ケット11を被覆された圧接接続用シールド線12は引
取機25に引取られ巻取機26で巻取られる。
The two insulating cores 3, 4 and the conductive cores 7 on one side of the insulating cores 4 fed from the respective feeders 13, 14, 15 are arranged in parallel in the longitudinal direction by a guide roll 17, and a copper foil forming device 18 is provided. Be led to. In the copper foil forming device 18, one copper foil tape 8 fed from the feeder 16 and passed through the guide roll 17 is provided around the insulating cores 3 and 4 and the conductive core 7 arranged in parallel with each other. The copper foil tape 8 is vertically covered so that both sides are in contact with each other on the insulating core 3, and the copper foil tape 8 is overlapped between the insulating cores 3 and 4 and between the insulating core 4 and the conductive core 7. At this time,
The ground conductor 5 exposed from the conductive plastic 6 is coated so as to come into contact with the copper foil tape 8. Then, the insulating cores 3 and 4 and the conductive core 7 which are covered with the copper foil tape 8 and have overlapping portions are first passed through the guide roll 17 and oscillated from the laser oscillator 20 of the laser hole punching device 19 and the laser projector 21. Holes 10 are intermittently provided in the copper foil tape 8 in the overlapping portion between the insulating core 4 and the conductive core 7 and the overlapping portion between the insulating cores 3 and 4 by the YAG laser light 22 projected from the guide. Pass the roll 17. Next, a plastic such as polyvinyl chloride is extruded by an extruder 24 on the outer periphery of the shield layer 9 having the holes 10 to cover the jacket 11. At this time, the hole 1
0 is filled with the plastic of the jacket 11. The pressure welding connecting shield wire 12 covering the jacket 11 is taken up by the take-up machine 25 and taken up by the take-up machine 26.

このように、銅箔テープの重ね合わせ部にレーザー光の
投射によって孔を間歇的に設けることにより銅箔テープ
同志が溶着一体化され、更に、その孔をプラスチックで
充填することにより銅箔テープ同志の密着力が一段と向
上し、圧接接続用シールド線端末部のジャケットを剥離
する端末処理作業においても銅箔テープ同志の離れを防
止でき、各コア間のピッチが乱れず圧接コネクタを容易
に接続することが可能となり、端末加工性を大幅に改善
することができる。
In this way, the copper foil tapes are welded and integrated by intermittently providing holes in the overlapping portions of the copper foil tapes by projecting laser light, and by filling the holes with plastic, the copper foil tapes are joined together. The adhesive strength of the copper foil tape is further improved, and the copper foil tapes can be prevented from separating from each other even in the terminal processing work for peeling the jacket of the end portion of the shield wire for pressure contact connection, and the pressure contact connector can be easily connected without disturbing the pitch between cores. This makes it possible to significantly improve the terminal processability.

なお、本発明の実施例では、並列配置した2本の絶縁コ
アの片側にのみ導電コアを配置した製造方法を説明した
が、導電コアを中央に設けその両側に絶縁コアを並列配
置する製造方法でも良い。
In the embodiment of the present invention, the manufacturing method in which the conductive core is arranged only on one side of the two insulating cores arranged in parallel has been described. However, the manufacturing method in which the conductive core is provided in the center and the insulating cores are arranged in parallel on both sides thereof. But good.

[発明の効果] 以上説明してきたように本発明の圧接接続用シールド線
の製造方法は、絶縁コア間及び絶縁コアと導電コア間で
金属テープを重ね合わせると共に、その重ね合わせ部に
レーザー光の投射によって孔を設け、その孔をプラスチ
ックを充填したことにより金属テープ同志の密着力が著
しく向上し、圧接接続用シールド線端末部のジャケット
を剥離する端末処理作業において金属テープ同志の離れ
を防止でき、各コア間のピッチが乱れず圧接コネクタを
容易に接続することが可能となり、端末加工性を大幅に
改善することができるという効果が発揮される。
[Effects of the Invention] As described above, in the method for manufacturing a shielded wire for pressure contact connection of the present invention, the metal tapes are overlapped between the insulating cores and between the insulating cores and the conductive cores, and the overlapping portion of the laser light By forming a hole by projection and filling the hole with plastic, the adhesion of the metal tapes can be significantly improved, and the metal tapes can be prevented from separating during the terminal processing work of peeling the jacket of the end part of the shield wire for pressure contact connection. Since the pitch between the cores is not disturbed, the press-connecting connector can be easily connected, and the end workability can be greatly improved.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明により得られる圧接接続用シールド線の
一例を示す断面説明図であり、第2図は本発明の圧接接
続用シールド線の製造方法の概略説明図である。 1:導体、 2:絶縁体 3、4:絶縁コア、 5:接地導体 6:導電性プラスチック、 7:導電コア 8:銅箔テープ、 9:シールド層 10:孔、11:ジャケット 12:圧接接続用シールド線、13、14、15、16:送出機線 17:ガイドロール 18:銅箔フォーミング器、19:レーザー孔開装置 20:レーザー発振器、21、23:レーザー投射器 22:YAGレーザー光、24:押出機 25:引取機、26:巻取機
FIG. 1 is a cross-sectional explanatory view showing an example of a pressure-contacting shielded wire obtained by the present invention, and FIG. 2 is a schematic explanatory view of a method for manufacturing the pressure-contacting shielded wire of the present invention. 1: Conductor, 2: Insulator 3, 4: Insulating core, 5: Ground conductor 6: Conductive plastic, 7: Conductive core 8: Copper foil tape, 9: Shield layer 10: Hole, 11: Jacket 12: Press connection Shield wire, 13, 14, 15, 16: Sending machine wire 17: Guide roll 18: Copper foil forming device, 19: Laser hole punching device 20: Laser oscillator, 21, 23: Laser projector 22: YAG laser light, 24: Extruder 25: Take-up machine, 26: Take-up machine

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鳴沢 敏夫 茨城県日立市日高町5丁目1番1号 日立 電線株式会社日高工場内 (72)発明者 中島 光一 茨城県日立市日高町5丁目1番1号 日立 電線株式会社日高工場内 (72)発明者 松尾 英夫 茨城県日立市日高町5丁目1番1号 日立 電線株式会社日高工場内 (56)参考文献 特開 昭63−239712(JP,A) 実開 昭59−91614(JP,U) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshio Narusawa 5-1-1 Hidaka-cho, Hitachi City, Ibaraki Prefecture Hitachi Cable Co., Ltd. Hidaka Plant (72) Inventor Koichi Nakajima 5 Hidaka-cho, Hitachi City, Ibaraki Prefecture 1-1-1 Hitachi Cable Co., Ltd. Hidaka Plant (72) Inventor Hideo Matsuo 5-1-1 Hidakacho, Hitachi City, Ibaraki Hitachi Cable Co., Ltd. Hidaka Plant (56) Reference JP-A-63 -239712 (JP, A) Actual development Sho 59-91614 (JP, U)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】導体外周を絶縁体で被覆した2本の絶縁コ
アと接地導体外周を導電性プラスチックで被覆した1本
の導電コアとを長手方向に並列配置し、その絶縁コアと
導電コアとの外周に1枚の金属テープのシールド層をそ
の金属テープの両側部が接触するように縦添え被覆し、
そのシールド層の外周にプラスチックのジャケットを押
出し被覆する圧接接続用シールド線の製造方法におい
て、前記絶縁コア間及び前記絶縁コアと導電コア間の前
記金属テープを重ね合わせると共に、当該重ね合わせ部
にレーザー光を投射して孔を設け、当該孔を前記プラス
チックで充填することを特徴とする圧接接続用シールド
線の製造方法。
1. Two insulating cores whose outer conductors are covered with an insulator and one conductive core whose outer conductors are covered with a conductive plastic are arranged in parallel in the longitudinal direction, and the insulating cores and the conductive cores are arranged. A shield layer of a metal tape is vertically attached to the outer periphery of the metal tape so that both sides of the metal tape come into contact with each other.
In a method for manufacturing a shield wire for pressure contact connection in which a plastic jacket is extruded and covered on the outer periphery of the shield layer, the metal tapes between the insulating cores and between the insulating cores and the conductive cores are overlapped with each other, and a laser is applied to the overlapped portion. A method of manufacturing a shield wire for pressure contact connection, which comprises projecting light to form a hole and filling the hole with the plastic.
JP63218761A 1988-09-01 1988-09-01 Manufacturing method of shielded wire for insulation displacement connection Expired - Lifetime JPH0622085B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63218761A JPH0622085B2 (en) 1988-09-01 1988-09-01 Manufacturing method of shielded wire for insulation displacement connection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63218761A JPH0622085B2 (en) 1988-09-01 1988-09-01 Manufacturing method of shielded wire for insulation displacement connection

Publications (2)

Publication Number Publication Date
JPH0268815A JPH0268815A (en) 1990-03-08
JPH0622085B2 true JPH0622085B2 (en) 1994-03-23

Family

ID=16724988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63218761A Expired - Lifetime JPH0622085B2 (en) 1988-09-01 1988-09-01 Manufacturing method of shielded wire for insulation displacement connection

Country Status (1)

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JP (1) JPH0622085B2 (en)

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JP3425516B2 (en) * 1997-09-11 2003-07-14 株式会社オートネットワーク技術研究所 Apparatus for manufacturing insulation displacement wire

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JPS5991614U (en) * 1982-11-15 1984-06-21 平河電線株式会社 Shielded wire
JPS63239712A (en) * 1988-03-04 1988-10-05 平河電線株式会社 Manufacture of wire with shield

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