JPH06224331A - IC socket - Google Patents

Abstract

(57) [Abstract] [Purpose] I mounted on a circuit board by mounting IC parts
When the C socket is mounted on a circuit board, it has sufficient connection strength for mounting / dismounting of mounted IC components, and also reduces the number of through holes in the circuit board. It is possible to increase the mounting area surface of a component. [Structure] An insulating support 2 having a plurality of pairs of electrode terminals 3 for electrically connecting to input / output electrode pads of mounted IC components, and electrode terminals on the surface of the insulating support 2. 3 is provided with lead terminals 9a and 9b, one end of which is electrically connected to the other and the other end of which is electrically connected to a wiring board that is led out from the insulating support 2 and is mounted. It can be connected / fixed by a through hole formed in the circuit board and is led out almost vertically to the lower surface side of the insulating support 2, and the other part 9b is insulated so that it can be connected to the connection pad surface of the circuit board surface. It is characterized in that it has a structure led out to the side surface side of the sexual support 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket,
Especially used for mounting and mounting IC parts on the wiring board surface.
Regarding the C socket.

[0002]

2. Description of the Related Art Generally, it is expensive or mounted,
Electronic components whose design is expected to change are often mounted on a circuit board via sockets. In other words, mounting and mounting the electronic parts for mounting via the socket can be done more easily without damaging the electronic parts for mounting than mounting or mounting the electronic parts for mounting directly on the circuit board. Because. A semiconductor IC component (IC element) does not leak to this example, and may be mounted on a circuit board (printed wiring board) via a socket called an IC socket. Figure 3
1 is a perspective view of a conventionally known IC socket 1, in which an input / output pad or a lead wire of an IC component (including a package type) is electrically connected to an upper surface of an insulating support (socket body) 2. A plurality of pairs of electrode terminals 3 to be electrically connected are arranged to face each other with a predetermined interval.
Further, lead terminals 4 which can be inserted and fixed to the through-hole connecting portions of the circuit board to be mounted are connected to the electrode terminals 3 so as to penetrate the insulating support (socket body) 2, respectively, so that the insulating properties are improved. It projects (leads out) almost vertically from the lower surface of the support 2.

FIG. 4 is a sectional view showing a state in which the IC socket 1 having the above structure is mounted on the circuit board 5.
The lead terminals 4 of the IC socket 1 on which components (not shown) are mounted are respectively inserted into a plurality of through holes 6 formed at predetermined positions of the circuit board 5 and electrically connected by solder 7. It is mechanically fixed.

[0004]

However, in the IC socket 1 having the above structure, when the IC socket 1 is mounted on the circuit board 5, the same number of through holes 6 as the lead terminals 4 of the IC socket 1 are formed in the circuit board 5. Because it must be
There is a problem that not only the mounting area of other electronic components on the back surface of the circuit board 5 is significantly restricted, but also the area where the wiring pattern can be formed is reduced.

The present invention has been made to solve these problems, and when mounted on a wiring board, the mounted I
It has a sufficient connection strength for attachment / detachment of the C component, and can reduce the number of through holes formed in the circuit board, thereby increasing the mounting area of the wiring pattern and other components. The purpose is to provide an IC socket.

[0006]

An IC socket according to the present invention has a plurality of pairs of electrode terminals for electrically connecting to input / output electrode pads (including input / output lead wires) of mounted IC parts. An insulative support provided on the upper surface and a lead whose one end is electrically connected to the electrode terminal on the insulative support surface and the other end is electrically connected to a circuit board led out from the insulative support and mounted. And a part of the lead terminal is connected by a through hole formed in the circuit board.
The structure is such that it can be fixed and is led out almost vertically to the lower surface side of the insulating support, and the other part is led out to the side surface side of the insulating support so that it can be connected to the connection pad surface of the circuit board surface. It is characterized by

[0007]

In the IC socket of the present invention, a plurality of lead terminals, which are electrically and mechanically connected to each other through the through holes of the circuit board and are involved in firmly fixing the entire socket, and formed on the main surface of the circuit board. Since each of them has a plurality of lead terminals for electrically connecting to the connected connection pad, the number of through holes in the circuit board for mounting is reduced, and when mounted on the circuit board, it is mounted. I
Sufficient connection strength is maintained for mounting and removing C parts. Therefore, the surface of the circuit board on which the wiring pattern is formed and the surface of the electronic component on which the electronic component is mounted are increased, and high-density mounting can be realized.

[0008]

Embodiments of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view showing an essential part of a structural example of an IC socket 8 according to the present invention. In the figure, reference numeral 2 denotes an insulating support base, and an input / output lead wire of an IC component such as an IC package is provided on the upper surface of the insulating support base 2.
Alternatively, a plurality of pairs of electrode terminals 3 to which the input / output pads of the IC element are electrically connected are arranged and buried so as to face each other at predetermined intervals. A part of them, for example, the electrode terminals 3 arranged at the front and rear ends on both sides are connected to lead terminals 9a each having a shape that can be inserted into a through hole formed in the circuit board. The lead terminal 9a penetrates through the insulating support base 2 and projects (leads out) substantially vertically from the lower surface. In addition, to the electrode terminals 3 arranged at the central portions on both sides other than the above, for example, a gull wing-shaped lead 9b is connected so as to be connectable to the connection pad surface formed on the main surface of the circuit board, and protrudes to the side surface side ( Has been derived).

FIG. 2 shows the IC socket 8 having the above-mentioned structure,
FIG. 2 is a cross-sectional view showing a state of being mounted on a required circuit board 5, in which a pin-shaped lead terminal 9a of the IC socket 8 is provided in a plurality of through holes 6 formed at predetermined positions of the circuit board 5. It is inserted, electrically connected by solder 7 and mechanically fixed. Further, the gull wing-shaped lead terminals 9 b are respectively brought into contact with the surfaces of the plurality of connection pads 10 formed on the upper surface of the circuit board 5, and are connected via the solder 7.

The IC socket 8 of the embodiment having the above structure is
When mounted on the circuit board 5, the plurality of gull wing-shaped lead terminals 9b are connected to the connection pads on the circuit board 5, respectively.
Since the solder 7 is attached on the surface 10, the through holes 6 for these are unnecessary. Therefore, it is possible to increase the area surface of the circuit board 5 where components can be mounted.
In addition, a plurality of pin-shaped lead terminals 9a symmetrically arranged at both ends of the row of gull-wing-shaped lead terminals 9b.
, Respectively, are inserted into corresponding through holes 6 of the circuit board 5 and are connected and fixed by the solder 7. Therefore, a mechanically sufficient connection can be made for mounting / dismounting of IC components mounted on the IC socket 8. The strength is maintained, it does not come off from the circuit board 5, no reinforcing work such as screwing is required, and no extra parts are required.

[0012]

As described above, according to the IC socket of the present invention, the number of through holes formed in the circuit (wiring) board on which it is mounted can be greatly reduced. Therefore, both sides of the circuit board can be effectively used, and the range in which the wiring pattern can be routed during pattern design can be widened. Moreover, since the mounting area of the components is increased, the mounting density can be improved. Further, the I mounted on the circuit board is mounted.
Even if the C component is attached or detached, it does not come off because it has sufficient connection strength to the circuit board.

[Brief description of drawings]

FIG. 1 is a perspective view showing a main part of a configuration example of an IC socket according to the present invention.

FIG. 2 is a sectional view schematically showing a state in which the IC socket shown in FIG. 1 is mounted on a circuit board.

FIG. 3 is a perspective view showing a configuration of a conventional IC socket.

FIG. 4 is a sectional view schematically showing a state in which the IC socket shown in FIG. 3 is mounted on a circuit board.

[Explanation of symbols]

1, 8 ... IC socket 2 ... Insulating support (socket body) 3 ... Electrode terminal 4, 9a ... Pin-shaped lead terminal (lead terminal led out substantially vertically to the lower surface side) 5 ... Circuit board 6 ... Through hole 7 … Solder 9b
… Gull wing-shaped lead terminal (lead terminal led out to the side) 10… Connecting pad.

Claims (1)

[Claims] 1. An insulating support having a plurality of pairs of electrode terminals provided on the upper surface for electrically connecting to input / output electrode pads of an IC component to be mounted, and one end of the insulating support on the surface of the insulating support. Are electrically connected to each other, and the other end is electrically connected to a wiring board which is led out from the insulating support and mounted on the wiring board, and a part of the lead terminal is a through hole formed in the circuit board. It was led out almost vertically to the lower surface side of the insulative support so that it could be connected and fixed in the hole, and part of the other part was led out to the side surface side of the insulative support so that it could be connected to the connection pad surface on the circuit board surface. An IC socket characterized by having a structure.