JPH06224347A - Lead shaping apparatus - Google Patents

Abstract

PURPOSE:To facilitate positioning of a dice and a punch by placing a semiconductor device on a lower mold, and folding and shaping a lead with the lower metal mold and an upper metal mold, pressing cladding resin of the semiconductor device and the root of the lead with a lowering pad. CONSTITUTION:A semiconductor device 1 is placed on the upper surface of a punch 22 of a lower metal mold 20. Once cladding resin 2 is accommodated in a recess 26, an upper metal mold 21 is lowered. First, the cladding resin 2 of the semiconductor device 1 and the root of leads 3, 3,... are pressed with a pad 23, and are fixed together with the lower metal mold 20, and then a dice 24 is lowered to fold the leads 3, 3,... and shape the same with use of the punch 22. Since outer surfaces 25, 25,... of the punch 22 and inner surfaces 27, 27,... of the dice 24 are formed into tapered shapes, the dice 24 is pushed down and folded from a folding location of the leads 3, 3,... most separated from the dice 24. For this, an interval between the lower metal mold 20 and the dice 24 becomes wider to prevent the leads 3, 3,... from being pulled out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead shaping device for shaping leads of a flat package type resin mold type semiconductor device in which leads are led out in four directions from an exterior resin.

[0002]

2. Description of the Related Art A resin-molded semiconductor device (1) of a flat package in which leads (3), (3) ... Are led out from four directions of a surface mounting component such as an exterior resin (2).
Is a lead (3) which is led out as shown in FIGS. 7 and 8.
(3) ... is bent into a crank shape, and its tip (3a)
(3a) ... are bent horizontally and aligned in the same plane.

The shaping of the leads (3) (3) ... Of the semiconductor device (1) is performed by shaping the leads including a lower die (4) and an upper die (5) as shown in FIGS. 9 and 10. It is done by the device. In the lead shaping device, a punch (6) is provided on a lower die (4), and a pad (7) and a die (10) are provided on an upper die (5). Punch (6) is lead (3)
(3) The outer surfaces (11) (11) of four sides are formed as vertical surfaces with a height corresponding to the bending height of (3), and a recess (12) for accommodating the exterior resin (2) is formed on the upper surface. Has been formed. On the other hand, the pad (7) has an exterior resin (2) and leads (3) (3) ...
A recess (14) for accommodating the exterior resin (2) is formed on the lower surface with a size capable of holding down the root of the. Dice (1
0) is a rectangular tube shape slightly larger than the punch (6) and has inner side surfaces (13) (13) ... The pad (7) is supported by the upper die (5) so as to be able to move up and down relatively, and the die (10) is moved up and down together with the upper die (5). ) Is the die (1
0) so as to project downward.

In this lead shaping device, the semiconductor device (1) is placed on the punch (6) of the lower mold (4), and the upper mold (5) is lowered to first mount the semiconductor device (1) on the upper mold (5). The pad (7) holds down the exterior resin (2) of the semiconductor device (1) and the roots of the leads (3) (3) ... And the leads (3) (3) ... Is shaping.

The lead shaping device described above forms the outer side surfaces (11) (11) of the punch (6) and the inner side surfaces (13) (13) of the die (10) into vertical planes, and also forms the die (1).
0) is lowered vertically, so the lead (3)
The clearance between the punch (6) and the die (10) is important for accurately shaping (3). However, due to the tolerance between the die (10) and the punch (6) or the variation in the thickness of the leads (3) (3) ..., the clearance for the leads (3) (3) ... 3) (3) may be handled improperly and may break in thin leads.

Therefore, conventionally, thin leads (3) (3) ...
When shaping is performed, as shown in FIG. 11 and FIG. 12, the dice (10) is divided into four, and each die (10) is made independent.
(10) ... descending in an oblique direction from the outer side to the inner side as the upper die (5) descends, and the leads (3) (3).
The shaping is performed by pressing the ... against the outer side surfaces (11) (11) of the punch (6).

[0007]

The lead shaping device can solve the problem of clearance. However, since the four dice (10) (10) ... Are operated independently, misalignment and inclination are likely to occur, and the four dice (1
It was difficult to operate 0), (10), ... Accurately, and poor shaping often occurred.

That is, since the four dice (10) (10) are independently positioned, the dice (10) (1)
0) ... sometimes caused a positional deviation. Further, even if the respective dies (10) (10) ... Are similarly lowered, due to the tolerance of the guide mechanism (not shown) and the like, the lowered position is displaced, the shaping state is unstable, and the leads (3) (3). ) ... tip (3
The heights of a), (3a), ... May be uneven, and the leads (3), (3) ,.

The present invention is intended to provide a lead shaping device which can easily position a die and a punch and can perform shaping without handling the leads.

[0010]

A lead shaping device according to the present invention accommodates an exterior resin of a resin mold type semiconductor device in which leads are led out in four directions from an exterior resin, and an outer periphery supporting a root of the lead is downward. A lower die formed in a tapered shape with a skirt extending toward it, a pad for pressing the exterior resin and the root of the lead on the lower die, and the lead being pressed by the inner peripheral surface of the lower end opening to the lower die. And a cylindrical upper mold for performing the above.

Further, the lead shaping device of the present invention accommodates the exterior resin of the resin-molded semiconductor device in which the leads are led out from the exterior resin in four directions, and supports the root of the lead, and is an ascendable and descendable product receiver. Insert the receiver,
A lower mold whose inner peripheral surface expands toward the upper end opening, and a lower mold that accommodates the exterior resin of the semiconductor device at the lower end surface and presses the root of the lead against the product receiver, and the outer peripheral surface lowers the lead. And an upper die which is pressed against the inner peripheral surface of the mold.

[0012]

In the lead shaping device according to the first aspect of the present invention, the semiconductor device is placed on the lower mold, and while lowering the exterior resin of the semiconductor device and the root of the lead by the descending pad, the lower mold and the upper mold are pressed. Use and to bend the lead and perform shaping.

The lead shaping device according to the second invention is
The semiconductor device is placed on the product receiver provided in the lower mold, and the lower mold and the product receiver descend while sandwiching the outer resin of the semiconductor device and the root of the lead, and the upper mold and the lower mold are separated. Bend the lead with.

In any of the lead shaping devices, the outer surface of the upper die for bending the leads and the inner surface of the lower die are formed in a taper shape. The mold has a large clearance and does not handle the leads.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.

The lead shaping device shown in FIGS. 1 to 3 comprises a lower mold (20) and an upper mold (21), and the lower mold (2
0) supporting the semiconductor device (1) and leads (3) (3)
A punch (22) for shaping ... is provided, and the upper die (21)
Is provided with a pad (23) for pressing the semiconductor device (1) and a die (24) for bending the leads (3) (3).

The punch (22) provided in the lower mold (20) is a rectangular support, and the upper surface is the base of the exterior resin (2) and leads (3) (3) ... Of the semiconductor device (1). It is formed in a quadrangle having a supporting size, and the outer side surfaces (25), (25) ... Further, a recess (26) for accommodating the exterior resin (2) of the semiconductor device (1) is formed on the upper surface of the punch (22).

The pad (23) has such a size as to hold the bases of the exterior resin (2) and the leads (3) (3) ... Of the semiconductor device (1), and the bottom surface of the exterior resin (2) of the semiconductor device (1). There is a recess (30) to accommodate the. Meanwhile dice (24)
Is a rectangular cylinder having a space larger than the punch (22) provided in the lower mold (20), and the inner surface (27) (27) ...
Has a taper with the same inclination as the outer side surfaces (25) (25) of the punch (22). The dice (2
4) is attached to the upper mold (21) and the pad (23)
Is supported by an upper die (21) so as to be able to move up and down relatively. And when the upper mold (21) rises, the pad (23)
Projects below the die (24) and enters the die (24) as the upper die (21) descends.

In the lead shaping device, the semiconductor device (1) is placed on the upper surface of the punch (22) of the lower mold (20),
When the exterior resin (2) is housed in the recess (26), the upper mold (21) is lowered, and first, the exterior resin (2) and the leads (3) of the semiconductor device (1) are first moved by the pad (23). (3) Press the base of the die and fix it with the lower die (20), and then the die (24) descends to bend the leads (3) (3).
Shape with punch (22).

In the lead shaping device, the outer side surfaces (25) (25) of the punch (22) and the inner side surfaces (27) (27) of the die (24) are formed in a tapered shape.
Since the die (24) is bent by pushing down from the farthest bending position (a) of the leads (3) (3) ... As shown in Fig. 5, the distance between the lower die (20) and the die (24) is wide. , Lead (3) (3) ... are not handled.

5 and 6 show another embodiment.
The lower die (20) is provided with a product receiver (15) for supporting the semiconductor device (1) and a die (24), and the upper die (2).
The semiconductor device (1) is pressed onto the lead (1) and the leads (3) (3) ...
A punch (22) for shaping the is provided. In this embodiment, the relationship between the die (24) and the punch (22) is the reverse of the above embodiment.

The product receiver (3) provided on the lower mold (20)
1) is formed in a size that supports the exterior resin (2) of the semiconductor device (1) and the roots of the leads (3) (3) ... And accommodates the exterior resin (2) of the semiconductor device (1) on the upper surface. An indentation (32) is formed. The product receiver (31) is supported so as to be able to move up and down, projects upward from the die (24) when not shaped, and is pushed down by the punch (22) to descend.

The lead shaping device is provided with a product receiver (31).
When the semiconductor device (1) is placed on the upper die (21)
Are lowered, and the punch (22) and the product receiver (31) cause the exterior resin (2) and the leads (3) and (3) of the semiconductor device (1).
Then, the punch (22) and the product receiver (31) are lowered to push the semiconductor device (1) into the die (24), and the punch (22) and the die (2) are fixed.
4) and the leads (3), (3) ... Are bent and shaped.

[0024]

According to the present invention, since the outer side surface of the punch and the inner side surface of the die for shaping the leads of the semiconductor device are inclined, the clearance between them is large, and tolerances and variations in lead thickness are eliminated. It is not affected and the leads are not treated improperly and broken. Further, since the die is a rectangular tube and is integrally formed, positioning is easy, and since the die is vertically moved up and down, the final descending positions are all the same, and the lead shaping state is stable. Therefore, even a semiconductor device in a flat package having leads with an extremely thin thickness can be reliably shaped.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a lead shaping device according to a first invention.

FIG. 2 is a cross-sectional view showing a state during lead shaping by the lead shaping apparatus of FIG.

3 is a bottom view showing a die of the lead shaping device of FIG. 1. FIG.

FIG. 4 is a sectional view showing the features of the present invention.

FIG. 5 is a sectional view of a lead shaping device according to a second invention.

6 is a cross-sectional view showing a state of the lead shaping apparatus of FIG. 5 during lead shaping.

FIG. 7 is a plan view showing a semiconductor device in a flat package.

FIG. 8 is a side view showing a semiconductor device in a flat package.

FIG. 9 is a sectional view of a conventional lead shaping device.

10 is a cross-sectional view showing a state of the lead shaping apparatus of FIG. 9 during lead shaping.

FIG. 11 is a plan view of another conventional lead shaping device.

12 is a cross-sectional view of the lead shaping device of FIG.

[Explanation of symbols]

 20 Lower mold 21 Upper mold 22 Punch 23 Pad 24 Die 25 Outer surface 27 Inner surface 30 Product receiver

Claims (2)

[Claims] 1. A taper-shaped lower part of an outer periphery for accommodating the exterior resin of a resin-molded semiconductor device in which leads are led out in four directions from the exterior resin and supporting the roots of the leads as it extends downward. It comprises a mold, a pad for pressing the exterior resin and the root of the lead on the lower mold, and a cylindrical upper mold for pressing the lead against the lower mold at the inner peripheral surface of the lower end opening to shape the lead. Lead shaping device characterized by. 2. A vertically movable product receiver for accommodating the exterior resin of a resin mold type semiconductor device in which leads are led out in four directions from the exterior resin and for supporting the root of the lead, and the product receiver is inserted through the inner periphery. The lower die has a surface that expands toward the upper end opening, and the lower end accommodates the exterior resin of the semiconductor device and the root of the lead is pressed against the product receiver. A lead shaping device, comprising: an upper die that is pressed against the peripheral surface to be molded.