JPH062298B2 - Binder resin composition for foundry sand - Google Patents
Binder resin composition for foundry sandInfo
- Publication number
- JPH062298B2 JPH062298B2 JP15555485A JP15555485A JPH062298B2 JP H062298 B2 JPH062298 B2 JP H062298B2 JP 15555485 A JP15555485 A JP 15555485A JP 15555485 A JP15555485 A JP 15555485A JP H062298 B2 JPH062298 B2 JP H062298B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- metal
- resin
- resin composition
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011342 resin composition Substances 0.000 title claims description 21
- 239000011230 binding agent Substances 0.000 title claims description 20
- 239000004576 sand Substances 0.000 title claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 claims description 18
- 239000000203 mixture Substances 0.000 claims description 17
- 229910052783 alkali metal Inorganic materials 0.000 claims description 13
- 150000001340 alkali metals Chemical class 0.000 claims description 13
- 150000002978 peroxides Chemical class 0.000 claims description 12
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims description 11
- 150000001342 alkaline earth metals Chemical class 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 8
- 239000003110 molding sand Substances 0.000 claims description 5
- 239000007800 oxidant agent Substances 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 4
- 229910021645 metal ion Inorganic materials 0.000 claims description 3
- 229910052788 barium Inorganic materials 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 229910052700 potassium Inorganic materials 0.000 claims description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011575 calcium Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 239000011777 magnesium Substances 0.000 claims 1
- 239000011591 potassium Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 24
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 238000006243 chemical reaction Methods 0.000 description 9
- -1 Acrylic ester Chemical class 0.000 description 7
- 238000004898 kneading Methods 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- XPFVYQJUAUNWIW-UHFFFAOYSA-N furfuryl alcohol Chemical compound OCC1=CC=CO1 XPFVYQJUAUNWIW-UHFFFAOYSA-N 0.000 description 6
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical compound C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 5
- 238000005266 casting Methods 0.000 description 5
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000443 aerosol Substances 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000010367 cloning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007849 furan resin Substances 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 229930040373 Paraformaldehyde Natural products 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 150000001299 aldehydes Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000003197 catalytic effect Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- NMFRQYYPAMMRHA-UHFFFAOYSA-N furan;phenol Chemical compound C=1C=COC=1.OC1=CC=CC=C1 NMFRQYYPAMMRHA-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 229920005610 lignin Polymers 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- WHFKYDMBUMLWDA-UHFFFAOYSA-N 2-phenoxyethyl acetate Chemical compound CC(=O)OCCOC1=CC=CC=C1 WHFKYDMBUMLWDA-UHFFFAOYSA-N 0.000 description 1
- WUQYBSRMWWRFQH-UHFFFAOYSA-N 2-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=CC=C1O WUQYBSRMWWRFQH-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920003026 Acene Polymers 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 244000226021 Anacardium occidentale Species 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 229920002261 Corn starch Polymers 0.000 description 1
- 229920001353 Dextrin Polymers 0.000 description 1
- 239000004375 Dextrin Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- HHLFWLYXYJOTON-UHFFFAOYSA-N Glyoxylic acid Natural products OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920002873 Polyethylenimine Polymers 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 235000020226 cashew nut Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000008120 corn starch Substances 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- 150000007973 cyanuric acids Chemical class 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 235000019425 dextrin Nutrition 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- RRLWYLINGKISHN-UHFFFAOYSA-N ethoxymethanol Chemical compound CCOCO RRLWYLINGKISHN-UHFFFAOYSA-N 0.000 description 1
- 239000000295 fuel oil Substances 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- 235000001727 glucose Nutrition 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 235000010985 glycerol esters of wood rosin Nutrition 0.000 description 1
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229930014626 natural product Natural products 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 229910052609 olivine Inorganic materials 0.000 description 1
- 239000010450 olivine Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000007528 sand casting Methods 0.000 description 1
- 239000004071 soot Substances 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000000346 sugar Nutrition 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
- 229920001864 tannin Polymers 0.000 description 1
- 235000018553 tannin Nutrition 0.000 description 1
- 239000001648 tannin Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 235000021122 unsaturated fatty acids Nutrition 0.000 description 1
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 description 1
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 1
- 235000012141 vanillin Nutrition 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mold Materials And Core Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は鋳物砂用粘結剤樹脂組成に関するものである。
更に詳しくは、本発明は耐火性粒状物に酸硬化性樹脂と
酸化剤を添加混練し、型枠に成型後、ガス状又はエロゾ
ル状の二酸化硫黄を注入して鋳型を製造する所謂酸硬化
性コールドボックスに使用する改良された鋳物砂用粘結
剤樹脂組成物に関するものである。The present invention relates to a binder resin composition for foundry sand.
More specifically, the present invention is a so-called acid-curable method for producing a mold by adding an acid-curable resin and an oxidizing agent to a refractory granule and kneading the mixture and molding it into a mold and then injecting sulfur dioxide in a gaseous or aerosol form. The present invention relates to an improved binder resin composition for foundry sand used in a cold box.
従来、中、高速で鋳型を製造するにはフェノール樹脂を
粒状耐火物に被覆した所謂コーテッドサンドを加熱硬化
して鋳型を製造するクローニング法が巾広く使用されて
いる。Conventionally, in order to manufacture a mold at medium to high speed, a cloning method in which a so-called coated sand obtained by coating a granular refractory with a phenol resin is heat-cured to manufacture a mold is widely used.
しかし、鋳型製造時の省エネルギー、鋳型生産速度、更
に鋳型、鋳物の品質を改善するため、ガス状又はエロゾ
ル状物質で常温硬化させるコールドボックス鋳型製造法
が、クローニング法を代替する鋳型の製造法として鋳物
業界で真剣に導入が試みられて来ている。However, in order to save energy during mold manufacturing, mold production speed, and further improve the quality of the mold and casting, the cold box mold manufacturing method in which it is cured at room temperature with a gaseous or aerosol substance is a mold manufacturing method that replaces the cloning method. It has been seriously tried to be introduced in the foundry industry.
コールドボックス法にはフラン系樹脂を代表とする酸硬
化性樹脂を過酸化物を酸化剤として二酸化硫黄により硬
化させるさ酸硬化コールドボックスと、ポリオールとポ
リイソシアネートとをエロゾル状の第3級アミンを触媒
として硬化するウレタンコールドボックスがある。In the cold box method, an acid-curable cold box in which an acid-curable resin typified by a furan-based resin is cured by sulfur dioxide using a peroxide as an oxidizing agent, and a polyol and polyisocyanate are mixed with a tertiary amine in an aerosol form. There is a urethane cold box that cures as a catalyst.
この中でウレタンコールドボックスを使用した鋳型は、
鋳物製造時の鋳砂の崩壊性が悪いとか、砂かみ、すくわ
れ、ピンホール、すす欠陥等の鋳造欠陥が発生し易い等
の欠点がある。Among them, the mold using urethane cold box is
There are drawbacks such as poor disintegration property of the casting sand during the production of castings, and sand casting, scooping, pinholes, soot defects and other casting defects.
それに対して酸硬化コールドボックスは前記の難点を解
決する方法として近年急速に注目を集めている。On the other hand, the acid-curing cold box has been rapidly attracting attention in recent years as a method for solving the above-mentioned problems.
酸硬化性コールドボックスは鋳型製造時省エネルギーで
ある、鋳型製造速度が速い、製造された鋳型の品質、鋳
物の品質が優れる等、従来のクローニング法、ウレタン
コールドボックス法より優れた特徴を数々有するが、改
善すべき課題の解決と同時に、これら優れた特徴を更に
向上させることもまた望まれている。The acid-curing cold box has many advantages over the conventional cloning method and urethane cold box method, such as energy saving at the time of mold production, high mold production speed, excellent quality of the produced mold, and excellent casting quality. It is also desired to solve these problems to be improved and further improve these excellent characteristics.
本発明は中でも特に鋳型の製造速度を大幅に向上せしめ
るとともに貯蔵安定性を改善せしめた粘結剤樹脂組成物
に関するものである。In particular, the present invention relates to a binder resin composition having a significantly improved mold production rate and improved storage stability.
従来、中、大量の鋳型を製造するには自動造型機が使用
されており、耐火性粒状材料に酸硬化性樹脂と過酸化物
が添加混練されて耐火性粒状材料表面を被覆し、空気圧
等によって自動的に充填成型、硬化、取り出しが1分以
内のサイクルで連続的に行われている。従ってコールド
ボックス法では、更に鋳型生産性を向上させるために、
鋳型を成型後1分以内で十分機械的に取り扱える様にす
る初期強度の改善が要望されている。Conventionally, automatic molding machines have been used to manufacture medium and large quantities of molds, and acid-curable resin and peroxide are added and kneaded to the refractory granular material to coat the surface of the refractory granular material, pneumatic pressure, etc. Automatically fills, molds, and takes out continuously in a cycle of less than 1 minute. Therefore, in the cold box method, in order to further improve mold productivity,
It is desired to improve the initial strength so that the mold can be mechanically handled within 1 minute after molding.
酸硬化性コールドボックス法において鋳型の製造速度を
向上させる要因としては、ガッシング法などの造型技術
面での要因及反応速度などの粘結剤面での要因が挙げら
れる。造型技術面において種々検討は為されているが、
鋳型や造型機等の違いによる制約も多い。それ故、上記
課題に対し粘結剤面からの改善もまた強く望まれている
のが現状である。Factors that improve the mold production rate in the acid-curable cold box method include factors in the molding technology such as the gassing method and factors in the binder such as reaction rate. Various studies have been made in terms of molding technology,
There are many restrictions due to differences in molds and molding machines. Therefore, under the present circumstances, there is a strong demand for improvement from the viewpoint of the binder with respect to the above problems.
本発明者らは、鋭意研究の結果、酸硬化性コールドボッ
クス法において、酸硬化性樹脂を主体とする樹脂組成物
中に含有されるアルカリ金属、アルカリ土類金属又はこ
れらの混合物(以下アルカリ金属及び/又はアルカリ土
類金属と略記する)の量と硬化速度及び貯蔵安定性の間
に密接な関係があることを解明し、樹脂組成物中のアル
カリ金属及び/又はアルカリ土類金属の含有量を低減せ
しめることで硬化速度が大幅に向上すると同時に貯蔵安
定性も改善されることを見出し本発明を完成するに至っ
た。As a result of intensive studies, the present inventors have found that in the acid-curable cold box method, an alkali metal, an alkaline earth metal, or a mixture thereof (hereinafter referred to as alkali metal) contained in a resin composition mainly containing an acid-curable resin. And / or alkaline earth metal) and the curing rate and storage stability are closely related to each other, and the content of alkali metal and / or alkaline earth metal in the resin composition is clarified. It was found that the curing rate is significantly improved and the storage stability is also improved by reducing the amount, and thus the present invention has been completed.
即ち、本発明は、酸硬化性樹脂を粘結剤とし、過酸化物
を酸化剤として二酸化硫黄により鋳型を成型する際に用
いられる鋳物砂用粘結剤樹脂組成物であって、酸硬化性
樹脂の少なくとも1種を主体とする組成物中の、金属、
金属イオン、金属塩あるいはこれらの混合物(以下金
属、金属イオン及び/又は金属塩と略記する)として含
有されるアルカリ金属及び/又はアルカリ土類金属の金
属原子当たりの含有量が2%(重量基準、以下同じ)以
下であることを特徴とする鋳物砂用粘結剤樹脂組成を提
供するものである。That is, the present invention is a binder resin composition for molding sand, which is used when molding a mold with sulfur dioxide using an acid-curable resin as a binder and a peroxide as an oxidant, which is acid-curable. A metal in a composition based on at least one resin,
The content of alkali metal and / or alkaline earth metal contained as a metal ion, a metal salt or a mixture thereof (hereinafter abbreviated as metal, metal ion and / or metal salt) per metal atom is 2% (weight basis). The same shall apply hereinafter), and a binder resin composition for foundry sand characterized by the following.
本発明の粘結剤樹脂組成物により、経時的増粘も少な
く、硬化速度を大幅に向上させ、実用的に鋳型の製造速
度を大幅に向上せしめることが可能となった。With the binder resin composition of the present invention, it is possible to significantly improve the curing speed and practically significantly increase the mold production speed with little increase in viscosity over time.
本発明の樹脂組成物中のアルカリ金属及びアルカリ土類
金属の大部分は通常、樹脂製造時の触媒もしくはその中
和剤として組成物中に含まれる。酸硬化性コールドボッ
クス法においては、この組成物中のアルカリ金属及びア
ルカリ土類金属の含有量によって極めて硬化速度が大き
な影響を受ける。反応助剤である二酸化硫黄を捕捉し、
塩交換等の阻害作用を示す為なのか、過酸化物の有効な
作用を阻害する為なのか、その作用については判明はし
ていないが、その含有量を2%以下にすることにより著
しく硬化速度が向上する。更に好ましくはその含有量は
1%以下である。Most of the alkali metals and alkaline earth metals in the resin composition of the present invention are usually contained in the composition as a catalyst during resin production or a neutralizing agent thereof. In the acid-curable cold box method, the curing rate is greatly affected by the contents of alkali metal and alkaline earth metal in the composition. Captures sulfur dioxide, which is a reaction aid,
It has not been clarified about its action whether it exhibits an inhibitory action such as salt exchange or an effective action of peroxide, but it is significantly hardened by reducing the content to 2% or less. Speed is improved. More preferably, the content is 1% or less.
一方、同時に組成物中のアルカリ金属及びアルカリ土類
金属の含有量を減少させることにより、経時的増粘が改
善され、特にフェノール系樹脂やフェノールフラン系樹
脂の場合その影響が大きい。経時的増粘は粘結剤の鋳物
砂への濡れ性や、粘結剤を混練した鋳物砂の充填性に悪
影響を与える。特にコールドボックス法においては鋳物
砂を加圧空気と共に金型中へ吹き込んで充填するため
に、粘結剤の濡れ性や混練砂の充填性が鋳型強度に与え
る影響は極めて大きい。On the other hand, by simultaneously reducing the contents of the alkali metal and the alkaline earth metal in the composition, the viscosity increase with time is improved, and particularly in the case of the phenol resin and the phenol furan resin, the influence is great. Thickening with time has an adverse effect on the wettability of the binder to the molding sand and the filling property of the molding sand in which the binder is kneaded. Particularly in the cold box method, since molding sand is blown into a mold together with pressurized air to fill it, the wettability of the binder and the filling property of the kneading sand have a great influence on the mold strength.
このように酸硬化性コールドボックス法では濡れ性や充
填性を低下させることなく硬化速度を向上させるために
樹脂組成物中のアルカリ金属及びアルカリ土類金属の含
有量を低下せしめた粘結剤樹脂組成物は極めて重要であ
る。As described above, in the acid-curable cold box method, the binder resin in which the content of the alkali metal and the alkaline earth metal in the resin composition is reduced in order to improve the curing rate without lowering the wettability and the filling property The composition is extremely important.
本発明における酸硬化性樹脂としては、フラン系樹脂、
フェノール系樹脂、尿素系樹脂、メラミン系樹脂、レゾ
ルシン系樹脂等が挙げられ、好ましくはフラン系樹脂、
フェノール系樹脂及び尿素系樹脂からなる群より選ばれ
る1種以上の混合物もしくは共縮合物が主体として用い
られる。また、従来公知の変性剤が少なくとも1種を混
合もしくは共縮合させることもできる。その変性率は20
%以下であることが好ましい。変性剤を具体的に例示す
れば、クマロン・インデン樹脂、石油樹脂、ポリエステ
ル、アルキッド樹脂、ポリビニルアルコール、エポキシ
樹脂、エチレン・ビニルアセテート、ポリビニルアセテ
ート、ポリブタジエン、ポリエーテル、ポリエチレンイ
ミン、ポリ塩化ビニル、ポリアクリル酸エステル、ポリ
ビニルブチラール、フェノキシ樹脂、酢酸セルロース、
キシレン樹脂、トルエン樹脂、ポリアミド、スチレン樹
脂、ポリビニルホルマール、アクリル樹脂、ウレタン樹
脂、ナイロン等のポリマー及びオリゴマーや、リグニ
ン、リグニンスルホン酸、ロジン、エステルガム、植物
油、ビチューメン、重油、カシューナット殻液、バニリ
ン、タンニン類等の天然物や、澱粉、コーンスターチ、
グルコース、デキストリン等の糖類及びその誘導体や、
レゾルシン残渣、クレゾール残渣、2,2,4-トリメチル-4
-(ヒドロキシフェニル)クマロンとイソプロペニルフェ
ノールの反応副生物、テレフタル酸とエチレングリコー
ルの反応副生物等の反応残渣及び副生物や、ポリエチレ
ングリコール等の多価アルコールや、アセントン、シク
ロヘキサノン、アセトフェノン等のケトン類及びアルデ
ヒドとの縮合物や、ジシアンジアミド、アクリルアミ
ド、チオ尿素等のアミノもしくはイミノ化合物及びそれ
らのアルデヒド縮合物や、フルフラール、グリオキザー
ル等のアルデヒド化合物や、イソシアヌル酸エステル、
不飽和脂肪酸エステル等のエステル化合物などである。As the acid-curable resin in the present invention, a furan-based resin,
Phenolic resin, urea resin, melamine resin, resorcin resin, and the like, preferably furan resin,
A mixture or co-condensate of at least one selected from the group consisting of a phenol resin and a urea resin is mainly used. Further, at least one kind of conventionally known modifier may be mixed or co-condensed. Its denaturation rate is 20
% Or less is preferable. Specific examples of the modifier include coumarone / indene resin, petroleum resin, polyester, alkyd resin, polyvinyl alcohol, epoxy resin, ethylene / vinyl acetate, polyvinyl acetate, polybutadiene, polyether, polyethyleneimine, polyvinyl chloride, and poly (vinyl chloride). Acrylic ester, polyvinyl butyral, phenoxy resin, cellulose acetate,
Polymers and oligomers such as xylene resin, toluene resin, polyamide, styrene resin, polyvinyl formal, acrylic resin, urethane resin, nylon, lignin, lignin sulfonic acid, rosin, ester gum, vegetable oil, bitumen, heavy oil, cashew nut shell liquid, Natural products such as vanillin and tannins, starch, corn starch,
Glucose, sugars such as dextrin and derivatives thereof,
Resorcin residue, cresol residue, 2,2,4-trimethyl-4
-Reaction residues and by-products such as reaction by-products of (hydroxyphenyl) coumarone and isopropenylphenol, reaction by-products of terephthalic acid and ethylene glycol, polyhydric alcohols such as polyethylene glycol, ketones such as acene, cyclohexanone, and acetophenone. Condensates with compounds and aldehydes, dicyandiamide, acrylamide, amino or imino compounds such as thiourea and their aldehyde condensates, furfural, aldehyde compounds such as glyoxal, and isocyanuric acid esters,
Examples thereof include ester compounds such as unsaturated fatty acid esters.
更に、本発明における粘結剤樹脂組成物は鋳型強度や取
り扱い易さを向上させるために、他の性能に悪影響を与
えない範囲内で希釈剤を混合しても差支えない。その配
合量は20%以下であることが好ましい。使用できる希釈
剤を具体的に例示すれば、ベンゼン、キシレン等の芳香
族炭化水素や、メタノール、エタノール、フルフリルア
ルコール等のアルコール類や、ジエチルエーテル、アニ
ソール、アセタール等のエーテル類や、アセトン、メチ
ルエチルケトン等のケトン類や、テトラヒドロフラン、
ジオキサン等の複素環炭化水素や、酢酸メチル、酢酸エ
チル等のエステル類や、エチレングリコール、グリセリ
ン等の多価アルコール類や、2-メトキシエタノール、2-
エトキシメタノール等のセロソルブ類や、2-メトキシエ
チルアセテート、2-エトキシエチルアセテート、2-ブト
キシエチルアセテート、2-フェノキシエチルアセテート
等のセロソルブアセテート類や、ジエチレングリコール
モノエチルエーテルアセテート等のカルビトールアセテ
ート類等が挙げられる。Further, the binder resin composition of the present invention may be mixed with a diluent within a range that does not adversely affect other properties in order to improve mold strength and handleability. The blending amount is preferably 20% or less. Specific examples of the diluent that can be used include aromatic hydrocarbons such as benzene and xylene, alcohols such as methanol, ethanol, and furfuryl alcohol, and ethers such as diethyl ether, anisole, and acetal, and acetone. Ketones such as methyl ethyl ketone, tetrahydrofuran,
Heterocyclic hydrocarbons such as dioxane, esters such as methyl acetate and ethyl acetate, polyhydric alcohols such as ethylene glycol and glycerin, 2-methoxyethanol, 2-
Cellosolves such as ethoxymethanol, cellosolve acetates such as 2-methoxyethyl acetate, 2-ethoxyethyl acetate, 2-butoxyethyl acetate, 2-phenoxyethyl acetate, carbitol acetates such as diethylene glycol monoethyl ether acetate, etc. Is mentioned.
更に、鋳型強度をより向上させる目的でシランカップリ
ング剤を加ええも差支えない。シランカップリング剤と
しては、例えば、γ-(2-アミノ)アミノプロピルメチル
ジメトキシシラン、γ‐ アミノプロピルトリメトキシ
シラン、γ‐ アミノプロピルトリエトキシシラン、γ
‐ メルカプトプロピルトリメトキシシラン、γ‐ グ
リシドキシプロピルトリメトキシシラン等が挙げられ
る。Further, a silane coupling agent may be added for the purpose of further improving the mold strength. Examples of the silane coupling agent include γ- (2-amino) aminopropylmethyldimethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, and γ
-Mercaptopropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane and the like can be mentioned.
尚、本発明の粘結剤樹脂組成物を鋳物砂に添加混練させ
る時期は過酸化物添加混練より前でも後でも特に差支え
ないが、混練砂の可使時間がより長い点より過酸化物添
加混練前が好ましい。The time at which the binder resin composition of the present invention is added and kneaded to the foundry sand may be before or after the peroxide addition and kneading, but the addition of peroxide from the viewpoint that the kneading sand has a longer pot life. Before kneading is preferable.
鋳型を製造するには、本発明に係る粘結剤と共に耐火性
粒状材料として、石英質を主成分とする硅砂の他、ジル
コン砂、クロマイト砂、オリビン砂等が使用されるが、
特に限定されるものではない。To produce a mold, as a refractory granular material with the binder according to the present invention, in addition to silica sand having silica as the main component, zircon sand, chromite sand, olivine sand, etc. are used.
It is not particularly limited.
又、酸化剤として用いられる過酸化物としては、ケトン
系、芳香族系等の有機過酸化物及び過酸化水素等の無機
過酸化物が使用されるが、特に限定されるものではな
い。As the peroxide used as the oxidizing agent, ketone-based, aromatic-based organic peroxides and inorganic peroxides such as hydrogen peroxide are used, but the peroxides are not particularly limited.
以下実施例をもって本発明の詳細を説明するが、本発明
は本実施例のみに限定されるものではない。Hereinafter, the present invention will be described in detail with reference to examples, but the present invention is not limited to the examples.
実施例1〜4及び比較例1〜2 常法によりフェノール及びパラホルムアルデヒドを種々
触媒量のNaOH塩基性触媒下反応させ、反応溶液の粘度が
25℃で1000cpsになった時点で反応を終了後、パラトル
エンスルホン酸によりpH7に中和し、メタノールで組成
物の25℃の粘度が約300 cpsになる様調整し、表-1に示
すようなNa含有量の樹脂組成物を得た。Examples 1 to 4 and Comparative Examples 1 to 2 Phenol and paraformaldehyde were reacted by a conventional method under various catalytic amounts of NaOH basic catalyst, and the viscosity of the reaction solution was changed.
After the reaction was completed at 1000 cps at 25 ° C, the mixture was neutralized to pH 7 with paratoluenesulfonic acid and adjusted with methanol so that the viscosity of the composition at 25 ° C was about 300 cps. A resin composition having a high Na content was obtained.
得られた樹脂組成物を35℃で所定日数放置し、25℃の粘
度を測定すると同時に次の方法により曲げ強度も測定し
た。即ち、得られた樹脂組成物1.2重量部をオーストラ
リア産フラタリー硅砂100重量部に添加混練し、これにM
EKPO系過酸化物0.4重量部を添加混練した混練砂を25×2
5×250m/mの型枠内に加圧空気と共に吹き込んで充填
し、次いで二酸化硫黄ガスを混練砂が充填された型枠内
へ吹き込んで鋳型テストピースを成型し、二酸化硫黄ガ
スを吹き込み後30秒後の鋳型曲げ強度を測定した。結果
を表-1に示す。The resin composition thus obtained was allowed to stand at 35 ° C. for a predetermined number of days, the viscosity at 25 ° C. was measured, and the bending strength was also measured by the following method. That is, 1.2 parts by weight of the obtained resin composition was added to 100 parts by weight of Australian flattery sand and kneaded, and M
25 × 2 of kneaded sand that was kneaded by adding 0.4 parts by weight of EKPO peroxide
Blow and fill the mold of 5 × 250 m / m with pressurized air, then blow the sulfur dioxide gas into the mold filled with the kneading sand to mold the mold test piece, and after blowing the sulfur dioxide gas, 30 The mold bending strength after 2 seconds was measured. The results are shown in Table-1.
実施例5〜11及び比較例3〜4 種々触媒量のKOH又はBa(OH)2塩基性触媒下、フルフリル
アルコール、フェノール及びパラホルムアルデヒドを常
法により反応させ、フェノールフラン樹脂を合成した。
反応溶液の粘度が25℃で1000cpsになった時点で反応を
終了後、パラトルエンスルホン酸水溶液にてpH7に中和
し、表-2に示す様なK又はBa含有量の樹脂組成物を得
た。 Examples 5 to 11 and Comparative Examples 3 to 4 Furfuryl alcohol, phenol and paraformaldehyde were reacted by a conventional method under various catalytic amounts of KOH or Ba (OH) 2 basic catalyst to synthesize a phenol furan resin.
After the reaction was completed when the viscosity of the reaction solution reached 1000 cps at 25 ° C., it was neutralized to pH 7 with an aqueous paratoluenesulfonic acid solution to obtain a resin composition containing K or Ba as shown in Table 2. It was
得られた樹脂組成物1.2重量部をオーストラリア産フラ
タリー硅砂100重量部に添加混練し、これにMEKPO系過酸
化物0.4重量部を添加混練した混練砂を25×25×250m/m
の型枠内に加圧空気と共に吹き込んで充填し、次いで二
酸化硫黄ガスを混練砂が充填された型枠内へ吹き込んで
鋳型テストピースを成型し、二酸化硫黄ガスを吹き込み
後30秒後の鋳型曲げ強度を測定した。結果を表-2に示
す。1.2 parts by weight of the obtained resin composition was added and kneaded to 100 parts by weight of Australian flattery silica sand, and kneaded sand was added and kneaded with 0.4 parts by weight of MEKPO-based peroxide to 25 × 25 × 250 m / m.
Blow and fill the mold with pressurized air, then blow the sulfur dioxide gas into the mold filled with the kneading sand to mold the mold test piece, and bend the mold 30 seconds after blowing the sulfur dioxide gas. The strength was measured. The results are shown in Table-2.
〔発明の効果〕 本実施例で明白なように、本発明により酸硬化性コール
ドボックス法において、酸硬化性樹脂の少なくとも1種
を主体とする樹脂組成物中に含有されるアルカリ金属及
び/又はアルカリ土類金属の含有量を低減させることに
より著しく硬化速度を向上させると同時に貯蔵安定性も
改善し、鋳型の生産性を大幅に向上させることが可能と
なる。 [Effects of the Invention] As is clear from this example, in the acid-curable cold box method according to the present invention, an alkali metal and / or an alkali metal contained in a resin composition mainly containing at least one acid-curable resin and / or By reducing the content of the alkaline earth metal, the curing rate can be remarkably improved and at the same time the storage stability can be improved and the productivity of the mold can be significantly improved.
Claims (3)
化剤として二酸化硫黄により鋳型を成型する際に用いら
れる鋳物砂用粘結剤樹脂組成物であって、酸硬化性樹脂
の少なくとも1種を主体とする組成物中の、金属、金属
イオン、金属塩あるいはこれらの混合物として含有され
るアルカリ金属、アルカリ土類金属又はこれらの混合物
の金属原子当たりの含有量が2重量%以下であることを
特徴とする鋳物砂用粘結剤樹脂組成物。1. A binder resin composition for molding sand, which is used when molding a mold with sulfur dioxide using an acid-curable resin as a binder and a peroxide as an oxidant, which is an acid-curable resin. 2% by weight per metal atom of an alkali metal, an alkaline earth metal or a mixture thereof, which is contained as a metal, a metal ion, a metal salt, or a mixture thereof, in a composition mainly containing at least one of A binder resin composition for foundry sand, characterized in that:
らの混合物の金属原子当たりの含有量が1重量%以下で
ある特許請求の範囲第1項記載の組成物。2. The composition according to claim 1, wherein the content of the alkali metal, alkaline earth gold layer or a mixture thereof per metal atom is 1% by weight or less.
カリウムからなる群より選ばれる少なくとも1種であ
り、アルカリ土類金属がマグネシウム、カルシウム、ス
トロンチウム又はバリウムからなる群から選ばれる少な
くとも1種である特許請求の範囲第1項記載の組成物。3. The alkali metal is at least one selected from the group consisting of lithium, sodium or potassium, and the alkaline earth metal is at least one selected from the group consisting of magnesium, calcium, strontium or barium. The composition according to claim 1 in the range.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15555485A JPH062298B2 (en) | 1985-07-15 | 1985-07-15 | Binder resin composition for foundry sand |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15555485A JPH062298B2 (en) | 1985-07-15 | 1985-07-15 | Binder resin composition for foundry sand |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6216840A JPS6216840A (en) | 1987-01-26 |
| JPH062298B2 true JPH062298B2 (en) | 1994-01-12 |
Family
ID=15608598
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15555485A Expired - Lifetime JPH062298B2 (en) | 1985-07-15 | 1985-07-15 | Binder resin composition for foundry sand |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062298B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5581114B2 (en) * | 2010-05-21 | 2014-08-27 | 花王株式会社 | Binder composition for mold making |
-
1985
- 1985-07-15 JP JP15555485A patent/JPH062298B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6216840A (en) | 1987-01-26 |
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