JPH06231995A - Lamination electronic part - Google Patents

Abstract

PURPOSE:To provide a laminated electronic part having a structure capable of preventing cross talk between internal electrodes for signals or the deterioration of characteristics and being miniatuarized in the laminated electronic part such as a laminated through-type ceramic capacitor, etc., having internal electrodes for signals with a plurality of channels. CONSTITUTION:Grounding internal electrodes 6 are arranged parallel adjacent to internal electrodes 4, 5 for signals. Also, grounding internal electrodes of one layer or more are arranged continuously or discontinuously even in a layer different from the internal electrodes between the internal electrodes 4, 5 for signals. Also, the internal electrodes for signals with a plurality of channels are respectively arranged in a different layer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated electronic component such as a multilayer feedthrough ceramic capacitor having a plurality of signal electrodes incorporated therein and used as a noise filter or the like, and more particularly to a crosstalk preventing structure thereof.

[0002]

2. Description of the Related Art In a multilayer feedthrough ceramic capacitor, a signal internal electrode and a dielectric are stacked and fired, and a signal external electrode and a ground external electrode are formed on a side surface portion. Since such a multilayer feedthrough capacitor has a high resonance frequency, it can meet the recent demand for higher frequencies. As such a multilayer feedthrough capacitor, a capacitor having signal internal electrodes for a plurality of channels formed therein is proposed in, for example, Japanese Patent Publication No. 4-37567.

[0003]

However, in such a multilayer feedthrough type capacitor having the conventional structure, if the distance between the signal internal electrodes of different channels is narrowed in order to reduce the size, the signal internal electrodes are reduced. There is a problem that crosstalk occurs between them and the characteristics are deteriorated.

In view of the above situation, it is an object of the present invention to provide a laminated electronic component having a structure capable of preventing crosstalk between signal internal electrodes and deterioration of characteristics and achieving miniaturization. To do.

[0005]

In order to achieve the above object, the present invention has a plurality of channels of signal internal electrodes, a dielectric, and a ground electrode facing the signal internal electrodes via a dielectric. In the laminated electronic component, the internal electrodes for ground are arranged side by side adjacent to the internal electrodes for signal. In the present invention, disposing one or more continuous or non-continuous ground internal electrodes between the signal internal electrodes of the plurality of channels in a layer different from the internal electrodes also prevents crosstalk. Preferably, the signal internal electrodes of the plurality of channels are preferably arranged in different layers.

[0006]

According to the present invention, even if a part of the signal riding on the signal internal electrode of a certain channel tries to propagate to the signal internal electrode of the adjacent channel through the dielectric layer, the ground internal electrodes arranged side by side in the meantime. Alternatively, since it is shielded by the ground inner electrode of a different layer, crosstalk between the signal inner electrodes of different channels is prevented. In addition, by forming the signal internal electrodes in different layers, and by making the signal internal electrodes face the ground internal electrodes through the dielectric layer, the interval between the signal electrodes can be increased and the crosstalk prevention effect can be obtained. Further improve.

[0007]

1A is a perspective view showing a feedthrough capacitor which is an embodiment of a laminated electronic component according to the present invention, FIG. 1B is an equivalent circuit diagram thereof, and FIG. 2 is a manufacturing process diagram of the feedthrough capacitor. is there. As shown in FIG. 1 (A), the feedthrough capacitor 1 includes a first dielectric layer 2 made of ceramic, upper and lower two layers of first grounding inner electrodes 3 and 3, and a first grounding inner electrode. First and second signal internal electrodes 4 and 5 sandwiched between the electrodes 3 and 3 via the dielectric 2, and crosstalk prevention provided between the signal internal electrodes 4 and 5. Second internal electrode 6 for ground is formed in a laminated structure, and the external electrodes A to H are connected to the exposed end portions of the respective internal electrodes.
Is formed on the outer surface of the dielectric 2.

Next, the manufacturing process of the feedthrough capacitor 1 of this embodiment will be described with reference to FIG. First, a dielectric material 2a serving as a base is formed by printing a necessary number of dielectric sheets or pastes in which a dielectric material such as ceramic is formed into a substantially rectangular sheet shape (a), and a conductor layer is formed thereon. First strike
The internal electrode 3 for ground is formed to a required thickness by, for example, a printing method (b). In this case, the internal electrode 3 for ground is formed over the entire length of the dielectric body 2a, and on both sides is formed a convex portion 3b which is exposed on both side surfaces and is externally connected to the second internal electrode 6 for ground. To do. Then, the dielectric 2b is laminated thereon to a required thickness (c).

Next, the first and second signal inner electrodes 4, 5 and the second ground inner electrode 6 are formed on the dielectric 2b.
Is arranged so that the second ground internal electrode 6 is located between the first and second signal internal electrodes 4 and 5 (d),
The dielectric 2c is laminated thereon to a required thickness (e).

Next, the first internal electrode 3 for ground is formed on the dielectric 2c to a required thickness (f), and the dielectric 2d for covering the upper surface is further formed thereon to a required thickness. Laminate (g).

The laminated body thus obtained is pressure-bonded, fired and integrated, and as shown in FIG. 1A, external electrodes A to H are formed by baking or plating. That is, the signal external electrodes A and B are formed by connecting them to both exposed ends of the first signal internal electrode 4, and are connected to both exposed ends of the second signal internal electrode 5 respectively. External electrodes C, D are formed and are connected to the exposed ends 3a, 3a of the first ground inner electrode 3 to form electrodes E, F, respectively, and both exposed ends of the second ground inner electrode 6 are formed. Department,
The convex portions 3b, 3b of the first ground internal electrode 3 are connected by the ground external electrodes G, H.

In the multilayer feedthrough capacitor 1 thus manufactured, the first signal inner electrode 4 and the first ground inner electrodes 3 and 3 which are vertically opposed to the first signal inner electrode 4 are connected to each other as shown in FIG. ), The feedthrough capacitor C1 shown in the equivalent circuit diagram is formed, and the feedthrough capacitor C2 is formed between the second signal inner electrode 5 and the first ground inner electrodes 3, 3 which are vertically opposed to the second signal inner electrode 5. , A capacitor C3 is formed between the first signal inner electrode 4 and the second ground inner electrode 6, and the capacitor C3 is formed between the second signal inner electrode 5 and the second ground inner electrode 6. C4 is formed.

In this way, the second ground internal electrode 6
As shown in FIG. 1B, the first
Since the capacitors C3 and C4 are formed between the signal inner electrode 4 and the second signal inner electrode 5, the first signal inner electrode 4 and the second signal inner electrode 5 are formed.
The signal component that is going to propagate between the internal electrodes 4 and 5 is shielded by the second internal electrode 6 for grounding therebetween, crosstalk between them is prevented, and the action between the internal electrodes 4 and 5 is prevented. It is possible to prevent the deterioration of characteristics due to.

FIG. 3 is a perspective view showing another embodiment of the present invention. In this embodiment, between the signal internal electrodes 4 and 5, other than the second ground internal electrode 6 in the same layer, One or more layers of the second ground internal electrode are provided in different layers, and in this example, 4 layers.
Layer internal electrodes 6a to 6d for ground are provided. Such formation of the internal electrodes 6a to 6d for ground is performed by the internal electrodes 6a to 6d during the process described with reference to FIG. 2 as shown in the manufacturing process diagram in the order of (a) to (o) in FIG. It is performed by inserting a process such as 6d printing.

Such internal electrodes 6a to 6d for ground are used.
By providing also in different layers, the signal internal electrode 4,
The coupling between the five can be prevented more favorably, and the crosstalk preventing effect can be further improved.

FIG. 5 (A) is a perspective view showing another embodiment of the present invention, and FIG. 5 (B) is a sectional view taken along line XX thereof. In this embodiment, the signal internal electrodes 4, 5 are arranged between them. The second ground internal electrode 7 is continuously laminated between the upper and lower ground internal electrodes 3 and 3. As shown in the manufacturing process diagram in the order of (a) to (i) in FIG. 5, the formation of the ground internal electrode 7 as described above is performed by using the ground internal electrode 3 and the signal internal electrode 4 described in FIG. It is necessary to form the conductor 7a (or 7b) and the dielectrics 2b (or 2c) on both sides thereof as shown in (c), (d) and (f), (g) during the formation step of 5. This can be done by repeating until the thickness is reached.

By providing the grounding internal electrode 7 as described above, the coupling between the signal internal electrodes 4 and 5 can be almost completely prevented, and the crosstalk preventing effect can be further improved.

In each of the above embodiments, the case where the number of signal internal electrodes is two (two channels) is shown, but when the number of channels is increased by forming three or more signal internal electrodes in the same layer. In this case, a ground internal electrode may be formed between each signal internal electrode. Also, FIG.
By repeating the steps (b) to (e), the steps (b) to (m) of FIG. 4 or the steps (b) to (g) of FIG. Or a multilayer feedthrough capacitor using a plurality of layers of internal electrodes 4 or 5 for one channel can be manufactured. In addition, the signal internal electrodes 4 and 5 may be provided laterally and three or more channels.

FIG. 7 is a sectional view showing another embodiment of the multilayer feedthrough capacitor according to the present invention, and FIG. 8 is a view showing the manufacturing process thereof. In the feedthrough multilayer capacitor 1A of this example, the signal internal electrodes 11 and 14 of adjacent channels do not exist in the same layer, and the signal internal electrodes 11 (14) are horizontally and secondly arranged respectively. 3 (4th, 5th) internal electrodes for ground 12, 13 (15, 16) are formed. Among these ground internal electrodes 12 to 16, the internal electrode 1 facing the signal internal electrode 11 (14)
Reference numeral 6 (12) constitutes a multilayer feedthrough capacitor between them and also serves to prevent crosstalk.

Next, the manufacturing process of the above example will be described with reference to FIG. First, the dielectric 2e is formed by sheet or printing.
Then, a base layer is formed (a), the first ground internal electrode 10 is formed thereon (b), and the dielectric 2f is laminated thereon (c).

Next, on the dielectric 2f, the first signal internal electrode 11 and the second and third ground internal electrodes 12 and 13 are sandwiched with the signal internal electrode 11 interposed therebetween. Body 2
It is formed in the width direction of f (d), and the dielectric 2g is laminated thereon (e).

Next, the second signal inner electrode 14 is formed on the dielectric 2g at a position not facing the first signal inner electrode 11, and the second signal inner electrode 14 is sandwiched between the second signal inner electrode 14 and the first signal inner electrode 11. Four
Then, the fifth ground internal electrodes 15 and 16 are formed (f), and the dielectric 2h is laminated thereon (g).

Thereafter, the steps (h) to (k) similar to the steps (d) to (g) are performed, and the sixth grounding internal electrode 17 is formed (m). A dielectric 2i for covering the upper surface is laminated thereon (n).

The laminate thus obtained is pressure-bonded, fired and integrated, and further, as shown in FIG. 7, signal external electrodes I and J and ground external electrodes K and L are formed on the outer surfaces, respectively. Therefore, the multilayer feedthrough capacitor 1A
Is created. In the multilayer feedthrough capacitor 1A, a multilayer feedthrough capacitor is formed between the first signal internal electrode 11 and the first and fifth ground internal electrodes 10 and 16 which are vertically opposed to the first signal internal electrode 11. Further, a feedthrough capacitor is formed between the second signal internal electrode 14 and the second and sixth ground internal electrodes 12 and 17 which are vertically opposed to the second signal internal electrode 14.

The ground internal electrodes 12 and 16 are arranged side by side with the first signal internal electrodes 11 and 14, respectively, and the cross electrodes between the first signal internal electrode 11 and the second signal internal electrode 14 are provided. -Prevents deterioration and deterioration of characteristics.

In this embodiment, the reason why the first signal inner electrode 11 or the second signal inner electrode 14 is formed in two layers is to secure the capacitance of the capacitor. The structure of the embodiment can of course be applied to the case where each of the internal electrodes 11 and 14 is provided in a single layer.

As described above, since the signal internal electrodes 11 and 14 of a plurality of channels are provided in different layers, the distance between the electrodes 11 and 14 is increased and the coupling is weakened, so that crosstalk is caused. It can be prevented even better.

The configurations shown in FIGS. 7 and 8 can be applied to the case where the signal internal electrodes have three or more channels. The present invention can also be applied to a combination of inductors and the like in a laminated structure, and a board on which an electronic component such as an IC is mounted. Further, the ground electrode 3 does not necessarily have to be provided inside the dielectric, and may be provided on the surface thereof and covered with a protective film such as resin.

[0029]

According to the first aspect of the present invention, even if the distance between the signal internal electrodes becomes narrower due to the miniaturization, different signals are generated by the ground internal electrodes which are arranged side by side adjacent to the signal internal electrodes. It is possible to prevent crosstalk between the internal electrodes for use and prevent deterioration of characteristics. Also,
This can contribute to miniaturization of laminated electronic components. According to the second aspect, since the ground inner electrode is provided in the different layer between the signal electrodes, the crosstalk between the different signal inner electrodes can be prevented more effectively. According to the third aspect, the crosstalk is more effectively prevented by the ground internal electrodes formed between the upper and lower ground internal electrodes between the different signal internal electrodes. According to the fourth aspect, since the signal electrodes are provided in different layers, the distance between the signal internal electrodes becomes large, and the crosstalk can be prevented even better.

[Brief description of drawings]

FIG. 1A is a perspective view showing a feedthrough capacitor as an embodiment of a laminated electronic component according to the present invention, and FIG. 1B is an equivalent circuit diagram thereof.

FIG. 2 is a diagram showing a manufacturing process of the present embodiment.

FIG. 3 is a perspective view showing another embodiment according to the present invention.

FIG. 4 is a diagram showing a manufacturing process of the embodiment shown in FIG.

5A is a perspective view showing another embodiment according to the present invention, and FIG. 5B is a sectional view taken along line XX of FIG.

FIG. 6 is a diagram showing a manufacturing process of the embodiment shown in FIG. 5;

FIG. 7 is a sectional view showing another embodiment according to the present invention.

FIG. 8 is a diagram showing a manufacturing process of the embodiment shown in FIG.

[Explanation of symbols]

 1, 1A Feedthrough capacitor 2, 2A Dielectric 3, 10 First internal electrode for ground 4, 11 First internal electrode for signal 5, 14 Second internal electrode for signal 6, 6a to 6d, 7, 12 Second internal electrode for ground 13 Third internal electrode for ground 15 to 17 Fourth to sixth internal electrode for ground A to L External electrodes C1 to C4 Capacitor

Front page continuation (72) Inventor Yoshinobu Kaneko 1-13-1 Nihonbashi, Chuo-ku, Tokyo T-Deay Co., Ltd. (72) Inventor Toshiro Fujieda 1-13-1 Nihonbashi, Chuo-ku, Tokyo In Decay Co., Ltd. (72) Inventor Takeshi Endo 1-13-1 Nihonbashi, Chuo-ku, Tokyo

Claims (4)

[Claims] 1. A laminated electronic component having a plurality of channels of signal internal electrodes, a dielectric, and a ground electrode facing the signal internal electrodes via a dielectric, wherein a ground is provided adjacent to the signal internal electrode. A laminated electronic component, in which internal electrodes for use are arranged side by side. 2. The laminated electronic component according to claim 1, wherein one or more layers of grounding internal electrodes are arranged in layers different from the internal electrodes between the signal internal electrodes of the plurality of channels. . 3. A laminated electronic component according to claim 2, wherein internal electrodes laminated over the upper and lower ground internal electrodes are provided between the signal internal electrodes of the plurality of channels. 4. A laminated electronic component according to claim 1, wherein the signal internal electrodes of the plurality of channels are arranged in different layers.