JPH06244591A - Electronic parts mounting equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To improve productivity by eliminating the adhesive application process for the electronic component mounting position on the printed circuit board. An adhesive applying device 10 for applying an adhesive to an electronic component 4, and a first nozzle part 6 and a second nozzle part each having a suction nozzle 8 for adsorbing the electronic part 4 and capable of moving up and down independently. 7 is provided in the head portion 5, and means for positioning the adhesive application device 10 is provided at a position below the first nozzle portion 6 or the second nozzle portion 7 in the raised position.
And the second nozzle portion 7 alternately apply the adhesive to the electronic component 4 to mount the electronic component 4 on the printed circuit board 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for applying an adhesive for fixing an electronic component in advance and transferring the electronic component onto a printed circuit board for mounting.

[0002]

2. Description of the Related Art In recent years, there has been a great demand for shortening work tact in order to improve productivity in the mounting process of electronic parts.

An example of an electronic component mounting apparatus in which an electronic component is fixed with a conventional adhesive will be described below with reference to FIG. In FIG. 4, 21 is an electronic component 2
A component supply unit 23 for supplying 2 is an XY robot, and positions a head unit 26 including a suction nozzle 24 and an adhesive application nozzle 25 for applying an adhesive at an arbitrary position. A table portion 27 carries in, carries out, and holds the printed circuit board 28. Reference numeral 29 is a controller of the entire apparatus.

Next, the mounting operation of the electronic component 22 in the electronic component mounting apparatus will be described. Printed circuit board 2
8 is carried in by the table portion 27 and held at a predetermined position. When it is necessary to fix the component with the adhesive, the application operation of the adhesive is required before the electronic component 22 is mounted. Therefore, first, the head unit 26 is moved by the XY robot 23 to the position where the electronic component 22 is mounted, and the adhesive is adhered. The adhesive is applied onto the printed board 28 by the agent applying nozzle 25. Thereafter, in order to supply the electronic component 22, the head unit 26 moves to the component supply unit 21, the electronic component 22 is sucked by the suction nozzle 24, and the head unit 26 is again moved to the position where the electronic component 22 is mounted by the XY robot 23. The electronic component 22 is moved and mounted on the printed circuit board 28 by the suction nozzle 24. The printed circuit board 28 after mounting is mounted on the table portion 27.
Be carried out by. The above sequence is controlled by the controller 29.

[0005]

However, in the above structure, it is necessary to apply the adhesive to the electronic component mounting position on the printed circuit board before the electronic component is sucked and mounted. Therefore, there is a problem that lost time occurs and productivity deteriorates.

In view of the above conventional problems, it is an object of the present invention to provide an electronic component mounting apparatus capable of eliminating the adhesive coating step for the electronic component mounting position of the printed circuit board and improving the productivity. And

[0007]

An electronic component mounting apparatus of the present invention sucks an electronic component from a component supply section by a suction nozzle provided in a head section, and applies an adhesive to the electronic component suctioned by the suction nozzle. Then, in an electronic component mounting apparatus for mounting an electronic component on a printed circuit board, a first nozzle portion and a second nozzle portion each having a suction nozzle for sucking the electronic component and capable of moving up and down independently, An adhesive applying device for applying an adhesive is provided in the head part, and means for selectively positioning the adhesive applying device at a position below the first nozzle part or the second nozzle part in the raised position is provided. And

[0008]

According to the above configuration of the present invention, when the first nozzle portion is at the raised position, the adhesive applying device is positioned below the adhesive applying device to apply the adhesive to the electronic component sucked by the first nozzle portion. When the second nozzle portion is in the raised position, the adhesive applying device is positioned below the adhesive applying device to apply the adhesive to the electronic component adsorbed by the second nozzle, and one nozzle applies the adhesive. In the meantime, by mounting the electronic component on the printed circuit board by the other nozzle part and adsorbing the electronic component by the component supply part, it is possible to reduce the adhesive application time, shorten the mounting tact, and improve the production efficiency. Can be improved. Moreover, it is not necessary to introduce an adhesive coating device into the mounting line.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electronic component mounting apparatus according to an embodiment of the present invention will be described below with reference to FIGS. FIG. 1 shows the overall schematic configuration of an electronic component mounting apparatus. In FIG. 1, reference numeral 1 is a printed circuit board, 2 is a table section for loading, unloading and holding the printed circuit board 1, and 3 is a component supply section for supplying an electronic component 4. Reference numeral 5 is a head part, which is an electronic component 4.
It is provided with a first nozzle portion 6 and a second nozzle portion 7 each having a suction nozzle 8 for sucking the, and is positioned by the XY robot 9 in the X and Y directions. An adhesive application device 10 is disposed below the head portion 5 and can be moved to a position below the first nozzle portion 6 or the second nozzle portion 7. Reference numeral 11 is a controller that controls the entire apparatus.

As shown in FIG. 2, the adhesive application device 10 is constructed by arranging three cylinders 12 containing an adhesive in an upward direction, and air is blown into each cylinder 12 to apply the adhesive. The nozzle 13 is configured to discharge the adhesive. Further, the amount and the application shape of the adhesive to be discharged can be changed according to the type and size of the electronic component 4. That is, the amount of adhesive is changed by controlling the amount of air blown in by the controller 11, and the shape of the adhesive applied is changed by positioning the adhesive applying device 10 so as to face the nozzle portion 6 or 7. It is configured to be performed by changing the type of the agent application nozzle 13.

Next, the mounting operation of the electronic component 4 will be described with reference to FIG. First, as shown in (a), the head unit 5 is moved to the component supply unit 3, and the electronic component 4 is moved by the first nozzle unit 6.
Adsorb. Next, as shown in (b), the second nozzle portion 7
The head portion 4 is moved to suck the electronic component 4 at the same time, and the adhesive application position 10 is positioned below the first nozzle portion 6 during this time so that the electronic component 4 attracted to the first nozzle portion 6 is Apply adhesive. Next, as shown in (c), the electronic component 4 is sucked by the second nozzle portion 7. During this period, the adhesive application is completed in the first nozzle section 6, so that the head section 5 transfers the electronic component 4 attracted by the first nozzle section 6 onto the printed circuit board 1 as shown in (d). While moving to the mounting device for mounting on the electronic component 4, the adhesive applying device 10 is positioned below the second nozzle portion 7 during this time, and the adhesive is applied to the electronic component 4 adsorbed by the second nozzle portion 7. Next, as shown in (e), when the head unit 5 arrives at the mounting position by the first nozzle unit 6, the first nozzle unit 6 descends and the electronic component 4 is mounted on the printed board 1. Next, as shown in (f), the head unit 5 moves to the component supply unit 3 to suck the electronic component 4 by the first nozzle unit 6, and sucks the electronic component 4. During this time, the second nozzle portion 7
Since the application of the adhesive to the adsorbed electronic component 4 has been completed, the head portion 5 is moved to the second position as shown in (g).
The electronic component 4 adsorbed by the nozzle portion 7 is moved to the mounting position for mounting on the printed circuit board 1, and the adhesive agent applying device 10 is positioned below the first nozzle portion 6 during this time. An adhesive is applied to the electronic component 4 adsorbed on the device 6. Next, as shown in (h), when the head unit 5 arrives at the mounting position by the second nozzle unit 7, the second nozzle unit 7 descends and the electronic component 4 is mounted on the printed circuit board 1. Next, as shown in (i), the head unit 5 uses the second nozzle unit 7 to pick up the electronic component 4 so as to suck the electronic component 4.
Then, the electronic component 4 is sucked. Hereinafter, the above processes (d) to (i) are repeated to sequentially mount the electronic components 4 on the printed circuit board 1.

[0012]

As described above, according to the electronic component mounting apparatus of the present invention, while one nozzle portion is applying the adhesive, the other nozzle portion mounts the electronic component on the printed circuit board. Since the electronic component is sucked by the component supply unit, the electronic component can be mounted without spending the adhesive application time on the printed circuit board, and the mounting tact can be shortened and the productivity can be improved. Further, the adhesive can be applied without introducing the adhesive applying device to the mounting line, and the production efficiency can be improved.

[Brief description of drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is a perspective view showing a schematic configuration of an adhesive application device in the example.

FIG. 3 is an operation explanatory diagram of the embodiment.

FIG. 4 is a perspective view of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 1 Printed Circuit Board 3 Component Supply Section 4 Electronic Component 5 Head Section 6 First Nozzle Section 7 Second Nozzle Section 8 Adsorption Nozzle 10 Adhesive Coating Device

Claims (1)

[Claims] 1. An electronic component in which an electronic component is sucked from a component supply unit by a suction nozzle provided in a head unit, an adhesive is applied to the electronic component suctioned by the suction nozzle, and then the electronic component is mounted on a printed circuit board. In a mounting apparatus, a head section includes a first nozzle section and a second nozzle section each of which has a suction nozzle for sucking an electronic component and is capable of independently moving up and down, and an adhesive application device for applying an adhesive to the electronic component. And a means for selectively positioning the adhesive application device at a lower position of the first nozzle portion or the second nozzle portion at a raised position.