JPH06260366A - Metal thin layer pattern manufacturing method, pattern forming film, and film capacitor - Google Patents

Abstract

(57) [Summary] [Structure] A film (A) for pattern formation in which a photosensitive resin layer (2) is formed on both sides of a light-transmitting substrate film (1).
The photosensitive resin layer (2) is irradiated with light from one surface side of the pattern-forming film through a screen having a predetermined pattern to simultaneously form the solvent-soluble layer (3) having the predetermined pattern on the photosensitive resin layers (2) on both surfaces of the substrate film. And solvent-insoluble layer (4)
To the exposure layer (5), a metal thin layer (6) is formed on the exposure layer (5), and then the solvent-soluble layer (3) is removed to form the same metal on both sides of the substrate film. A method for producing a metal thin layer pattern, which comprises forming a thin layer pattern (7), and the pattern forming film. According to the method for producing a metal thin layer pattern of the present invention, the same metal thin layer patterns can be formed on both sides of the substrate film symmetrically with respect to the substrate film, and in principle, no positional deviation occurs. Moreover, the film for pattern formation of the present invention is suitable for manufacturing the above-mentioned film capacitor and the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a thin metal layer pattern, which can form thin metal layers having the same pattern on both sides of a film without causing displacement of the layers, and a pattern forming method used for the method. It relates to films and film capacitors.

[0002]

2. Description of the Related Art Conventionally, a plastic film capacitor has been manufactured by forming a pattern of a thin metal layer such as aluminum on both sides of a film. Generally, as a method of manufacturing such a film capacitor, The following methods are adopted.

That is, as shown in FIG. 2, a water-soluble ink b is applied to both sides of the film a by gravure printing or the like in a pattern corresponding to a negative of a pattern in which a metal portion is desired to be left on the plastic film a, and then a vapor deposition method is applied thereon. After depositing the metal layers c and c on the entire surface of the film by the sputtering method,
After washing with water, the water-soluble ink b is removed to remove unnecessary portions of the metal layer c, and a metal thin layer pattern d is obtained.

Alternatively, a metal is vapor-deposited on the entire surface of both sides of the plastic film by a vapor deposition method, a sputtering method or the like, a pattern is printed on the resin with an alkali-resistant or acid-resistant resin, and the metal layer is removed by etching with an alkali or an acid. In addition, the alkali-resistant and acid-resistant resin is peeled off entirely or partially as required.

[0005]

However, in any of the above methods, the patterns are separately formed on both sides of the film. Therefore, it is difficult to match the patterns on both sides of the film, and if the metal layers on the upper and lower sides do not match, it will be defective, and in particular, as the capacitors become smaller in recent years, the positional deviation of the double-sided printing pattern will reduce the product yield. There was the problem of making it worse.

The present invention has been made in view of the above circumstances, and a method for producing a thin metal layer pattern capable of forming a pattern on both surfaces of a film without any positional deviation, and a film for forming a pattern and a film capacitor used in this method. The purpose is to provide.

[0007]

In order to achieve the above object, the present invention provides a screen having a predetermined pattern on a photosensitive resin layer of a pattern forming film in which a photosensitive resin layer is formed on both sides of a light transmitting substrate film. Through irradiation with light from one surface side of the pattern forming film, the photosensitive resin layers on both surfaces of the substrate film are simultaneously changed into an exposure layer composed of a solvent-soluble layer and a solvent-insoluble layer having a predetermined pattern, and a metal is further formed on the exposure layer. A method for producing a metal thin layer pattern, which comprises forming a thin layer and then removing the solvent-soluble layer to form the same metal thin layer pattern on both surfaces of the substrate film.

The present invention also provides a film for pattern formation, which comprises a photosensitive resin layer formed on both sides of a light transmissive substrate film.

The present invention further provides a film capacitor having the same metal thin layer pattern formed on both surfaces of the substrate film by the above method for manufacturing a metal thin layer pattern.

[0010]

The method for producing a thin metal layer pattern of the present invention uses a pattern-forming film in which a photosensitive resin layer is formed on both surfaces of a light-transmitting substrate film as described above. By irradiating the resin layer with light from one side of the pattern forming film through a screen of a predetermined pattern, the photosensitive resin layer on the side opposite to the substrate film is light-transmissive in addition to the photosensitive resin layer on the side irradiated with light. Simultaneous exposure through the substrate film, thereby exposing the photosensitive resin layers on both sides of the substrate film at the same time, changing the photosensitive resin layers on both sides to an exposure layer consisting of a solvent-soluble layer and a solvent-insoluble layer, and having exactly the same pattern. The exposure layer including the solvent-soluble layer and the solvent-insoluble layer can be formed at the target position on the substrate film without misalignment. Further, by forming a thin metal layer on the exposed layer and then removing the solvent-soluble layer, a predetermined thin metal layer pattern can be formed without misalignment with each other, leaving the thin metal layer on the solvent-insoluble layer. In principle, pattern displacement does not occur.

The film capacitor obtained by such a manufacturing method has a thin metal layer pattern formed on both sides of the substrate film without any displacement, and has good performance.

[0012]

Embodiments of the present invention will be specifically described below with reference to FIG. FIG. 1 shows an embodiment of the steps of the manufacturing method of the present invention. In the figure, (a) shows a light-transmissive substrate film 1, and both sides of this substrate film 1 are shown in (b) by doctor coating or the like. The photosensitive resin layers 2, 2
To form a film A for pattern formation. Then, as shown in (c), light is irradiated from one surface side of the pattern forming film A through a screen having a predetermined pattern.
As a result, the photosensitive resin layers 2 on both sides of the film are changed into exposure layers 5 and 5 composed of a solvent-soluble layer 3 and a solvent-insoluble layer 4 having a predetermined pattern as shown in (d). Furthermore,
As shown in (e), thin metal layers 6 and 6 are formed on the exposed layers 5 and 5 by a vapor deposition method or a sputtering method and then washed with a solvent such as water to wash away the solvent-soluble layer 3 to form a solvent-soluble layer. The thin metal layer 3 is removed to remove the thin metal layer pattern 7 having a predetermined pattern on the solvent-insoluble layer 4 as shown in (f).
Can be obtained.

In this method, the above steps can be continuously performed while moving the continuous long substrate film 1.
Productivity is good, and a long film having a thin metal layer pattern formed thereon can be cut into a predetermined length with a laser or the like to obtain a product.

The material and the thickness of the substrate film 1 in the present invention can be appropriately selected from the light transmitting property or the insulating property according to the use, and polyethylene, polycarbonate, nylon, polyvinyl chloride, polystyrene, ionomer,
Examples of the material include polyimide and the like, and the thickness can be about 2 to 100 μm.

The photosensitive resin may be either a negative type or a positive type, and examples thereof include a photosensitive resin for screen plate making and a photosensitive resin for photoresist. For screen plate making, partially saponified polyvinyl alcohol is added to polyvinyl acetate emulsion as a protective colloid,
Diazo resin added as a photosensitizer, photopolymerizable solvent-soluble photopolymer, 1 to the hydroxyl group of PVA
For photoresists such as solvent-soluble photopolymers containing 2 mol% formylstyrylpyridinium, solvent-soluble photoresists obtained by adding several% dichromate to solvent-soluble polymers such as casein, glue, and polyvinyl alcohol. A cinnamic acid-based resist or the like can be used. The film thickness of the photosensitive resin can be appropriately selected, and can generally be about 1 to 10 μm.

The method for producing a metal thin layer pattern of the present invention is
In irradiating the photosensitive resin layers 2 formed on both sides of the substrate film 1 with light, the photosensitive resin layers 2 on both sides are simultaneously dissolved in a solvent by irradiating light from one side of the substrate film 1 through a screen having a predetermined pattern. The photosensitive layer 5 having a predetermined pattern composed of the layer 3 and the solvent-insoluble layer 4 is changed.

In this case, the wavelength, intensity, irradiation amount, etc. of light can be appropriately selected according to the type of photosensitive resin.

The metal thin layer 6 formed on the photosensitive layer 5 may be made of any metal, but aluminum is suitable for obtaining a film capacitor. The thickness of the thin metal layer 6 can be appropriately selected depending on the application, but is generally in the range of 500 to 2000Å.

In the next washing step, the solvent-soluble layer 3 is washed away with a solvent such as water according to a usual method such as spraying.
Accordingly, the thin metal layer on the solvent-soluble layer 3 is removed at the same time, and the thin metal layer on the solvent-insoluble layer 4 is left, whereby a predetermined thin metal layer pattern 7 can be obtained.

The pattern-forming film of the present invention is suitable for manufacturing a film capacitor as described above, but is not limited to this, and can be widely used for forming a pattern on both sides of the film without misalignment. Yes, for example by coating or etching conductive paint,
It can be used for forming printed circuits on both sides of a film by copper plating.

[0021]

According to the method of manufacturing a metal thin layer pattern of the present invention, the same metal thin layer patterns can be formed on both sides of the substrate film symmetrically with respect to the substrate film, and in principle, no positional deviation occurs.

The pattern forming film of the present invention is suitable for manufacturing the above film capacitor and the like.

Further, the film capacitor of the present invention is
Excellent performance because there is no misalignment between the thin metal layers on both sides.

[Brief description of drawings]

FIG. 1 is a partial cross-sectional view illustrating a step of an embodiment of a method for manufacturing a thin metal layer pattern of the present invention.

FIG. 2 is a partial cross-sectional view illustrating a conventional method for manufacturing a thin metal layer pattern.

[Explanation of symbols]

 1 Light-Transmissive Substrate Film 2 Photosensitive Resin Layer 3 Solvent-Soluble Layer 4 Solvent-Insoluble Layer 5 Exposure Layer 6 Metal Thin Layer 7 Metal Thin Layer Pattern A Pattern Forming Film

Claims (3)

[Claims] 1. A substrate for irradiating a light-transmissive substrate film with light-sensitive resin layers formed on both sides of the pattern-forming film by irradiating light from one side of the pattern-forming film through a screen having a predetermined pattern on the photosensitive resin layer. By simultaneously changing the photosensitive resin layers on both sides of the film into an exposed layer consisting of a solvent-soluble layer and a solvent-insoluble layer in a predetermined pattern, further forming a thin metal layer on this exposed layer, and then removing the solvent-soluble layer. A method for producing a thin metal layer pattern, which comprises forming the same thin metal layer pattern on both surfaces of a substrate film. 2. A pattern-forming film comprising a light-transmissive substrate film and photosensitive resin layers formed on both sides thereof. 3. A film capacitor comprising the same thin metal layer pattern formed on both surfaces of a substrate film by the method for producing a thin metal layer pattern according to claim 1.