JPH062684U - Wafer size conversion adapter for ion implantation equipment - Google Patents

Abstract

(57) [Summary] (Modified) [Purpose] To enable ion implantation into wafers of different diameters with a single ion implantation device. [Structure] A recess 8 is formed in the receiving plate 1, and a rubber sheet 9 is laid in this recess to mount a small-diameter wafer 5. By fitting several bosses 11 attached to the receiving plate into the holes 12 of the pressing plate 2 for pressing the peripheral portion of the wafer, the small-diameter wafer is held in a state where the receiving plate and the pressing plate are aligned. . The receiving plate and the pressing plate are formed so that the outer shapes thereof are the same as those of the large-diameter wafer, and the small-diameter wafer can be handled in the same manner as the large-diameter wafer.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a wafer size conversion adapter that enables wafers of different diameters to be ion-implanted by the same ion implantation device.

[0002]

[Prior art]

 A semiconductor wafer into which ions are implanted by a batch processing type ion implantation device is usually formed to have a diameter of 100, 150 or 200 mm. In the ion implantation device, a wafer disk or wafer that holds the wafer during ion implantation is used. The transfer of the wafer to the disk, the handling robot, the elevator mechanism of the wafer cassette in the air lock chamber provided to transfer the wafer between the end station in the vacuum state and the atmosphere chamber, etc. It is configured according to the diameter wafer.

[0003]

[Problems to be solved by the device]

 Therefore, when performing ion implantation with the same ion implanter for wafers with different diameters, the wafer disk, transfer, handling robot, elevator mechanism, etc. must be replaced according to the wafer diameter. Since many members and parts related to the above are stored in the vacuum chamber, it takes a long time to replace them, and it also takes time to start up the ion implantation apparatus after the replacement, which is not easy.

An object of the present invention is to provide a wafer size conversion adapter that allows wafers of different diameters to be ion-implanted by the same ion implantation device.

[0005]

[Means for Solving the Problems]

 The present invention relates to a wafer size conversion adapter for an ion implantation apparatus, which has a receiving plate that holds a small-diameter wafer by controlling its position, or a receiving plate and a holding plate that restrict the position of a small-diameter wafer by holding it. The receiving plate and the pressing plate are characterized in that their peripheral shapes are the same as those of the large diameter wafer.

[0006]

[Action]

 A small-diameter wafer is held in a position-regulated state by a receiving plate or a receiving plate and a holding plate.The peripheral shapes of these receiving plates and holding plates are the same as those of the large-diameter wafer, so a small-diameter wafer is It can be treated in the same way as a wafer, and ions can be implanted in a small-diameter wafer by using the ion implanter for a large-diameter wafer as it is.

[0007]

【Example】

 An embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows the structure of a wafer size conversion adapter used when a wafer is mounted and held on a wafer disk of an ion implanter by a ring clamp mechanism. Fig. 1 (a) shows a state in which a small diameter wafer is mounted. 2B is a cross-sectional view of the conversion adapter of FIG. 1, FIG. 6B is a plan view of a receiving plate in the conversion adapter, and FIG. The conversion adapter consists of a receiving plate 1 and a holding plate 2. The shape of the receiving plate and the peripheral shape of the holding plate are the same as those of the large diameter wafer. Notches 3 and 4 each corresponding to an orientation flat indicating the crystal direction are formed. The holding plate 2 is provided with an opening 6 of a similar shape slightly smaller than the peripheral shape of the small-diameter wafer 5 so that the peripheral portion of the small-diameter wafer 5 placed on the receiving plate 1 can be pressed. A step portion 7 into which the small-diameter wafer 5 is fitted is formed at the opening end portion.

By placing the holding plate 2 on the small-diameter wafer 5 placed on the receiving plate 1 and fitting the wafer in the step portion 7, the position of the wafer is regulated with respect to the holding plate, and the receiving plate is received. By aligning the notch 3 of the plate 1 with the notch 4 of the holding plate, the small diameter wafer 5 can be treated in the same manner as the large diameter wafer. Although the small-diameter wafer 5 is merely sandwiched between the receiving plate 1 and the holding plate 2, the wafer is carried and handled by the robot arm from below to be carried to a predetermined place in the ion implantation apparatus. Since it takes the form of mounting, the predetermined holding state of the small-diameter wafer 5 can be maintained by the receiving plate 1 and the pressing plate 2 described above. Therefore, it is possible to implant ions into a small-diameter wafer by using the ion-implanting device configured for a large-diameter wafer as it is. When the conversion adapter sandwiching the small-diameter wafer 5 is mounted on the wafer disk of the ion implanter, the peripheral portion of the holding plate 4 is pressed by the ring clamper, and the small-diameter wafer 3 is held by the receiving plate 1 to the wafer disk. Will be attached closely to.

FIGS. 2A and 2B are a cross-sectional view of a wafer size conversion adapter used when a wafer is held by a wafer disk of an ion implantation apparatus by centrifugal force and a plan view of a receiving plate as an adapter. Is. The wafer size conversion adapter is composed of only the receiving plate 1, and the overall planar shape is the same as that of the large diameter wafer. The notch 3 corresponding to the orientation flat of the large diameter wafer and the small diameter wafer 5 are fitted. A recess 8 for mounting is formed. By fitting and mounting the small-diameter wafer 5 in the concave portion 8 of the receiving plate 1, the small-diameter wafer 5 can be handled in the same manner as a large-diameter wafer, and when the wafer is mounted on the wafer disc, the wafer is kept as it is. Place in the holding recess.

FIGS. 3A, 3B, and 3C are cross-sectional views of another embodiment of a wafer size conversion adapter used for mounting and holding a wafer on a wafer disk of an ion implantation apparatus by a ring clamp mechanism. FIG. 4A is a plan view of a receiving plate and a plan view of a holding plate in the same adapter. The adapter consists of a receiving plate 1 and a pressing plate 2. The peripheral shape of both plates is the same as that of a large-diameter wafer, and in the peripheral part, a notch 3 corresponding to an orientation flat showing the crystal direction of the wafer, 4 are formed respectively. A recess 8 into which a small-diameter wafer 5 having an orientation flat is fitted and mounted is formed in the receiving plate 1, a rubber sheet 9 is laid in this recess, and the small-diameter wafer 5 is mounted thereon.

The holding plate 22 that presses the peripheral portion of the small-diameter wafer 5 fitted and mounted in the recess 8 of the receiving plate 1 has a ring shape as a whole, and the peripheral end portion of the opening 10 thereof serves as a peripheral portion of the small-diameter wafer. It is configured to hold the presser wafer. The holding plate 2 is provided with holes 12 into which, for example, four bosses 11 provided on the receiving plate 1 are fitted. The small-diameter wafer 5 is placed in the recess 8 of the receiving plate 1, and the pressing plate 2 is placed on the receiving plate 1 so that the boss 11 fits into the hole 12. It is possible to handle the small-diameter wafer 5 in the same manner as the large-diameter wafer without causing any trouble. Since the rubber sheet 9 is provided, the wafer is firmly fixed when the small diameter wafer is attached to the wafer disk by the conversion adapter.

[0012]

[Effect of device]

 Since the present invention is configured as described above, a small-diameter wafer is held in a position-regulated state by the receiving plate or the receiving plate and the pressing plate that constitute the wafer size conversion adapter, and the peripheral shape of these receiving plate and the pressing plate. Is the same as a large-diameter wafer, so a small-diameter wafer can be treated the same as a large-diameter wafer, and ions can be implanted into a small-diameter wafer using the ion implantation system for large-diameter wafers. be able to.

Further, when implanting different-diameter wafers, it is not necessary to replace the members and parts inside the end station, which is a vacuum chamber, so the time before the start of implantation is shortened, and the particles inside the end station are reduced. Will not increase.

[Brief description of drawings]

FIG. 1 is a block diagram of an embodiment for a ring clamp mechanism.

FIG. 2 is a configuration diagram of an embodiment for a centrifugal force clamp mechanism.

FIG. 3 is a configuration diagram of another embodiment for the ring clamp mechanism.

[Explanation of symbols]

 1 Support plate 2 Presser plate 5 Small diameter wafer 6, 10 Opening 7 Step 8 Recess 9 Rubber sheet 11 Boss 12 hole

Claims (2)

[Scope of utility model registration request] 1. A support plate for holding a small-diameter wafer with its position regulated, or a support plate and a holding plate for holding a small-diameter wafer with its position restricted and sandwiching the support plate and the holding plate. Is formed in the same manner as a large diameter wafer, and is a wafer size conversion adapter for an ion implantation apparatus. 2.