JPH0627182B2 - Liquid epoxy resin composition suitable for impregnation - Google Patents
Liquid epoxy resin composition suitable for impregnationInfo
- Publication number
- JPH0627182B2 JPH0627182B2 JP62217040A JP21704087A JPH0627182B2 JP H0627182 B2 JPH0627182 B2 JP H0627182B2 JP 62217040 A JP62217040 A JP 62217040A JP 21704087 A JP21704087 A JP 21704087A JP H0627182 B2 JPH0627182 B2 JP H0627182B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- liquid
- room temperature
- impregnation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 〔技術分野〕 本発明は、含浸に好適な液状エポキシ樹脂組成物に関す
るものである。TECHNICAL FIELD The present invention relates to a liquid epoxy resin composition suitable for impregnation.
従来、含浸用に適したエポキシ樹脂組成物として、脂環
式エポキシ樹脂、ジヒドロキシベンゼン類及び無水物か
らなるものが知られている(特開昭57-174314号公報)。
この公報においては、その実施例中に、脂環式エポキシ
樹脂として、3,4-エポキシシクロヘキシルメチル-(3,4-
エポキシ)シクロヘキサンカルボキシレートを用いると
共に、酸無水物として、無水メチルハイミック酸及びジ
ヒドロキシベンゼンとして、レゾルシノールを用い、こ
の混合物を、少量のトリエタノールアミンの存在下、12
0℃で16時間加熱した後、さらに180℃で16時間加熱して
硬化させた例が示されている。Conventionally, as an epoxy resin composition suitable for impregnation, one composed of an alicyclic epoxy resin, dihydroxybenzenes and an anhydride is known (Japanese Patent Laid-Open No. 57-174314).
In this publication, in that Example, as an alicyclic epoxy resin, 3,4-epoxycyclohexylmethyl- (3,4-
(Epoxy) cyclohexanecarboxylate and methyl resorcinol as the acid anhydride and methylhydroxymic acid anhydride as the acid anhydride, and this mixture was used in the presence of a small amount of triethanolamine.
An example is shown in which after heating at 0 ° C. for 16 hours, further heating at 180 ° C. for 16 hours to cure.
しかしながら、このようなエポキシ樹脂組成物を、自動
車等に用いるモータや発電機における固定子コイル(ス
テータコイル)や回転子コイル(アーマチュアコイル)を
製作する際に、そのコイル内に含浸させてコイルを固定
化しようとした時に、そのエポキシ樹脂組成物はコイル
内へよく含浸するものの、その硬化速度が遅いために、
作業効率が著しく悪いという欠点を有する。さらに、硬
化樹脂被膜のコイルに対する密着性も不十分なため、コ
イルと被膜との界面で剥離やクラックが発生するという
問題も生じた。However, when manufacturing such a stator coil (stator coil) or rotor coil (armature coil) in a motor or a generator used in an automobile, etc., such an epoxy resin composition is impregnated into the coil to form a coil. Although the epoxy resin composition is well impregnated into the coil when it is attempted to be immobilized, its curing speed is slow,
It has a drawback that the working efficiency is extremely poor. Further, since the adhesion of the cured resin coating to the coil is insufficient, there is a problem that peeling or cracking occurs at the interface between the coil and the coating.
本発明は、従来のエポキシ樹脂組成物に見られる前記欠
点を克服することを目的とする。The present invention aims to overcome the above-mentioned drawbacks found in conventional epoxy resin compositions.
本発明によれば、平均分子量300〜600のビスフェノール
A型エポキシ樹脂30〜60重量％と、常温で液状の環に縮
合したエポキシ基を有する脂環式エポキシ樹脂70〜40重
量％とからなるエポキシ樹脂に対し、常温で液状の酸無
水物及び常温で液状のイミダゾール化合物を配合した組
成物であって、該イミダゾール化合物の配合量が、該エ
ポキシ樹脂100重量部に対し2〜4重量部の割合であるこ
とを特徴とする含浸に好適な液状エポキシ樹脂組成物が
提供される。According to the invention, bisphenols with an average molecular weight of 300-600
An epoxy resin consisting of 30 to 60% by weight of an A type epoxy resin and 70 to 40% by weight of an alicyclic epoxy resin having an epoxy group condensed to a liquid ring at room temperature, and an acid anhydride and a room temperature liquid at room temperature. In the composition containing a liquid imidazole compound, the compounding amount of the imidazole compound is 2 to 4 parts by weight relative to 100 parts by weight of the epoxy resin, a liquid epoxy suitable for impregnation. A resin composition is provided.
本発明で用いるエポキシ樹脂は、平均分子量300〜600の
ビスフェノールA型エポキシ樹脂30〜60重量％と常温で
液状の環に縮合したエポキシ基を有する脂環式エポキシ
樹脂70〜40重量％とからなるもので、常温で液状を示
す。本発明においては、平均分子量が上記した範囲のビ
スフェノールA型エポキシ樹脂を使用することが必須と
される。他のエポキシ樹脂、例えば、ビスフェノールF
型エポキシ樹脂を用いた場合には、硬化物の耐熱性が低
下するほか、常温で液状の環に縮合したエポキシ基を有
する脂環式エポキシ樹脂を多量に使用しなければなら
ず、この多量使用では、硬化物がもろくなる。常温で液
状の環に縮合したエポキシ基を有する脂環式エポキシ樹
脂としては、次の如きものが挙げられる。The epoxy resin used in the present invention comprises 30 to 60% by weight of a bisphenol A type epoxy resin having an average molecular weight of 300 to 600 and 70 to 40% by weight of an alicyclic epoxy resin having an epoxy group condensed in a liquid ring at room temperature. It is liquid at room temperature. In the present invention, it is essential to use a bisphenol A type epoxy resin having an average molecular weight in the above range. Other epoxy resins, such as bisphenol F
When using a type epoxy resin, the heat resistance of the cured product decreases, and a large amount of alicyclic epoxy resin having epoxy groups condensed in the liquid ring at room temperature must be used. Then, the cured product becomes brittle. Examples of the alicyclic epoxy resin having an epoxy group condensed in a liquid ring at room temperature include the following.
(1) 3,4-エポキシシクロヘキシルメチル-(3,4-エポキ
シ)シクロヘキサンカルボキシレート (2) ビニルシクロヘキセンジオキサイド (3) ビス(3,4-エポキシシクロヘキシルメチル)アジペー
ト (4) ジシクロアリファティックジエステルジエポキシド 前記混合エポキシ樹脂において、ビスフェノールA型エ
ポキシ樹脂の割合が前記範囲より少なくなると、得られ
るエポキシ樹脂組成物の耐クラック性が劣るようにな
り、一方、前記範囲より多くなると、得られるエポキシ
樹脂組成物の含浸性が悪化するとともに、耐熱性に劣る
ようになる。従って、両者のエポキシ樹脂の混合割合は
前記範囲にするのが好ましい。(1) 3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexanecarboxylate (2) Vinyl cyclohexene dioxide (3) Bis (3,4-epoxycyclohexylmethyl) adipate (4) Dicycloaliphatic diester diepoxide In the mixed epoxy resin, when the proportion of the bisphenol A type epoxy resin is less than the above range, the crack resistance of the resulting epoxy resin composition becomes poor, while when it is more than the above range, the resulting epoxy resin composition is obtained. The impregnating property of is deteriorated and the heat resistance is deteriorated. Therefore, the mixing ratio of both epoxy resins is preferably in the above range.
本発明で用いる硬化剤は、常温で液状の酸無水物であ
り、その具体例としては、例えば、メチルテトラヒドロ
無水フタル酸、メチルヘキサヒドロ無水フタル酸、無水
メチルナジック酸等が挙げられる。また、その硬化促進
剤としては、常温で液状のイミダゾール化合物が用いら
れ、その具体例としては、2-エチル-4-メチルイミダゾ
ールや1-ベンジル-2-メチルイミダゾール等が用いられ
る。The curing agent used in the present invention is an acid anhydride that is liquid at room temperature, and specific examples thereof include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, and methylnadic acid anhydride. Further, as the curing accelerator, an imidazole compound which is liquid at room temperature is used, and specific examples thereof include 2-ethyl-4-methylimidazole and 1-benzyl-2-methylimidazole.
本発明において、硬化促進剤として用いるイミダゾール
化合物は、前記混合エポキシ樹脂100重量部に対し、2〜
4重量部の割合で用いる。この範囲を超えると、エポキ
シ樹脂の含浸性及び硬化性が損われる上に、被膜密着性
が悪くなり、かつポットライフも短かくなり、一方、こ
の範囲より少なくなると、硬化性が著しく悪化するよう
になる。硬化剤として用いる酸無水物の配合量は特に制
約されないが、一般には、混合エポキシ樹脂100当量に
対し、0.5〜1.5重量部、好ましくは0.8〜1.2重量部の割
合である。In the present invention, the imidazole compound used as a curing accelerator is 2 to 100 parts by weight of the mixed epoxy resin.
Used at a ratio of 4 parts by weight. If it exceeds this range, the impregnability and curability of the epoxy resin will be impaired, the film adhesion will deteriorate, and the pot life will also become short, while if it is less than this range, the curability will deteriorate significantly. become. The amount of the acid anhydride used as the curing agent is not particularly limited, but is generally 0.5 to 1.5 parts by weight, preferably 0.8 to 1.2 parts by weight, based on 100 equivalents of the mixed epoxy resin.
本発明のエポキシ樹脂組成物は、常温液状のもので、す
ぐれた含浸性を示し、その上、硬化速度も大きく、ポッ
トライフも長く、かつ硬化被膜の密着性、耐熱性にすぐ
れたものである。本発明のエポキシ樹脂組成物は、温度
100〜180℃において、40〜3分間加熱することにより硬
化させることができ、モータや発電機における固定子及
び回転子のコイル固定用の熱硬化性樹脂として好適のも
のである。The epoxy resin composition of the present invention is liquid at room temperature, exhibits excellent impregnability, has a high curing rate, a long pot life, and has excellent adhesion and heat resistance of a cured film. . The epoxy resin composition of the present invention has a temperature
It can be cured by heating at 100 to 180 ° C. for 40 to 3 minutes, and is suitable as a thermosetting resin for fixing coils of stators and rotors of motors and generators.
次に本発明を実施例によりさらに詳細に説明する。 Next, the present invention will be described in more detail with reference to Examples.
実施例 エピコート828(ビスフェノールA型エポキシ樹脂、分子
量380、油化シェルエポキシ社製)、セロキサイド2021
(3,4-エポキシシクロヘキシルメチル-(3,4-エポキシ)シ
クロヘキサンカルボキシレート、ダイセル化学工業社
製)、HN2200R(メチルテトラヒドロ無水フタル酸、日立
化成社製)、2E4MZ(2-エチル-4-メチルイミダゾール、四
国ファインケミカル社製)を表-1に示す割合量(重量部)
で配合し、液状のエポキシ樹脂組成物を得た。Examples Epicoat 828 (bisphenol A type epoxy resin, molecular weight 380, manufactured by Yuka Shell Epoxy Co., Ltd.), Celoxide 2021
(3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexanecarboxylate, manufactured by Daicel Chemical Industries, Ltd., HN2200R (methyltetrahydrophthalic anhydride, manufactured by Hitachi Chemical Co., Ltd.), 2E4MZ (2-ethyl-4-methyl) Imidazole, manufactured by Shikoku Fine Chemical Co., Ltd.)
To obtain a liquid epoxy resin composition.
次に、この組成物について、その含浸性、硬化性、コイ
ルと硬化樹脂被膜との界面の剥離、クラックの有無、耐
熱性及びポットライフを以下のようにして測定し、性能
評価し、その結果を表-1に示す。Next, for this composition, its impregnability, curability, peeling at the interface between the coil and the cured resin coating, the presence or absence of cracks, heat resistance and pot life were measured as follows, and the performance was evaluated, and the results Are shown in Table-1.
また、比較のために、硬化促進剤として、特開昭61-973
19号公報に示されたDMP-30(2,4,6-トリス(ジメチルアミ
ノメチル)フェノール)を用いた組成物及び脂環式エポキ
シ樹脂に対する硬化促進剤として慣用されている三フッ
化ホウ素モノメチルアミン(表-1において、BF3-MAと略
記)を用いた組成物についても同様の性能評価を行い、
その結果を表-1に示した。For comparison, as a curing accelerator, JP-A-61-973 is used.
Composition using DMP-30 (2,4,6-tris (dimethylaminomethyl) phenol) disclosed in JP-A-19 and boron trifluoride monomethyl which is commonly used as a curing accelerator for alicyclic epoxy resin The same performance evaluation was performed for a composition using an amine (abbreviated as BF 3 -MA in Table 1),
The results are shown in Table-1.
(1) 含浸性 小型発電機用の回転子コアに線径2mmの銅線を約5層に巻
いた回転子コイルを製作し、この回転子コイルを160℃
に加熱してこの上からエポキシ樹脂を滴下含浸させ、16
0℃で硬化させた後、冷却して巻線方向に対して横断す
る方向に回転子コイルを切断し、樹脂の含浸状況を観察
し、含浸性を次のように区分し、「○」を含浸性が良と評
価した。(1) Impregnation A rotor coil for small generators was manufactured by winding a copper coil with a wire diameter of 2 mm into about 5 layers, and this rotor coil was cooled to 160 ° C.
Heat the above to drip-impregnate epoxy resin from above,
After curing at 0 ° C, cool and cut the rotor coil in the direction transverse to the winding direction, observe the resin impregnation state, classify the impregnating property as follows, and mark "○". The impregnation property was evaluated as good.
巻線の全層にわたって樹脂が含浸しているもの：[○] 巻線の3層または4層までしか含浸していないもの：[△] 巻線の1層または2層にしか樹脂が含浸していないもの：
[×] (2) 硬化性 JIS C-2104により、熱板温度150℃でゲルタイムを測定
し、ゲルタイムを次のように区分し、[○]を硬化性が良
と評価した。Resin impregnated in all layers of the winding: [○] Impregnated up to 3 or 4 layers of the winding: [△] Resin impregnated in only 1 or 2 layers of the winding What not:
[×] (2) Curability According to JIS C-2104, the gel time was measured at a hot plate temperature of 150 ° C., the gel time was classified as follows, and [○] was evaluated as having good curability.
70秒〜120秒：[○] 120秒超：[△] 70秒未満：[×] (3) 巻線と硬化樹脂との界面の剥離、クラックの有無 前記(1)の含浸性測定法と同様にして、巻線にエポキシ
樹脂を含浸、硬化させて得られた回転子コイルに空気中
155℃/30分間〜-40℃/30分間のヒートサイクルを10サイ
クルかけた後、室温にして巻線と硬化樹脂との界面を拡
大鏡にて観察し、剥離、クラックの有無の判断した。70 seconds to 120 seconds: [○] more than 120 seconds: [△] less than 70 seconds: [×] (3) Delamination of the interface between the winding and the cured resin, the presence or absence of cracks Similarly, the winding is impregnated with epoxy resin and cured, and the rotor coil obtained is cured in air.
After 10 cycles of heat cycle from 155 ° C / 30 minutes to -40 ° C / 30 minutes, the temperature was brought to room temperature and the interface between the winding and the cured resin was observed with a magnifying glass to determine the presence or absence of peeling and cracks.
(4) 耐熱性 160℃で硬化した樹脂サンプルを、熱分析装置(理学電機
社製、TMA測定装置)にかけて、室温から220℃まで連続
的に昇温しながら各温度における線膨張率を求め、線膨
張率が変化する温度をガス転移温度とした。このガラス
転移温度を次のように区分し、[○]を耐熱性が良と評価
した。(4) Heat resistance A resin sample cured at 160 ° C was applied to a thermal analysis device (TMA measuring device manufactured by Rigaku Denki Co., Ltd.) to obtain the linear expansion coefficient at each temperature while continuously raising the temperature from room temperature to 220 ° C. The temperature at which the coefficient of linear expansion changes was defined as the gas transition temperature. This glass transition temperature was classified as follows, and [○] was evaluated as having good heat resistance.
155℃以上：[○]、155℃未満：[×] (5) ポットライフ 25℃において、エポキシ樹脂と硬化剤及び/又は促進剤
を混合した直後から、その粘度が混合直後の粘度の2倍
になるまでに要した時間を可使時間とし、可使時間が6
時間以上をポットライフ良と評価した。155 ° C or higher: [○], less than 155 ° C: [×] (5) Pot life At 25 ° C, immediately after mixing the epoxy resin with the curing agent and / or accelerator, the viscosity is twice the viscosity immediately after mixing. The time required to become is the work life, and the work life is 6
The pot life was evaluated as good when the time was over.
Claims (3)
エポキシ樹脂30〜60重量％と、常温で液状の環に縮合し
たエポキシ基を有する脂環式エポキシ樹脂70〜40重量％
とからなるエポキシ樹脂に対し、常温で液状の酸無水物
及び常温で液状のイミダゾール化合物を配合した組成物
であって、該イミダゾール化合物の配合量が、該エポキ
シ樹脂100重量部に対し2〜4重量部の割合であることを
特徴とする含浸に好適な液状エポキシ樹脂組成物。1. A bisphenol A type epoxy resin having an average molecular weight of 300 to 600, 30 to 60% by weight, and an alicyclic epoxy resin having an epoxy group condensed to a liquid ring at room temperature, 70 to 40% by weight.
A composition obtained by blending an acid anhydride that is liquid at room temperature and an imidazole compound that is liquid at room temperature with respect to an epoxy resin consisting of, wherein the blending amount of the imidazole compound is 2 to 4 with respect to 100 parts by weight of the epoxy resin. A liquid epoxy resin composition suitable for impregnation, characterized in that it is a part by weight.
クロヘキシルメチル-(3,4-エポキシ)シクロヘキシルカ
ルボキシレートである特許請求の範囲第1項の組成物。2. A composition according to claim 1, wherein the cycloaliphatic epoxy resin is 3,4-epoxycyclohexylmethyl- (3,4-epoxy) cyclohexylcarboxylate.
ダゾールである特許請求の範囲第1項又は第2項の組成
物。3. The composition according to claim 1 or 2, wherein the imidazole is 2-ethyl-4-methylimidazole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62217040A JPH0627182B2 (en) | 1987-08-31 | 1987-08-31 | Liquid epoxy resin composition suitable for impregnation |
| KR1019880011026A KR890003877A (en) | 1987-08-31 | 1988-08-30 | Liquid epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62217040A JPH0627182B2 (en) | 1987-08-31 | 1987-08-31 | Liquid epoxy resin composition suitable for impregnation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6460624A JPS6460624A (en) | 1989-03-07 |
| JPH0627182B2 true JPH0627182B2 (en) | 1994-04-13 |
Family
ID=16697895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62217040A Expired - Lifetime JPH0627182B2 (en) | 1987-08-31 | 1987-08-31 | Liquid epoxy resin composition suitable for impregnation |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH0627182B2 (en) |
| KR (1) | KR890003877A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4155335A4 (en) * | 2020-05-21 | 2024-05-22 | Daicel Corporation | Curable epoxy composition for rotatory electric machine |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2563042Y2 (en) * | 1991-12-04 | 1998-02-18 | ナショナル住宅産業株式会社 | Kasagi mounting structure |
| EP2229416B1 (en) | 2008-01-08 | 2018-04-04 | Dow Global Technologies LLC | High tg epoxy systems for composite application |
| JP7068431B2 (en) * | 2020-05-21 | 2022-05-16 | 株式会社ダイセル | Curable epoxy composition for rotary electric machines |
| CN116083018B (en) * | 2022-12-30 | 2023-10-13 | 广东粤港澳大湾区黄埔材料研究院 | QFN packaging material, preparation method and application thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57134914A (en) * | 1981-02-16 | 1982-08-20 | Toshiba Corp | Manufacture of electric equipment coil |
| EP0073736A1 (en) * | 1981-08-27 | 1983-03-09 | Ciba-Geigy Ag | Process for the manufacture of resin-coated pressure-sensitive products |
| JPS61118906A (en) * | 1984-11-15 | 1986-06-06 | 株式会社日立製作所 | Electric winding and manufacture thereof |
| JPH0717732B2 (en) * | 1985-08-13 | 1995-03-01 | 日本石油化学株式会社 | Structural material using epoxy resin composition as matrix resin |
-
1987
- 1987-08-31 JP JP62217040A patent/JPH0627182B2/en not_active Expired - Lifetime
-
1988
- 1988-08-30 KR KR1019880011026A patent/KR890003877A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4155335A4 (en) * | 2020-05-21 | 2024-05-22 | Daicel Corporation | Curable epoxy composition for rotatory electric machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR890003877A (en) | 1989-04-18 |
| JPS6460624A (en) | 1989-03-07 |
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