JPH06293077A - Expansion bonding method - Google Patents
Expansion bonding methodInfo
- Publication number
- JPH06293077A JPH06293077A JP5104935A JP10493593A JPH06293077A JP H06293077 A JPH06293077 A JP H06293077A JP 5104935 A JP5104935 A JP 5104935A JP 10493593 A JP10493593 A JP 10493593A JP H06293077 A JPH06293077 A JP H06293077A
- Authority
- JP
- Japan
- Prior art keywords
- melt resin
- adhesive layer
- hot
- resin adhesive
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000012943 hotmelt Substances 0.000 claims abstract description 51
- 229920005989 resin Polymers 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 48
- 239000000463 material Substances 0.000 claims abstract description 44
- 239000012790 adhesive layer Substances 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 13
- 239000004831 Hot glue Substances 0.000 abstract 1
- 229920006223 adhesive resin Polymers 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
- B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/08—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/481—Non-reactive adhesives, e.g. physically hardening adhesives
- B29C65/4815—Hot melt adhesives, e.g. thermoplastic adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、基材上に被接着材を接
着する接着方法に係り、特に接着面積を拡大することが
できる拡大接着方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding method for bonding a material to be bonded onto a base material, and more particularly to an expanding bonding method capable of expanding a bonding area.
【０００２】[0002]
【従来の技術】従来、基材上に被接着材を接着する場合
には、接着剤を塗布したり、両面粘着テープを用いる方
法が汎く行なわれており、また接着強度を向上させるた
めに加圧することも行なわれている。2. Description of the Related Art Conventionally, in the case of adhering a material to be adhered onto a base material, a method of applying an adhesive or using a double-sided adhesive tape has been widely used. Pressurization is also performed.
【０００３】[0003]
【発明が解決しようとする課題】前記従来の接着方法の
うち、接着剤を塗布する前者は、接着剤の塗布および乾
燥等の作業が必要で自動化が困難であり、また、有機溶
剤等の有毒物質を用いる必要があるため、作業環境が悪
化するという問題もある。Among the above-mentioned conventional bonding methods, the former method of applying an adhesive requires operations such as application and drying of the adhesive and is difficult to automate, and is toxic to organic solvents and the like. Since it is necessary to use substances, there is also a problem that the working environment deteriorates.
【０００４】また、両面粘着テープを用いる後者は、前
者ほど作業環境を悪化させるおそれは少ないが、テープ
貼りおよび剥離紙の除去等の困難な作業があり、前者以
上に自動化が容易でないとともに、粘着面に空気中のホ
コリが付着した場合には、接着力が極端に低下するとい
う問題がある。The latter, which uses a double-sided adhesive tape, is less likely to worsen the working environment as compared with the former, but there are difficult operations such as tape application and removal of release paper. When dust in the air adheres to the surface, there is a problem that the adhesive force is extremely reduced.
【０００５】また、従来の接着方法は、いずれの場合に
も、接着剤を塗布したり粘着テープを配置した範囲しか
接着することができず、一定の範囲を確実に接着したい
場合には、接着すべき範囲の全域に均一に接着剤や粘着
剤を配置し、しかも接着後、前記範囲を均一に加圧する
必要があり、作業が容易でない。In any case, the conventional bonding method can bond only the area where the adhesive is applied or the adhesive tape is arranged, and when the certain area is desired to be reliably bonded, the bonding is performed. It is necessary to dispose the adhesive or the pressure-sensitive adhesive uniformly over the entire range to be applied, and to pressurize the range evenly after the adhesion, which makes the work difficult.
【０００６】本発明は、かかる現況に鑑みなされたもの
で、簡単な作業で、広い面積を安定して接着でき、作業
環境を悪化させるおそれもない拡大接着方法を提供する
ことを目的とする。The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an expansion bonding method capable of stably bonding a large area with a simple operation and without deteriorating the working environment.
【０００７】[0007]
【課題を解決するための手段】本発明は、前記目的を達
成する手段として、基材上に、ホットメルト樹脂接着層
を介して被接着材を配置するとともに、基材または被接
着材のうちの少なくともいずれか一方側から高周波振動
を印加し、ホットメルト樹脂接着層を拡散させて基材と
被接着材とを接着するようにしたことを特徴とする。[Means for Solving the Problems] As a means for achieving the above-mentioned object, the present invention is to arrange an adherend on a base material via a hot-melt resin adhesive layer, and High-frequency vibration is applied from at least one of the two sides to diffuse the hot melt resin adhesive layer to bond the base material and the adherend.
【０００８】そして、本発明においては、ホットメルト
樹脂接着層の層厚を１０μｍ以上とすることが好まし
い。In the present invention, the hot melt resin adhesive layer preferably has a layer thickness of 10 μm or more.
【０００９】[0009]
【作用】本発明に係る拡大接着方法においては、基材上
に、ホットメルト樹脂接着層を介して被接着材を配置し
た後、基材側あるいは被接着材側から高周波振動を加え
る。この振動の印加により、ホットメルト樹脂接着層が
熱溶融するとともに、振動の拡がりに伴なって、溶融し
たホットメルト樹脂接着層が振動を加えた位置から外側
に均一に拡散し、拡大された広い範囲で基材と被接着材
とが接着される。In the expansion bonding method according to the present invention, the material to be bonded is placed on the base material via the hot-melt resin bonding layer, and then high frequency vibration is applied from the base material side or the target material side. By applying this vibration, the hot-melt resin adhesive layer is melted by heat, and with the spread of the vibration, the molten hot-melt resin adhesive layer is uniformly diffused outward from the position where the vibration is applied, and the expanded wide area is expanded. The base material and the adherend are adhered to each other within the range.
【００１０】そして、本発明において、ホットメルト樹
脂接着層の層厚を１０μｍ以上とすることにより、充分
な接着面積の拡大効果と接着強度とを得ることが可能と
なる。In the present invention, by setting the layer thickness of the hot melt resin adhesive layer to 10 μm or more, it is possible to obtain a sufficient effect of expanding the adhesive area and the adhesive strength.
【００１１】[0011]
【実施例】以下、本発明実施の一例を図面を参照して説
明する。図１において、符号１は、例えば硬質プラスチ
ック製の基材であり、この基材１上には、例えばＰＰ製
の被接着材２が、ホットメルト樹脂接着層３を介して接
着されるようになっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, reference numeral 1 denotes a base material made of, for example, hard plastic, and an adherend 2 made of, for example, PP is adhered to the base material 1 via a hot melt resin adhesive layer 3. Has become.
【００１２】前記ホットメルト樹脂接着層３は、例えば
ゴム系のホットメルト樹脂（例えば、カネボウＮＳＣ株
式会社製のＮＺ−５７００）をシート状にして形成され
ており、その層厚は、１０μｍ以上，好ましくは５０〜
２００μｍに設定されている。そして、このホットメル
ト樹脂接着層３は、超音波振動等の高周波振動４の印加
により熱溶融するとともに、振動の拡がりに伴なって高
周波振動の印加点から周囲に均一に拡散し、拡大された
範囲で基材１と被接着材２とを接着するようになってい
る。The hot-melt resin adhesive layer 3 is made of, for example, a rubber-based hot-melt resin (for example, NZ-5700 manufactured by Kanebo NSC Co., Ltd.) in a sheet shape, and its layer thickness is 10 μm or more, Preferably 50-
It is set to 200 μm. The hot-melt resin adhesive layer 3 is thermally melted by application of high-frequency vibration 4 such as ultrasonic vibration, and also spreads uniformly from the application point of high-frequency vibration to the surroundings as the vibration spreads. The base material 1 and the adherend 2 are adhered to each other within the range.
【００１３】なお、ホットメルト樹脂接着層３の層厚
を、１０μｍ，好ましくは５０〜２００μｍに設定して
いるのは、以下の理由による。すなわち、高周波振動４
を印加しても伸びがほとんどない平板材を接着する場合
には、高周波振動４の印加により、ホットメルト樹脂接
着層３のみが拡散，拡大するため、１０μｍ以上の層厚
があれば、充分な接着力が得られるが、高周波振動４を
印加した際に、伸びるおそれがある素材（例えば、ウレ
タンやゴム等）を用いて複雑な形状に成形したものを接
着する場合には、高周波振動４の印加により、成形品自
体に伸びが生じてホットメルト樹脂説着層３が薄く伸ば
されることになるので、接着力保持のため、５０〜２０
０μｍ程度の層厚が必要となるからである。なお、ここ
で云うホットメルト樹脂接着層３の層厚は、基材１およ
び被接着材の２の表面が平滑な場合の値であり、表面に
凹凸がある場合には、その凹凸形状に合わせて層厚を厚
くする必要があることは云うまでもない。The thickness of the hot melt resin adhesive layer 3 is set to 10 μm, preferably 50 to 200 μm for the following reason. That is, high frequency vibration 4
In the case of adhering a flat plate material having almost no elongation even when applied with, a high-frequency vibration 4 is applied to diffuse and expand only the hot-melt resin adhesive layer 3, so that a layer thickness of 10 μm or more is sufficient. Adhesive force can be obtained, but when a high-frequency vibration 4 is applied and a material formed in a complicated shape using a material (for example, urethane or rubber) that is likely to expand is bonded, By the application, the molded product itself is stretched and the hot-melt resin adhesive layer 3 is thinly stretched.
This is because a layer thickness of about 0 μm is required. The layer thickness of the hot-melt resin adhesive layer 3 referred to here is a value when the surfaces of the base material 1 and the adherend material 2 are smooth, and when the surface has irregularities, it is adjusted to the irregular shape. Needless to say, it is necessary to increase the layer thickness.
【００１４】次に、本実施の一例における拡大接着方法
を、図２を参照して説明する。接着に際しては、まず図
２（ａ）に示すように、基材１上にシート状に加工され
ているホットメルト樹脂接着材を配置してホットメルト
樹脂接着層３とし、その上に、図２（ｂ）に示すように
被接着材２を載置する。Next, the expansion bonding method in this embodiment will be described with reference to FIG. At the time of adhesion, first, as shown in FIG. 2A, a hot-melt resin adhesive material processed into a sheet shape is arranged on the base material 1 to form a hot-melt resin adhesive layer 3, and then the hot-melt resin adhesive layer 3 is formed. The adherend 2 is placed as shown in FIG.
【００１５】次いで、被接着材２の上面側から、超音波
工具ホーン５を用いて、ホットメルト樹脂接着層３に高
周波振動４（図１参照）を加える。すると、ホットメル
ト樹脂接着層３が、加えられた高周波振動４により熱溶
融するとともに、溶融したホットメルト樹脂接着層３
が、振動の拡がりに伴なって加工点から周囲に均一に拡
散し、図２（ｄ）に示すように拡大された広い範囲で基
材１と被接着材２とが接着される。Next, high frequency vibration 4 (see FIG. 1) is applied to the hot melt resin adhesive layer 3 from the upper surface side of the adherend 2 using the ultrasonic tool horn 5. Then, the hot melt resin adhesive layer 3 is thermally melted by the applied high frequency vibration 4, and the melted hot melt resin adhesive layer 3 is melted.
However, as the vibration spreads, it uniformly diffuses from the processing point to the periphery, and the base material 1 and the adherend 2 are bonded to each other in a widened wide range as shown in FIG. 2D.
【００１６】なお、超音波工具ホーン５を駆動する超音
波加工装置としては、その出力が１０Ｗ〜１５Ｋｗ，使
用周波数が３００ＨZ 〜１００ＫＨZ 程度のものが好ま
しい。また超音波工具ホーン５は、その先端振幅（Ｏ
Ｐ）が１０μｍ〜数ｍｍ程度で、先端形状は、フラット
でホットメルト樹脂接着層３の当初の範囲よりも大きい
ものが好ましい。特に、超音波工具ホーン５の先端形状
は、熱溶融したホットメルト樹脂接着層３を均一に拡散
して均一強度で接着させる上で極めて重要である。[0016] As the ultrasonic machining device for driving an ultrasonic tool horn 5, the output of 10W～15Kw, use frequency is preferably about 300H Z ~100KH Z. Further, the ultrasonic tool horn 5 has a tip amplitude (O
P) is about 10 μm to several mm, and the tip shape is preferably flat and larger than the initial range of the hot melt resin adhesive layer 3. In particular, the shape of the tip of the ultrasonic tool horn 5 is extremely important for uniformly diffusing the hot-melt hot melt resin adhesive layer 3 and bonding the hot melt resin adhesive layer 3 with uniform strength.
【００１７】すなわち、超音波工具ホーン５の先端がフ
ラットでなく、またその大きさがホットメルト樹脂接着
層３の当初の範囲よりも小さい場合には、超音波工具ホ
ーン５からの超音波振動４が、ホットメルト樹脂接着層
３に均等に伝わらないことがあり、この場合には、熱溶
融したホットメルト樹脂接着層３を均一に拡散させるこ
とができないからである。That is, when the tip of the ultrasonic tool horn 5 is not flat and the size thereof is smaller than the initial range of the hot melt resin adhesive layer 3, the ultrasonic vibration 4 from the ultrasonic tool horn 5 is generated. However, it may not be evenly transmitted to the hot melt resin adhesive layer 3, and in this case, the hot melt hot melt resin adhesive layer 3 cannot be uniformly diffused.
【００１８】（実験例）本発明者等は、次の条件で、ホ
ットメルト樹脂接着層３を介して基材１と被接着材２と
を接着する実験を行なった。基材１としては、ウレタン
スポンジ，被接着材２としてはＰＰを用い、これらの間
に５０μｍ厚のホットメルト樹脂フィルムをホツトメル
ト樹脂層３として介装した。そしてこれらを、１０×１
５０ｍｍの大きさの治具上に載置し、被接着材２の上面
側から、３．０Ｋｇ／ｃｍ2 の圧力で超音波振動を加え
た。超音波工具ホーン５としては、先端面フラットで３
０×２００ｍｍの大きさのものを用い、先端振幅（Ｏ
Ｐ）は３０μｍ，使用周波数は１５．０ＫＨZ とした。
また、発振時間は１．５ｓｅｃ，冷却時間は０．５ｓｅ
ｃとした。その結果、熱溶融したホットメルト樹脂３が
均一に拡散し、拡大された広い範囲を接着できることが
確認された。(Experimental example) The present inventors conducted an experiment in which the base material 1 and the adherend 2 were adhered via the hot melt resin adhesive layer 3 under the following conditions. Urethane sponge was used as the substrate 1, PP was used as the material to be adhered 2, and a hot melt resin film having a thickness of 50 μm was interposed as a hot melt resin layer 3 between them. And these 10 × 1
It was placed on a jig having a size of 50 mm, and ultrasonic vibration was applied from the upper surface side of the adherend 2 at a pressure of 3.0 Kg / cm 2 . The ultrasonic tool horn 5 has a flat tip 3
Use a size of 0 x 200 mm, and use the tip amplitude (O
P) is 30μm, use frequency was 15.0KH Z.
The oscillation time is 1.5 sec and the cooling time is 0.5 sec.
c. As a result, it was confirmed that the hot-melt hot-melt resin 3 was uniformly diffused and was able to adhere to a wide expanded area.
【００１９】しかして、高周波振動４を加えてホットメ
ルト樹脂層３を熱溶融させることにより、熱溶融したホ
ットメルト樹脂層３を拡散して、拡大された広い範囲を
接着することができる。By applying the high frequency vibration 4 to heat-melt the hot-melt resin layer 3, however, the hot-melt resin layer 3 which has been heat-melted can be diffused to bond the expanded wide area.
【００２０】なお、前記実施の一例においては、シート
状のホットメルト樹脂接着材を用いてホットメルト樹脂
接着層３を形成する場合について説明したが、ホットメ
ルト樹脂接着材を基材１あるいは被接着材２に塗布して
ホットメルト樹脂層３を形成するようにしてもよい。In the above embodiment, the case where the hot-melt resin adhesive layer 3 is formed by using the sheet-shaped hot-melt resin adhesive material has been described, but the hot-melt resin adhesive material is used as the base material 1 or the adherend. The material 2 may be applied to form the hot melt resin layer 3.
【００２１】また、前記実施の一例においては、高周波
振動４を被接着材２側から加える場合について説明した
が、基材１側から加えるようにしてもよく、また必要に
応じ、基材１および被接着材２の両側から加えるように
してもよい。また、縦方向の高周波振動ではなく、捩り
振動工具ホーンを用いて捩り振動とすることも有効であ
る。Further, in the above-mentioned embodiment, the case where the high frequency vibration 4 is applied from the side of the adherend 2 has been described, but it may be applied from the side of the base material 1 and, if necessary, the base material 1 and You may make it add from both sides of the to-be-adhered material 2. It is also effective to use a torsional vibration tool horn to generate torsional vibration instead of vertical high frequency vibration.
【００２２】さらに、前記実施の一例においては、高周
波振動４として、超音波を用いる場合について説明した
が、機械的あるいは電気的な振動を用いるようにしても
よく、同様の効果が期待できる。Further, in the above embodiment, the case where the ultrasonic wave is used as the high frequency vibration 4 has been described, but mechanical or electrical vibration may be used, and the same effect can be expected.
【００２３】[0023]
【発明の効果】以上説明したように本発明は、基材上
に、ホットメルト樹脂接着層を介して被接着材を配置す
るとともに、基材または被接着材のうちの少なくともい
ずれか一方側から高周波振動を印加し、熱溶融したホッ
トメルト樹脂接着層を周囲に拡散させて、基材と被接着
材とを接着するようにしているので、簡単な作業で、広
い面積を安定して接着でき、作業環境を悪化させるおそ
れもなく、自動化も容易である。As described above, according to the present invention, the material to be adhered is arranged on the base material via the hot-melt resin adhesive layer, and at least one of the base material and the material to be adhered is used. Since high-frequency vibration is applied and the hot-melt resin adhesive layer that has been melted by heat is diffused to the periphery to bond the base material and the material to be bonded, it is possible to stably bond a large area with a simple work. , There is no fear of deteriorating the work environment, and automation is easy.
【００２４】そして、本発明において、ホットメルト樹
脂接着層の層厚を μｍ以上とすることにより、充分
な接着面積の拡大効果と接着強度とを得ることができ
る。In the present invention, by setting the thickness of the hot melt resin adhesive layer to be at least μm, it is possible to obtain a sufficient effect of enlarging the adhesive area and the adhesive strength.
【図１】本発明実施の一例に係る拡大接着方法を示す説
明図である。FIG. 1 is an explanatory diagram showing an expansion bonding method according to an example of the present invention.
【図２】（ａ）〜（ｂ）は本発明実施の一例に係る拡大
接着方法を作業手順に従って順次示す説明図である。2 (a) and 2 (b) are explanatory views sequentially showing an expansion bonding method according to an example of the present invention in accordance with a work procedure.
１ 基材 ２ 被接着材 ３ ホットメルト樹脂接着層 ４ 高周波振動 ５ 超音波工具ホーン 1 Base Material 2 Adhesive Material 3 Hot Melt Resin Adhesive Layer 4 High Frequency Vibration 5 Ultrasonic Tool Horn
Claims (2)
して被接着材を配置するとともに、基材または被接着材
のうちの少なくともいずれか一方側から高周波振動を印
加し、ホットメルト樹脂接着層を拡散させて基材と被接
着材とを接着することを特徴とする拡大接着方法。1. A hot melt resin is prepared by disposing an adherend on a base material via a hot melt resin adhesive layer and applying high frequency vibration from at least one of the base material and the adherend. An expanding bonding method, which comprises diffusing an adhesive layer to bond a base material and an adherend.
μｍ以上であることを特徴とする請求項１記載の拡大接
着方法。2. The layer thickness of the hot melt resin adhesive layer is 10
The expansion adhesion method according to claim 1, wherein the expansion adhesion is not less than μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5104935A JPH06293077A (en) | 1993-04-08 | 1993-04-08 | Expansion bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5104935A JPH06293077A (en) | 1993-04-08 | 1993-04-08 | Expansion bonding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06293077A true JPH06293077A (en) | 1994-10-21 |
Family
ID=14393958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5104935A Pending JPH06293077A (en) | 1993-04-08 | 1993-04-08 | Expansion bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06293077A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6792667B2 (en) * | 2001-10-23 | 2004-09-21 | Di/Dt, Inc. | Fully automatic process for magnetic circuit assembly |
| JP2005282165A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Surface material peeling method |
| JP2005281533A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Part peeling method |
| JP2013108257A (en) * | 2011-11-18 | 2013-06-06 | Canon Machinery Inc | Assembly device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60236828A (en) * | 1984-05-08 | 1985-11-25 | Pearl Kogyo Kk | Machining method of sun shade for car |
| JPS6245124B2 (en) * | 1979-05-30 | 1987-09-25 | Tokyo Shibaura Electric Co | |
| JPH03229034A (en) * | 1990-01-31 | 1991-10-11 | Tokai Rubber Ind Ltd | Manufacture of viscous body enclosing damper |
-
1993
- 1993-04-08 JP JP5104935A patent/JPH06293077A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6245124B2 (en) * | 1979-05-30 | 1987-09-25 | Tokyo Shibaura Electric Co | |
| JPS60236828A (en) * | 1984-05-08 | 1985-11-25 | Pearl Kogyo Kk | Machining method of sun shade for car |
| JPH03229034A (en) * | 1990-01-31 | 1991-10-11 | Tokai Rubber Ind Ltd | Manufacture of viscous body enclosing damper |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6792667B2 (en) * | 2001-10-23 | 2004-09-21 | Di/Dt, Inc. | Fully automatic process for magnetic circuit assembly |
| JP2005282165A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Surface material peeling method |
| JP2005281533A (en) * | 2004-03-30 | 2005-10-13 | Sekisui Chem Co Ltd | Part peeling method |
| JP2013108257A (en) * | 2011-11-18 | 2013-06-06 | Canon Machinery Inc | Assembly device |
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