JPH06310896A - Particles for shielding electromagnetic wave and electromagnetic wave shielding molded object using the same - Google Patents
Particles for shielding electromagnetic wave and electromagnetic wave shielding molded object using the sameInfo
- Publication number
- JPH06310896A JPH06310896A JP12038393A JP12038393A JPH06310896A JP H06310896 A JPH06310896 A JP H06310896A JP 12038393 A JP12038393 A JP 12038393A JP 12038393 A JP12038393 A JP 12038393A JP H06310896 A JPH06310896 A JP H06310896A
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic wave
- particles
- amorphous alloy
- shielding
- wave shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 59
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract description 30
- 238000002844 melting Methods 0.000 claims abstract description 13
- 230000008018 melting Effects 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 239000007769 metal material Substances 0.000 claims abstract description 12
- 230000005684 electric field Effects 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 238000000151 deposition Methods 0.000 claims abstract 2
- 238000000465 moulding Methods 0.000 claims description 14
- 238000005219 brazing Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 8
- 239000010949 copper Substances 0.000 abstract description 8
- 230000035699 permeability Effects 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- TVZPLCNGKSPOJA-UHFFFAOYSA-N copper zinc Chemical compound [Cu].[Zn] TVZPLCNGKSPOJA-UHFFFAOYSA-N 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000002156 mixing Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電磁波のシールドが必
要な物体に施される磁気電磁波シールド成形体及びそれ
を成形するために使用される電磁波シールド用粒子に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic and electromagnetic wave shield molded body applied to an object requiring electromagnetic wave shielding and electromagnetic wave shielding particles used for molding the same.
【０００２】[0002]
【従来の技術】放射電磁波のシールドは、電磁波シール
ドが必要な物体に対し、これを電磁波シールド材料で全
面、或いはその一部を覆うことにより、電磁波シールド
性を発揮することが可能であり、電気回路内の部分とし
て、又建築的規模で、広く使用されている。電磁波シー
ルド理論においては、電界波に対しては導電率の良いも
のほど良好なシールド効果を示すが、磁界波をシールド
するには単に導電率が高いだけでは有効でなく、高透磁
率の磁性材料が必要とされている。2. Description of the Related Art A shield for radiated electromagnetic waves is capable of exerting an electromagnetic wave shielding property by covering an object requiring an electromagnetic wave shield with an electromagnetic wave shielding material over the entire surface or a part thereof. Widely used as part of circuits and on an architectural scale. In the electromagnetic wave shield theory, the better the electric conductivity wave is, the better the shielding effect is. However, the magnetic field wave is not effectively shielded by simply having a high electric conductivity. Is needed.
【０００３】然しながら、高導電率で、高透磁率である
という単材はなく、またシールド層の厚さを増すことに
よりシールド効果を向上させることは、シールド層の重
量増につながり好ましくない。However, there is no single material having a high electric conductivity and a high magnetic permeability, and it is not preferable to increase the shield effect by increasing the thickness of the shield layer, because it increases the weight of the shield layer.
【０００４】鉄板に銅メッキを施した板材、銅箔やアル
ミ箔で非晶質合金フレークをはさみ、加熱圧着させた導
電性非晶質合金積層シートなどが電磁波シールド材とし
て知られているが、インジエクション成形や、型成形が
できないため、特に電気電子回路などのシールドケース
や、筺体などの用途に対しては部品点数が多くなる、加
工が困難であるなどの問題点がある。Known as an electromagnetic wave shielding material are a sheet material obtained by plating an iron plate with copper, a conductive amorphous alloy laminated sheet obtained by sandwiching amorphous alloy flakes with copper foil or aluminum foil, and heat-pressing them. Since injection molding and mold molding cannot be performed, there are problems that the number of parts is large and the processing is difficult, especially for applications such as a shield case for electric and electronic circuits and a housing.
【０００５】[0005]
【発明が解決しようとする課題】本発明は、従来技術の
このような問題点に着目してなされたものであり、電磁
波シールドを必要とするいかなる場面においても電磁波
シールドが確実に実施できる電磁波シールド成形体及び
それを成形するために使用する電磁波シールド用粒子を
提供することを課題としている。SUMMARY OF THE INVENTION The present invention has been made by paying attention to such problems of the prior art, and the electromagnetic wave shield can be surely implemented in any situation where the electromagnetic wave shield is required. An object of the present invention is to provide a molded body and particles for electromagnetic wave shielding used for molding the molded body.
【０００６】[0006]
【課題を解決するための手段及び作用】形状が鱗片状、
板状又は略球状で、厚さ５〜１００μｍ、アスペクト比
１０〜１5,０００である非晶質合金粒子に、高透電率金
属材料を、メッキ或いはスパッタリングのような蒸着に
より、コーティングさせた高透磁率非晶質合金粒子に、
半田、亜鉛−銅合金のように金属を接合するため使用さ
れている比較的低融点でとける鑞をコーティングさせた
電磁波シールド用粒子を作り、これを加熱加圧してその
集合体である成形体を作成して電磁波シールド成形体と
して使用する、或いはその電磁波シールド成形体又は電
磁波シールド用粒子と樹脂とを混合し、鑞の融点以上の
温度で加熱加圧成形して電磁波シールド成形体として使
用することにより、電界波と磁界波との両方を同時に効
率よくシールドする電磁波シールド成形体がえられるこ
とを認めた。[Means and Actions for Solving the Problem] The shape is scale-like,
Amorphous alloy particles having a plate-like or substantially spherical shape and a thickness of 5 to 100 μm and an aspect ratio of 10 to 15,000 are coated with a metal material having a high electric conductivity by vapor deposition such as plating or sputtering. Permeability amorphous alloy particles,
Solder, zinc-copper alloy used for joining metals, which is used for joining metals, is made of brazing-coated electromagnetic wave shielding particles for electromagnetic wave shielding, which is heated and pressed to form a molded body which is an aggregate thereof. Create and use as an electromagnetic wave shield molded body, or mix the electromagnetic wave shield molded body or particles for electromagnetic wave shielding with a resin, and heat and press-mold at a temperature not lower than the melting point of the braze to use as an electromagnetic wave shield molded body. By this, it was confirmed that an electromagnetic wave shield molding which efficiently shields both electric field waves and magnetic field waves at the same time can be obtained.
【０００７】非晶質合金粒子に直接鑞をコーティングさ
せた粒子を、鑞の融点以上の温度で加熱加圧成形する
と、加熱の際、鑞コーティング層が非晶質合金粒子表面
から溶融脱離し、成形性及び成形後の電磁波シールド効
果が低下する。然し、予め非晶質合金粒子に、メッキ又
は蒸着などの方法により、鑞より高い融点を有する高導
電率金属材料の層を形成させたあと、鑞をコーティング
させてえられる電磁波シールド用粒子は、鑞の融点以上
の温度で加熱しても鑞の溶融脱離が少ない。このため加
熱加圧成形性及び成形後の電磁波シールド効果が良好で
ある。高導電率金属材料としては、主としてCu、Agなど
を主体とした高融点金属材料が使用され、鑞としては高
導電率金属材料より低融点である亜鉛−銅、半田などの
溶融して金属を接合させるのに使用されるものが使用可
能であるが、特に例えば、コモンソルダー、プランバー
ソルダー、チンスミスソルダーなどの半田類が好ましい
といえる。When the amorphous alloy particles are directly coated with the brazing particles by heating and pressing at a temperature above the melting point of the brazing material, the brazing coating layer is melted and desorbed from the surface of the amorphous alloy particles during heating, The moldability and the electromagnetic wave shielding effect after molding are reduced. However, the amorphous alloy particles in advance, by a method such as plating or vapor deposition, after forming a layer of a high-conductivity metal material having a melting point higher than that of the braze, the electromagnetic shielding particles obtained by coating the braze, Even if heated at a temperature above the melting point of the brazing material, the melting and desorption of the brazing material is small. Therefore, the heat and pressure moldability and the electromagnetic wave shielding effect after molding are good. As the high-conductivity metal material, a high-melting-point metal material mainly composed of Cu, Ag or the like is mainly used, and as the brazing metal having a melting point lower than that of the high-conductivity-metal material, such as zinc-copper, and melting metal such as solder. What is used for joining can be used, but it can be said that solders such as common solder, plumber solder and Chin Smith solder are particularly preferable.
【０００８】上記の方法でえられた電磁波シールド用粒
子は、非晶質合金粒子の特性である約１０００００に達
する透磁率により放射電磁波における磁界波（ローイン
ピーダンス波）、特に波源に近い（云い替えれば低周
波）領域でのシールド効果が高い。また非晶質合金粒子
の周囲に形成された高導電率金属材料は、例えばCu、Ag
など、の層は、その導電率の高さにより、電界波（ハイ
インピーダンス波）のシールド効果が高い。よって電磁
波シールド用粒子は、電磁波における電界波と磁界波と
の両方の高いシールド効果を有している。The electromagnetic wave shielding particles obtained by the above method are close to a magnetic field wave (low impedance wave) in radiated electromagnetic waves, particularly a wave source due to the magnetic permeability of about 100000 which is a characteristic of amorphous alloy particles (in other words The shield effect is high in the low frequency region. The high conductivity metal material formed around the amorphous alloy particles is, for example, Cu, Ag.
Due to its high electrical conductivity, the layer (1), etc. has a high shielding effect for electric field waves (high impedance waves). Therefore, the particles for electromagnetic wave shielding have a high shielding effect for both electric field waves and magnetic field waves in electromagnetic waves.
【０００９】非晶質合金粒子の厚さを５μｍ未満にする
と、非晶質合金粒子の製造が困難となり、１００μｍを
越えて厚くすると非晶質化が難しくなるので、その厚さ
は５〜１００μｍとする。特に好ましい厚さは、２０〜
６０μｍである。If the thickness of the amorphous alloy particles is less than 5 μm, it becomes difficult to produce the amorphous alloy particles, and if it exceeds 100 μm, it becomes difficult to amorphize. Therefore, the thickness is 5 to 100 μm. And A particularly preferred thickness is 20 to
It is 60 μm.
【００１０】非晶質合金粒子のアスペクト比が１０未満
では、非晶質合金粒子を集合体として成形する場合、非
晶質合金粒子同志の電気抵抗価が高くなり、且つ非晶質
合金粒子の透磁率が低下する。他方アスペクト比が１５
０００を越えると、非晶質合金粒子の取扱が面倒にな
り、生産性が低下する。加えて非晶質合金粒子同志の絡
みつきを生じ、成形時の非晶質合金粒子の密度を著しく
低下させる。このためそのアスペクト比は１０〜１5,０
００、特に好ましくは５０〜１００００の範囲である。When the aspect ratio of the amorphous alloy particles is less than 10, when forming the amorphous alloy particles as an aggregate, the electric resistance values of the amorphous alloy particles are high, and the amorphous alloy particles have a high electric resistance. Permeability decreases. On the other hand, the aspect ratio is 15
When it exceeds 000, the handling of the amorphous alloy particles becomes troublesome and the productivity is lowered. In addition, the amorphous alloy particles are entangled with each other, and the density of the amorphous alloy particles during molding is remarkably reduced. Therefore, the aspect ratio is 10 to 150,0.
00, particularly preferably 50 to 10,000.
【００１１】このようにして得られた電磁波シールド用
粒子は、その集合体を加熱加圧することにより、その粒
子同志の表面の鑞が溶融して押付けられる。その後冷却
すると粒子同志が完全に融着され、且つ溶融した鑞が粒
子の重なりの間に生じる隙間を埋めるため、高い電磁波
シールド効果を示す電磁波シールド用粒子の集合体であ
る電磁波シールド成形体がえられる。The particles for electromagnetic wave shielding thus obtained are pressed by melting the brazing on the surface of the particles by heating and pressing the aggregate. When cooled thereafter, the particles are completely fused together, and the molten braze fills the gaps created between the overlapping particles, so an electromagnetic wave shield molded body that is an aggregate of particles for electromagnetic wave shield that exhibits a high electromagnetic wave shielding effect is obtained. To be
【００１２】又、電磁波シールド用粒子或いはその集合
体である電磁波シールド成形体と樹脂とを混合し、鑞の
融点以上の温度で加熱加圧成形することにより、電磁波
シールド用粒子、或いは電磁波シールド成形体が融着さ
れて重なり合い電気的導通が良好になり、且つ鑞が電磁
波シールド用粒子、或いは電磁波シールド成形体の重な
りの間に生じる隙間を埋めるため、高い電磁波シールド
効果を発揮するとともに放射電磁波における磁界波（ロ
ーインピーダンス波）は、高透磁率磁性材料である非晶
質合金粒子によりシールドされ、電界波（ハイインピー
ダンス波）は、非晶質合金粒子に施された高導電率金属
材料によりシールドされる。このため電界波、磁界波の
両方を効率よくシールドする電磁波シールド成形体とな
る。Particles for electromagnetic wave shielding or particles for electromagnetic wave shielding or electromagnetic wave shielding molding by mixing an electromagnetic wave shielding molded body, which is an aggregate of the electromagnetic wave shielding particles, and a resin, and heating and pressing at a temperature not lower than the melting point of the brazing material. The body is fused and overlapped to improve electrical conduction, and the braze fills the gap generated between the electromagnetic wave shielding particles or the electromagnetic wave shielding molded body, thereby exhibiting a high electromagnetic wave shielding effect and radiating electromagnetic waves. Magnetic field waves (low impedance waves) are shielded by amorphous alloy particles that are magnetic materials with high magnetic permeability, and electric field waves (high impedance waves) are shielded by high conductivity metal materials applied to the amorphous alloy particles. To be done. Therefore, the electromagnetic wave shield molded body efficiently shields both electric field waves and magnetic field waves.
【００１３】以下に、本発明の磁気電磁波シールド成形
体の実施例を説明する。図１は、非晶質合金フレーク１
の表面に銅メッキ２を施した高透磁率非晶質合金粒子を
更に半田漕に漬け銅メッキ表面に半田層３を形成した、
電磁波シールド用粒子４の断面図である。銅メッキの厚
さは５（μｍ）〜１０（μｍ）、半田層の厚さは１５
（μｍ）〜３０（μｍ）であった。図２は上記電磁波シ
ールド用粒子４とエポキシ樹脂５を混合したものを、型
に注入し、３５０℃で加圧成形した、電磁波シールド成
形体６の断面図である。電磁波シールド用粒子４の表面
に形成された半田層は、電磁波シールド用粒子が接触す
る箇所で融着されており非常に良好な導通状態を示し
た。またこの方法で２００（ｍｍ）角、厚さ0.８（ｍ
ｍ）の試料を作製し、アドバンテスト法により電磁波シ
ールド効果の測定を行った。結果は電界波が１００（Ｍ
Ｈｚ）で７５（ｄＢ）以上、磁界波が１０（ｋＨｚ）で
３０（ｄＢ）以上、１０（ＭＨｚ）で６５（ｄＢ）以上
と、高いシールド効果を示した。Examples of the magnetic electromagnetic wave shield molding of the present invention will be described below. FIG. 1 shows an amorphous alloy flake 1
The high-permeability amorphous alloy particles having the copper plating 2 on the surface of were further immersed in a solder bath to form a solder layer 3 on the copper plating surface.
3 is a cross-sectional view of an electromagnetic wave shielding particle 4. FIG. The thickness of copper plating is 5 (μm) to 10 (μm), and the thickness of solder layer is 15
(Μm) to 30 (μm). FIG. 2 is a cross-sectional view of an electromagnetic wave shield molded body 6 in which a mixture of the electromagnetic wave shielding particles 4 and the epoxy resin 5 is injected into a mold and pressure-molded at 350 ° C. The solder layer formed on the surface of the electromagnetic wave shielding particles 4 was fused at the position where the electromagnetic wave shielding particles were in contact with each other, and showed a very good conduction state. In addition, with this method, 200 (mm) square, thickness 0.8 (m
The sample m) was prepared and the electromagnetic wave shielding effect was measured by the Advantest method. The result is that the electric field wave is 100 (M
It showed a high shielding effect of 75 (dB) or more at (Hz) and 30 (dB) or more at 10 (kHz) magnetic field waves and 65 (dB) or more at 10 (MHz).
【００１４】[0014]
【発明の効果】本発明による電磁波シールド用粒子は、
その構成により電界波、磁界波の両方に対しすぐれたシ
ールド効果を示すので、それを加熱加圧成形してえられ
る電磁波シールド成形体は電磁波に対しすぐれたシール
ド効果を示す。The particles for electromagnetic wave shielding according to the present invention are
Since the structure shows an excellent shield effect against both electric field waves and magnetic field waves, the electromagnetic wave shield molding obtained by heating and pressurizing it shows an excellent shield effect against electromagnetic waves.
【図１】本発明による電磁波シールド用粒子の断面図で
ある。FIG. 1 is a sectional view of an electromagnetic wave shielding particle according to the present invention.
【図２】図１の電磁波シールド用粒子を用いて成形した
電磁波シールド成形体の断面図である。FIG. 2 is a cross-sectional view of an electromagnetic wave shield molded body formed using the electromagnetic wave shielding particles of FIG.
１ 非晶質合金フレーク ２ 銅メッキ ３ 半田層 ４ 電磁波シールド用粒子 ５ エポキシ樹脂 ６ 電磁波シールド成形体 1 Amorphous alloy flakes 2 Copper plating 3 Solder layer 4 Electromagnetic wave shielding particles 5 Epoxy resin 6 Electromagnetic wave shield molding
Claims (6)
料をメッキ或は蒸着させてえられた高透磁率非晶質合金
粒子に、該金属材料より低い融点を有する鑞をコーティ
ングさせたことを特徴とする電磁波シールド用粒子。1. High-permeability amorphous alloy particles obtained by plating or vapor-depositing a high-conductivity metal material on the surface of the amorphous alloy particles are coated with a brazing material having a melting point lower than that of the metal material. Particles for electromagnetic wave shielding, which are characterized in that
球状であり、厚さ５〜１００μｍ、アスペクト比１０〜
１5,０００である請求項１の電磁波シールド用粒子。2. The amorphous alloy particles are scaly, plate-like or substantially spherical, have a thickness of 5 to 100 μm and an aspect ratio of 10 to 10.
The particle for electromagnetic wave shielding according to claim 1, which is 15,000.
シールド用粒子。3. The electromagnetic wave shielding particle according to claim 1, wherein the brazing material is solder.
電磁波シールド用粒子を加熱加圧してえられたことを特
徴とする電磁波シールド成形体。4. An electromagnetic wave shield molded product obtained by heating and pressing the electromagnetic wave shield particles according to claim 1.
電磁波シールド用粒子又は請求項４記載の電磁波シール
ド成形体と樹脂とを混合し、鑞の融点以上の温度で加熱
加圧成形させてえられたことを特徴とする電磁波シール
ド成形体。5. An electromagnetic wave shielding particle according to any one of claims 1 to 3 or an electromagnetic wave shield molding according to claim 4 and a resin are mixed and heated and pressed at a temperature equal to or higher than the melting point of the braze. An electromagnetic wave shield molding characterized by being obtained.
両方を同時に効率よくシールドする請求項４又は５の電
磁波シールド成形体。6. The electromagnetic wave shield molding according to claim 4, wherein both the magnetic field wave and the electric field wave of the radiated electromagnetic wave are efficiently shielded at the same time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12038393A JPH06310896A (en) | 1993-04-26 | 1993-04-26 | Particles for shielding electromagnetic wave and electromagnetic wave shielding molded object using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12038393A JPH06310896A (en) | 1993-04-26 | 1993-04-26 | Particles for shielding electromagnetic wave and electromagnetic wave shielding molded object using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06310896A true JPH06310896A (en) | 1994-11-04 |
Family
ID=14784856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12038393A Pending JPH06310896A (en) | 1993-04-26 | 1993-04-26 | Particles for shielding electromagnetic wave and electromagnetic wave shielding molded object using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06310896A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006134907A (en) * | 2004-11-02 | 2006-05-25 | Dowa Mining Co Ltd | Radio wave absorber material and radio wave absorber |
| WO2018147424A1 (en) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | Printed wiring board |
| CN110062571A (en) * | 2019-03-11 | 2019-07-26 | 常州讯宛德电子有限公司 | A kind of preparation method of porous foam charcoal electromagnetic shielding composite material |
-
1993
- 1993-04-26 JP JP12038393A patent/JPH06310896A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006134907A (en) * | 2004-11-02 | 2006-05-25 | Dowa Mining Co Ltd | Radio wave absorber material and radio wave absorber |
| WO2018147424A1 (en) * | 2017-02-13 | 2018-08-16 | タツタ電線株式会社 | Printed wiring board |
| JPWO2018147424A1 (en) * | 2017-02-13 | 2019-12-12 | タツタ電線株式会社 | Printed wiring board |
| CN110062571A (en) * | 2019-03-11 | 2019-07-26 | 常州讯宛德电子有限公司 | A kind of preparation method of porous foam charcoal electromagnetic shielding composite material |
| CN110062571B (en) * | 2019-03-11 | 2020-12-01 | 磐安县阳安科技有限公司 | Preparation method of porous foam carbon electromagnetic shielding composite material |
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