JPH0631442B2 - Multi-layer plated steel sheet for solder - Google Patents
Multi-layer plated steel sheet for solderInfo
- Publication number
- JPH0631442B2 JPH0631442B2 JP1060686A JP6068689A JPH0631442B2 JP H0631442 B2 JPH0631442 B2 JP H0631442B2 JP 1060686 A JP1060686 A JP 1060686A JP 6068689 A JP6068689 A JP 6068689A JP H0631442 B2 JPH0631442 B2 JP H0631442B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solder
- corrosion resistance
- steel sheet
- solderability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 18
- 229910000831 Steel Inorganic materials 0.000 title claims description 16
- 239000010959 steel Substances 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 238000005260 corrosion Methods 0.000 description 26
- 230000007797 corrosion Effects 0.000 description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 20
- 230000000694 effects Effects 0.000 description 6
- 230000003679 aging effect Effects 0.000 description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 5
- ZCDOYSPFYFSLEW-UHFFFAOYSA-N chromate(2-) Chemical compound [O-][Cr]([O-])(=O)=O ZCDOYSPFYFSLEW-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002845 discoloration Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 102100020895 Ammonium transporter Rh type A Human genes 0.000 description 1
- 101100301844 Arabidopsis thaliana RH50 gene Proteins 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 101150107345 Rhag gene Proteins 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- -1 and in particular Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、半田用鋼板に係り、半田の拡がり、半田ピー
ル強度（以下、半田性と略す）、耐食性、加工性、経時
性および経済性に優れたNiを下層とした半田用被層めっ
き鋼板に関する。Description: TECHNICAL FIELD The present invention relates to a steel plate for soldering, spread of solder, solder peel strength (hereinafter, abbreviated as solderability), corrosion resistance, workability, aging property and economical efficiency. A layered steel sheet for solder having Ni as a lower layer, which is excellent in heat resistance.
半田の可能な鋼板として、Snめっき鋼板があることは広
く知られているところである。Snめっき鋼板は半田性に
優れているが、耐食性が十分でない。そのため、通常の
雰囲気において、未塗装で使用する場合、めっき量が５
ｇ／m2以上必要であり、経済性に劣る。しかも、めっき
量が５〜１０ｇ／m2の場合でも、ＪＩＳ Ｚ ２３７１
に規定された塩水噴霧試験、２４時間で全面に赤錆の発
生が認められる場合が多い。したがって、耐食性の向上
のため、クロメート処理、あるいはりん酸塩処理などの
化成処理が施されている。クロメート処理の場合、耐食
性を向上させるためには、Crとして、０．２mg/dm2以上
必要である。しかし、クロメート処理を０．１mg/dm2以
上施すと、半田性が著しく低下するので好ましくない。
言い換えれば、耐食性が劣るのが実情である。It is widely known that there is a Sn-plated steel plate as a solderable steel plate. Sn-plated steel sheet has excellent solderability, but its corrosion resistance is not sufficient. Therefore, when used unpainted in a normal atmosphere, the plating amount is 5
It is required to be g / m 2 or more, which is inferior in economic efficiency. Moreover, even when the plating amount is 5 to 10 g / m 2 , JIS Z 2371
In many cases, the occurrence of red rust is observed on the entire surface after 24 hours of the salt spray test specified in the above. Therefore, in order to improve the corrosion resistance, a chemical conversion treatment such as a chromate treatment or a phosphate treatment is performed. In the case of chromate treatment, Cr should be 0.2 mg / dm 2 or more in order to improve the corrosion resistance. However, if the chromate treatment is applied at 0.1 mg / dm 2 or more, the solderability is significantly reduced, which is not preferable.
In other words, the fact is that corrosion resistance is poor.
前述のごとく、半田性、耐食性、加工性、経時性および
経済性に優れためっき鋼板を得るためには、Snめっき鋼
板の場合、半田性をそこなわないようにして、耐食性を
向上させる必要がある。しかし、公知の方法では、半田
性と耐食性の向上は相反する傾向があるので、耐食性に
優れると同時に半田性にも優れた鋼板を得ることは困難
である。As described above, in order to obtain a plated steel sheet excellent in solderability, corrosion resistance, workability, aging property and economical efficiency, in the case of Sn plated steel sheet, it is necessary to improve the corrosion resistance by not impairing the solderability. is there. However, in the known method, the improvement in solderability and the corrosion resistance tend to contradict each other. Therefore, it is difficult to obtain a steel sheet having excellent corrosion resistance and solderability at the same time.
したがって、めっき層の改善が必要である。Therefore, it is necessary to improve the plating layer.
本発明による、めっき層の改善はNiめっき量が０．０２
〜１０ｇ／m2を下層とし、その上に、Zn，あるいはZnに
Ni,Fe,Sn,Cuの１種以上を含有したNiの標準電極電位
（以下、電位と略す）より卑な電位を示す合金めっきの
０．１〜５０ｇ／m2を上層としたことを特徴とする。The improvement of the plating layer according to the present invention is such that the Ni plating amount is 0.02.
-10g / m 2 as the lower layer, and then Zn or Zn
Characterized by the upper layer being 0.1 to 50 g / m 2 of alloy plating showing a base potential lower than the standard electrode potential of Ni containing one or more of Ni, Fe, Sn and Cu (hereinafter abbreviated as potential) And
以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.
本発明において、Niめっきは、硫酸ニッケル、スルファ
ミン酸、塩化ニッケル等を含む公知の酸性浴でめっきさ
れたものである。また、光沢剤を含むめっき浴からめっ
きされた光沢Niめっきでもさしつかえない。通常、電気
めっきでは、Ni単独めっきの方が作業性の点から優れて
いる。Niめっき量は０．０２〜１０ｇ／m2である。０．
０２ｇ／m2での半田ピール強度は、Niめっきを施さない
ときの４kgに対して、５kgと向上するが、それ以下の場
合は下地鋼板をNiで均一に被覆することができず、特
に、半田ピール強度は改善されず、半田性のバラツキの
原因となる。また、耐食性への効果も少なく、好ましく
ない。１０ｇ／m2以上になると、半田性、耐食性につい
ては優れる傾向にあるが、経済性に劣る。In the present invention, the Ni plating is plating with a known acidic bath containing nickel sulfate, sulfamic acid, nickel chloride and the like. Also, bright Ni plating plated from a plating bath containing a brightening agent may be used. Generally, in electroplating, Ni single plating is superior in workability. The amount of Ni plating is 0.02 to 10 g / m 2 . 0.
The solder peel strength at 02 g / m 2 is improved to 5 kg compared to 4 kg when Ni plating is not applied, but if it is less than this, the base steel sheet cannot be uniformly coated with Ni, and in particular, Solder peel strength is not improved, which causes variations in solderability. Moreover, the effect on the corrosion resistance is small, which is not preferable. When it is 10 g / m 2 or more, solderability and corrosion resistance tend to be excellent, but economic efficiency is poor.
次に、その上に被覆するZnめっきは、アルカリ浴からの
めっき、あるいは酸性浴からの公知のめっきのいずれか
らもさしつかえない。また、これらにNi,Fe,Sn,Cuの１
種以上を含有することができるが、いずれもNiの電位よ
り卑な電位でなければならない。作業性の点からみれ
ば、単独めっきの方が容易である。めっき量は０．１〜
５０ｇ／m2が好ましい。０．１ｇ／m2以下の場合は、耐
食性が著しく劣り、５０ｇ／m2以上になると、Niの効果
が半減し、加えて、経済性が劣る。上層がNiより貴なめ
っきの場合、耐食性に対して、Niの効果がみられないの
で好ましくない。Next, the Zn plating to be coated thereon may be plating from an alkaline bath or known plating from an acidic bath. In addition, one of Ni, Fe, Sn, Cu
Although more than one species can be contained, they must all have a potential lower than that of Ni. From the viewpoint of workability, the single plating is easier. Plating amount is 0.1
50 g / m 2 is preferred. When it is 0.1 g / m 2 or less, the corrosion resistance is remarkably inferior, and when it is 50 g / m 2 or more, the effect of Ni is halved and the economical efficiency is poor. When the upper layer is a plating nobler than Ni, Ni is not effective for corrosion resistance, which is not preferable.
また、本発明のNiめっきのあと、半田性をそこなわない
で耐食性を改善するために、Znに、Mo,Crを含むめっき
を施し、そして、本発明の上層のめっきをしてもさしつ
かえない。また、上層のめっき層をさらに複層にするこ
ともできる。Further, after the Ni plating of the present invention, in order to improve the corrosion resistance without impairing the solderability, Zn is plated with Mo, Cr, and the upper layer of the present invention may be plated. . Further, the upper plating layer can be made into a multilayer.
このようにして作成した複層めっき鋼板は、そのまま使
用してもよいが、半田性をさらに改善するために、耐食
性をそこなわないような後処理を施すことができる。た
とえば、ポリエチレングリコール・フェニールエーテル
を厚み０．５μｍになるように塗布すると効果的であ
る。The multi-layer plated steel sheet thus produced may be used as it is, but in order to further improve the solderability, it is possible to carry out a post-treatment that does not impair the corrosion resistance. For example, it is effective to apply polyethylene glycol phenyl ether to a thickness of 0.5 μm.
本発明の複層めっきによって、半田性、耐食性、加工
性、経時性および経済性が著しく向上する結果が得られ
た。With the multi-layer plating of the present invention, the result was obtained that solderability, corrosion resistance, workability, aging property and economical efficiency were remarkably improved.
特性が向上する理由は明らかでないが、耐食性について
は、上層のめっき層が下層のNiめっき層に比べて電位は
卑な方向にあり、腐食環境にさらされたとき、Niめっき
表面に存在する卑な金属が、より優先されて腐食するた
め、Niの溶解が抑制され、その結果として、鋼板のFeの
溶出が抑制されるものと考えられる。つまり、赤錆の発
生が抑えられているものと考えられる。半田性について
は、下層のNiめっきが半田（Sn-Pb）との合金化におい
て、強度を改善しているものと考えられる。Although the reason for the improvement in characteristics is not clear, regarding the corrosion resistance, the upper plating layer has a lower potential than the lower Ni plating layer, and when exposed to a corrosive environment, the base metal that exists on the Ni plating surface. It is considered that since the corrosion of other metals is given higher priority, the dissolution of Ni is suppressed, and as a result, the elution of Fe from the steel sheet is suppressed. That is, it is considered that the generation of red rust is suppressed. Regarding solderability, it is considered that the Ni plating of the lower layer improves strength in alloying with solder (Sn-Pb).
本発明は、かかる知見のもとになされたものであって、
本発明の処理をすることによって、半田性、特に半田強
度に優れ、耐食性、加工性、経時性および経済性に優れ
た複層めっき鋼板を連続的に生産できる。The present invention was made based on such findings,
By carrying out the treatment of the present invention, it is possible to continuously produce a multi-layer plated steel sheet having excellent solderability, particularly solder strength, corrosion resistance, workability, aging property and economical efficiency.
以下、本発明の効果を実施例（１〜７）、比較例（１〜
７）を第１表、第２表に示し、これらについて説明す
る。Hereinafter, the effects of the present invention will be described in Examples (1 to 7) and Comparative Examples (1 to 7).
7) is shown in Tables 1 and 2 and these will be described.
特性評価 (1)半田の拡がり：２５０℃に保持した半田浴上に５０m
m×５０mmの試験片を静置し、その上に 重量０．４ｇでハゼ折りしたやに入り半田（ＪＩＳ Ｚ
３２８３、ＲＨ５０）を置き、１０秒後の半田拡がり
面積を測定し、評価した。Characteristic evaluation (1) Spread of solder: 50m on the solder bath kept at 250 ℃
Place the m × 50 mm test piece on it and place it on it. Goby folded solder with a weight of 0.4g (JIS Z
3283, RH50), and the solder spread area after 10 seconds was measured and evaluated.
○：拡がり面積２００mm2以上×：５０mm2以下 (2)半田ピール強度：７mm×５０mmの試験片を評価面が
外になるように、３０mmの所から直角に折り曲げる。次
に、折り曲げた試験片の評価面を向かい合せで、０．５
mmのすきまができるようにして、市販の半田用フラック
スを塗布後、直ちに、半田浴（ＪＩＳ Ｚ ３２８３、
Ｈ６０）に１０mm浸漬で、５，１０秒間保持する。その
後、引っ張り試験の最大強度で評価した。◯: Spreading area 200 mm 2 or more ×: 50 mm 2 or less (2) Solder peel strength: A test piece of 7 mm × 50 mm is bent at a right angle from 30 mm so that the evaluation surface is outside. Next, with the evaluation surfaces of the bent test pieces facing each other, 0.5
Immediately after applying a commercially available flux for soldering so as to allow a clearance of mm, a solder bath (JIS Z 3283,
It is dipped in H60) for 10 mm and held for 5 to 10 seconds. Then, the maximum strength of the tensile test was evaluated.
○：最大強度５kg以上×：２kg以下 (3)耐食性：ＪＩＳ Ｚ ２３７１による塩水噴霧試験
を２サイクル行い（１サイクル：８時間噴霧、１６時間
停止）、赤錆発生の有無によって評価した。◯: Maximum strength 5 kg or more ×: 2 kg or less (3) Corrosion resistance: A salt spray test according to JIS Z 2371 was performed for 2 cycles (1 cycle: spraying for 8 hours, stopping for 16 hours), and evaluated by the presence or absence of red rust.
○：赤錆なし×：全面赤錆 (4)加工性：エラクセン張出し（Er＝７mm）、およびデ
ュポン衝撃（１／２″×１kg×３０cm）を行い、セロテ
ープでめっきの加工密着性を評価した。○：剥離なし (5)経時変化：恒温恒湿（６０℃、ＲＨ９５％以上）
で、１，０００時間経時後の外観（変色）を観察し、さ
らに前述の試験のピール強度を評価した。○：変色なし
×：全面変色 第２表の実施例１〜９に示したように、本発明のめっき
は耐食性、半田性、経時変化において優れた効果を示し
た。比較例１，２はZnめっきで特性を評価したが、半田
性のピール強度が劣った。比較例３，４はSnめっきで特
性を評価したが、半田性は優れているが耐食性が劣っ
た。比較例５〜７では一般に使用されている化成処理と
して、クロメート処理あるいはりん酸塩処理を施した
が、耐食性に対して効果の認められるものは半田性が劣
る傾向を示した。◯: No red rust X: Full red rust (4) Workability: Eraxen overhang (Er = 7 mm) and DuPont impact (1/2 ″ × 1 kg × 30 cm) were performed, and the plating adhesion was evaluated with cellophane tape. : No peeling (5) Aging: Constant temperature and humidity (60 ° C, RH 95% or more)
The appearance (discoloration) after 1,000 hours was observed, and the peel strength of the above-mentioned test was evaluated. ◯: No discoloration ×: Whole surface discoloration As shown in Examples 1 to 9 in Table 2, the plating of the present invention showed excellent effects in corrosion resistance, solderability and aging. In Comparative Examples 1 and 2, the characteristics were evaluated by Zn plating, but the peel strength of solderability was poor. In Comparative Examples 3 and 4, the characteristics were evaluated by Sn plating, but the solderability was excellent, but the corrosion resistance was poor. In Comparative Examples 5 to 7, chromate treatment or phosphate treatment was applied as a generally used chemical conversion treatment, but those exhibiting an effect on corrosion resistance tended to have poor solderability.
第１表、第２表の実施例１〜９に示したように、本発明
のめっきは、半田性、特に半田強度に優れ、耐食性、加
工性、経時性および経済性にも優れている。特に、半田
性と耐食性は相反する傾向があるのが、半田性のピール
強度と耐食性が良好な半田用複層めっき鋼板を得ること
ができた。As shown in Examples 1 to 9 of Tables 1 and 2, the plating of the present invention is excellent in solderability, particularly solder strength, and is also excellent in corrosion resistance, workability, aging property and economical efficiency. In particular, the solderability and the corrosion resistance tend to contradict each other, but a solder multi-layer plated steel sheet having good solder strength and corrosion resistance could be obtained.
フロントページの続き (56)参考文献 特開 昭63−277786（ＪＰ，Ａ) 特開 昭61−113774（ＪＰ，Ａ) 特公 昭55−51426（ＪＰ，Ｂ２)Continuation of the front page (56) Reference JP-A-63-277786 (JP, A) JP-A-61-113774 (JP, A) JP-B-55-51426 (JP, B2)
Claims (1)
２〜１０ｇ／m2施し、上層にZnの単独めっき、あるいは
ZnにNi,Fe,Sn,Cuの一種以上を含有したNiの標準電極電
位より卑な電位を示す合金めっきを０．１〜５０ｇ／m2
施したことを特徴とする半田用複層めっき鋼板。1. A steel sheet having a Ni plating amount of 0.0 as a lower layer.
2-10g / m 2 applied, Zn single plating on the upper layer, or
0.1-50 g / m 2 alloy plating containing more than one of Ni, Fe, Sn and Cu in Zn and showing a base potential lower than the standard electrode potential of Ni
A multi-layer plated steel sheet for solder characterized by being applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1060686A JPH0631442B2 (en) | 1989-03-15 | 1989-03-15 | Multi-layer plated steel sheet for solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1060686A JPH0631442B2 (en) | 1989-03-15 | 1989-03-15 | Multi-layer plated steel sheet for solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02240280A JPH02240280A (en) | 1990-09-25 |
| JPH0631442B2 true JPH0631442B2 (en) | 1994-04-27 |
Family
ID=13149436
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1060686A Expired - Fee Related JPH0631442B2 (en) | 1989-03-15 | 1989-03-15 | Multi-layer plated steel sheet for solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631442B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3047566U (en) * | 1997-09-29 | 1998-04-14 | 株式会社内山商会 | Decomposable nursery rack |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10836138B2 (en) | 2015-05-07 | 2020-11-17 | Hitachi, Ltd. | Laminated body having corrosion-resistant coating, and method for manufacturing same |
| JP6969688B2 (en) * | 2018-09-05 | 2021-11-24 | 日本製鉄株式会社 | Electroplating bath, manufacturing method of electroplating products, and electroplating equipment |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5551426A (en) * | 1978-10-12 | 1980-04-15 | Niigata Eng Co Ltd | Treatment of ammonia-containing waste gas |
| JPS61113774A (en) * | 1984-11-09 | 1986-05-31 | Nippon Steel Corp | Lead-tin alloy plated steel sheet having superior corrosion resistance |
| JPH06957B2 (en) * | 1986-12-05 | 1994-01-05 | 東洋鋼鈑株式会社 | Double-layer plated steel sheet with excellent solderability |
-
1989
- 1989-03-15 JP JP1060686A patent/JPH0631442B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3047566U (en) * | 1997-09-29 | 1998-04-14 | 株式会社内山商会 | Decomposable nursery rack |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02240280A (en) | 1990-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |