JPH0631443B2 - Method for forming plating film on magnesium alloy - Google Patents
Method for forming plating film on magnesium alloyInfo
- Publication number
- JPH0631443B2 JPH0631443B2 JP7432289A JP7432289A JPH0631443B2 JP H0631443 B2 JPH0631443 B2 JP H0631443B2 JP 7432289 A JP7432289 A JP 7432289A JP 7432289 A JP7432289 A JP 7432289A JP H0631443 B2 JPH0631443 B2 JP H0631443B2
- Authority
- JP
- Japan
- Prior art keywords
- plating film
- magnesium alloy
- film
- forming
- copper plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Other Surface Treatments For Metallic Materials (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は所要形状に加工されたマグネシウム合金に、
所要のめっき膜を得るためのめっき方法に係るものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a magnesium alloy processed into a required shape,
The present invention relates to a plating method for obtaining a required plating film.
第３図は従来のマグネシウム合金へのめっき成膜方法を
説明するための図であり、以下第３図に基づきめっき成
膜方法を説明する。FIG. 3 is a diagram for explaining a conventional plating film forming method on a magnesium alloy, and the plating film forming method will be described below with reference to FIG.
第３図において、従来のマグネシウム合金へのめっき成
膜方法はマグネシウム合金(1)をクロム酸酸洗液で酸洗
後リン酸1.91〜2.22ｍｏ、酸性フッ化アンモン1.72〜
1.84ｍｏに調整した活性化液を用いて活性化処理する
ことによりマグネシウム合金(1)の表面にMgF2(6)の皮膜
を形成した後、亜鉛置換を施すことによりマグネシウム
合金(1)の表面に均一な亜鉛置換膜(2)が形成される。In FIG. 3, the conventional method for forming a plating film on a magnesium alloy is as follows. The magnesium alloy (1) is pickled with a chromic acid pickling solution and then phosphoric acid 1.91 to 2.22 mo and acidic ammonium fluoride 1.72 to
After the MgF 2 (6) film is formed on the surface of the magnesium alloy (1) by activation treatment using an activation liquid adjusted to 1.84 mo, the surface of the magnesium alloy (1) is subjected to zinc substitution. A uniform zinc substitution film (2) is formed on the surface.
次に上記亜鉛置換膜(2)を形成した後、その亜鉛置換膜
(2)上に電気分解による銅めっき膜(3)を１〜２μ施し、
さらにニッケルめっき膜(4)を設けた後に所要のめっき
膜(5)を形成するようにしていた。Next, after forming the zinc substitution film (2), the zinc substitution film
(2) Apply copper plating film (3) by electrolysis to 1 ~ 2μ,
Furthermore, after providing the nickel plating film (4), the required plating film (5) is formed.
なお、マグネシウムは両性金属でPHが１０ないし１１で
は反応がマイルドでPH５以下とPH１１以上では反応が激
しくなる。そこで脱脂クロム酸による酸洗いを行った
後、活性化処理による弗化マグネシウム形成から防錆バ
リアーである無電解ニッケルの成膜までの全てをPH５な
いしPH１１の範囲内で行う必要がある。It should be noted that magnesium is an amphoteric metal and the reaction is mild when the pH is 10 to 11, and the reaction becomes violent when the pH is 5 or less and 11 or more. Therefore, after pickling with degreasing chromic acid, it is necessary to perform everything from the formation of magnesium fluoride by the activation treatment to the formation of electroless nickel which is a rust barrier within the range of PH5 to PH11.
従来はマグネシウム合金(1)に亜鉛置換膜(2)を形成した
後、電気分解による銅めっき膜(3)を設け、さらにその
銅めっき膜(3)上にニッケルめっき膜(4)を形成するよう
にしていたがアスペクト比（穴深さ／穴底）の大きな形
状をもつマグネシウム合金に所要のめっき膜を形成する
場合、上記従来の方法ではマグネシウム合金の形状によ
り銅めっきにおける電流分布の強度が不均一となり、か
ならずしもマグネシウム合金に均一なめっき膜を形成す
ることができなかった。さらに詳しく述べると銅めっき
膜(3)上に所要のめっき膜（例えばニッケルめっき膜）
を施した場合、電流分布の強度が小さい部分のところで
はニッケルめっきや硫酸銅めっき中に含まれる成分によ
りマグネシウム合金との間で急激な反応を起こし、その
ためマグネシウム合金にめっき膜を形成することができ
ないことがあった。Conventionally, after forming a zinc substitution film (2) on a magnesium alloy (1), a copper plating film (3) is provided by electrolysis, and a nickel plating film (4) is further formed on the copper plating film (3). However, when a required plating film is formed on a magnesium alloy having a large aspect ratio (hole depth / hole bottom), the strength of the current distribution in copper plating depends on the shape of the magnesium alloy. It became non-uniform, and it was not always possible to form a uniform plating film on the magnesium alloy. More specifically, the required plating film (eg nickel plating film) on the copper plating film (3)
In the case where the strength of the current distribution is small, the components contained in the nickel plating or copper sulfate plating cause a rapid reaction with the magnesium alloy, and therefore a plating film may be formed on the magnesium alloy. There were things I couldn't do.
この発明はかかる課題を解決するためになされたもので
あり、アスペクト比の大きな形状をもつマグネシウム合
金に対しても均一なめっき膜を形成することができるマ
グネシウム合金への成膜方法を得ることを目的とするも
のである。The present invention has been made to solve the above problems, and it is an object of the present invention to provide a method for forming a film on a magnesium alloy capable of forming a uniform plating film even on a magnesium alloy having a large aspect ratio. It is intended.
この発明に係るマグネシウム合金への成膜方法は電気分
解による銅めっきの薄膜上に無電解銅めっき膜を形成
し、その無電解銅めっき膜上に無電解ニッケルめっき膜
を形成するようにしたものである。A method for forming a film on a magnesium alloy according to the present invention is one in which an electroless copper plating film is formed on a thin film of copper plating by electrolysis, and an electroless nickel plating film is formed on the electroless copper plating film. Is.
またこの発明は上記無電解ニッケルめっき膜を形成した
後に、その微視孔に四弗化エチレンを含浸させるように
したものである。Further, according to the present invention, after the electroless nickel plating film is formed, the microscopic holes are impregnated with ethylene tetrafluoride.
この発明において、無電解銅めっき膜はマグネシウム合
金との間では反応性がないため複雑形状やアスペクト比
の大きな形状をもつマグネシウム合金に均一なめっき膜
を形成し、さらに無電解ニッケルめっき膜は防錆バリア
として作用する。また四弗化エチレンは無電解ニッケル
めっき膜の微視孔に含浸されるので無電解ニッケルめっ
き膜を最終膜とする場合、耐食性をさらに向上させる。In this invention, since the electroless copper plating film has no reactivity with the magnesium alloy, a uniform plating film is formed on the magnesium alloy having a complicated shape or a shape with a large aspect ratio. Acts as a rust barrier. Further, since ethylene tetrafluoride is impregnated into the microscopic holes of the electroless nickel plating film, when the electroless nickel plating film is the final film, the corrosion resistance is further improved.
以下第１図によりこの発明のマグネシウム合金へのめっ
き成膜方法について説明する。Hereinafter, the method for forming a plating film on a magnesium alloy according to the present invention will be described with reference to FIG.
第１図において、所要の形状に加工されたマグネシウム
合金(1)をクロム酸酸洗液で酸洗後リン酸1.91〜2.22mo
l、酸性フッ化アンモン1.72〜1.84molに調整した活性化
液を用いて活性化処理することによりマグネシウム合金
(1)の表面にMgF2(6)の皮膜を形成した後に亜鉛置換を施
すことによりマグネシウム合金(1)の表面は均一な亜鉛
置換膜(2)で覆われる。In Fig. 1, magnesium alloy (1) processed into the required shape was pickled with a chromic acid pickling solution and then phosphoric acid 1.91 to 2.22mo.
l, Magnesium alloy by activation treatment using an activation liquid adjusted to acidic ammonium fluoride 1.72-1.84 mol
By forming a film of MgF 2 (6) on the surface of (1) and then performing zinc substitution, the surface of the magnesium alloy (1) is covered with a uniform zinc substitution film (2).
次に電気分解による銅めっき皮膜(3)を0.1ないし２μ施
しPH12.3ないし12.7に制御したパラホルムアルデヒドを
還元剤とした無電解銅めっき膜(7)を２μを施すことに
より複雑形状品や高アスペクト品に均一な成膜ができ
る。Next, electroless copper plating film (3) is applied to 0.1 to 2μ and electroless copper plating film (7) with paraformaldehyde controlled to PH 12.3 to 12.7 is applied to 2μ to form a complex shaped product or a high-quality product. Uniform film formation on aspect products.
すなわち上記無電解銅めっき膜(7)はマグネシウム合金
(1)との間では反応性がないという特性を有しており、
電気分解による銅めっき皮膜(3)上に本発明による無電
解銅めっき膜(7)を施すことにより均一な成膜ができ
る。That is, the electroless copper plating film (7) is a magnesium alloy.
It has the characteristic that it has no reactivity with (1),
A uniform film can be formed by applying the electroless copper plating film (7) of the present invention on the copper plating film (3) obtained by electrolysis.
次に防錆バリアーとして膜厚を均等とするため次亜リン
酸ソーダを還元剤とするニッケルめっき膜(8)を５ない
し１０μ施すことにより複雑形状品やアスベスト比の高
い物品に均一な膜形成が可能となり、めっき液中での物
品の腐食を起こすことがない。Next, a nickel plating film (8) with sodium hypophosphite as a reducing agent is applied in an amount of 5 to 10 μm in order to make the film thickness uniform as a rust preventive barrier, thereby forming a uniform film on a product having a complicated shape or a high asbestos ratio. It is possible to prevent corrosion of the article in the plating solution.
第２図はこの発明の他の実施例を示す図であり、第１図
の方法と異なるところは無電解ニッケルめっき膜(8)を
形成した後にその無電解ニッケルめっき膜(8)の微視孔
に四弗化エチレン(13)を含浸させたところである。この
四弗化エチレン(13)の含浸による特徴は無電解ニッケル
めっき膜(8)を最終膜とする場合、第１図の方法に比べ
てさらに耐食性を向上させるところである。FIG. 2 is a diagram showing another embodiment of the present invention. The difference from the method of FIG. 1 is that after the electroless nickel plating film (8) is formed, a microscopic view of the electroless nickel plating film (8) is made. The holes have just been impregnated with ethylene tetrafluoride (13). A characteristic of the impregnation with ethylene tetrafluoride (13) is that when the electroless nickel plating film (8) is used as the final film, the corrosion resistance is further improved as compared with the method of FIG.
以上のようにこの発明は電気分解による銅めっき膜上に
マグネシウム合金との間で反応しない特性を有する無電
解銅めっき膜を形成することによりマグネシウム合金を
安定した状態でめっき成膜を行うことができるため高ア
スペクト、複雑形状品のマグネシウム合金に均一なめっ
き成膜を施すことができる。また無電解銅めっき膜上に
防錆バリアとしての無電解ニッケルめっき膜を形成する
ことにより耐食性を向上させることができる。さらに無
電解ニッケルめっきの微視孔に四弗化エチレンを含浸さ
せることでめっき液中での物品の腐食、皮膜不均一によ
る腐食をさらに防止することが可能となり製造コスト、
信頼性を向上させることができマグネシウム合金を用い
た製品の軽量化に対応することができる。INDUSTRIAL APPLICABILITY As described above, according to the present invention, a magnesium alloy can be plated in a stable state by forming an electroless copper plating film having a property of not reacting with a magnesium alloy on a copper plating film by electrolysis. Therefore, it is possible to perform uniform plating film formation on a magnesium alloy having a high aspect ratio and a complicated shape. Further, the corrosion resistance can be improved by forming an electroless nickel plating film as a rust barrier on the electroless copper plating film. Furthermore, by impregnating the micropores of electroless nickel plating with ethylene tetrafluoride, it is possible to further prevent the corrosion of articles in the plating solution and the corrosion due to non-uniformity of the coating, which reduces the manufacturing cost.
The reliability can be improved, and the weight reduction of the product using the magnesium alloy can be dealt with.
第１図はこの発明のマグネシウム合金へのめっき皮膜方
法を説明するための図、第２図はこの発明の他の実施例
を説明するための図、第３図は従来のマグネシウム合金
へのめっき皮膜方法を説明するための図である。 図中、(1)はマグネシウム合金、(2)は亜鉛置換膜、(3)
は銅めっき膜、(4)はニッケルめっき皮膜、(5)はめっき
膜、(6)はMgF2、(7)は無電解銅めっき膜、(8)は無電解
ニッケルめっき膜、(9)は四弗化エチレンである。FIG. 1 is a diagram for explaining a method for plating a magnesium alloy film according to the present invention, FIG. 2 is a diagram for explaining another embodiment of the present invention, and FIG. 3 is a conventional magnesium alloy plating process. It is a figure for demonstrating a coating method. In the figure, (1) is a magnesium alloy, (2) is a zinc-substituted film, (3)
Is a copper plating film, (4) is a nickel plating film, (5) is a plating film, (6) is MgF 2 , (7) is an electroless copper plating film, (8) is an electroless nickel plating film, (9) Is ethylene tetrafluoride.
Claims (2)
の膜上に電気分解による銅めっき膜を設けた後、所要の
めっき膜を形成するようにしたマグネシウム合金へのめ
っき成膜方法において、上記銅めっき膜上に無電解銅め
っき膜を形成し、その無電解銅めっき膜上に防錆バリア
ーとして無電解ニッケルめっき膜を形成したことを特徴
とするマグネシウム合金へのめっき成膜方法。1. A method for forming a plating film on a magnesium alloy, which comprises applying a zinc substitution film to a magnesium alloy, providing a copper plating film by electrolysis on the film, and then forming a required plating film. A method for forming a plating film on a magnesium alloy, characterized in that an electroless copper plating film is formed on a copper plating film, and an electroless nickel plating film is formed on the electroless copper plating film as a rust preventive barrier.
に、その微視孔に四弗化エチレンを含浸させたことを特
徴とする請求項１記載のマグネシウム合金へのめっき成
膜方法。2. The method for forming a plating film on a magnesium alloy according to claim 1, wherein after forming the electroless nickel plating film, the microscopic holes are impregnated with ethylene tetrafluoride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7432289A JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7432289A JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02254179A JPH02254179A (en) | 1990-10-12 |
| JPH0631443B2 true JPH0631443B2 (en) | 1994-04-27 |
Family
ID=13543764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7432289A Expired - Fee Related JPH0631443B2 (en) | 1989-03-27 | 1989-03-27 | Method for forming plating film on magnesium alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0631443B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105525290A (en) * | 2014-10-23 | 2016-04-27 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparation method |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2378993C (en) | 2002-03-26 | 2007-12-18 | National Research Council Of Canada | Acousto-immersion coating and process for magnesium and its alloys |
| US7704366B2 (en) * | 2005-08-17 | 2010-04-27 | Trevor Pearson | Pretreatment of magnesium substrates for electroplating |
| CN100430520C (en) * | 2005-12-30 | 2008-11-05 | 东北大学 | A kind of method for electroless copper plating on the surface of magnesium and magnesium alloy |
| US8231743B2 (en) | 2009-10-22 | 2012-07-31 | Atotech Deutschland Gmbh | Composition and process for improved zincating magnesium and magnesium alloy substrates |
| CN105586590A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN105586598A (en) * | 2014-10-23 | 2016-05-18 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparing method |
| CN114045476B (en) * | 2021-11-11 | 2023-10-20 | 重庆大学 | A copper-magnesium composite material and its preparation method and application |
-
1989
- 1989-03-27 JP JP7432289A patent/JPH0631443B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105525290A (en) * | 2014-10-23 | 2016-04-27 | 吴长义 | Magnesium alloy material, terminal, communication device, vehicle and preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02254179A (en) | 1990-10-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0393169B1 (en) | Method for plating on titanium | |
| DE4202409C2 (en) | Use of an additive for a zincate bath | |
| US3810792A (en) | Process for the application of phosphate coatings on steel,iron and zinc surfaces | |
| US3977839A (en) | Coated metal article and method of coating | |
| JP2674075B2 (en) | Electrodeposition pretreatment Phosphate treatment method | |
| US3817774A (en) | Preparation of plastic substrates for electroless plating | |
| US4061802A (en) | Plating process and bath | |
| Xie et al. | Environmentally friendly and facile Mg (OH) 2 film for electroless nickel plating on magnesium alloy for enhanced galvanic corrosion inhibition | |
| JPH01277A (en) | Electrodeposition pretreatment phosphate treatment method | |
| US3698919A (en) | Preparation of plastic substrates for electroless plating and solutions therefor | |
| KR950014360A (en) | Zinc-based metal-plated composite steel article and method for manufacturing the article | |
| US3790400A (en) | Preparation of plastic substrates for electroless plating and solutions therefor | |
| JPH0631443B2 (en) | Method for forming plating film on magnesium alloy | |
| US3178311A (en) | Electroless plating process | |
| JPH0457755B2 (en) | ||
| US2746136A (en) | Treatment of aluminum and its alloys prior to electro-plating with lead | |
| US3506499A (en) | Method of surface-treating zinc,aluminum and their alloys | |
| US4632734A (en) | Process for electrochemically or chemically coating niobium | |
| CA1119900A (en) | Process for plating a composite structure | |
| JPS5845382A (en) | Surface treatment of alloy electroplated steel plate | |
| JPS6045705B2 (en) | Method of forming phosphate coating on metal surface | |
| CA1143632A (en) | Method and means for treatment of surfaces | |
| US3961993A (en) | Coated metal article and method of coating | |
| JP3035676B2 (en) | Method for electroless nickel plating on zinc-aluminum alloy, composition for catalytic treatment, composition for activation treatment, and composition for electroless nickel strike plating | |
| US3425876A (en) | Phosphate coating process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |