JPH06314708A - Semiconductor manufacturing apparatus and method of manufacturing semiconductor device - Google Patents

Abstract

(57) [Abstract] [Purpose] A semiconductor manufacturing apparatus in which a semiconductor chip is accurately placed and fixed at a predetermined die bonding position, a raised portion of a preform material is made flat, and suction of the preform material is prevented, and A method for manufacturing a semiconductor device is provided. [Structure] A recess 4 for holding a semiconductor chip 7 and an air intake hole 2 for vacuum-sucking the semiconductor chip 7 held in the recess 4.
And an exhaust hole 3 communicating with a side surface of the semiconductor chip 7 held by the collet 1 and a gap formed by the collet 1, and an inert gas is introduced into the exhaust hole 3. The inert gas exhausting means 5 blown toward the reform material 8 was connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus and a semiconductor device manufacturing method, and more particularly to a semiconductor manufacturing apparatus and a semiconductor chip used in a die bonding process performed when a semiconductor chip is incorporated into a package. The present invention relates to a method of manufacturing a semiconductor device, which is die-bonded to a predetermined die-bonding position.

[0002]

2. Description of the Related Art Conventionally, an alloying method, a soldering method, an adhering method or the like has been generally used in a die bonding process for adhering a semiconductor chip to a lead frame or a case of a package. In any of these methods, an adhesive (hereinafter, referred to as a "preform material") such as a resin containing Ag, a Au / Si layer, a brazing material, or an epoxy resin is used for a semiconductor chip sucked and held at a predetermined position of a collet. It is placed on the die pad (die bonding position) of the applied package and pressure bonded and fixed.

In this die bonding method, it is difficult to control the coating amount of the preform material, and when a large amount of the preform material is coated, when the semiconductor chip is pressure-bonded to the preform material, The preform material sticks out to the outside from the adhesive surface and solidifies into a spherical shape around the semiconductor chip, or the suction force that sucks the semiconductor chip causes the protruding preform material to rise up the side surface of the semiconductor chip and become a semiconductor chip. There is a problem that the formed element is contaminated.

Therefore, in order to solve such a problem,
As disclosed in Japanese Patent Application Laid-Open No. 63-228728, a semiconductor chip gripping portion having a recessed shape capable of gripping a semiconductor chip, and an air intake hole communicating with a space formed by the recessed portion and the semiconductor chip. With a collet,
A gas supply means communicating with the suction hole and communicating with the suction hole of the collet; exhausting the space of the recess to vacuum-suck the semiconductor chip into the recess; Introducing a die bonding machine that selectively blows gas around.

In this die bonding apparatus, by blowing gas around the semiconductor chip, the swelled portion of the preform material protruding from the bonding surface between the semiconductor chip and the die pad is flattened, and the preform material is solidified into a ball shape. , It prevents the semiconductor chip from climbing up the side surface.

[0006]

However, in the die bonding apparatus disclosed in Japanese Patent Laid-Open No. 63-228728, the semiconductor chip is vacuum-sucked in the recess of the collet, and the recess and the semiconductor chip are separated from each other. A structure that selectively blows gas from the space to be formed around the semiconductor chip, that is, by using the same hole and switching between vacuum and blowing (blowing), adsorption of semiconductor chip and blowing of gas Therefore, there is a problem that it is difficult to control the timing of switching between suction and blowing.

If the timing at which the semiconductor chip is adsorbed by the collet is switched to a state in which gas is blown out around the semiconductor chip too early, the semiconductor chip falls from the collet and is placed at a predetermined die bonding position. There was a problem that it could not be placed. Further, in the worst case, there is a problem that the collet is dropped on the dropped semiconductor chip and the surface of the semiconductor chip is scratched.

On the other hand, if the timing of switching from the state in which the semiconductor chip is adsorbed by the collet to the state in which the gas is blown out around the semiconductor chip is too late, the preform material will be attracted to the semiconductor chip by the suction force for adsorbing the semiconductor chip. There is a problem that it goes up from the side surface of the device and contaminates the element formed on the semiconductor chip. The present invention has an object to solve such conventional problems, and it is possible to accurately mount and fix a semiconductor chip at a predetermined die bonding position, and a raised portion of a preform material. Can be made flat, and
An object of the present invention is to provide a semiconductor manufacturing apparatus and a semiconductor device manufacturing method in which the suction of a preform material is prevented.

[0009]

In order to achieve this object, the present invention relates to a recess for holding a semiconductor chip, a semiconductor chip held in the recess and a space formed by the recess, In a semiconductor manufacturing apparatus provided with a collet having an intake hole for vacuum suctioning a chip, an exhaust hole communicating with a gap formed between the side surface of the semiconductor chip gripped by the collet and the collet, and communicating with the exhaust hole, The present invention provides a semiconductor manufacturing apparatus, comprising: an inert gas exhausting unit that blows out an inert gas through the exhaust hole.

In the method of manufacturing a semiconductor device, the semiconductor chip sucked and gripped at a predetermined position of the collet is placed at a predetermined die bonding position where the preform material is applied, and the semiconductor chip is die-bonded. While blowing an inert gas from the gap formed by the side surface of the semiconductor chip gripped by the collet and the collet,
The present invention provides a method for manufacturing a semiconductor device, which comprises mounting and fixing the semiconductor chip at a predetermined die bonding position.

[0011]

In the semiconductor manufacturing apparatus according to the present invention, in addition to the suction hole for vacuum-sucking the semiconductor chip held in the recess of the collet, the exhaust hole communicating with the side surface of the semiconductor chip and the gap formed by the collet, An inert gas exhaust means communicating with the exhaust hole and blowing out an inert gas through the exhaust hole;
Since the semiconductor chip is provided, the vacuum suction of the semiconductor chip and the rising portion of the preform material can be flattened, and the blowing of the inert gas for preventing the suction of the preform material can be performed independently. . Therefore, it is not necessary to switch between vacuum suction and blowing when mounting the semiconductor chip at a predetermined die bonding position. Therefore, the semiconductor chip can be accurately placed and fixed at a predetermined die bonding position, the raised portion of the preform material can be flattened, and suction of the preform material can be prevented. it can.

Then, in the method for manufacturing a semiconductor device according to the present invention, the semiconductor chip is suction-held at a predetermined position of the collet, and the inert gas is blown from the gap formed by the side surface of the semiconductor chip and the collet. Since the semiconductor chip is placed and fixed at a predetermined die bonding position, the vacuum suction of the semiconductor chip and the blowing of the inert gas can be performed independently. Therefore, the semiconductor chip can be securely gripped by the collet until it is mounted and fixed at a predetermined die bonding position, so that the semiconductor chip can be mounted and fixed at an accurate position. Further, since the placing and fixing are performed while blowing the inert gas, it is possible to flatten the rising portion of the preform material and prevent the preform material from being sucked.

[0013]

Embodiments of the present invention will now be described with reference to the drawings. 1 is a sectional view of the configuration of a semiconductor manufacturing apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the semiconductor manufacturing apparatus shown in FIG. The semiconductor manufacturing apparatus shown in FIGS. 1 and 2 includes a collet 1 having a size corresponding to the size of a semiconductor chip and provided with a conical recess 4 capable of gripping the semiconductor chip. An intake hole 2 is communicated with the surface of the recess 4 facing the open side, and a vacuum pump 6 is connected to the intake hole 2 via an intake pipe 11.

The exhaust hole 3 is provided outside the recess 4 and at a position corresponding to the center of each side of the recess 4 of the collet 1.
Are communicated with each other, and each exhaust hole 3 has an exhaust pipe 1
An inert gas exhaust means 5 is connected via 2. Next, a specific operation of the semiconductor manufacturing apparatus according to this embodiment will be described with reference to the drawings.

FIG. 3 is a cross-sectional view showing a process of die-bonding a semiconductor chip to a predetermined die-bonding position using the semiconductor manufacturing apparatus according to this embodiment. First,
In the step shown in FIG. 3A, the semiconductor chip 7 is housed in the recess 4 of the collet 1 of the semiconductor manufacturing apparatus with the surface (the surface on which the elements are formed) of the semiconductor chip 7 facing upward. Next, the vacuum pump 6 is operated, suction is performed from the suction hole 2 through the suction pipe 11, and the semiconductor chip 7 housed in the recess 4 is vacuum-sucked.

Next, in the step shown in FIG.
The die pad 1 in which the preform material 8 is applied to the collet 1 that has sucked and gripped the semiconductor chip 7 in the step (1)
Move up to 3. Next, in this state, the inert gas exhausting means 5 is operated to blow out the inert gas from the exhaust hole 3 through the exhaust pipe 12, and the collet is directed toward the die pad 13 to which the preform material 8 is applied. Drop 1

In this example, an epoxy resin containing Ag powder was used as the preform material 8 and N ₂ was used as the inert gas. Next, in the step shown in FIG. 3C, the collet 1 is continuously processed in the step shown in FIG.
, And the semiconductor chip 7 is placed on the preform material 8 and pressure-bonded. At this time, the preform material 8 protruding from the back surface of the semiconductor chip 7 is flattened and hardened by the inert gas blown out from the exhaust hole 3. further,
Due to the inert gas blown out, the preform material 8
However, since it is possible to prevent the semiconductor chip 7 from being sucked by the suction force for sucking the semiconductor chip 7, the elements formed on the semiconductor chip 7 are not contaminated by the preform material 8. Furthermore, since N ₂ is used as the gas blown out from the exhaust hole 3, an N ₂ gas layer is formed on the preform material 8 and the preform material 8 can be prevented from being oxidized.

The semiconductor chip 7 has an adhesive resin 8
Since it is sucked and gripped by the concave portion 4 of the collet 1 until it is fixed at a predetermined position, it does not move during mounting, pressure bonding, and fixing, so that it can be accurately fixed at a predetermined position. After that, when the fixing of the semiconductor chip 7 is completed,
The operation of the inert gas exhausting means 5 and the vacuum pump 6 is stopped, and the collet 1 is returned to its original position.

In this embodiment, the exhaust hole 3 is provided with the recess 4
It is provided on the outside of the collet 1 at a position corresponding to the center of each side of the concave portion 4 of the collet 1. However, the present invention is not limited to this, and the exhaust holes 3 may be formed on the semiconductor chip 7 held by the collet 1. If it communicates with the gap formed by the side surface and the collet 1, a plurality of openings may be formed on each side of the recess 4 as shown in FIG. 4, and as shown in FIG. It may be opened arbitrarily, such as opening the hole 9.

Further, in the present embodiment, the intake hole 2 is opened on the surface facing the open side of the recess 4, but the present invention is not limited to this, and the intake hole 2 includes the semiconductor chip 7 held by the recess 4 and the recess. Four
As long as they are communicated with the space formed by and, they may be opened to other portions. In the present embodiment, the preform material 8
Although the epoxy resin containing Ag powder is used as the above, the present invention is not limited to this, and another resin may be used as long as it can be used for die bonding.

In this embodiment, the adhesive method using resin as the preform material 8 has been described.
Of course, similar effects can be obtained not only by this but also by the Au / Si eutectic alloy method, the solder bonding method and the like. In particular, in the Au / Si eutectic alloy method and the solder bonding method, since the heated adhesive is sprayed with an inert gas, the cooling rate of the adhesive is increased and the adhesion rate can be improved.

Further, in this embodiment, N is used as the inert gas.
_{Although 2} is used, the present invention is not limited to this, and other inert gas such as Ar may be used. Further, in this embodiment, the collet 1 provided with the recess 4 having a substantially quadrangular pyramid shape is used.
The same effect can be obtained by using another type of collet 1.

[0023]

As described above, in the semiconductor manufacturing apparatus according to the present invention, the suction hole for vacuum-sucking the semiconductor chip held in the recess of the collet and the raised portion of the preform material for bonding the semiconductor chip are flat. In addition, since the exhaust hole for the inert gas blown out to prevent the suction of the preform material is independently provided, when the semiconductor chip is mounted at a predetermined die bonding position, vacuum suction and blowout are performed. There is no need to switch between and. Therefore, the semiconductor chip can be securely held by the collet until it is placed and fixed at a predetermined die bonding position, and as a result, it can be placed and fixed at an accurate position. The placement and fixing can be performed while blowing out an inert gas, and as a result, the raised portion of the preform material can be made flat and suction of the preform material can be prevented, and the semiconductor chip It is possible to prevent the element formed on the substrate from being contaminated.

In the method of manufacturing a semiconductor device according to the present invention, the semiconductor chip is suction-held at a predetermined position of the collet, and the inert gas is blown from the gap formed by the side surface of the semiconductor chip and the collet while In order to mount and fix the semiconductor chip at the specified die bonding position,
The vacuum suction of the semiconductor chip and the blowing of the inert gas can be performed independently. Therefore, the semiconductor chip can be securely held by the collet until it is placed and fixed at a predetermined die bonding position.
It can be placed and fixed in an accurate position. Since this mounting and fixing is performed while blowing out an inert gas, the raised portion of the preform material can be made flat and suction of the preform material can be prevented, so that it is formed on the semiconductor chip. The device can be prevented from being contaminated.

[Brief description of drawings]

FIG. 1 is a sectional view showing the configuration of a semiconductor manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an A side of the semiconductor manufacturing apparatus shown in FIG.

FIG. 3 is a cross-sectional view showing a process of die-bonding a semiconductor chip to a predetermined die-bonding position using the semiconductor manufacturing apparatus according to the present embodiment.

FIG. 4 is a plan view of a semiconductor manufacturing apparatus according to another embodiment of the present invention.

FIG. 5 is a plan view of a semiconductor manufacturing apparatus according to another embodiment of the present invention.

[Explanation of symbols]

 1 Collet 2 Intake Hole 3 Exhaust Hole 4 Recess 5 Inert Gas Exhaust Means 6 Vacuum Pump 7 Semiconductor Chip 8 Preform Material 9 Exhaust Hole 11 Intake Pipe 12 Exhaust Pipe

Claims (2)

[Claims] 1. A semiconductor manufacturing device comprising: a recess for holding a semiconductor chip; and a collet having a suction hole that communicates with a space formed by the semiconductor chip held by the recess and the recess, and vacuum suctions the semiconductor chip. In the device, an exhaust gas communicating with a gap formed by the side face of the semiconductor chip held by the collet and the collet, and an inert gas exhaust gas that communicates with the exhaust hole and blows out an inert gas through the exhaust hole. And a means for manufacturing the semiconductor. 2. A method of manufacturing a semiconductor device, wherein a semiconductor chip sucked and gripped at a predetermined position of a collet is placed at a predetermined die bonding position where a preform material is applied, and the semiconductor chip is die-bonded. A method of manufacturing a semiconductor device, comprising placing and fixing the semiconductor chip at a predetermined die bonding position while blowing an inert gas from a gap formed between the side surface of the semiconductor chip gripped by the collet and the collet.