JPH06314860A - Flexible circuit board - Google Patents
Flexible circuit boardInfo
- Publication number
- JPH06314860A JPH06314860A JP10267193A JP10267193A JPH06314860A JP H06314860 A JPH06314860 A JP H06314860A JP 10267193 A JP10267193 A JP 10267193A JP 10267193 A JP10267193 A JP 10267193A JP H06314860 A JPH06314860 A JP H06314860A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- flexible circuit
- reinforcing plate
- adhesive
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 abstract description 6
- 238000005452 bending Methods 0.000 abstract description 5
- 239000004020 conductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000013039 cover film Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、可撓性回路基板に於い
て、特に補強板に関するものであって着脱の作業性・信
頼性を向上させたものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board, and more particularly to a reinforcing board having improved workability and reliability of attachment / detachment.
【０００２】[0002]
【従来の技術】従来、電子機器類に使用される配線ケー
ブルとして、可撓性の絶縁フィルム間に互いに並列する
複数本の導線材を挟みラミネートしたフラットケーブル
や、可撓性の絶縁フィルムに銅箔を貼り合わせエッチン
グして回路形成した後に必要に応じ端子部を除いた部分
にカバーレイを貼り合わせた構成の可撓性回路基板が使
用されていた。2. Description of the Related Art Conventionally, as a wiring cable used for electronic devices, a flat cable in which a plurality of conductive wires which are arranged in parallel with each other are sandwiched between flexible insulating films, and a flexible insulating film is made of copper. A flexible circuit board has been used in which foils are bonded and etched to form a circuit, and then a cover lay is bonded to a portion excluding a terminal portion if necessary.
【０００３】これらはコネクタに差し込む場合、そのま
までは剛性が不足して挿入しにくいため補強板を端子部
分に裏打ちしてコネクタに差し込むことが多い。これら
の補強板としては、厚めのポリエステルフィルムや剛性
の高いガラスエポキシ板が使われている（図４Ａ参
照）。When these are inserted into a connector, they are insufficient in rigidity as they are and are difficult to insert, so that a reinforcing plate is often lined with a terminal portion and inserted into the connector. As these reinforcing plates, a thick polyester film or a glass epoxy plate having high rigidity is used (see FIG. 4A).
【０００４】[0004]
【発明が解決しようとする課題】しかし最近の電子機器
類の小型化に伴い、スペースが狭小になって、いきおい
可撓性回路基板は折り曲げられて挿入されている。この
ために端子に裏打ちされている補強板のところから折り
曲げられる。このために、その折り曲げ部分にストレス
が大きくかかり、導体が断線するなどの問題があった
（図４Ｂ参照）。However, with the recent miniaturization of electronic devices, the space becomes narrower, and the flexible circuit board is bent and inserted. For this purpose, the terminals are bent from the reinforcing plate lined with them. For this reason, a large stress is applied to the bent portion, and there is a problem that the conductor is broken (see FIG. 4B).
【０００５】一方コネクタに差し込む場合、手で差し込
むのであるが、持ちづらいことやコネクタにどのくらい
差し込んだかわからないということがあり、作業性、接
続信頼性に問題があった。On the other hand, when inserting into a connector, it is inserted by hand, but it is difficult to hold and it is difficult to know how long it has been inserted into the connector, resulting in problems in workability and connection reliability.
【０００６】上述したように従来の可撓性回路基板では
その折り曲げ部分にストレスが大きくかかり、導体が断
線するなどの問題があったり、コネクタに差し込む場
合、持ちづらいことやどのくらい差し込んだかわからな
いなどの問題があった。As described above, in the conventional flexible circuit board, stress is greatly applied to the bent portion thereof, and there is a problem that the conductor is broken, or when it is inserted into the connector, it is difficult to hold and how long it is inserted. There was a problem.
【０００７】本発明は上述の点に鑑み、折り曲げによる
ストレスを緩和すると同時にコネクタへの差し込みを容
易にし、又接続を確実にする可撓性回路基板を得ること
を目的とする。The present invention has been made in view of the above points, and an object thereof is to obtain a flexible circuit board that alleviates the stress caused by bending, facilitates insertion into a connector, and ensures reliable connection.
【０００８】[0008]
【課題を解決するための手段】本発明の可撓性回路基板
は、例えば図１に示すように、可撓性回路基板の端子部
に裏打ちした補強板５が、接着剤により一部分接着され
ているものである。In the flexible circuit board of the present invention, for example, as shown in FIG. 1, a reinforcing plate 5 lined with a terminal portion of the flexible circuit board is partially bonded with an adhesive. There is something.
【０００９】また、本発明の可撓性回路基板は、例えば
図１に示すように、補強板５を接着する接着剤が着色さ
れている上述構成の可撓性回路基板である。The flexible circuit board of the present invention is, for example, as shown in FIG. 1, the flexible circuit board having the above-mentioned structure in which the adhesive for bonding the reinforcing plate 5 is colored.
【００１０】[0010]
【作用】本発明の可撓性回路基板によれば、補強板の一
部に接着していないフリーの部分を設けたので、その部
分を把手とすると同時に折り曲げ部のストレスを緩和す
ることができる。According to the flexible circuit board of the present invention, since the free portion which is not adhered is provided on a part of the reinforcing plate, the stress at the bent portion can be relieved at the same time as using that portion as a handle. .
【００１１】又、着色した接着剤を補強板の接着に使用
することにより、透明な補強板を使用したときに、その
透明な補強板を通して着色した接着剤を見ることによっ
て正しく確実にコネクタに差し込まれたかを確認でき
る。Further, by using a colored adhesive for bonding the reinforcing plate, when the transparent reinforcing plate is used, the colored adhesive can be correctly and surely inserted into the connector by seeing the colored adhesive through the transparent reinforcing plate. Can be confirmed.
【００１２】[0012]
【実施例】以下、実施例により本発明を詳述する。EXAMPLES The present invention will be described in detail below with reference to examples.
【００１３】実施例１ 図１は本発明の第１の実施例を示すものである。ここ
で、導体２をカバーフィルム１及びベースフィルム３で
挟み込んだものがフラットケーブルである。Embodiment 1 FIG. 1 shows a first embodiment of the present invention. Here, the flat cable is formed by sandwiching the conductor 2 between the cover film 1 and the base film 3.
【００１４】このフラットケーブルは、ＴＣ７９０１
（ソニーケミカル（株）製 ＰＥＴ１２μｍ＋接着剤２
５μｍ）に並列する複数本の導線（東京特殊電線（株）
製ＴＣＣｕ−Ｒ０．０５０×０．８ｍｍ）を敷設して熱
圧着（温度１３０℃，圧力１５ｋｇｆ／ｃｍ2 ，時間１
５秒）することにより作製した。This flat cable is TC7901.
(Sony Chemical Co., Ltd. PET 12 μm + adhesive 2
5 μm) multiple parallel conductors (Tokyo Special Electric Wire Co., Ltd.)
TCCu-R0.050 × 0.8 mm) made by the company is laid and thermocompression bonded (temperature 130 ° C., pressure 15 kgf / cm 2 , time 1
5 seconds).
【００１５】また、補強板５は、ＰＥＴ１８８μｍ（東
レ（株）ルミラー＃１８８）を幅３０×２４ｍｍにスリ
ットして、下記着色接着剤を乾燥後３０μｍ厚で３０×
９μｍ塗布し、残りの１５ｍｍには着色接着剤を塗布し
ないようにして作製した。The reinforcing plate 5 is formed by slitting PET 188 μm (Lumirror # 188 manufactured by Toray Industries, Inc.) into a width of 30 × 24 mm, and drying the following colored adhesive with a thickness of 30 μm and 30 ×
9 μm was applied, and the remaining 15 mm was manufactured without applying a colored adhesive.
【００１６】上述した接着剤は、ポリエステル樹脂（バ
イロンＧＭ９９５ 東洋紡（株）製）６６重量部にポリ
オレフィン樹脂（タフマーＰ０６８０ 三井石油化学
（株）製）８重量部、アイオノマー（サーリン９０２０
三井・デュポンポリケミカル（株）製）８重量部、テ
ルペンフェノール（ＹＳポリスター 安原油脂（株）
製）８重量部、着色剤（ＰＥＭ２６６１ 大日精化工業
（株）製）１０重量部を混合して作製した。The above-mentioned adhesive includes 66 parts by weight of polyester resin (manufactured by Byron GM995 Toyobo Co., Ltd.), 8 parts by weight of polyolefin resin (Tufmer P0680 manufactured by Mitsui Petrochemical Co., Ltd.), and ionomer (Sarlin 9020).
8 parts by weight of Mitsui DuPont Polychemical Co., Ltd., terpene phenol (YS Polystar Yasuhara Yushi Co., Ltd.)
8 parts by weight) and 10 parts by weight of a colorant (PEM2661 manufactured by Dainichiseika Kogyo KK) were mixed.
【００１７】次に、上述したフラットケーブルの端子部
の裏面に、上で作成した補強板を接着部分を端子部側に
くるようにして、１３５℃，２ｋｇｆ／ｃｍ2 ，１０秒
の条件で熱圧着して、試験に供した（図１Ａ参照）。Next, on the back surface of the terminal portion of the above-mentioned flat cable, the reinforcing plate prepared above is heat-treated under conditions of 135 ° C., 2 kgf / cm 2 , and 10 seconds so that the adhesive portion comes to the terminal portion side. It pressure-bonded and used for the test (see FIG. 1A).
【００１８】次に評価方法と評価結果について説明す
る。Next, the evaluation method and the evaluation result will be described.
【００１９】フラットケーブルの補強部分の接着部の端
から９０度折り曲げてコネクタにフラットケーブルを差
し込み、抵抗値を測定して、コネクタから抜き取る。こ
のような工程を一回として端子の抵抗値が３０％増加し
た時の挿抜回数を補強板を全面接着したものを比較例と
して比較した。The flat cable is bent 90 degrees from the end of the adhesive portion of the reinforcing portion, the flat cable is inserted into the connector, the resistance value is measured, and the flat cable is pulled out from the connector. The number of times of insertion / removal when the resistance value of the terminal increased by 30% with one such step was compared as a comparative example.
【００２０】測定結果は以下のとおりであった。 測定結果 ５片の平均値 実施例１ 比較例１ ７３回 ３３回 と倍以上の効果があった。The measurement results were as follows. Measurement results Average value of 5 pieces Example 1 Comparative Example 1 73 times 33 times, which is more than double the effect.
【００２１】以上のことから本例によれば、図１のよう
な構成をとることにより接着剤層４が全面に接着される
のではなく一部分のみ接着され、他の部分は接着されて
いないフラットケーブルとなっているので、他の部分は
図２のようにＰ方向から補強板のみに力を加えること
で、コネクタに差し込みが可能となる。From the above, according to this embodiment, by adopting the structure shown in FIG. 1, the adhesive layer 4 is not adhered to the entire surface but only a part of the adhesive layer 4 and the other part is not adhered. Since it is a cable, the other part can be inserted into the connector by applying a force only to the reinforcing plate from the P direction as shown in FIG.
【００２２】従来のように、直角に折り曲げて差し込ま
れる場合に比べて折り曲げ部にかかるストレスが小さく
なり断線しにくくなる。またフラットケーブルが屈曲さ
れた場合でも応力が１ヵ所に集中することなく分散され
ているので耐折寿命がのびる。また、図１Ｂのように補
強板側から見ると接着剤層４がコネクタ６にどれくらい
差し込んでいるかの目やすとなるのでコネクタ６からの
着脱防止に役立つ。As compared with the conventional case of bending and inserting at a right angle, the stress applied to the bent portion is reduced and the wire is less likely to be broken. Further, even when the flat cable is bent, the stress is dispersed without being concentrated in one place, so that the folding endurance is extended. Further, as seen from the reinforcing plate side as shown in FIG. 1B, it becomes easy to see how much the adhesive layer 4 is inserted into the connector 6, which is useful for preventing attachment and detachment from the connector 6.
【００２３】実施例２ 次に、本発明可撓性回路基板の他の実施例について説明
する。Embodiment 2 Next, another embodiment of the flexible circuit board of the present invention will be described.
【００２４】ここでは、まずＦＰＣ原反にＣＫ１−０３
０２Ａ（ソニーケミカル製、銅箔３５μｍ／接着剤２０
μｍ／ポリイミド２５μｍ）を用いて写真法で０．５ｍ
ｍピッチの配線部分を作った。First, CK1-03 is applied to the FPC original fabric.
02A (Sony Chemical, copper foil 35 μm / adhesive 20
0.5m by photographic method using μm / polyimide 25μm)
I made the wiring part of m pitch.
【００２５】これに端子部を除いてレジストにＳＲ−２
９Ｇ（タムラ製作所）をスクリーン印刷でカバーコート
した。更に端子部に半田メッキ５μｍ形成した（金メッ
キでもよい）。SR-2 is applied to the resist except for the terminals.
9G (Tamura Corporation) was screen-coated with a cover coat. Furthermore, 5 μm of solder plating was formed on the terminal portion (gold plating may be used).
【００２６】以下は実施例１と同様に補強板を作成し端
子部裏面に接着した。In the following, a reinforcing plate was prepared and adhered to the back surface of the terminal portion in the same manner as in Example 1.
【００２７】実施例１と同様な評価方法により、測定し
た結果は以下のとおりである。 測定結果 ５片の平均値 実施例２ 比較例２ ６１回 ２８回 と倍以上の効果があった。以上のことから、本例によれ
ば、実施例１におけると同様な効果を得ることができ
た。The results of measurement by the same evaluation method as in Example 1 are as follows. Measurement results Average value of 5 pieces Example 2 Comparative Example 2 61 times 28 times, which is more than double the effect. From the above, according to this example, the same effect as in Example 1 could be obtained.
【００２８】なお、補強板の構成は、図３のようにＬ１
＜Ｌ２＜Ｌ３であることが好ましい。接着剤部分（Ｌ
２）が端子部（Ｌ１）より短いと端子部折れが発生す
る。また、補強板の長さ（Ｌ３）は長い程良いが、スペ
ースの関係からＬ２より長ければ良い。The structure of the reinforcing plate is L1 as shown in FIG.
It is preferable that <L2 <L3. Adhesive part (L
When 2) is shorter than the terminal portion (L1), the terminal portion is broken. Further, the longer the length (L3) of the reinforcing plate is, the better, but it is better if it is longer than L2 in view of the space.
【００２９】補強板の厚さは実施例では１８８μｍのみ
を使用したが、この厚みはコネクタの仕様と可撓性回路
基板の厚みで制限されるので、決して１８８μｍのみが
良いという訳ではない。各種の厚みが使用できる。Although only 188 μm was used as the thickness of the reinforcing plate in this embodiment, this thickness is not limited to 188 μm because it is limited by the specifications of the connector and the thickness of the flexible circuit board. Various thicknesses can be used.
【００３０】なお、本発明は上述の実施例に限らず本発
明の要旨を逸脱することなくその他種々の構成を採り得
ることはもちろんである。The present invention is not limited to the above-mentioned embodiments, and it goes without saying that various other configurations can be adopted without departing from the gist of the present invention.
【００３１】[0031]
【発明の効果】以上説明したように、本発明によれば、
補強板の端面に力を入れてコネクタに差し込むことがで
きるので、断線等の不良をなくすことができる。As described above, according to the present invention,
Since the end face of the reinforcing plate can be inserted into the connector by applying force, defects such as disconnection can be eliminated.
【００３２】また、屈曲された場合、ストレスのかかる
部分が変わるので従来のように１ヵ所で折り曲げられる
場合と異なり屈曲特性が飛躍的によくなる。Further, when bent, the stressed portion changes, so that the bending characteristic is dramatically improved, unlike the conventional case of bending at one place.
【００３３】また、補強板の接着剤に色がついているの
でコネクタにどれくらい差し込んでいるのか、不十分か
十分か判断の目安とすることができる。Further, since the adhesive of the reinforcing plate is colored, it can be used as a standard for determining how much the adhesive is inserted in the connector and whether it is sufficient or insufficient.
【図１】本発明可撓性回路基板の一実施例を示す構成図
である。FIG. 1 is a configuration diagram showing an embodiment of a flexible circuit board of the present invention.
【図２】可撓性回路基板のコネクタ差し込み時の状態を
示す図である。FIG. 2 is a diagram showing a state where a flexible circuit board is inserted into a connector.
【図３】本発明可撓性回路基板における各構成の長さを
示す構成図である。FIG. 3 is a configuration diagram showing the length of each component in the flexible circuit board of the present invention.
【図４】従来の可撓性回路基板を示す構成図である。FIG. 4 is a configuration diagram showing a conventional flexible circuit board.
１ カバーフィルム ２ 導体 ３ ベースフィルム ４ 接着剤層 ５ 補強板 ６ コネクタ ７ 基板 1 Cover Film 2 Conductor 3 Base Film 4 Adhesive Layer 5 Reinforcement Plate 6 Connector 7 Board
Claims (2)
強板が、接着剤により一部分接着されていることを特徴
とする可撓性回路基板。1. A flexible circuit board, wherein a reinforcing plate lined with a terminal portion of the flexible circuit board is partially bonded with an adhesive.
ることを特徴とする請求項１に記載する可撓性回路基
板。2. The flexible circuit board according to claim 1, wherein the adhesive for adhering the reinforcing plate is colored.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267193A JPH06314860A (en) | 1993-04-28 | 1993-04-28 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10267193A JPH06314860A (en) | 1993-04-28 | 1993-04-28 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06314860A true JPH06314860A (en) | 1994-11-08 |
Family
ID=14333703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10267193A Pending JPH06314860A (en) | 1993-04-28 | 1993-04-28 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06314860A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003198070A (en) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | Flexible printed wiring board |
| JP2007059586A (en) * | 2005-08-24 | 2007-03-08 | Fujikura Ltd | Circuit wiring board and manufacturing method thereof |
| JP2007109952A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| JP2007109951A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| JP2008053502A (en) * | 2006-08-25 | 2008-03-06 | Sanyo Electric Co Ltd | Flexible printed board |
| US7779539B2 (en) * | 2006-02-17 | 2010-08-24 | Au Optronics Corp. | Method for preventing broken circuits of a flexible printed circuit |
| CN102122770A (en) * | 2009-12-15 | 2011-07-13 | 富来有限公司 | Flexible cable for connector connection and manufacturing method thereof |
| EP3361835A4 (en) * | 2015-12-29 | 2018-11-21 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible circuit board and mobile terminal |
| US12312509B2 (en) | 2019-12-20 | 2025-05-27 | 3M Innovative Properties Company | Adhesive article comprising polymer and polymerizable cyclic olefins, adhesive compositions and methods |
| US12338316B2 (en) | 2019-10-14 | 2025-06-24 | 3M Innovative Properties Company | Compositions comprising cyclic olefins and thermally conductive filler |
-
1993
- 1993-04-28 JP JP10267193A patent/JPH06314860A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003198070A (en) * | 2001-12-26 | 2003-07-11 | Iwaki Electronics Corp | Flexible printed wiring board |
| JP2007059586A (en) * | 2005-08-24 | 2007-03-08 | Fujikura Ltd | Circuit wiring board and manufacturing method thereof |
| US8282841B2 (en) | 2005-08-24 | 2012-10-09 | Fujikura Ltd. | Printed circuit board and manufacturing method thereof |
| JP2007109952A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| JP2007109951A (en) * | 2005-10-14 | 2007-04-26 | Bridgestone Corp | Reinforcing plate with adhesive and flexible printed board |
| US7779539B2 (en) * | 2006-02-17 | 2010-08-24 | Au Optronics Corp. | Method for preventing broken circuits of a flexible printed circuit |
| JP2008053502A (en) * | 2006-08-25 | 2008-03-06 | Sanyo Electric Co Ltd | Flexible printed board |
| CN102122770A (en) * | 2009-12-15 | 2011-07-13 | 富来有限公司 | Flexible cable for connector connection and manufacturing method thereof |
| EP3361835A4 (en) * | 2015-12-29 | 2018-11-21 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible circuit board and mobile terminal |
| US10779401B2 (en) | 2015-12-29 | 2020-09-15 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Flexible printed circuit board and mobile terminal |
| US12338316B2 (en) | 2019-10-14 | 2025-06-24 | 3M Innovative Properties Company | Compositions comprising cyclic olefins and thermally conductive filler |
| US12312509B2 (en) | 2019-12-20 | 2025-05-27 | 3M Innovative Properties Company | Adhesive article comprising polymer and polymerizable cyclic olefins, adhesive compositions and methods |
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