JPH06314897A - Chip mounter - Google Patents

Abstract

PURPOSE:To improve accuracy in mounting by measuring a positional difference of a chip component by an image system regarding a chip mounter which picks up a chip component and mounts it on a printed circuit board. CONSTITUTION:An image pick-up camera 2 which moves unitedly with a head 1 of a chip mounter is arranged and a mirror 8 is arranged between a component supplier and a printed circuit board 9. A position correction means is provided, which calculates a quantity of positional difference of a chip component 5 according to image data from the image pick-up camera 2 which has taken an image of the chip component 5 passing above the mirror 8. Then, a control device is provided, by which after correcting the positional difference from the position correction means, the head 1 is moved by a driving means to the printed circuit board 9 the quantity of positional difference from the position correction means and the chip component 5 is thus mounted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip mounter for picking up a chip part and mounting it on a printed board.

[0002]

2. Description of the Related Art Conventionally, a method of correcting the position of a chip component sucked by a nozzle of a chip mounter is performed by a centering mechanism (mechanical chuck) which mechanically corrects the position in the X-Y direction, especially in a medium mounter.

[0003]

However, since the method based on the mechanical position correction described above has a limit in accuracy, an image correction method is adopted, but in the case of a medium or small mounter, the entire device is used. It is not preferable to make the camera compact and increase the space for installing the camera device. Further, it is necessary to move the nozzle of the head for picking up the chip to the position of the camera device, which increases the takt time and lengthens the chip mounting time of the mounter, resulting in a decrease in work efficiency. .

The present invention has been made in view of the above problems, and measures the positional deviation of chip parts of a medium-sized mounter by an image method, corrects the positional deviation and mounts it on a printed circuit board to improve the mounting accuracy. The purpose is to provide the chip mounter.

[0005]

The gist of the present invention for solving the above problems and achieving the above objects is to pick up a chip component from a component supply device by a nozzle of a head and transfer it onto a printed circuit board for mounting. In the chip mounter, an imaging camera that moves integrally with the head is provided, a mirror is arranged between the component supply device and a printed circuit board, and the chip component passing over the mirror is photographed. Position correction means for calculating the positional deviation amount of the chip component based on the image data from the image pickup camera is provided, and the head is corrected by the positional deviation amount from the position correction means and moved to the printed circuit board by the driving means. It consists in providing a control device for mounting the parts.

[0006]

According to the chip mounter of the present invention, the image pickup camera is provided integrally with the head, and the amount of positional deviation of the chip component can be known from the reflected image of the mirror. That is, it is not necessary to make a detour by moving the head to a place where the imaging camera is installed and calculating the positional deviation amount of the chip component there, and there is no time loss. Therefore, medium size
Even with a small chip mounter, mechanical centering with inferior accuracy is unnecessary, and a highly accurate image correction method can be achieved with a simple configuration.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, one embodiment according to the present invention will be described in detail with reference to the drawings. FIG. 1 is an explanatory diagram showing a configuration of a main part of a chip mounter according to the present invention, in which a head 1 of the chip mounter and an imaging camera 2 are integrally attached via a rigid frame body 3.

A nozzle 6 for picking up the chip component 5 supplied from the tape feeder 4 by moving it up and down and further sucking it is provided under the head 1. A mirror 8 is arranged between the tape feeder 4 and the belt conveyor 7.

The image pickup camera 2 picks up an image of the chip component 5 which is picked up by the nozzle 6 and reflected on the mirror 8. At that time, a strobe (not shown) provided in the vicinity of the image pickup camera 2 emits light in about 1 μs.

The head 1 and the imaging camera 2 are
Servo motors 10 and 10 for driving together with the rigid frame 3
Further, the head 1 is rotated in the XY directions by a ball screw or the like, and the head 1 is rotated by the pulse motor 11 about the axis.

A position shift amount calculation circuit 12 is provided as a position correction means for calculating the amount of position shift of the chip component with respect to the reference position based on the image data obtained by analyzing the image from the image pickup camera 2.

In the position shift amount calculation circuit 12, the chip component 5 sucked by the nozzle 6 calculates a reference position, for example, a shift in the XY direction and a shift in rotation with respect to the axis of the nozzle 6. Is. Further, as the calculation method, known means is adopted. The data of the amount of positional deviation is transmitted to the CPU (Central Processing Unit) 13 as a digital signal.

With this structure, as shown in FIG. 2, when the chip component 5 is mounted on the printed circuit board 9, the printed circuit board 9 is transferred from one side in the X direction by the belt conveyors 7 and 7a. , When it reaches the reference position, it is stopped. Note that the normal position correction of the printed circuit board 9 may be performed.

Next, in response to a command from the CPU 13, the head 1 moves above the tape feeder 4, further lowers the nozzle 6 to adsorb a desired chip component 5, and the nozzle 6 again rises and stops. After that, the head 1 moves the servo motors 10, 1 to move to a predetermined position on the printed circuit board 9.
It is moved in the XY direction by driving 0.

In this way, the head 1 is mounted on the printed circuit board 9
When it moves to, since it passes over the mirror 8, the stroboscopic light is emitted within the range where the head 1 passes over the mirror 8 and an image is taken by the imaging camera 2.

Then, by the time the head 1 reaches a predetermined position on the printed circuit board 9, the positional deviation amount calculation circuit 12 calculates the positional deviation amount of the chip component 5, and the data is transmitted to the CPU 13. It is something. Therefore, the tact time from the mounting of the chip component of the chip mounter to the mounting of the next chip component is kept to a minimum.

After the head 1 reaches a predetermined position on the printed circuit board 9, the servo motor 10 moves the head 1 by the servomotor 10 in response to a command from the CPU 13 by the calculated positional deviation amount. The position correction in the −Y direction and the rotation correction by the pulse motor 11 are performed.

In this way, after the position of the chip component 5 of the nozzle 6 is corrected, the nozzle 6 of the head 1 descends and the chip component 5 is placed on the printed board 9.

The mirrors 8 are provided between the tape feeders 4 and 4 on both sides of the printed circuit board 9 in the Y direction, and the number of the heads 1 is not limited to one.
A chip mounter having 3 to 3 heads can have the same structure.

Since there is only one mirror 8 in the mirror 8, it is necessary to tilt the optical axis of the image pickup camera 2 as shown in FIG. 1, but the image of the chip component obtained by this is transformed into a trapezoid, and the position is changed. It is not preferable for detecting the deviation.

Therefore, as shown in FIG. 5 or 6,
The mirrors 8a and 8b may be inclined at 45 degrees to each other,
By combining the three mirrors 8c, 8d and 8e,
In either case, the image of the chip component can be prevented from being inclined at right angles to the optical axis of the imaging camera 2. However, in the configuration of the mirror shown in FIG. 5, since the front and rear in the Y direction are reversed, it is necessary to calculate the positional deviation amount in consideration of it.

Further, in the above-described embodiment, the correction of the amount of positional deviation is performed by moving the head 1 to a predetermined position on the printed circuit board 9 and then further moving the head 1. However, instead of this, while the head 1 is being moved to the printed board 9, the position data after the position correction for the position data for moving to a predetermined position on the printed board 9 by the CPU 13 is added. It is also preferable to obtain the position data and thereby move the head 1 on the printed circuit board 9 at once.

[0023]

As described above, the chip mounter of the present invention is provided with the image pickup camera which moves integrally with the head for picking up the chip component, and the mirror is arranged between the component supply device and the printed circuit board. Position correction means for calculating the amount of positional deviation of the chip component based on the image data from the image pickup camera that has photographed the chip component passing over the mirror, and the head is displaced from the position correction means. Since the control device for correcting the quantity and moving the printed circuit board by the drive means to mount the chip component is provided, it is possible to provide the highly accurate position deviation correction means in a compact manner. Play. Further, even in a medium-sized or small-sized chip mounter, the excellent effect that the chip components can be mounted with high precision is achieved.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a configuration of a main part of a chip mounter according to the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a block diagram of a chip mounter.

FIG. 4 is a flow chart diagram showing a procedure for mounting a chip component on a printed circuit board by correcting its positional deviation.

FIG. 5 is a side view of another example of the mirror.

FIG. 6 is a side view of another example of the mirror.

[Explanation of symbols]

 1 head, 2 imaging camera, 3 frame, 4 tape feeder, 5 chip parts, 6 nozzles, 7,7a belt conveyor, 8 mirror, 9 printed circuit board.

Claims (1)

[Claims] 1. A chip mounter for picking up a chip component from a component supply device by a nozzle of a head, transferring the chip component onto a printed circuit board, and mounting the chip component, wherein an imaging camera that moves integrally with the head is provided. A mirror is disposed between the supply device and the printed circuit board, and position correction means for calculating the amount of positional deviation of the chip component based on image data from the image pickup camera that photographs the chip component passing over the mirror is provided. A chip mounter comprising a controller for correcting the amount of positional deviation from the position correcting unit and moving the head to the printed circuit board by a driving unit to mount a chip component.