JPH0632407B2 - Cooling mechanism for electronic devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a cooling mechanism for an electronic device, and particularly to a cooling mechanism for a test head of an IC tester device.

(Prior Art) Recently, a test head of an IC tester device tends to be smaller and faster, and heat generated by a semiconductor integrated circuit element or the like which constitutes the test head is efficiently guided to the outside of the device to further improve the temperature distribution. Must be uniform.

2 (a) is a plan view of a conventional test head body (measuring unit) 1, FIG. 2 (b) is a sectional side view of FIG. 2 (a), 2 is a cooling fan, and 3 is a cylinder. Reference numeral 4 denotes a printed wiring board (printed circuit board) radially arranged around the reference numeral 5, and reference numeral 5 denotes a ventilation portion (gap) for guiding the wind 6 from the fan 2.

(Problems to be Solved by the Invention) Since the conventional test head is forcedly ventilated by the fan 2 as shown in FIG. 2, the wind 6 blows strongly on the upper portion of the printed wiring board 2 due to the straightness of the wind. As a result, the flow of wind 6 was uneven. Therefore, since the heat radiation effect and the temperature distribution are not uniform, there is a drawback that the measurement data varies and stable accuracy cannot be ensured.

Therefore, an object of the present invention is to make the temperature rise uniform by uniformly and uniformly blowing air to a printed wiring board of an electronic device such as a test head of an IC tester device.

[Structure of Invention]

(Means and Action for Solving the Problem) The present invention arranges a cylindrical wind direction control plate along a plurality of arranged printed wiring boards, and a plurality of air holes are formed in a side wall of the wind direction control plate. A cooling mechanism for electronic equipment, characterized in that it is provided with air blowing means arranged to blow air into the tubular wind direction control plate, and the air holes are irregularly provided depending on their installation locations.

That is, the present invention, the air holes of the wind direction control plate is provided irregularly depending on the installation location, for example, by changing the hole diameter depending on the installation location, or by varying the air hole installation density depending on the location, the wind direction and the air volume. It is controlled so that the entire printed circuit board is uniformly exposed to the wind.

Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
FIG. 3A is a plan view of the same embodiment, FIG. 2B is a side view of the same section, and FIG. 3C is an enlarged view of a main part of the same structure, which is the same as that of FIG. Since this is an example in the case of corresponding to the above, the corresponding portions are denoted by the same reference numerals, the description thereof will be omitted, and the characteristic points will be described. The feature of this embodiment is that a cylindrical wind direction control plate 11 having a side wall in which a plurality of air holes 12 are opened and arranged is provided inside the printed wiring boards 4, 4, ... And the air holes 12 are the first
As shown in Figure (c), the hole diameter becomes smaller toward the top,
That is, the hole diameter was increased toward the bottom. The ceiling of the wind direction control plate 11 is covered.

In FIG. 1, the wind 6 from the fan 2 is blown in the direction a, and the pressure is increased especially in the upper side of the wind direction control plate 11, so that the wind 6 is blown out from each hole 12 in the direction of arrow b (straight direction). Since the air holes 12 are smaller toward the top and the hole diameter is larger toward the bottom, the amount of air blown out from the inside of the wind direction control plate 11 is constant above and below, so that each printed wiring board 4 is It is cooled uniformly.

The present invention is not limited to the above-mentioned embodiment, and various applications are possible. For example, in the embodiment, the present invention is applied to the test head of the IC tester device, but it is desired that the other heating object is inside the device and the cooling device is provided with an electronic device to have a cooling effect, and the cooling effect is further uniformized. It can also be applied to things. Further, according to the present invention, for example, even if the arrangement density of the air holes of the wind direction control plate is set to be smaller as it goes up and larger as it goes down, the effect of keeping the air volume constant is obtained as in the embodiment.

By the way, in order to cool the printed wiring board uniformly, it is necessary to carry out the procedure shown in FIG.
As described above, when a single printed wiring board 4 is blown with air from a large number of air holes, the heat generating material (IC or the like) is uniformly blown, and the uniform cooling effect is large. Ie 1
The wind pressure emitted from the two air holes is large toward the center of the air holes, but is low toward the periphery of the air holes. Therefore, as shown in FIG. 1 (b), when a single printed wiring board 4 is cooled from many directions by a large number of air holes 12, the uniform cooling effect can be increased.

Further, when the wind is blown into the bottomed tubular wind direction control plate by the blowing means, the wind pressure becomes higher as it gets closer to the bottom part at the back of the wind direction control plate, and as it gets farther from the bottom part, that is, the cylindrical wind direction. It is clear that the wind pressure becomes smaller as it approaches the entrance side of the control plate.

Therefore, as shown in FIG. 1 (b), the wind 6 indicated by the arrow in the figure is such that the wind blown from the upper side in the figure at the bottom of the lid and the wind blown from the lower side in the figure far from the bottom are equal. The air hole 12 has a smaller diameter toward the upper side in the figure, and the air hole 12 has a larger diameter toward the lower side. For this reason, it becomes possible to uniformly apply air to the plurality of heat-generating-member-equipped printed wiring boards that require cooling. That is, depending on the location of the side wall of the bottomed cylindrical wind direction control plate, the diameter of the air hole 12 is simply changed as described above, or the air hole 1
Only by changing the installation density of two, it is possible to uniformly apply air to a plurality of printed wiring boards.

Further, as shown in FIG. 1 (a), since a large number of printed wiring boards can be arranged in a radial arrangement around one bottomed cylindrical wind direction control plate, one bottomed cylindrical wind direction control plate is provided. Thus, a large number of print control plates can be cooled at once.

Further, since the tubular portion 3 is provided inside the bottomed tubular wind direction control plate 11 and the air blower 2 can blow air into the narrowed gap 5 therebetween, a large amount of air is blown as the air blower 2. There is no need to use a large blower, and a relatively small one can be used.

Further, since the wind direction control plate 11 that blows in the wind has a bottomed cylindrical shape and the wind pressure that is blown is used for cooling,
Cooling air can be used efficiently.

〔The invention's effect〕

As described above, according to the present invention, the cooling effect of the printed wiring board as a heat source is improved, and the temperature rise distribution is made uniform.

[Brief description of drawings]

FIG. 1 (a) is a plan view of an embodiment of the present invention.
FIG. 2B is a sectional side view of the same, FIG. 1C is an enlarged view of a main part thereof, FIG. 2A is a plan configuration diagram of a conventional mechanism, and FIG. It is a figure. DESCRIPTION OF SYMBOLS 1 ... Test head measurement part, 2 ... Fan, 4 ... Printed wiring board, 5 ... Gap, 11 ... Wind direction control board, 12 ... Wind hole.

Claims (2)

[Claims] 1. A printed wiring board having a bottomed cylindrical wind direction control plate is arranged such that each side of a plurality of heat generating material mounted printed wiring boards is parallel to the axial direction of the bottomed cylindrical wind direction control plate. A plurality of air holes are arranged on the outer wall of the cylindrical wind direction control plate so as to face each other along each of the sides of the plurality of heat-generating-object mounted printed wiring boards, and the cylindrical wind direction control plate is arranged. An electronic device comprising an air blower for blowing air into the slope, wherein the air hole in the peripheral wall of the tubular wind direction control plate has a smaller hole diameter toward the bottom of the tubular air flow direction control plate. Cooling mechanism. 2. A printed wiring board having a bottomed cylindrical wind direction control plate is arranged so that each side of the printed wiring board mounting a plurality of heating elements is parallel to the axial direction of the bottomed cylindrical wind direction control plate. A plurality of air holes are arranged on the outer wall of the cylindrical wind direction control plate so as to face each other along each of the sides of the plurality of heat-generating-object mounted printed wiring boards, and the cylindrical wind direction control plate is arranged. It is characterized in that it comprises an air blowing means for blowing air into the slope, and the air holes in the peripheral wall of the tubular wind direction control plate have a smaller installation density of the number of holes toward the bottom of the tubular wind direction control plate. Cooling mechanism for electronic devices.