JPH06333959A - Lead frame supplying device - Google Patents

Abstract

PURPOSE:To prevent a lead frame supplying device from picking up and carrying two lead frames together at the time of supplying a lead frame and, at the same time, to reduce the deformation of lead frames. CONSTITUTION:The device supplies the uppermost lead frame 16 of lead frames kept in a bundle-like state in a lead frame stock case to a carrying stage with a suction arm 5 after separating the frame 16 from the other lead frames in such a way that the arm 5 is lowered to the upper surface of the frame 16 and both ends of the frame 16 are turned up by means of pressers 7 at both ends of the frame 16 in its length direction while the lead frame 16 is pressed by the arm 5, and then, inserting stopper pins into the gaps formed below the turned up both end sections of the frame 16. In case the uppermost lead frame 16 is not separated from the remaining lead frames and there is a possibility of inner leads being deformed at the time of picking up the frame 16, the stopper pins are raised together with the frame 16 and the remaining lead frames when the raising load becomes larger than a preset value and proximity sensors mounted on the stopper pins detects such a condition as a 'erroneous pickup', because the inner leads of the lead frames may be deformed. When the sensors detect the erroneous pickup, the operation of this device is stopped and a worker manually handles the non-separated lead frame.

Description

Detailed Description of the Invention

[0001]

The present invention relates to a semiconductor manufacturing process,
In particular, it relates to a lead frame supply device.

[0002]

2. Description of the Related Art Conventionally, there have been mainly the following two methods as a lead frame supply device. (1) The first mechanism is, as shown in FIG. 5, a loader 1 that stacks lead frames 15 and raises them in a bundle, a lead frame stock case 2 that houses the lead frames 15 in a bundle, and this lead frame stock. As shown in FIG. 6, the case 2 has a bottom plate 2 as a drive space for raising the bundled lead holes 15 by the loader 1.
4 has a structure in which the central portion of 4 is hollowed out, and the center of one of the side plates 4 is cut off. Then, the bundled lead frames 15 are lifted by the loader 1, and the loader stop sensor 4 for stopping the bundled lead frames 15 detects the stop position, and the top of the bundled lead frames 15 stopped at the arbitrary height is detected. The suction arm 5 is configured to suck and pick up one by one and supply the picked-up sheet to a transfer stage (not shown).

(2) Further, the second mechanism is disclosed in JP-A-1-9.
As shown in No. 6933, the side plate 4 of the lead frame stock case 2 has the same structure and operation as shown in FIG.
Of the two surfaces, the height of the two plates 26, 27 that are assembled at right angles is made lower than the other two, and the longitudinal side is driven back and forth to press one longitudinal end of the uppermost lead frame 16. 7 is a space for inserting, and the short side is a space for operating the suction arm 5. As the operation, as in FIG. 5, the bundled lead frames 15 are lifted from the loader 1 to the lower surface above the side plate of the lead frame stock case 15, and the uppermost lead frame 16 is moved.
One end in the longitudinal direction of is pressed against the pressing element 7. At this time, since the side surface plate 29 facing the side surface plate 27 on the pressing side in the longitudinal direction of the lead frame stock case 2 is higher, the pressed lead frame 16 bends in a convex shape from the center, and below it. It was separated from the lead frame and then supplied to the transfer stage 3 by the suction arm 5.

[0004]

In the above-mentioned two conventional lead frame supplying devices, firstly, in (1),
As shown in the figure, when the silver plating 32 on the surface of the inner lead 30 or the island 31 in the lead frame also wraps around to the back surface and adheres to the lower lead frame, the pickup arm picks up two sheets together and the transfer stage However, there was a problem that the lead frame in the lower stage was dropped and the lead frame was deformed while the lead frame was supplied to the carrier or while the lead frame was being supplied to the transport stage. Also (2)
In the case of using a lead frame with a narrow inner lead pitch, the lower inner lead and the uppermost inner lead entangle with each other when bending the uppermost lead frame, and there is a drawback that the inner leads are deformed. there were.

[0005]

According to the present invention, a lead frame used for mounting semiconductor pellets is stacked in a bundle and turned up from both longitudinal ends of the uppermost lead frame to form one lead frame. It is a lead frame supply device in which pressing elements for separating the lead frames are provided at both ends in the longitudinal direction of the stacked lead frames, and when the uppermost lead frame is separated into one and picked up, it is in the lower stage. It has a stopper pin for pressing the surface of the lead frame and a function for detecting a pickup error.

[0006]

According to the present invention, after the suction arms are lowered and pressed onto the uppermost position of the lead frames stacked in a bundle, both ends of the lead frame in the longitudinal direction are pressed by the pressing elements.
The lead frame is lifted up so that both ends can be lifted up, and the leads can be separated one by one and the deformation that occurs when the lead frame is supplied can be reduced. In addition, when the lead frame is heavily attached, the stopper pin and the pick-up error detection function can reliably separate the lead frames one by one, and the lead frame can be supplied without damaging the lead frame. is there.

[0007]

Embodiments of the present invention will be described with reference to the drawings. [Embodiment 1] FIG. 1 is a plan view of an embodiment of the present invention, FIG. 2 is a front view of the embodiment, and FIG. 3 is a side view of the embodiment, which will be described with reference to these drawings. In addition to the loader 1, the lead frame stock case 2, the transfer stage 3, the loader stop sensor 4, and the suction arm 5, the lead frame stock case 2 has a longitudinal direction similar to that of the lead frame supply device shown in FIG. At both ends, there are pushers 7 which are driven by cylinders 6 diagonally upward and backward. Stopper pins 9 that are driven by cylinders 8 at four positions in the lateral direction of the lead frame stock case 2 to move back and forth, guides 10 that slide the cylinders 8 up and down, tension coil springs 11 and brackets 12 that suspend the cylinders 8. The proximity sensor 13 is provided to output an error signal when the cylinder 8 is raised by the slide guide 10. The suction arm 5 has a shape whose longitudinal direction is shorter than the entire length of the lead frame 15.

Next, this operation will be described. First loader 1
Then, the bundled lead frames 15 are lifted up, and the loader stop sensor 4 detects and stops them up to a stop position, and then the suction arm is lowered to the uppermost surface of the uppermost lead frame 15 and pressed down, and then pressed. Lead frame 15
The pushers 7 at both ends in the longitudinal direction move forward and try to lift both ends. At this time, since the uppermost lead frame 16 is pressed by the suction arm 5, the upper end of the lead frame 16 is turned up from both ends by the pushers 7 with the both ends serving as fulcrums. And the topmost lead frame 16 that turned up
Between the lead frame 17 on the lower side (just below it),
The stopper pin 9 moves forward and presses the surface of the lower lead frame 17. After that, the pusher 7 retracts and the suction arm 5
Rises while adsorbing only the uppermost lead frame 16. At this time, if it is lightly attached to the lower lead frame 17, it is separated by the pressing force of the stopper pin 9 and the suction force of the suction arm 5, and only the topmost lead frame 16 is transferred to the transfer stage. Can be supplied.

In the case of heavy adhesion due to the entanglement of the inner leads, the restoring force of the tension coil spring 11 that suspends the stopper pin 9 is set in advance to such a load that the inner leads are not deformed, and the suction arm is set. When raising 5, the stopper pin 9 rises together with the lower lead frame 17 via the slide guide 10, and the proximity sensor 13 provided on the lower surface of the cylinder 8 causes the proximity sensor 13 to move.
Therefore, the proximity sensor 13 sends an error signal to the control unit (not shown) to stop the operation as a "pickup error", and after the operator is called, the operator does not separate due to heavy adhesion. Lead frame 1
Procedures 6 and 17 will be performed.

[Second Embodiment] FIG. 4 is a schematic view of the second embodiment. The configuration and operation of the second embodiment are the same as those of the first embodiment described with reference to FIGS. 1, 2 and 3, but the pressing surface of the pressing element 7 is made uneven, and the pressing element 7 advances and the end portion is It can be reliably lifted. Thereby, the end surface of the uppermost lead frame 16 is easily hooked and lifted.

[0011]

As described above, according to the present invention, by having the pressing elements on both sides in the longitudinal direction of the lead frame, and having the stopper pin and the pick-up error detection function, two pieces are picked up together by the suction arm and the transfer stage. It is possible to reduce the deformation of the lead frame and to improve the usage efficiency of the lead frame in the manufacturing process.

[Brief description of drawings]

FIG. 1 is a plan view of a first embodiment of the present invention.

FIG. 2 is a front view of the first embodiment of the present invention.

FIG. 3 is a side view of the first embodiment of the present invention.

FIG. 4 is a schematic diagram of a second embodiment of the present invention.

FIG. 5 is a schematic view of a conventional lead frame supply device.

FIG. 6 is a schematic view of a lead frame stock case.

FIG. 7 is a schematic view of a conventional lead frame supply device.

FIG. 8 is a schematic diagram of a lead frame.

[Explanation of symbols]

 1 loader 2 lead frame stock case 3 transfer stage 4 loader stop sensor 5 suction arm 6 cylinder 7 pusher 8 cylinder 9 stopper pin 10 slide guide 11 tension coil spring 12 bracket 13 proximity sensor 15 lead frame 16 top lead frame 17 lower stage Lead frame 24 Bottom plate 25 Side plate 26 Side plate 27 Side plate 29 Side plate 30 Inner lead 31 Island 32 Silver plating

Claims (3)

[Claims] 1. A lead frame used for mounting semiconductor pellets is stacked in a bundle, and a presser for separating the lead frames one by one is piled up by turning up from the longitudinal ends of the uppermost lead frame. Lead frame supply device, characterized in that it is provided at both ends in the longitudinal direction of the formed lead frame. 2. When the lead frames used for mounting semiconductor pellets are stacked in a bundle and the uppermost lead frames are separated and picked up one by one,
A lead frame supply device having a stopper pin for pressing the surface of the lower lead frame and a function of detecting a pickup error. 3. The lead frame supply device according to claim 1, wherein the pressing element for separating the lead frames one by one has an uneven pressing surface.