JPH06335944A - Molding device for half case for floppy disk - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a mold device for a half case for a floppy disk that can be shared. [Structure] On a center line CL1 of a fixed die 60 that longitudinally cuts a region B1 corresponding to a shutter area portion and a region B2 corresponding to a label area portion, within a region B2 corresponding to the label area portion. One gate 63 for injecting the molten resin is arranged at a position corresponding to the region corresponding to the boss portion facing the region B2 and being as close as possible to the region B1 corresponding to the shutter area portion. [Effect] Since the molten resin flows dispersed around the gate 63 and the resin flow areas are equalized, the difference in shrinkage of the molded product is small, and the influence of the outer size, thickness, etc. is small. Therefore, it is not necessary to perform preform processing, and the mold device can be shared.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold device for resin-molding a half case for a floppy disk that houses a disk-shaped storage disk body.

[0002]

2. Description of the Related Art Conventionally, a mold device for molding a half case for a floppy disk for accommodating a storage disk body has been designed to be movable relative to a fixed mold and fixed mold. A movable die that forms a cavity with the die is provided, and between the fixed die and the movable die on the engraved surface corresponding to the four corners of the surface of the half case of the movable die. An injection port (hereinafter referred to as “gate”) for injecting the molten resin was provided in the formed cavity. Therefore, the molten resin injected into the cavity from the gates at these four points flows toward the center of the half case.

FIG. 9 shows a floppy disk molded by a molding die device having a four-point gate. This figure shows the state viewed from the upper case side. In the figure, 1 is a shutter (shown by a broken line), 2 is a shutter 1.
The shutter area 3 is slidably mounted, and the label area 3 is provided with a label, and resin injection marks 4a, 4b, 4c, 4d appear at four corners of the upper case.

When a floppy disk is molded by the molding die apparatus having the above-mentioned four-point gate, the degassing in the central portion is apt to be insufficient especially in the upper case (see FIG. 9) having no through hole in the central portion. . Therefore, so-called shininess may occur on the surface of the molded product (upper case), or the molded product may warp because pressure is not uniformly applied to the molded product.

To deal with the above, for example, Japanese Patent Publication No. 1-1.
As disclosed in Japanese Patent No. 66922, a molding die apparatus has been proposed in which a molten resin is supplied into a cavity from a two-point gate. These gates are the parts that are covered by the shutter when the floppy disk is not filled in the office automation (OA) equipment such as the personal computer and the word processor, and are outside the storage part of the storage disk body, and as much as possible in the half case. On the engraved surface of the movable mold that corresponds to the center of
Two points are arranged.

FIG. 10 shows a half case for a floppy disk molded by a molding die apparatus having a two-point gate. FIG. 10 (a) is a plan view seen from the upper case side, and FIG. 10 (b). FIG. 4 is a plan view seen from the lower case side. As is apparent from the figure, in the shutter area section 2, when the floppy disk is not used, the shutter 1
The resin injection marks 4a and 4b are left in the portion covered by the broken line (indicated by a broken line), outside the storage portion of the storage disk medium, and as close to the center of the half case as possible.

[0007]

When the half case is molded by the molding die apparatus having the above-mentioned two-point gate, the molten resin smoothly flows in the cavity, so that the gas can be smoothly discharged. Therefore, it is possible to prevent defects such as shininess and warpage in the molded product. However, 2
When a molding die apparatus equipped with a point gate is used, the injection direction of the resin is from two points on the shutter side. Therefore, when the molten resin is flown from each of these two points, the gas is exactly half case. Concentrate on the center line that crosses the shutter area portion 2 and the label area portion 3. Therefore, the final filling portion of the resin injected from the gate is not completely joined on the center line. As a result, as shown in FIGS. 10 (a) and 10 (b), a so-called weld line (weld li) is formed on the center line that longitudinally crosses the shutter area 2 and the label area 3.
ne) WL appears. The shutter area portion 2 is a portion formed with a thin wall for mounting the shutter 1 and the label area portion 3 for attaching a label. Therefore, when the weld line WL is generated on the center line that cuts the shutter area 2 and the label area 3 as described above, the strength of the molded product becomes weak.

Further, in ordinary injection molding, degassing is usually dealt with by subjecting the die to gas venting treatment. However, as described above, the gas concentrated on the center line that crosses the shutter area 2 and the label area 3 is
It cannot be exhausted sufficiently by normal gas vent processing. For this reason, it is necessary to perform special degassing such as pasting a slit-shaped block for degassing on the engraved surface of the mold corresponding to the final point of the weld line. In such a special degassing, not only is it time-consuming to bond the blocks, but also so-called burrs may occur at a portion corresponding to the block bonding portion of the molded product.

Further, in the molding die apparatus having the two-point gate, since the resin is injected only from the shutter area 2 side, the contraction of the shutter area 2 with the gate and the label area 3 without the gate. There is a difference. In order to avoid this, in the two-point gate molding die device, the width of the engraving surface corresponding to the label-free label area portion 3 of the die is set wide in advance in consideration of the difference in shrinkage.
It is necessary to apply so-called preform processing. Since the molten resin used at the time of molding is different for each manufacturer, the difference in shrinkage between the shutter area portion 2 and the label area portion 3 differs depending on the molten resin used. Therefore, the above-mentioned preform processing has to be performed depending on the molten resin used, and as a result, the mold apparatus cannot be shared.

In view of the above, the present invention can form a half case for a floppy disk which can enhance the strength of a molded product, can be degassed by a normal gas venting process, and can be shared without requiring a preform process. The purpose is to provide a mold device.

[0011]

A molding die apparatus according to the present invention is provided with a shutter area portion which is recessed in the upper part of the surface and in which a shutter is mounted so as to be movable in the left and right directions.
Resin molding of a half case for a floppy disk that has a label area part that is recessed in the lower part of the surface and has a label attached, and has a disk body storage part that stores a disk-shaped storage disk body inside To do
The molten resin is injected into the engraved surface of the mold at a thick position on the center line that crosses the shutter area and the label area in a vertical direction and at a position as close as possible to the shutter area. The injection port for this is provided.

Specifically, a shutter area portion is provided in the upper portion of the front surface, in which a shutter is movably mounted in the left-right direction, and a wide concave portion is provided in the vicinity of the shutter area portion from the lower end of the surface. A boss for rotatably supporting the storage disc body, which is provided with a label area portion to be attached and a disc body storage portion for accommodating a disc-shaped storage disc body on the inner surface, and which is rotatably supported at approximately the center of the disc body storage portion. A mold device for resin-molding an upper case for a floppy disk having a thickly projecting portion is located approximately on the center line of the mold that vertically cuts the shutter area and the label area. An injection for injecting the molten resin into the engraved surface corresponding to the thick boss portion on the back side in the label area portion and corresponding to the position as close as possible to the shutter area portion. The provision.

In this upper case molding die device,
The molten resin injected into the mold cavity flows dispersed around the injection port, and the flow areas of the resin become equal.
As a result, the difference in shrinkage between the shutter area and the label area is reduced, and the influence of the outer dimensions and thickness of the molded product (upper case) can be reduced. Therefore, even if the molten resin used changes, it is not necessary to consider the difference in shrinkage of the molded product,
There is no need to perform preform processing depending on the molten resin used. Therefore, the mold device can be shared.

Further, as described above, the molten resin flows dispersedly around the injection port, and as a result of the resin flow area being constant, the weld line is dispersed without being concentrated at the final point, and the shutter area and the label area are dispersed. No weld line is formed on the center line that crosses the section, which leads to increased strength of the molded product. Furthermore, since the weld line is not concentrated at the final point and is dispersed, and the gas is not concentrated at the center line that crosses the shutter area portion and the label area portion in a vertical direction, the mold is preliminarily aligned with the final point of the weld line. There is no need to perform special gas vent processing such as pasting slit-shaped blocks on the engraved surface, and gas vent processing by ordinary parting can be used. As a result, burrs due to special gas vent processing do not occur in the molded product.

Further, a shutter area portion provided on the upper surface of the shutter, in which the shutter is movably mounted in the left-right direction, and a narrow recessed portion from the lower end of the surface toward the shutter area portion, are affixed with labels. A boss portion that includes a label area portion and a disc body storage portion that accommodates a disc-shaped storage disc body on the inner surface, and that rotatably supports the storage disc body between the shutter area portion and the label area portion. In a mold device for resin-molding a lower case for a floppy disk in which a through hole is formed so as to correspond to the above, in a mold, the mold is located on substantially the center line that vertically cuts the shutter area part and the label area part. Then, the molten resin is injected into the engraved surface corresponding to the thick position between the shutter area and the through hole and the position as close as possible to the shutter area. Providing an inlet for.

In this lower case molding die device,
The molten resin injected from the injection port disperses and flows around the injection port, and the resin flow areas are equalized. As a result, the difference in shrinkage of the molded product (lower case) is reduced. Can be shared, since there is no need to perform preform processing in advance, since the influence of the above can be reduced.

Also, in the lower case molding die apparatus, similarly to the upper case molding die apparatus, the strength of the molded product can be strengthened, and the degassing can be completed by the usual gas vent processing. .

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the accompanying drawings. FIG. 5 shows an upper case for a floppy disk, and FIG. 5 (a) is a plan view seen from the front side.
FIG. 3B is a plan view seen from the inner surface side. Also, FIG.
Shows a lower case for a floppy disk, in which FIG. 11A is a plan view seen from the front side, and FIG. 19B is a plan view seen from the inner side. With reference to these figures, the floppy disk accommodates and holds a disk-shaped storage disk body (not shown) in an upper case 10 and a lower case 30.

The upper case 10 is formed in a substantially square thin-walled surface. Then, on the surface 10a of the upper case 10, as shown in FIG. 5 (a), a shutter area 12 is provided with a shutter (shown by a broken line) 11.
And a label area portion 13 to which a label is attached. The shutter area 12 is the case surface 10
A narrow rectangular window 14 is provided on the upper part of a, and a rectangular window 14 for introducing a magnetic head provided in an office automation (OA) device (not shown) is provided at a substantially central portion of the shutter area 12. Are formed.

The label area portion 13 is the case surface 10a.
It is widely provided in a substantially rectangular shape close to the shutter area portion 12 from the lower end of the label area portion 13 and outside the lower edge portion of the label area portion 13 (left side in FIG. 5A, right side in FIG. 5B). 2) has a hole 15 for a light protector. Inner surface 10b of upper case 10
As shown in FIG. 5B, a cylindrical boss portion 16 that rotatably supports the storage disk body is formed in the central portion of the. Further, an outer frame 17 is formed over substantially the entire area of the outer edge portion of the case inner surface 10b, and an arcuate rib 18 is formed so as to be continuous with the outer frame 17. Therefore, the inside of the rib 18 serves as a disk body housing 19 for housing the storage disk body, and the outside of the rib 18 and the upper right of FIG. 5B shows the shutter 11 in FIG. 5A. The spring accommodating portion 20 is for accommodating a spring (not shown) that biases to the right.

As shown in FIGS. 7 (a) and 7 (b), the lower case 30 is formed into a substantially square thin-walled surface. Then, on the surface 30a of the lower case 30, as shown in FIG. 7A, a shutter area portion 31 to which a shutter (shown by a broken line) 11 is attached and a label area portion to which a label is attached are attached. And 32 are provided. The shutter area portion 31 is narrowly provided in a substantially rectangular shape on the upper surface of the case surface 30a, and a magnetic head provided in an office automation (OA) device (not shown) is introduced in a substantially central portion of the shutter area portion 31. A rectangular window 33 for forming is formed.

The label area portion 32 is the case surface 30a.
Is narrowed in a substantially rectangular shape from the lower end of the label area portion 32 toward the shutter area portion 31, and outside the lower edge portion of the label area portion 32 (right side in FIG. 7A, left side in FIG. 7B). The hole 34 for the light protector is formed on the surface. As shown in FIG. 7B, a circular through hole 35 is formed in the center of the inner surface 30b of the lower case 30 so as to correspond to the boss portion 16 that rotatably supports the storage disk body. An outer frame 36 is formed on the outer edge portion of the inner surface 30b of the case over substantially the entire area thereof, and an arcuate rib 37 is connected to the outer frame 36.
Are formed. Therefore, the inside of the rib 37 serves as a disk body storage portion 38 for housing the storage disk body, and the outside of the rib 37 and the upper left of FIG. 7B shows the shutter 11 in FIG. 7A. Is a spring housing portion 39 for housing a spring (not shown) that biases to the left.

FIG. 6 is an enlarged sectional view taken along line II-II of FIG. 5A, showing a sectional structure of the upper case. With reference to FIG. 6, the shutter area portion 12 and the label area portion 13 of the upper case 10 are each slightly recessed from the other portions. Further, the boss portion 16 of the upper case 10 is provided so as to project from the central portion of the disc body storage portion 19. Therefore, the thickness d1 of the boss portion 16 is equal to the upper case 1
0 is the thickest. An annular rib 16a is formed so as to project on the peripheral portion of the boss portion 16.

FIG. 8 is an enlarged sectional view taken along the line IV-IV of FIG. 7A and shows a sectional structure of the lower case. Referring to the figure, the shutter area portion 31 and the label area portion 32 of the lower case 30 are formed in a state of being slightly recessed from the other portions. Therefore, the shutter area portion 31 and the label area portion 3 in which the through holes 35 are formed
The thickness d <b> 2 of the region between 2 and 2 is the thickest in the lower case 30.

FIG. 1 is a plan view of a molding die apparatus for an upper case for a floppy disk according to an embodiment of the present invention, FIG.
FIG. 3 is an enlarged sectional view taken along line IX-IX in FIG. 1. With reference to these drawings, the molding die apparatus for the upper case according to the present embodiment is movable between the movable die 40 and the movable die 40 in the vertical direction. And a fixed mold 60 that forms the cavity 50.

As shown in FIG. 2, an engraving surface 41 corresponding to the shape of the inner surface 10b of the upper case 10 is engraved on the parting surface of the movable mold 40 facing the fixed mold 60. A protrusion pin 42 for forming the window 14 is inserted in an area A1 of the engraved surface 41 corresponding to the magnetic head introduction window 14, and an area A2 of the engraved surface 41 corresponding to the boss portion 16 is a boss. Since the portion 16 has the thickest wall, it is deepestly cut into the portion 16 than the other portions. The tip 42a of the protruding pin 42 for forming the window has a substantially oval shape in plan view (see FIG. 1).
The movable mold 40 and the movable mold 50 are
It is extended above the parting line with.

As shown in FIG. 2, an engraved surface 61 corresponding to the shape of the surface 10a of the upper case 10 is engraved on the parting surface of the fixed mold 60 facing the movable mold 40. An area B3 between the area B1 corresponding to the shutter area portion 12 of the engraving surface 61 and the area B2 corresponding to the label area portion 13 is an area B1 corresponding to the shutter area portion 12 and an area corresponding to the label area portion 13. It is carved slightly deeper than B2.

When the movable mold 40 touches down on the fixed mold 60, the region B1 of the engraved surface 61 corresponding to the shutter area 12 is fitted to the tip 42a of the window forming protrusion pin 42. A fitting hole 62 is formed.
As shown in FIG. 1, the window fitting hole 62 penetrates the fixed mold 60 and has a substantially oval shape in plan view corresponding to the shape of the tip 42 a of the protrusion pin 42.

A gate 63 for injecting the molten resin 70 into the cavity 50 is provided in a region B1 of the engraved surface 61 corresponding to the shutter area 12 as shown in FIG.
The movable die 40 is formed so as to face the area A2 corresponding to the boss portion 16 of the engraved surface 41 of the movable die 40. As shown in FIG. 1, the gate 63 penetrates the fixed mold 60, and the area B1 corresponding to the shutter area portion 12 and the label area portion 1 are provided.
3 and the area B2 corresponding to the area B2, which is substantially on the center line CL1 and which corresponds to the area A2 corresponding to the boss portion 16 facing the area B2 in the area B2 corresponding to the label area portion 13, and One point is arranged at a position as close as possible to the area B1 corresponding to the shutter area section 12.

FIG. 3 is a plan view of a molding die apparatus for a lower case for a floppy disk according to an embodiment of the present invention, FIG.
FIG. 4 is an enlarged sectional view taken along line XI-XI of FIG. 3. With reference to these drawings, the molding die device for the lower case according to the present embodiment is movable between the movable die 80 and the movable die 80 in the vertical direction. And a fixed mold 100 that forms the cavity 90.

On the parting surface of the movable mold 80 facing the fixed mold 100, as shown in FIG.
An engraved surface 81 is engraved corresponding to the shape of the inner surface 30b. A protrusion pin 82 for forming the window 33 is inserted into a region C1 of the engraved surface 81 corresponding to the magnetic head introduction window 33, and a region C2 of the engraved surface 41 corresponding to the through hole 35 is A protruding pin 83 for forming the through hole 35 is inserted. Projecting pin 8 for window formation
The tip 82 a of the second member 2 is formed in a substantially oval shape in plan view (see FIG. 3), and extends above the parting line between the movable mold 80 and the fixed mold 100. The tip 83a of the protruding pin 83 for forming the through hole is formed in a circular shape in plan view and extends above the parting line between the movable mold 80 and the fixed mold 100.

On the parting surface of the fixed mold 100 facing the movable mold 80, as shown in FIG.
An engraved surface 101 is engraved corresponding to the shape of the surface 30a of the. An area D1 corresponding to the shutter area portion 31 of the engraving surface 101 and an area D corresponding to the label area portion 32
An area D3 between the area 2 and the area 2 (see FIG. 3) has the largest thickness, and corresponds to the area D1 corresponding to the shutter area portion 31.
And, it is carved deeper than the area D2 corresponding to the label area portion 32.

In the area D1 corresponding to the shutter area portion 31 of the engraved surface 101, when the fixed mold 60 touches down on the movable mold 40, a protruding pin 82 for forming a window is formed.
Is formed with a fitting hole 102 that fits into the tip 82a of the. As shown in FIG. 3, the window fitting hole 102 penetrates the fixed mold 100, and the tip 82 a of the protrusion pin 82.
Corresponding to the shape of, the plan view is substantially oval.

In the area D3 between the area D1 corresponding to the shutter area 31 of the engraved surface 101 and the area D2 corresponding to the label area 32, the movable mold 80 is touched down on the fixed mold 100. At this time, a fitting hole 103 that fits into the tip 83a of the protruding pin 83 for forming the through hole is formed. As shown in FIG. 3, the through hole fitting hole 103 penetrates through the fixed mold 100, and the protruding pin 83
It has a substantially circular shape in plan view corresponding to the shape of the tip 83a of the.

Further, in the area D3 between the area D1 corresponding to the shutter area portion 31 of the engraved surface 101 and the area D2 corresponding to the label area portion 32, the through hole fitting hole 10 is formed.
As shown in FIG. 4, a gate 104 for injecting the molten resin 70 into the cavity 90 is formed on the side of the area D1 corresponding to the shutter area portion 31 with respect to 3. The gate 104, as shown in FIG.
0 on the center line CL2 that passes through the area D1 corresponding to the shutter area portion 31 and the area D2 corresponding to the label area portion 32, and is transparent to the area D1 corresponding to the shutter area portion 31. One point is arranged at a position where the wall thickness between the hole fitting hole 103 and the hole fitting hole 103 is thick and at a position as close as possible to the area D1 corresponding to the shutter area portion 31.

In the molding die device for the upper case,
As shown in FIG. 2, when the movable mold 40 is touched down to the fixed mold 60, the cavity 50 is formed between the movable mold 40 and the fixed mold 60. This cavity 5
By injecting the molten resin 70 through the gate 63 into the inside of the disk 0, the upper case 10 for the floppy disk shown in FIG.
Is molded.

At this time, as shown in FIG. 1 and FIG. 2, the label is located substantially on the center line CL1 which longitudinally cuts the area B1 corresponding to the shutter area section 12 and the area B2 corresponding to the label area section 13. Within the area B2 corresponding to the area portion 13, the molten resin 70 is provided at a position corresponding to the area A2 corresponding to the boss portion 16 facing the area B2 and being as close as possible to the area B1 corresponding to the shutter area portion 12. Since the gate 63 for injecting is arranged at one point, the molten resin 70 injected into the cavity 50 flows dispersedly around the gate 63, and the flow area of the resin 70 becomes equal.

As a result, the difference in shrinkage between the shutter area 12 and the label area 13 of the upper case 10 is reduced, and the influence of the outer size and thickness of the molded product (upper case 10) can be reduced. Therefore, even if the molten resin used is changed, the shrinkage difference between the shutter area portion 12 and the label area portion 13 need not be taken into consideration, and there is no need to perform preform processing according to the molten resin used. Therefore, the mold device can be shared.

Further, as described above, the molten resin 70 flows dispersedly around the gate 63, and the resin flow area becomes constant. As a result, the weld line is dispersed without being concentrated at the final point,
A weld line does not occur on the center line CL1 that longitudinally crosses the shutter area portion 12 and the label area portion 13. Therefore, the strength of the molded product is increased. Further, since the weld line is not concentrated at the final point and is dispersed, the gas is not concentrated at the center line CL1 which vertically crosses the shutter area portion 12 and the label area portion 13. for that reason,
In advance on the mold engraving surface according to the final point of the weld line,
There is no need to perform a special gas venting process such as pasting slit-shaped blocks together, and a gas venting process with normal parting can be used. As a result, burrs due to special gas vent processing do not occur in the molded product.

In the molding device for the lower case,
As shown in FIG. 4, the fixed mold 100 is touched down to the movable mold 80 to form a cavity 90 between the movable mold 80 and the fixed mold 100.
By injecting the molten resin 70 through the gate 104, the lower case 30 for the floppy disk shown in FIG.
Is molded.

At this time, as shown in FIGS. 3 and 4, a center line CL that longitudinally cuts through the area D1 corresponding to the shutter area portion 31 and the area D2 corresponding to the label area portion 32.
2, a position where the wall thickness between the region D1 corresponding to the shutter area portion 31 and the through hole fitting hole 103 becomes thicker and closer to the region D1 corresponding to the shutter area portion 31 as much as possible. Since the gate 104 for injecting the molten resin 70 is arranged at one point, the molten resin 70 injected from the gate 104 flows dispersedly around the gate 104, and the flow area of the resin 70 becomes equal. .

As a result, the shrinkage difference between the shutter area 31 and the label area 32 of the lower case 30 is reduced. Therefore, the influence of the outer size, thickness, etc. of the molded product (lower case 30) is small, and it is not necessary to perform preform processing in advance, so that the mold device can be shared. Also, in the molding die device for the lower case, similarly to the molding die device for the upper case, the strength of the molded product can be strengthened, and the gas venting can be completed by the normal gas vent processing.

The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made within the scope of the present invention.

[0044]

As is apparent from the above description, according to the present invention, the molten resin flows dispersed around the injection port,
The resin flow areas are equal. Therefore, the difference in shrinkage of the molded product is reduced, and the influence of the outer size, the thickness, etc. can be reduced. As a result, it is not necessary to perform preform processing, and the mold device can be shared.

Further, since the weld lines are not concentrated on the last one point and are dispersed, and no weld line is generated on the center line which vertically extends through the shutter area portion and the label area portion,
It also increases the strength of molded products. Furthermore, since the weld line is not concentrated at the final point and is dispersed, the gas is not concentrated at the center line that crosses the shutter area and the label area, so gas venting processing by normal parting is performed. Can be dealt with.

[Brief description of drawings]

FIG. 1 is a plan view of a molding die device for a lower case for a floppy disk according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line XI-XI of FIG.

FIG. 3 is a plan view of a molding die device for a lower case for a floppy disk according to an embodiment of the present invention.

FIG. 4 is an enlarged cross section taken along line XI-XI of FIG.

FIG. 5 shows an upper case for a floppy disk,
The figure (a) is the top view seen from the surface side, and the figure (b) is the plan view seen from the inner surface side.

FIG. 6 is an enlarged sectional view taken along line II-II of FIG. 5A, showing a sectional structure of the upper case.

FIG. 7 shows a lower case for a floppy disk,
FIG. 3A is a plan view seen from the front side, and FIG. 3B is a plan view seen from the inner side, which is a cross-sectional plan view of a microwave oven according to a third embodiment of the present invention.

FIG. 8 is an enlarged sectional view taken along line IV-IV of FIG. 7A, showing a sectional structure of the lower case.

FIG. 9 is a plan view showing a floppy disk molded by a molding die device having a four-point gate, as viewed from the upper case side.

10A and 10B show a half case for a floppy disk molded by a molding die apparatus having a two-point gate, where FIG. 10A is a plan view seen from the upper case side, and FIG. 10B is a lower case. It is the top view seen from the side.

[Explanation of symbols]

 10 Upper Case 11 Shutter 12 Shutter Area Section 13 Label Area Section 16 Boss Section 19 Disk Body Housing 30 Lower Case 31 Shutter Area 32 Label Area 35 Through Hole 38 Disk Body Housing 40,80 Movable Mold 60,100 Fixed Mold 50,90 Cavity 41,61,81,101 Engraved surface 63,104 Gate

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Internal reference number FI technical display location // B29L 31:34 4F

Claims (3)

[Claims] 1. A shutter area portion provided on an upper portion of a surface, in which a shutter is movably mounted in a left-right direction, and a label area portion provided on a lower portion of the surface, on which a label is attached, A mold device for resin-molding a half case for a floppy disk, which has a disk body storage part for accommodating a disk-shaped storage disk body on its inner surface, wherein the shutter area part and the label area of the mold are The injection port for injecting the molten resin is provided on a sculptured surface corresponding to a position where the wall thickness is approximately on the center line that crosses the section and the position as close as possible to the shutter area. Mold device for half case for floppy disk. 2. A shutter area portion provided on an upper portion of a surface, in which a shutter is movably mounted in a left-right direction, and a recessed portion provided widely from a lower end of the surface in the vicinity of the shutter area portion and having a label attached thereto. A label area and a disk body storage section for storing a disk-shaped storage disk body on the inner surface, and a thick boss that rotatably supports the storage disk body in the center of the disk body storage section. A mold device for resin-molding an upper case for a floppy disk, which is convexly formed on the meat, wherein the label is located substantially on the center line that crosses the shutter area portion and the label area portion of the mold vertically. An injection port for injecting the molten resin is provided on the engraved surface corresponding to the thick boss portion on the back side in the area portion and corresponding to the position as close as possible to the shutter area portion. Mold device for forming a half case for a floppy disk. 3. A shutter area portion, which is recessed in the upper portion of the surface, and in which the shutter is mounted so as to be movable in the left-right direction, and a recessed portion, which is narrowly recessed from the lower end of the surface toward the shutter area portion, to which a label is attached. A boss portion that includes a label area portion and a disc body storage portion that accommodates a disc-shaped storage disc body on the inner surface, and that rotatably supports the storage disc body between the shutter area portion and the label area portion. A mold device for resin-molding a lower case for a floppy disk in which a through hole is formed so as to correspond to the above, and the mold device is located approximately on the center line that vertically cuts the shutter area and the label area. For injecting the molten resin on the engraved surface corresponding to the position where the wall thickness is large between the shutter area and the through hole and the position closest to the shutter area. A molding device for a half case for a floppy disk, which is provided with an inlet.