JPH0633646U - Waterproof plate - Google Patents

Abstract

(57) [Abstract] [Purpose] A waterproof plate for a precision cutting device such as a dicing device, which can prevent contact with a spindle housing inserted in a hole of a movable plate without enlarging the hole of the movable plate. To do. [Structure] In a waterproof plate that partitions a cutting area in a precision cutting device such as a dicing device from a machine area,
The waterproof plate is composed of a movable plate and a fixed frame that slidably holds the movable plate. A hole for inserting the spindle housing is formed in the central portion of the movable plate, and two or more places around the hole are provided. A bearing is installed to avoid contact between the spindle housing and the hole.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a waterproof plate for preventing cutting water, cutting chips, etc. from splashing to the machine body when dicing a semiconductor wafer with a precision cutting device such as a dicing device.

[0002]

[Prior art]

 A conventional waterproof plate is composed of, for example, a fixed frame 1 and a movable plate 2 which is movably held in the fixed frame 1 in the vertical direction or in a circumferential direction with a predetermined radius of curvature as shown in FIG. The plate 2 is provided with a hole 2a for inserting the spindle housing 3. A spindle 4 is held in the spindle housing 3, and a rotary blade 5 is attached to the tip of the spindle 4, and a semiconductor wafer 7 placed on a table 6 is sprayed with cutting water 8a from a nozzle 8 while being rotated by the rotary blade 5. Dicing is performed, and at this time, a waterproof plate C is used to prevent cutting water, cutting dust, and the like scattered in the cutting area A from entering the machine area B side.

[0003]

[Problems to be solved by the device]

 According to the conventional waterproof plate C, when the spindle housing 3 is moved back and forth, the movable plate 2 may be damaged by being rubbed or caught in the hole 2a of the movable plate 2, and the proper movement of the spindle housing 3 is hindered. This may result in dicing processing defects. In order to prevent such a problem, the hole 2a of the movable plate 2 may be enlarged so that the spindle housing 3 does not come into contact with it. A situation in which it easily enters the area B side occurs.

The present invention has been made in view of the above conventional situation, and it is an object of the present invention to provide a water-proof plate capable of preventing contact with a spindle housing without enlarging a hole of a movable plate. It is what

[0005]

[Means for Solving the Problems]

 As a means for technically solving this problem, the present invention provides a waterproof plate that separates a cutting area and a machine area in a precision cutting device such as a dicing device for dicing a semiconductor wafer, and the waterproof plate is a movable plate. It is composed of a fixed frame that slidably holds this movable plate, and a hole through which the spindle housing is inserted is bored in the center of the movable plate, and the spindle housing and the hole are provided at two or more places around this hole. The gist is that a bearing is provided to avoid contact with the. Furthermore, it is a gist to form unevenness for smooth sliding on either the movable plate or the fixed frame.

[0006]

[Work]

 The spindle housing is guided by bearings so that it can move back and forth in a stable manner so that it does not come into contact with the holes in the movable plate.Moreover, it is not necessary to make the holes in the movable plate large, so cutting water, cutting chips, etc. It can be surely prevented from entering the side. Furthermore, the movable plate can be slid smoothly by forming irregularities on the movable plate or the fixed frame.

[0007]

【Example】

 Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings (however, the same members as those of the conventional example are designated by the same reference numerals as those described above). In FIG. 1, reference numeral 1 denotes a fixed frame which divides a cutting area A and a machine area B into which a movable plate 2 is held so as to be vertically movable linearly or with a predetermined radius of curvature. ing.

A hole 2a for inserting the spindle housing 3 is formed in the center of the movable plate 2, and as shown in FIG. 2, one surface of the movable plate 2 is vertically moved to smoothly slide on the fixed frame 1. The ridges 2b forming the are formed side by side at regular intervals. The ridges 2b may be formed on both sides of the movable plate 2, or may be formed on the inner surface side of the fixed frame 1 without being formed on the movable plate 2.

Reference numeral 9 denotes a bearing, which is attached at three places around the hole 2a of the movable plate 2 via stays 10 as shown in FIGS. 3 and 4, and guides the front and rear movement of the spindle housing 3. . That is, the outer ring of the bearing 9 is brought into contact with the outer peripheral surface of the spindle housing 3 to rotate, so that the spindle housing 3 can be smoothly moved back and forth. Further, since the spindle housing 3 is supported at three points by the bearings 9 at the upper part of the outer circumference and both sides of the side part, there is always a gap between the outer peripheral surface of the spindle housing 3 and the hole 2a of the movable plate 2. A fixed interval is maintained, and this interval can be the minimum necessary minimum. Therefore, the hole 2a of the movable plate 2 can be smaller than the conventional one.

Further, when the spindle housing 3 moves up and down, the movable plate 2 moves together with the spindle housing 3 while keeping a constant distance between the outer peripheral surface of the spindle housing 3 and the hole 2a of the movable plate 2 by the bearing. Therefore, the spindle housing 3 does not come into contact with the hole 2a of the movable plate 2. Therefore, the movable plate 2 will not be damaged, and the proper movement of the spindle housing 3 will not be impaired, resulting in dicing processing failure.

Reference numeral 4 denotes a spindle rotatably held in a spindle housing 3. As shown in FIG. 1, a rotary blade 5 is attached to the tip end of the spindle, and a semiconductor wafer 7 placed on a table 6 is nozzled. 8 is sprayed with cutting water 8a to perform dicing with the rotary blade 5. At this time, it is possible to prevent the cutting water and cutting chips scattered in the cutting area A from entering the machine area B side by the waterproof plate C 1 including the fixed frame 1 and the movable plate 2.

In the above embodiment, the bearings are arranged at three places, but the present invention is not limited to this, and it is possible to arrange the bearings at at least two places, and the bearings are arranged on the movable plate or the fixed frame. The ridges are not limited to the above-mentioned ones, and may be any appropriate ridges, as long as the projections and depressions can be formed to reduce the contact area between the movable plate and the fixed frame.

[0013]

[Effect of device]

 As described above, according to the present invention, in a waterproof plate composed of a fixed frame such as a dicing device and a movable plate, two or more bearings are arranged around the hole of the movable plate, and the holes are formed by the bearings. Since the spindle housing inserted through the connector is held and the forward and backward movement of the spindle housing is guided, the bearing does not move in a stable manner by the bearings and does not come into contact with the hole in the movable plate. Since it is not necessary to enlarge the hole in the machine, cutting water, cutting chips, etc. can be reliably prevented from entering the machine area, which is an excellent effect. Furthermore, by forming irregularities on the movable plate or the fixed frame, the movable plate can be slid smoothly.

[Brief description of drawings]

FIG. 1 is a perspective view of an essential part showing an embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX in FIG.

3 is a cross-sectional view taken along the line YY in FIG.

FIG. 4 is a plan view of a bearing portion.

FIG. 5 is a perspective view of a main part showing a conventional example.

6 is a cross-sectional view taken along the line YY in FIG.

[Explanation of symbols]

1 ... Fixed frame 2 ... Movable plate 2a ... Hole 2b
... Ridge 3 ... Spindle housing 4 ... Spindle 5 ... Rotating blade 6 ... Table 7 ... Semiconductor wafer 8 ... Nozzle 8a ... Cutting water
9 ... Bearing 10 ... Stay A ... Cutting area
B ... Machine area C ... Waterproof plate

Claims (2)

[Scope of utility model registration request] 1. A waterproof plate for partitioning a cutting region and a machine region in a precision cutting device such as a dicing device for dicing a semiconductor wafer, wherein the waterproof plate is a movable plate and a fixed frame for slidably holding the movable plate. And a hole for inserting the spindle housing is bored in the central portion of the movable plate, and bearings for avoiding contact between the spindle housing and the hole are provided at two or more locations around the hole. Waterproof plate. 2. The unevenness for smooth sliding is formed on either the movable plate or the fixed frame.
The described waterproof plate.