JPH06338569A - Package for semiconductor optical device - Google Patents

Abstract

(57) [Summary] [Purpose] To obtain a package capable of effectively removing even a small amount of water mixed in the package of a semiconductor laser. [Structure] A desiccant 6 such as silica gel is formed in a thin film inside the packages 4a and 4b in which the semiconductor laser 1 is mounted and accommodated. [Effect] Even if a small amount of water or oxygen is mixed into the package during the packaging work, it can be effectively removed, and the reliability of the laser or the like can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor optical device package for improving the reliability of a semiconductor optical device mounted on the package.

[0002]

2. Description of the Related Art FIG. 2 is a sectional view showing a conventional semiconductor optical device package. In the figure, 1 is a semiconductor laser and 2 is a semiconductor laser heat sink for radiating heat generated by the semiconductor laser 1. The semiconductor laser 1 is mounted on the heat sink 2. Reference numeral 4 denotes a package made of iron for accommodating and sealing the semiconductor optical laser 1 mounted on the heat sink 2, and includes a plate portion 4a and a lid portion 4b. Leads 3a and 3b are provided for taking out the electrodes of the semiconductor laser 1 to the outside of the package 4, and 5 is provided on the lid portion 4b of the package 4 for taking out the laser light 7 emitted from the semiconductor laser 1. It is a transparent resin.

Next, the structure of a conventional package will be described when a semiconductor laser is used. 780 nm band GaAs / A used as a light source for optical disks
In the 1GaAs semiconductor laser 1, the active layer is AlGa.
Since it is made of As, it is very easily oxidized.
Then, a large number of surface states are formed on the surface of the oxidized active layer (cleavage plane). Therefore, the electrons / holes near the surface are non-radiatively recombined by the surface states, thereby giving energy to the crystal lattice and becoming heat. Therefore, when the laser light becomes strong, the temperature in the vicinity of the surface rises, and finally the AlGaAs crystal melts and becomes inoperable.

As described above, since the semiconductor laser is vulnerable to oxidation, when the laser is packaged, work is conventionally performed in a nitrogen atmosphere so that oxygen and moisture do not enter the package.

[0005]

The conventional package is
I used to work in a nitrogen atmosphere to prevent oxygen and water from entering the package, but if the workplace is not properly managed, a small amount of oxygen and water will be mixed in immediately and the laser reliability will drop. There was a problem that it caused it.

The present invention has been made in order to solve the above problems, and is for a semiconductor optical device capable of effectively removing a small amount of oxygen and moisture even if they are mixed in the package. Intended to provide the package.

[0007]

A package for a semiconductor optical device according to the present invention comprises a desiccant such as silica gel which adsorbs moisture and oxygen formed into a thin film inside the package.

The semiconductor optical device package according to the present invention contains a substance to be formed in the package as silica gel, calcium chloride, RP agent (oxygen / water removing agent), soda lime, or these substances. It was done.

[0009]

In the package of the present invention, since a film of silica gel or the like that adsorbs moisture and oxygen is formed inside, even if a small amount of water or the like is mixed in the package, it is more effective for the film. Can be removed, and as a result, the reliability of the laser can be improved.

[0010]

【Example】

Example 1. An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, as in FIG. 2, 1 is a semiconductor laser,
Reference numeral 2 denotes a semiconductor laser heat sink for radiating heat generated by the semiconductor laser 1, and the semiconductor laser 1 is mounted on the heat sink 2. Reference numeral 4 denotes an iron package which houses and seals the semiconductor optical laser 1 mounted on the heat sink 2, and includes a plate portion 4a and a lid portion 4b. 3a and 3b are the semiconductor lasers 1
Leads 5 for taking out the electrodes of the package 4 to the outside of the package 4 are transparent resins provided on the lid 4b of the package 4 for taking out the emitted laser beam 7 of the semiconductor laser 1 to the outside. Further, 6 is silica gel which is a desiccant formed by a sputtering method.

Next, the operation of this embodiment will be described. As shown in FIG. 1, when the desiccant 6 made of silica gel is provided on the inner surfaces of the packages 4a, 4b made of iron to house and seal the semiconductor laser 1, the semiconductor laser 1 is packaged. Even if a small amount of water, oxygen, or the like is mixed in, the silica gel 6 adsorbs the water, oxygen, or the like, so that oxidation of the semiconductor laser can be suppressed. Therefore, the reliability of the laser can be improved.

Example 2. Although silica gel was used as the moisture adsorbent in Example 1 above, in the present invention, instead of this silica gel, as shown in FIG. 3, calcium chloride, soda lime, RP agent (oxygen / water removing agent), etc. Alternatively, a desiccant 6a containing a plurality of these substances can be used,
Also in the second embodiment of the present invention thus configured, the same effect as that of the first embodiment can be obtained.

Embodiment 3. In Example 1, the silica gel 6 was formed on the inside of the packages 4a and 4b, but in the present invention, as shown in FIG. 4, the silica gel 6b is formed not only on the inside of the package 4 but also on the surface of the heat sink 2 of the laser.
It is needless to say that the same effects as those of the above-described first and second embodiments can be obtained in the third embodiment of the present invention thus configured.

[0014]

As described above, according to the semiconductor optical device package of the present invention, the package contains silica gel, calcium chloride, an oxygen / water scavenger, soda lime, or these substances inside the package. Since the desiccant consisting of is formed into a thin film, even if a small amount of water, oxygen, etc. is mixed in the package, these can be effectively removed by the desiccant, and the package is sealed. There is an effect that the reliability of a semiconductor optical device such as a semiconductor laser used can be greatly improved.

[Brief description of drawings]

FIG. 1 is a sectional view showing a semiconductor optical device package according to a first embodiment of the present invention.

FIG. 2 is a sectional view showing a conventional semiconductor optical device package.

FIG. 3 is a sectional view showing a semiconductor optical device package according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a semiconductor optical device package according to a third embodiment of the present invention.

[Explanation of symbols]

1 Semiconductor Laser 2 Heat Sink for Semiconductor Laser 3 Leads 4a, 4b Package 5 Transparent Resin 6 Silica Gel (Drying Agent) 6a Calcium Chloride, Soda Lime, RP Agent (Oxygen / Moisture Removing Agent), etc. or Desiccating Agent 6b Silica Gel (desiccant)

Claims (3)

[Claims] 1. A semiconductor optical device package including a semiconductor optical device, wherein a substance that adsorbs moisture or oxygen is formed into a thin film inside the package. package. 2. The package for a semiconductor optical device according to claim 1, wherein the semiconductor optical device is a semiconductor laser mounted on a bottom surface of the package via a heat sink. 3. The package for a semiconductor optical device according to claim 1 or 2, wherein the substance formed in the package is silica gel, calcium chloride, oxygen / water scavenger, soda lime, or a plurality of these substances. A package for a semiconductor optical device, which includes: