JPH0634705A - Latch-up detection method in burn-in - Google Patents

Abstract

PURPOSE:To make it possible to detect latch-up which occurs in burn-in visually and easily by carrying out burn-in in the condition that heat sensitive material is put on the top face of an IC device. CONSTITUTION:A device 1 is set in a socket 3, a sheet of heat sensitive paper 4 is put on the top face of the device 1, and the heat sensitive paper 4 is pressed by a reatiner plate 5 so that it is not off from the right place. Burn-in is carried out in-such a condition. As for the device 1 in which latch-up does not occur, the heat sensitive paper 4 in the part is not discolored because temperature does not rise much. As for the device 1 in which latch-up occurs, the heat sensitive paper 4 in the part is discolored because temperature rises. Consequently, it is possible to know that latch-up has occurred in the device 1 in the part by discoloring of the heat sensitive paper 4. Such heat sensitive paper 4 that is discolored at a temperature higher by 15 to 30 deg.C than the temperature in a burn-in device, 120 to l30 deg.C, is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a latch-up detection method in burn-in of integrated circuit devices such as IC and LSI.

[0002]

2. Description of the Related Art Conventionally, when an integrated circuit device is tested / evaluated by burn-in, even if latch-up occurs in an internal circuit after burn-in, this cannot be detected only by visual inspection. Also, for devices that have not been destroyed even if latch-up occurs,
In some cases, device tests cannot detect and eliminate defects. In that case, the latch-up generated by burn-in cannot be detected without testing each individual device, and conventionally, a device test was performed after the burn-in was completed to analyze the burn-in failure.

[0003]

As described above, the prior art is as follows.
Since the device test was performed individually after the burn-in was completed, there was a problem that this took a lot of time and effort.

The object of the present invention is to solve the above problems,
It is an object of the present invention to provide a method capable of easily visually detecting latch-up caused by burn-in.

[0005]

The latch-up detection method in burn-in according to the present invention is characterized in that the burn-in is carried out with a heat-sensitive material placed on the upper surface of the integrated circuit device.

The heat-sensitive material is preferably heat-sensitive paper.

[0007]

By using a heat-sensitive material that changes color at a high temperature (the temperature inside the burn-in device + the self-heating temperature of the device in which latch-up has occurred), the integrated circuit device in which latch-up has occurred can be easily detected visually. it can.

[0008]

Embodiments of the present invention will be described below with reference to the drawings.

The drawing shows part of a burn-in device for an integrated circuit device (1).

The burn-in device is a burn-in board (2)
, A plurality of integrated circuit device mounting sockets (3) attached thereto, a thermal paper (4) as a thermal material and a pressing plate (5) of the thermal paper (4). On the thermal paper (4),
At the time of burn-in, there is used one that does not discolor only by the temperature inside the burn-in equipment, but discolors when the self-heating temperature of the device (1) in which latch-up occurs is added to this. For example, the temperature in the burn-in equipment is 120 to 1
As the thermal paper (4), which has a temperature of about 30 ° C., a paper whose color changes at a temperature higher by about 15 to 30 ° C. is used.

When the device (1) is burned in using the above apparatus, first, the device (1) is connected to the socket (3).
The thermal paper (4) on top of these devices (1).
Place the thermal paper (4) on the thermal paper (4) with the pressing plate (5) to prevent it from slipping, and burn in under such a condition. Regarding the device (1) where latch-up does not occur, the temperature does not rise so much, so the thermal paper (4) in that part does not discolor.
As for the device (1) in which the latch-up has occurred, the temperature rises, and the thermal paper (4) in that part is discolored. Therefore, it can be seen that the discoloration of the thermal paper (4) caused latchup in the device (1) in that portion.

It is also possible to make the thermal paper (4) into a sticky form and attach it to the upper surface of the device (1). Alternatively, the heat-sensitive material may be liquefied and applied on the upper surface of the device (1).

[0013]

According to the method of the present invention, as described above, the latch-up of the integrated circuit device at the burn-in can be easily detected by visual observation, and therefore, the device test can be individually performed after the burn-in as in the conventional case. Since it is not necessary to perform it, the test time can be shortened significantly.

[Brief description of drawings]

FIG. 1 is a longitudinal sectional view of a main part of a burn-in device for an integrated circuit device showing an embodiment of the present invention.

[Explanation of symbols]

 (1) Integrated circuit devices (4) Thermal paper (thermal material)

Claims (2)

[Claims] 1. A latch-up detection method in burn-in, wherein burn-in is performed with a heat-sensitive material placed on the upper surface of an integrated circuit device. 2. The method for detecting latch-up in burn-in according to claim 1, wherein the heat-sensitive material is heat-sensitive paper.