JPH0634710Y2 - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH0634710Y2 JPH0634710Y2 JP1987082360U JP8236087U JPH0634710Y2 JP H0634710 Y2 JPH0634710 Y2 JP H0634710Y2 JP 1987082360 U JP1987082360 U JP 1987082360U JP 8236087 U JP8236087 U JP 8236087U JP H0634710 Y2 JPH0634710 Y2 JP H0634710Y2
- Authority
- JP
- Japan
- Prior art keywords
- land
- wiring board
- printed wiring
- inspection
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Description
【考案の詳細な説明】 （産業上の利用分野） 本考案はプリント配線板に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a printed wiring board.
（従来の技術） プリント配線板は、従来、部品を実装後にパターンや動
作を検査するため、ラインの任意の箇所に検査用のラン
ドを設けた構造になっている。(Prior Art) Conventionally, a printed wiring board has a structure in which an inspection land is provided at an arbitrary position of a line in order to inspect a pattern and an operation after mounting a component.
そして、高密度化にともないランドの数も多くなり、径
も小さくなってきた。As the density has increased, the number of lands has increased and the diameter has decreased.
（考案が解決しようとする問題点） しかし、部品実装の際の半田が検査用のランドにも付着
するが、ランドの径が小さいためこの付着した半田の付
き方や高さ等が一様でなく、検査の際に用いられるピン
状端子や導電性ゴム等の電極治具とランドとが接触不良
となる欠点があった。(Problems to be solved by the invention) However, the solder at the time of mounting the component adheres to the inspection land as well, but since the diameter of the land is small, the attachment method and height of the adhered solder are not uniform. However, there is a drawback that contact failure occurs between the land and the electrode jig such as a pin-shaped terminal or conductive rubber used in the inspection.
本考案の目的は、以上の欠点を改良し、検査の際の電極
治具とランドとの接触不良を防止しうるプリント配線板
を提供するものである。An object of the present invention is to provide a printed wiring board which is capable of improving the above-mentioned drawbacks and preventing contact failure between an electrode jig and a land during inspection.
（問題点を解決するための手段） 本考案は、上記の目的を達成するために、絶縁基板に設
けられたランドの一部にカーボンからなる検査用のラン
ドが設けられていることを特徴とするプリント配線板を
提供するものである。(Means for Solving the Problems) In order to achieve the above-mentioned object, the present invention is characterized in that a land for inspection made of carbon is provided in a part of the land provided on the insulating substrate. A printed wiring board is provided.
（作用） 検査用のランドが半田の付着し難いカーボンからなるた
め、部品実装の際の半田がほとんどランドに付着せず、
電極治具の接触不良を防止できる。(Operation) Since the land for inspection is made of carbon, which is difficult for solder to adhere to, almost no solder adheres to the land when mounting components,
It is possible to prevent poor contact of the electrode jig.
（実施例） 以下、本考案を図示の実施例に基づいて説明する。(Embodiment) Hereinafter, the present invention will be described based on an illustrated embodiment.
第１図において、１は絶縁基板である。２は絶縁基板１
に設けられた銅箔のラインである。３は、このライン２
の中途に設けられた検査用のランドであり、カーボンを
銅箔の上から直接塗布したものである。４はライン２の
端に設けられた部品接続用のランドであり、中央にスル
ーホール５が設けられている。In FIG. 1, reference numeral 1 is an insulating substrate. 2 is an insulating substrate 1
It is a line of copper foil provided in. 3 is this line 2
It is a land for inspection provided in the middle, and carbon is directly applied on the copper foil. Reference numeral 4 denotes a land for connecting components, which is provided at the end of the line 2, and has a through hole 5 in the center.
このプリント配線板６に部品８を半田９接続した状態を
第２図に示した。すなわち、半田は部品接続用のランド
４には付着するが検査用のランド３には付着せず、複数
個あってもほぼ同一の高さや表面状態となる。なお、６
はライン２とランド３以外に形成された絶縁層であり、
７はランド３以外の表面に積層されたメッキレジスト層
である。A state in which the component 8 is connected to the solder 9 on the printed wiring board 6 is shown in FIG. That is, the solder adheres to the component connecting lands 4 but does not adhere to the inspection lands 3, and the plurality of solders have substantially the same height and surface condition. 6
Is an insulating layer formed except the line 2 and the land 3,
Reference numeral 7 is a plating resist layer laminated on the surface other than the land 3.
（考案の効果） 以上の通り、本考案によれば、検査用のランドをカーボ
ンで形成しているため、半田が付着することによる不均
一性を防止でき、ピン端子や導電ゴム等の電極治具とラ
ンドとの接触不良を防止しうるプリント配線板が得られ
る。(Effect of the Invention) As described above, according to the present invention, since the inspection land is formed of carbon, it is possible to prevent non-uniformity due to the adhesion of the solder, and it is possible to prevent the electrode terminal such as the pin terminal or the conductive rubber. It is possible to obtain a printed wiring board that can prevent poor contact between the tool and the land.
第１図は本考案の実施例の平面図、第２図は第１図の実
施例の部品を半田接続後の正面断面図を示す。 １……絶縁基板、２……ライン、３……ランド。FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a front sectional view after soldering the components of the embodiment of FIG. 1 ... Insulating substrate, 2 ... Line, 3 ... Land.
Claims (1)
ボンからなる検査用のランドが設けられていることを特
徴とするプリント配線板。1. A printed wiring board, wherein an inspection land made of carbon is provided on a part of a line provided on an insulating substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082360U JPH0634710Y2 (en) | 1987-05-29 | 1987-05-29 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987082360U JPH0634710Y2 (en) | 1987-05-29 | 1987-05-29 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63190972U JPS63190972U (en) | 1988-12-08 |
| JPH0634710Y2 true JPH0634710Y2 (en) | 1994-09-07 |
Family
ID=30934943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987082360U Expired - Lifetime JPH0634710Y2 (en) | 1987-05-29 | 1987-05-29 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0634710Y2 (en) |
-
1987
- 1987-05-29 JP JP1987082360U patent/JPH0634710Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63190972U (en) | 1988-12-08 |
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