JPH06349976A - High-density wiring board and manufacturing method thereof - Google Patents

Abstract

(57) [Summary] [Structure] The inspection electrode region is provided outside the product part of the multilayer wiring board, and the terminals of the high-density wiring formed on the substrate are guided to the inspection electrode region to widen the wiring interval. A high-density wiring board having inspection electrodes formed thereon. [Effect] Even with fine-pitch wiring, the wiring can be inspected by an existing contact-type inspecting machine by using the inspection electrodes, so that a multilayer wiring board having high-density wiring can be easily manufactured by a conventional multilayer board manufacturing technique. You can Since the inspection electrode is cut off after use, there is no problem with the product.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer wiring board having a fine pitch wiring capable of high-density mounting of a semiconductor multi-chip module (MCM).

[0002]

2. Description of the Related Art With the miniaturization and high performance of electronic devices, the mounting density of semiconductor chip mounting boards is also required. As a countermeasure, semiconductors are mounted on high density wiring boards. Bare chip direct mounting is carried out in which chips are directly mounted on the substrate without casing. As a typical example of this, a multi-chip module (MCM) in which a large number of bare chips are mounted on one substrate is known. This MCM is intended to eliminate the delay of package transmission by directly mounting a semiconductor chip on a high-density wiring board and to minimize the signal transmission between chips on the board to achieve high speed.

The above MCM is generally (a) MCM-D, (b) MCM-C, (d) MC based on the material and structure of the substrate.
It is classified into three types of ML. The MCM-D is one in which an organic insulating material such as polyimide and a metal conductor are used on a metal substrate or a ceramic substrate to form a high-density wiring having a multilayer structure by a thin film technology (deposition). A low dielectric constant glass / ceramic substrate that can be fired at low temperature is used, and MCM-L is a resin laminated plate.
High-density wiring is formed by the printed wiring technology. Problems in such an MCM include multilayering of substrate wiring and fine pitch. In order to achieve high-density mounting, high-density wiring adapted to a large number of chips mounted on the substrate is required, and the wiring pitch of the substrate is a factor that directly limits the mounting density. For example, even if the electrode terminals of the semiconductor chip can be formed with a pitch of about 0.1 to 0.15 mm, as long as the wiring pitch of the chip electrodes on the mounting substrate is wider than this, high density mounting corresponding to this pitch cannot be realized.

Conventionally, due to the limitation of fine wiring formation by screen printing, the limitation of wiring spacing due to migration of Ag used as a wiring material, and the limitation of miniaturization of via hole diameter in a green sheet used as a multilayer wiring board material. , The fine pitch of the board wiring has been limited. However, line width / pitch = 50/5 due to progress in plate making technology and improved screen printing paste.
It is also possible to print wiring of 0 μm, and use a good conductor with excellent migration resistance such as Ni by plating,
0.1-0.15 due to improvements in green sheet processability
It is becoming possible to manufacture high-density wiring boards on the order of mm. Therefore, for such a high-density wiring board, inspection of the conductor wiring on the board has become a problem.

As a method for inspecting wiring on a semiconductor substrate, generally, an inspection using a contact probe is performed. This is done by directly contacting a plurality of probes aligned with the surface wiring of the substrate to the substrate, or by covering the substrate with an insulating mask that is perforated according to the pattern requiring inspection and then applying the probe to the substrate. It is a method of pressing and applying a voltage to the probe all at once or according to an appropriate program to inspect the energized state. However, the pitch limit between probes used in the past is about 0.3 mm, and fine pitch wiring with a pitch of about 0.1 to 0.15 mm cannot be inspected. Further, basically, the probe may damage the wiring. Therefore, an inspection method that does not contact the wiring as much as possible is desired. Although such a non-contact type inspection device is also known, it is possible to inspect the wiring at the above intervals, but this type of device is expensive and the operation is complicated. It's hard to do.

[0006]

SUMMARY OF THE INVENTION The present invention provides a high-density wiring board and a method for manufacturing the same that solves the above-mentioned problems. By providing a wiring inspection electrode on the outer periphery of the board, a conventional inspection probe is used. Even so, the wiring inspection can be performed with high accuracy.

[0007]

According to the present invention, the following high-density wiring multilayer substrate and method for manufacturing the same are provided. (1) An inspection electrode area is provided outside the wiring board product part, terminals of high-density wiring formed on the substrate are guided to the inspection electrode area, and an inspection electrode having a wide wiring interval is formed in the area. High-density wiring board characterized by being (2) A plating electrode region is formed outside the inspection electrode region of the wiring board, and a wiring terminal forming the inspection electrode is guided to the plating electrode region to form a plating electrode. The high-density wiring board according to (1) above, which is characterized by (3) An electrode area for inspection is provided outside the product part of the wiring board, the terminals of the high-density wiring formed on the substrate are guided to the electrode area for inspection, and the electrode for plating is formed outside the electrode area for inspection. After forming an electrode for plating by guiding to the area, plating the wiring using the electrode for plating, cutting off the electrode area for plating, and then performing wiring inspection using the electrode for inspection, and after inspection, for inspection A method for manufacturing a high-density wiring board in which an electrode region is cut off to form a product board.

[0008]

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in detail below with reference to the drawings. The illustrated embodiments are examples of the present invention and do not limit the scope of the invention. 1 and 2 are schematic plan views schematically showing a multilayer wiring board according to the present invention. FIG. 1 shows a surface layer and FIG. 2 shows a wiring layer below the surface layer. Further, FIG. 3 is a schematic sectional view thereof, showing an example of a two-layer structure. The substrate structure is not limited to two layers. In the illustrated substrate 10, an internal wiring 12 is formed between a lower layer 11 and an upper layer 13. The internal wiring 12 is electrically connected between layers by a via 14 penetrating the layers, and an electrode 15 formed on the surface of the upper layer 13, It is connected to 16 and 17. Also, the upper layer 13
A protective layer 18 made of an insulating resin or the like is provided on the surface of the. As shown in FIG. 1, the substrate 10 has a product portion C formed in the center thereof, an inspection electrode region B formed around the product portion C, and a plating electrode region outside the region B. A is provided. As shown in FIG. 2, the internal wiring 12 of the product portion C is a high-density wiring with a space of about 0.1 to 0.15 mm, and is connected to the terminals of a semiconductor chip (not shown) mounted on the surface thereof. An electrode 17 is formed, and the electrode 17 is connected to the internal wiring 12 by a via 14. The outer ends 12a of the internal wirings 12 gradually extend in the wiring space and extend to the surrounding inspection electrode region B, and in the region B, they are arranged at a pitch of 0.5 to 1.0 mm. In the illustrated example, the wiring 1 is provided so as to surround the chip mounting area of the product section C.
2 are formed, the wiring end portions 12a extend radially from the wiring 12 toward the periphery, and are arranged in the region B at regular intervals. A large number of inspection electrodes 15 are formed on the surface of the region B at intervals so that a current wiring inspection probe can be used.
Connected to 2. The inspection electrodes 15 may be formed in two rows so that they do not contact each other, and they may be alternately provided in the inner row and the outer row.

The wiring on the substrate is mainly formed of a conductor such as Ag or Ag-Pd. However, in order to improve solder resistance when mounting a semiconductor chip and prevent Ag migration during energization. Generally, Ni plating is applied on the wiring. Further, Au plating is further applied if necessary. Electrodes for plating are formed for this plating process. In the illustrated example, a region A where the plating electrode is provided is formed outside the inspection electrode region B, and the plating electrode 16 is formed in the region A. The inspection electrode 15 needs an electrode 15 for each wiring in order to inspect the continuity of the individual wiring 12 and the via 14. However, it is sufficient to energize the entire wiring at one time during the plating process. ,
It is not necessary to provide an independent electrode for each wiring. Therefore, in this example, the plurality of wiring end portions 1 are arranged so that the current density becomes uniform.
2a are connected by a line 13 whose terminals form a plurality of plating electrodes 16 in the area A.

N is formed on the wiring 12 by utilizing the plating electrode 16.
i After electroplating, the surface of the substrate is covered with a surface layer 18 made of an insulating resin to protect the wiring layer, and after photoetching, Au plating or solder plating is applied if necessary. The quality of the plating can be determined by observing the actual condition under a microscope.

After providing the protective layer on the surface, the plating electrode region A is cut off to plate the plating electrode 16 and the wiring end 12a.
Remove the line 19 connecting As a result, each wiring 12 becomes independent. In this state, the inspection electrode 15 formed at the end of each wiring is used to inspect each wiring for disconnection or short circuit. Specifically, for example, a wiring inspection probe is brought into contact with the electrode 15 to inspect the energization state of each wiring. After the wiring inspection, the inspection electrode region B is cut off to obtain a product substrate.

In this example, the semiconductor mounting portion is provided at the center. However, in a substrate on which a plurality of semiconductor chips are mounted, the semiconductor mounting portion is not limited to the center but is provided at an appropriate position. The internal wiring 12 corresponding to the semiconductor chip may be formed in each layer of the multilayer structure, and the inspection electrode for inspecting the internal wiring of each layer may be formed in the region B on the substrate surface. Alternatively, the inspection electrode 15 may be used without providing the plating electrode 16, and an auxiliary conductor that connects a plurality of inspection electrodes 15 may be applied to the electrode 15 during plating to conduct electricity.

The wiring board 10 can be manufactured using a commonly used substrate material such as a low temperature firing substrate material. Further, it can be manufactured according to a normal manufacturing process except for the wiring inspection electrode and the plating electrode.

[0014]

The wiring board of the present invention has a wiring interval of 0.1.
Even with a fine pitch of ~ 0.15mm, the wiring can be inspected by the current contact type inspecting machine using the inspection electrodes, so it is possible to easily manufacture the multi-layer wiring board with high-density wiring by the conventional multi-layer board manufacturing technology. it can. Also,
Since the inspection electrode formed on the substrate of the present invention is cut off after use, there is no problem with the product.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing an outline of a multilayer wiring board according to the present invention.

FIG. 2 is a schematic plan view showing a wiring layer of the substrate.

FIG. 3 is a sectional view schematically showing a multilayer structure of the substrate.

[Explanation of reference numerals] 10-multilayer substrate, 11-lower layer, 12-internal wiring,
13-upper layer, 14-via, 15-inspection electrode, 16
-Plating electrode, 17-Product part electrode, 18-Surface layer A-Plating electrode region, B-Inspection electrode region, C
-Product Department

Claims (3)

[Claims] 1. An inspection electrode region, in which an inspection electrode region is provided outside a wiring board product part, terminals of high-density wiring formed on a substrate are guided to the inspection electrode region, and a wiring interval is widened in the region. A high-density wiring board characterized by being formed. 2. A plating electrode region is formed outside the inspection electrode region of the wiring board, and wiring terminals forming the inspection electrode are guided to the plating electrode region to form the plating electrode. The high-density wiring board according to claim 1, wherein: 3. A plating method in which an inspection electrode region is provided outside the wiring board product portion, terminals of high-density wiring formed on the substrate are guided to the inspection electrode region, and the terminals are formed outside the inspection electrode region. Forming an electrode for plating by leading to the electrode area for plating, after cutting the wiring using the electrode for plating, the electrode area for plating is cut off, after that, the wiring is inspected using the electrode for inspection, and after the inspection, A method for manufacturing a high-density wiring board in which the inspection electrode area is cut off to form a product board.