JPH0636637Y2 - IC handler interface dew condensation prevention device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to a device for preventing dew condensation on an interface mechanism of an IC handler.

[Prior art]

The IC handler automatically conveys a large number of ICs, attaches them to IC measurement sockets for electrical performance inspection, and classifies and conveys the ICs detached from the measurement sockets according to the inspection results. A device that is used in combination with an IC tester.

The above-described inspection of electrical performance is performed while the IC, which is the object to be inspected, is kept at a predetermined inspection condition temperature (for example, −40 ° C. or 150 ° C.).

An interface mechanism is provided for connecting the IC measurement socket to an IC tester separate from the IC handler.

FIG. 2 is a sectional view of the interface mechanism portion.

Reference numeral 1 is a cover, which forms the outer casing of the IC handler,
The cover 1 is provided with a window-shaped opening 1a.

Reference numeral 2 denotes a wiring board for an interface, which is attached to the window-shaped opening 1a.

Reference numeral 3 is a heat insulating plate installed inside the cover 1, and supports the substrate 2 via a substrate supporter 4.

A plurality of pillars are planted inward on the heat insulating plate 3 (upward in the drawing). The pillar 5 supports a socket board 6, and an IC measuring socket 7 is installed on the socket board 6.

A plurality of electric wires 8 pass through the heat insulating plate 3 and the IC
The socket 7 and the substrate 2 are connected. An IC tester (not shown) is connected to this substrate 2.

[Problems to be solved by the invention]

When the inspection condition temperature of the IC to be inspected is lower than room temperature, the periphery of the IC socket 7 is cooled by a cooler (not shown). For this reason, dew condensation 9 occurs on the outer surface (lower surface in the figure) of the substrate 2 provided at a position corresponding to the outer peripheral portion thereof. Condensation on the substrate 2 causes a problem that an electric signal for measurement leaks.

In order to prevent the above-mentioned dew condensation, it is conceivable that the vicinity of the inside of the substrate 2 is hardened by a heat insulating material, but such a structure hinders the inspection and maintenance of the interface mechanism portion and deteriorates the maintainability. Let

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an apparatus capable of effectively preventing dew condensation without significantly disturbing the maintenance of the interface mechanism section.

[Means for solving problems]

In order to achieve the above object, the present inventor first clarified the mechanism of dew condensation, and discovered the following phenomenon,
I confirmed this.

The portion where the electric wire 8 penetrates the heat insulating plate 3 is configured to maintain a heat insulating function by utilizing a known technique.
The airtightness of this part is not perfect, and heat inevitably leaks to this part. Therefore, the above-mentioned dew condensation also occurs in the wire penetration portion A,
The part corresponding to A ′ is remarkable.

Therefore, the present invention was created with the aim of supplementing the heat insulating properties of the wire penetrations A and A ′ while minimizing maintenance obstruction, and it has a window-like opening provided in the cover of the IC handler. , A substrate arranged so as to be fitted into the opening, a heat insulating plate provided inside the opening, a plurality of support pillars planted in the heat insulating plate, and the plurality of support pillars. An interface mechanism including a socket board supported in parallel with a heat insulating plate, an IC socket attached to the socket board, and a plurality of electric wires that penetrate the heat insulating plate and connect the IC socket and the substrate (A) An enclosing plate that surrounds the plurality of columns and forms a closed space between the socket board and the heat insulating plate, and (b) Wool-like heat insulation in the closed space. Filled with material is there. However, the closed space does not require airtightness.

[Action]

According to the above configuration, since no filling is made between the inside of the interface substrate (the substrate and the heat insulating plate 3), maintenance is minimal, and the penetration portion described above is used.
The inside of A, A '(upper side in the figure) is filled with wool-like heat insulating material to prevent heat leakage from the through portion. Therefore, dew condensation is prevented in advance.

The above-mentioned closed space portion is a portion that needs to be inspected and maintained infrequently and is infrequent, but the means required for temporarily taking out or refilling the wool-like heat insulating material is not so large.

〔Example〕

FIG. 1 is a sectional view showing one embodiment of a dew condensation preventing device according to the present invention.

This embodiment is an improvement of the conventional example shown in FIG. 2 by applying the present invention, and the same reference numerals as those in the above figure denote the same or similar constitutions as in the conventional example. It is a part.

Next, the points different from the conventional example will be described.

An enclosure plate 10 made of a stainless steel plate is attached to surround a plurality of columns 5.

As a result, a closed space surrounded by the surrounding plate 10, the heat insulating plate 3, and the socket board 6 is formed. However, the closed space in the present invention means a “covered space”.

Wool-like insulation (eg glass wool) in the closed space
Fill 11. As a result, the penetration portion (the electric wire 8 is connected to the heat insulating plate 3
The heat-insulating function of the points A and A'that penetrate through is backed up from the inside (upper side in the figure), and the heat leakage at these points is blocked. Therefore, dew condensation on a portion (outer surface of the substrate 2) corresponding to the outside of this portion is prevented in advance.

[Effect of device]

As described in detail above, when the device of the present invention is applied to the interface mechanism of an IC handler, it has an excellent practical effect that it is possible to effectively prevent dew condensation without significantly disturbing the maintenance in the vicinity thereof. .

[Brief description of drawings]

FIG. 1 is a sectional view of a dew condensation preventing device according to the present invention, and FIG. 2 is a sectional view of a conventional interface mechanism. 1 ... IC handler cover, 1a ... Window-shaped opening, 2 ...
Substrate of interface mechanism, 3 ... Insulation plate, 4 ... Substrate supporter, 5 ... Support, 6 ... Socket board, 7 ...
… IC measurement socket (IC socket), 8… electric wire, 9…
… Condensation, 10 …… Enclosure, 11 …… Wool-like insulation.

Claims (1)

[Scope of utility model registration request] 1. A window-shaped opening provided in a cover of an IC handler, a substrate arranged so as to be fitted into the opening, a heat insulating plate provided inside the opening, and the heat insulating member. A plurality of pillars implanted in the plate, a socket board supported by the plurality of pillars in parallel with the heat insulating plate, an IC socket attached to the socket board, and the IC socket penetrating the heat insulating plate And a plurality of electric wires for connecting the substrate and the board, (a) an enclosing plate that surrounds the plurality of columns and forms an enclosed space between the socket board and the heat insulating plate. (B) An IC handler interface dew condensation prevention device, characterized in that (b) a wool-like heat insulating material is filled in the closed space.