JPH0637151A - Manufacturing method of tape carrier for TAB - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a tape carrier for TAB in which deformation of inner leads does not easily occur. [Structure] An inner lead is formed after applying an insulating material 19 such as a resin on the surface of the copper foil conductor 13 in the device hole 5 of the tape base material 1, and the insulating material is left only at the tip of the inner lead, and the inner leads are mutually connected. To connect. A so-called support ring is formed by this insulating material. The support ring is formed thinner than the height of the bump. By this action,
It is possible to prevent deformation of the inner lid, which is likely to occur during or after the tape carrier manufacturing process and during the face-up or face-down bonding process.

Description

Detailed Description of the Invention

[0001]

[Industrial application] This patent is for TAB (Tape Automate)
d Bonding) tape carrier.

[0002]

2. Description of the Related Art An outline of a tape carrier based on the prior art is shown in FIG. 14, a cross section of the same inner lead portion is shown in FIG. 15, and a manufacturing process is shown in FIG.

The tape carrier is mainly composed of a two-layer structure (polyimide base material and conductor) tape carrier and a three-layer structure (polyimide base material, adhesive and conductor) tape, which is one of the connection methods for the semiconductor chip and the tape carrier. , Au bumps, which are Au protrusions, are provided on the semiconductor chip side.

On the tape carrier side, a lead-out pattern of a copper foil conductor serving as an Sn-plated inner lead for bonding with an Au bump is provided, and the Au bump and the inner lead are aligned with each other by heating and pressure bonding. Then, a eutectic alloy of Au and Sn was made, and electrical connection was performed.

However, in the structure of the conventional tape carrier, one end of the inner lead protrudes to the outside and only one side of the inner lead is supported, so that the inner lead is not exposed during the process from the manufacturing process of the tape carrier to the mounting of the semiconductor chip on the tape carrier. Deformation such as twisting and bending was likely to occur due to impact or contact from the.

The prior art is as follows: (1) JP-A-2-9705
No. 1, (2) JP-A-2-102533, (3) JP-A-2-
122533, (4) The material of Japanese Patent Laid-Open No. 156647/1990 is shown for reference.

[0007]

A conventional tape carrier manufacturing process is shown in FIG. This is a tape carrier having a three-layer structure, and in the case of a tape carrier having a two-layer structure, there is no adhesive for bonding the copper foil conductor and the polyimide base material.

In the conventional manufacturing process, the back surface coating agent shown in FIG. 13 (f) is formed after the copper etching shown in FIG.
Since it is removed at the same time by removing the resist of 3 (h), the inner lead formed by the copper etching of FIG. 13 (g) is projected to the outside and is supported only on one side. Therefore, deformation is likely to occur in the process from the step of removing the resist (the photoresist and the coating resin) to the step of mounting the chip on the tape carrier in FIG. 13 (h). Representative forms of the variations are shown in FIGS. 16 and 17. 17 is an enlarged view of the inner lead portion of FIG.
(A) of the figure shows a twisted state, and (b) and (c) of the figure show a bent state. These disadvantages are mechanically weak because the inner lead protrudes to the outside and is supported on only one side, and during the process from the tape carrier manufacturing process to the mounting of the semiconductor chip on the tape carrier, external impact during transportation or Caused by contact. This problem is reduced by forming the support ring immediately after forming the inner lead.

18 and 19 show a face-down and face-up bonding process when a tape carrier with a support ring prepared by a conventional process is used. In this case, in the face-down bonding, since there is no influence of the thickness of the support ring, normal connection is possible. However, in the case of face-up bonding shown in FIG. 19, the thickness of the support ring becomes thicker than the height of the bump (50 to 125 μm),
When the inner lead and the bump are joined by the bonding tool, the support ring comes into contact with the chip, and the thicker the inner lead is pressed and bent. For this reason, it is difficult to perform face-up bonding on the inner lead after connection, because the disconnection 31 is likely to occur.

Further, if even one inner lead is deformed, the bumps on the semiconductor chip and the inner lead are displaced from each other, making it impossible to join them. Therefore, the tape carrier having the bent inner lead is defective.

The present invention solves these problems, and twists, bends, etc. caused by external impact or contact during transportation in the process from the tape carrier manufacturing process to the mounting of semiconductor chips on the tape carrier. Prevents deformation of inner leads. The thickness of the support ring to be formed can be made thinner than the height of the bumps formed on the semiconductor chip. The so-called face-down bonding for connecting the bumps on the semiconductor chip to the tape carrier conductor pattern surface side and the semiconductor chip Another object of the present invention is to provide a TAB tape carrier that enables face-up bonding to connect the bump and the base material side of the tape carrier.

[0012]

Means for Solving the Problem Production of a tape carrier for TAB in which a conductor foil is adhered to the surface of a flexible substrate having a through hole and an inner lead is formed by etching the conductor foil. The method consists of applying an insulating material to the surface of the conductor foil that covers the through holes and then etching the conductor foil to form the inner leads, and removing the unnecessary portions of the insulating material so that each tip of the inner lead is insulated. And a step of forming support members connected to each other.

A method of manufacturing a tape carrier for TAB, in which an inner lead is formed by adhering a conductor foil to the surface of a flexible base material having a through hole and etching the conductor foil of the second invention, After the resin is coated on the surface that covers the through-holes, the conductor foil is etched to form the inner leads, and a support member that connects the respective tip portions to each other by applying an insulating material to the tip portions of the inner leads is provided. The method is characterized by including a step of forming and a step of removing the coated resin.

[0014]

[Function] The tips of the inner leads are interconnected by the insulating material. Further, the insulating material can be easily formed thin.
Therefore, it is formed thinner than the height of the bump of the chip to be bonded. This action strengthens the inner lead against pressure such as bending and twisting.

[0015]

The present invention will be described below. FIG. 3 shows an outline view of a tape carrier with a support ring according to an embodiment of the first invention. This figure is a top view of a tape carrier made of a backside coating resin, and is a partially enlarged view of the inner lead portion. Further, FIG. 4 shows a case where slits 6 are provided at four corners of the inner lead portion.

FIG. 5 shows a cross section of the inner lead portion in the tape carrier according to the first embodiment, and shows the relationship of the constitution of the inner lead 2, the tape base material 1 and the support ring 3. The support ring 3 is formed at the tip of the inner lead 2, and the plurality of inner leads are connected to each other. An insulator such as resin is used for the inner lead.

The tape carrier having the above structure can be obtained by the following steps. 1 and 2 are 3
The process of manufacturing a support ring is shown in the manufacturing process of a layered structure tape carrier. 1 (a) to 1 (g) and 2 (a) to 2 (f) show respective steps of the support ring forming process using the backside coating resin, both figures showing the continuous production of the first embodiment. Represents a process.

FIG. 1A is a first process diagram and is a plan view of the polyimide tape substrate 1. The device hole 5 is opened in the same base material having the sprocket hole 11.

FIG. 1B is a second process diagram in which the copper foil 13 as a conductor is attached to the tape substrate 1 with the adhesive 4. This figure shows a cross-sectional view of the polyimide tape substrate 1. This step and the subsequent steps are sectional views.

FIG. 1C is a third process diagram in which a photoresist material 14 is applied on the surface of the copper foil opposite to the tape substrate 1.

FIG. 1D is a fourth process diagram in which a mask 15 is applied to the photoresist surface and exposure is performed.

FIG. 1 (e) is a fifth process diagram in which the photoresist surface is developed and the photoresist material exposed in the fourth process is removed.

FIG. 1 (f) is a sixth process diagram, in which the coating resin 19 is applied to the device hole portion of the tape base material 1 on the opposite surface which is the surface of the copper foil and which has been photoresist-treated. .

FIG. 1G is a seventh process diagram, and the copper foil in the portion where the photoresist material is removed in the fifth process is removed by the etching process.

FIG. 2 (a) is an eighth step diagram, in which the photoresist material 14 on the copper foil surface applied in the third step is removed by the photoresist stripping step and the inner leads 17 are exposed.

FIG. 2B is a ninth step diagram, in which the photoresist material 14 is applied to the device hole side surface of the resin applied in the sixth step.

FIG. 2 (c) is a tenth process chart, showing the ninth process.
A mask is applied to the photoresist surface applied in the step of (1) to perform exposure.

FIG. 2D is an eleventh process diagram, in which the photoresist portion exposed in the tenth process is removed by the developing process.

FIG. 2 (e) is a twelfth step diagram, in which the coating resin 19 in the portion where the photoresist material has been removed in the eleventh step is removed by the etching step. Next, the photoresist stripping step removes the photoresist material 14 on the coating resin 19 and the polyimide substrate 1 applied in the ninth step, and the coating resin 19 appears on the surface.

FIG. 2 (f) is a thirteenth process drawing, which is a tin plating process for the conductor pattern, and the inner lead 2 having the support ring 3 is completed.

The TAB tape carrier is completed through the above 13 steps.

Therefore, since the inner lead is always protected by the back surface coating resin 19 after the formation of FIG. 1 (g) and before the chip is mounted on the tape carrier, the deformation of the inner lead, which is a conventional problem, is caused. Can be prevented.

FIG. 6 is a flow chart of the face-up bonding process of the tape carrier with the support ring shown in FIGS. 3 and 4. The thickness of the support ring 3 at the tip of the inner lead 2 is larger than the height of the bump 7 on the chip. The thickness is made thin so that the support ring 3 does not contact the chip when the inner lead 2 and the bump 7 are bonded by the bonding tool 9.

FIG. 7 is a flow chart of the face-down bonding process of the tape carrier with the support ring shown in FIGS. 3 and 4. When the inner lead 2 and the bump 7 are joined, a groove is formed in the bonding tool 9 so that the support ring 3 does not come into direct contact with the bonding tool 9.

FIG. 9 is an embodiment of the second invention, and is a top view of the inner lead portion of the tape carrier 2 with a support ring, which is produced by applying a resin after copper etching.
FIG. 10 shows a tape carrier in which the slits 6 are provided at the four corners of the embodiment of FIG.

FIG. 11 is a sectional view of an inner lead portion of a tape carrier with a support ring, which is produced by applying a resin after copper etching according to the present invention.

FIG. 8 shows a process of forming a support ring in which a resin for the support ring is applied after the copper etching shown in FIG. In the process chart of FIG. 8, a liquid cured resin 16 having a high electrical insulation property, which is convenient for forming a support ring at the tip of the inner lead formed after the copper etching shown in FIG. 8G, is drawn in a fixed shape by a dispenser. Or apply it
Alternatively, a fixed ring is applied by screen printing, the resin is cured, and a support ring in which only the side surfaces of the inner leads are fixed to each other by the resin is produced. Next, after the support ring 19 is manufactured, the photoresist and the backside coating resin of FIG. 8 (i) are peeled off and the tin plating of FIG. 8 (j) is performed to manufacture a tape carrier.

FIG. 12 is a flow chart of the face-up boding process of the tape carrier with the support ring shown in FIGS. 9 and 10. Since the side surfaces of the inner leads 2 are fixed by resin, the thickness of the resin of the support ring 23 exposed from the leads can be made thinner than the height of the bumps 7 on the semiconductor chip. This enables face-up and face-down bonding with the support ring. The slits 6 provided at the corners of the four sides of the support ring shown in FIGS. 4 and 10 have a function of alleviating a positional deviation that occurs when the inner lead 2 and the bump 7 are joined, and the slit 6 is provided in forming the support ring. There are cases.

[0039]

According to the TAB tape carrier of the present invention, the inner leads are less likely to be deformed in the steps of manufacturing and bonding, and the yield and reliability of products are improved.

[Brief description of drawings]

FIG. 1 shows a manufacturing process of a tape carrier according to an embodiment of the first invention.

FIG. 2 is a continuation process of FIG.

FIG. 3 shows an outline view of a tape carrier with a support ring according to an embodiment of the first invention.

FIG. 4 is an outline view of a tape carrier in which a support ring has a slit in the embodiment of the first invention.

FIG. 5 is an enlarged cross-sectional view of the inner lead portion according to the embodiment of the first invention.

FIG. 6 is a flow chart of a face-up bonding process of the tape carrier with the support ring according to the embodiment of the first invention.

FIG. 7 is a flow chart of a face-down bonding process of the tape carrier with the support ring according to the embodiment of the first invention.

FIG. 8 shows a manufacturing process of a tape carrier according to an embodiment of the second invention.

FIG. 9 shows an outline drawing of a tape carrier with a support ring according to an embodiment of the second invention.

FIG. 10 is an outline view of a tape carrier having slits in the support ring in the embodiment of the second invention.

FIG. 11 is an enlarged sectional view of an inner lead portion according to an embodiment of the second invention.

FIG. 12 is a flow chart of a face-up bonding process of a tape carrier with a support ring according to an embodiment of the second invention.

FIG. 13 shows a manufacturing process of a tape carrier according to the prior art.

FIG. 14 shows an outline drawing of a tape carrier according to the prior art.

FIG. 15 is an enlarged cross-sectional view of an inner lead portion based on a conventional technique.

FIG. 16 shows a typical variation of inner leads of a tape carrier according to the prior art.

FIG. 17 shows details of deformation of inner leads.

FIG. 18 is a flow diagram of a face-down bonding process for a tape carrier with a support ring according to the prior art.

FIG. 19 is a flow diagram of a face-up bonding process for a tape carrier with a support ring according to the prior art.

[Explanation of symbols]

 1 Tape Base Material (Polyimide Tape) 2 Inner Lead (Sn-Plated Product on Conductor Pattern) 3 Support Ring 4 Adhesive 5 Device Hole 6 Slit 7 Bump (Au Protrusion) 8 Semiconductor Chip 9 Bonding Tool 10 Eutectic Alloy (Au-Sn) ) 11 sprocket hole 13 copper foil conductor 14 photoresist 15 mask 16 backside coating resin (conventional type) 17 inner lead (conductor pattern) 18 conductor pattern 19 backside coating resin (support ring)

Claims (2)

[Claims] 1. A method for producing a tape carrier for TAB, comprising forming an inner lead by adhering a conductor foil to a surface of a flexible substrate having a through hole and etching the conductor foil, the method comprising: A step of forming an inner lead by etching the conductor foil after applying an insulating material to the surface covering the through hole; and removing each unnecessary portion of the insulating material by the insulating material. And a step of forming support members connected to each other. 2. A method of manufacturing a tape carrier for TAB, comprising forming an inner lead by adhering a conductor foil to a surface of a flexible substrate having a through hole and etching the conductor foil, the method comprising: A step of coating the resin covering the surface of the through hole to form the inner leads by etching the conductor foil, and connecting the respective tip portions to each other by applying an insulating material to the respective tip portions of the inner leads. A method of manufacturing a tape carrier for TAB, comprising a step of forming a support member and a step of removing the coated resin.