JPH0637164A - Flip chip bonding condition inspection device - Google Patents

Abstract

(57) [Abstract] [Purpose] A flip chip bonding state inspection device for inspecting the bonding state between an electronic component and a substrate bonded by flip chip detects the bonding state between the electronic component and the substrate, and Be sure to inspect for wear and peeling. [Structure] A vibration generating means 1 applies a vibration to one point on a substrate, and is composed of a needle 2a having a sharp tip and a solenoid 2b for applying a vibration to the needle 2a. The measuring means 3 measures the displacement of the flip chip to be inspected using an optical Doppler vibrometer, and the oscilloscope 4 is a digital type with a communication function, and the solenoid 2
b and the output side of the measuring means 3 are connected to the oscilloscope 4. Then, the arithmetic processing means 5 takes in the signal from the measuring means 3 and arithmetically processes it to judge the quality of the joint of the inspected part.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding state inspection device for inspecting a bonding state between an electronic component bonded by a flip chip and a substrate.

[0002]

2. Description of the Related Art In recent years, flip chips for mounting an IC chip directly on a substrate through bumps of conductive metal have become popular for high density mounting in the field of mounting electronic components.

Conventionally, there is a method of visualizing the inside of the joint portion by a radiation transmission method such as X-ray as an inspection apparatus for inspecting the joint state by the flip chip. There is also a method of inspecting a microscopic portion with a microfocus X-ray.

[0004]

However, the above-mentioned conventional inspection device has a problem that it is not possible to sufficiently detect non-sticking and peeling at the bonded portion.

The present invention solves the above-mentioned conventional problems, and a flip-chip bonded state capable of reliably inspecting the unbonded state and peeling of the bonded portion by detecting the bonded state between the electronic component and the substrate by the flip chip. An object is to provide an inspection device.

[0006]

In order to achieve the above object, the present invention provides a vibration generating means for applying a vibration to one point on a substrate, a measuring means for measuring the displacement of a portion to be inspected, and a measuring means for measuring the displacement. It is configured to include an arithmetic processing unit that receives a signal and performs arithmetic processing to determine whether the bonding state of the inspected portion is good or bad.The vibration generating unit includes a light source that irradiates a single point on the substrate, and The intensity modulation signal generating means for changing the intensity of the light source and the intensity modulation means for changing the intensity of the light by the signal from the intensity modulation signal generating means.

[0007]

In the above construction, when the vibration generating means gives a vibration to the substrate, the measuring means measures the temporal change of the displacement of the portion to be inspected, and the arithmetic processing means fetches the signal from the measuring means and receives the signal. The quality of the bonded state of the inspection unit is determined. Further, the intensity of the illuminating light source is changed by the intensity modulation signal generation means and the intensity modulation means to give vibration to one point on the substrate.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. As shown in the figure, the vibration generating means 1 is for vibrating one point on the substrate, and is composed of a needle 2a having a sharp tip and a solenoid 2b for vibrating the needle 2a. Measuring means 3
Is for measuring the displacement of the flip chip to be inspected using an optical Doppler vibrometer, the oscilloscope 4 is a digital type with a communication function, and the solenoid 2b and the output side of the measuring means 3 are connected to the oscilloscope 4. The arithmetic processing means 5 is composed of a microcomputer, takes in the signal from the measuring means 3 and performs arithmetic processing to judge the quality of the joint of the inspected part. In the figure, 6 is a substrate, 7 is an electronic component, and 7a is a bump provided on the electronic component 7.

Next, the operation will be described. The needle 2a is arranged directly below the bump 7a to be inspected, and the solenoid 2b is turned on and off, whereby the needle 1 vibrates and the substrate 6 is vibrated. At this time, the measuring means 3 is set right above the bump 7a to measure the displacement, and the displacement is observed by the oscilloscope 4.

FIG. 2 shows a waveform in a state where the joining is performed correctly at this time, and FIG. 3 shows a waveform in a state where the joining is not performed. As can be seen from the waveforms of FIGS. 2 and 3, the vibration generated just below the bump 7a has a difference in the transmission speed and the transmission strength transmitted to the chip. Then, the arithmetic processing means 5 analyzes the difference to determine the quality of the bonding state of the inspected portion.

FIG. 4 shows another embodiment of the present invention. In the figure, the parts with the same numbers as in FIG. 1 are the same parts. The characteristic configuration of the present embodiment is that the configuration of the vibration generating means is different. That is, the light source 8 for irradiating a single point on the substrate 6, the intensity modulation signal generating means 9 such as an oscillator for changing the intensity of the light source 8, and the intensity modulation means 10 for changing the intensity of light are provided. Uses a YAG laser light source, and intensity modulation means 1
Reference numeral 0 is a switch built in the YAG laser light source 8.
According to this configuration, since the inspection can be performed in a non-contact state with the substrate 6, the inspection accuracy is improved without being affected by the damage of the substrate 6 or static electricity.

[0012]

As is apparent from the above embodiments, the flip chip bonding state inspection apparatus of the present invention comprises a vibration generating means for applying a vibration to one point on the substrate, a measuring means for measuring the displacement of the portion to be inspected, and It is provided with an arithmetic processing means for taking in a signal from the measuring means and performing arithmetic processing to judge whether the bonding state of the inspected part is good or bad.
The bonding state between the electronic component and the substrate can be detected to reliably inspect for unbonding and peeling of the bonded portion, and high reliability can be obtained.

[Brief description of drawings]

FIG. 1 is a system configuration diagram of a flip chip bonding state inspection device according to an embodiment of the present invention.

FIG. 2 is a characteristic curve diagram in a state where bonding is correctly performed in the flip chip bonding state inspection device.

FIG. 3 is a characteristic curve diagram of the flip-chip bonding state inspection device in a non-bonded state.

FIG. 4 is a system configuration diagram of a flip chip bonding state inspection device according to another embodiment of the present invention.

[Explanation of symbols]

 1 Vibration Generation Means 3 Measuring Means 5 Arithmetic Processing Means 6 Boards 7 Electronic Components

Claims (2)

[Claims] 1. An inspection apparatus for inspecting a bonding state between an electronic component bonded by flip chip and a substrate, comprising:
Vibration generating means for applying a vibration to one point on the substrate, measuring means for measuring the displacement of the inspected portion, and calculation for taking in a signal from this measuring means and performing an arithmetic processing to judge whether the bonding state of the inspected portion is good or bad. A flip-chip bonded state inspection device comprising a processing means. 2. The vibration generating means changes the intensity of light by a light source for irradiating a single point on the substrate, an intensity modulation signal generating means for changing the intensity of the light source, and a signal from the intensity modulating signal generating means. The flip chip bonding state inspection device according to claim 1, wherein the flip chip bonding state inspection device comprises an intensity modulating means.