JPH063785B2 - Method for manufacturing composite circuit component - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a composite type in which a filter circuit is formed by a capacitance between front and back electrodes of a dielectric substrate and a coil mounted and connected on the dielectric substrate. The present invention relates to a method for manufacturing a circuit component.

[Technical Background of the Invention and Problems Thereof] In a filter circuit manufactured as a composite circuit component, electrodes formed on the front surface and the back surface of a dielectric substrate are used in order to exert desired electrical characteristics. Trimming is performed.

By the way, if the circuit configuration has a small number of components and a simple circuit configuration, its adjustment is easy. However, for example, in a composite circuit component that forms a bandpass filter by combining a plurality of resonance circuits, individual resonance Since it is necessary to adjust the resonance frequency for each circuit, adjustment after circuit assembly is not always easy. For example, it is possible to attach a lead wire that is used only for adjustment to the electrode that belongs to the connection point between each resonance circuit, but if the resonance frequency is several megahertz, it may not be possible to perform accurate adjustment due to the effect of stray capacitance. Therefore, not only the adjustment process cannot be standardized, but also the adjustment takes a long time, which hinders the price reduction of the product.

[Object of the Invention] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a composite circuit capable of performing reliable adjustment quickly and improving productivity. It is to provide a method of manufacturing a component.

[Summary of the Invention] An outline of the present invention for achieving the above object is to manufacture front and back electrodes belonging to the second resonance circuit when manufacturing a composite circuit component having first, second, and third resonance circuits. A first step of mounting and connecting a plurality of coils on a dielectric substrate short-circuited between them, and connecting first, second, and third lead wires for each of the resonance circuits; Second step of adjusting the first resonant circuit via the lead lines of the same and adjusting the third resonant circuit via the second and third lead lines, and the front and back of the dielectric substrate. A third step of releasing the short circuit between the electrodes and adjusting the second resonance circuit via the first, second, and third lead wires, so that reliable adjustment can be performed quickly. By doing so, productivity can be improved.

[Examples of the Invention] Hereinafter, the present invention will be specifically described with reference to Examples.

FIG. 1 is a plan view showing an example of a composite type circuit component to which the present invention is applied. Reference numeral 1 is a dielectric substrate formed by forming front and back electrodes, which will be described later, on the front and back surfaces of a ceramic substrate mainly composed of barium titanate, and P _{1 to} P ₆ are the dielectric substrates 1. Front electrodes formed on the front side, Pa to Pc are back electrodes formed on the back side of the dielectric substrate 1, and L ₁ is the front electrodes P ₁ and P _2.
A first coil L ₂ mounted on and connected to the surface electrode P _3;
And L ₄ is a second coil mounted on and connected to P ₄ , and L ₃ is a _third coil mounted on and connected to the surface electrodes P ₅ and P ₆ .
Also, 2, 3 and 4 are the back surface electrode Pb and the front surface electrode P, respectively.
₃ , _3rd , 1st, 2nd and 3rd leader lines connected to the back surface electrode Pc, 5 is a notch plated for short-circuiting the front surface electrode P ₂ and the back surface electrode Pb, 6 is a front surface electrode P ₄ And a cutout portion 7 plated to short-circuit the backside electrode Pa with the backside electrode Pa.
Is a notch plated for short-circuiting the front surface electrode P ₃ and the back surface electrode Pa, and 8 is a front surface electrode P ₆ and the back surface electrode Pc.
It is a cutout portion that is plated to short-circuit with and. However, in the composite type circuit component as a finished product, the plated portion of the notch 7 is cut out as shown by CUT, for example. This will be described in detail later.

FIG. 2 shows an equivalent circuit of the composite circuit component having the above configuration. In the figure, C ₁ is a capacitor based on the capacitance between the front and back electrodes of the front surface electrode P ₁ and the back surface electrode Pa, C ₂ is a capacitor based on the capacitance between the front and back electrodes of the front surface electrode P ₃ and the back surface electrode Pa, and C
Reference numeral ₃ denotes a capacitor due to static electricity between the front and back electrodes of the front surface electrode P ₅ and the back surface electrode Pa. The coil L ₁ and the capacitor C ₁ form a _first resonance circuit (series resonance circuit) X ₁ and a coil L ₂ A second resonance circuit (parallel resonance circuit) X ₂ is formed from the capacitor C _2, and a third resonance circuit (series resonance circuit) X ₃ is formed from the coil L ₃ and the capacitor C ₃ .
Then, the first, second, and third resonance circuits X ₁ , X ₂ , X
The combination of ₃ forms a bandpass filter.

Next, a method of manufacturing the composite type circuit component configured as described above will be described step by step.

First, as shown in FIG. 3, the front surface electrodes P _{1 to} P ₆ and the back surface electrodes Pa to Pc are formed, and the cutouts 5, 6,
The dielectric substrate 1 is prepared by plating 7 and 8, for example. The created dielectric substrate 1 has cutouts 5, 6, 7, 8
The front surface electrode P ₂ and the back surface electrode Pb are short-circuited, the front surface electrode P ₄ and the back surface electrode Pa are short-circuited, the front surface electrode P ₃ and the back surface electrode Pa are short-circuited, and the front surface electrode P ₆ is The back surface electrode Pc is short-circuited. Then, as shown in FIG. 4, the coils L _{1 to} L ₃ and the lead wires 2 to 4 are connected to the dielectric substrate 1 (first step).
In the first step, since the front surface electrode P ₃ and the back surface electrode Pa are short-circuited by the plating process of the cutout portion 7, the coil L _{2 is formed} as shown in its equivalent circuit in FIG.
And the second resonant circuit X ₂ consisting of the capacitor C ₂ is short-circuited and does not function.

In this state, the first resonance circuit X ₁ is adjusted via the first and second lead lines 2 and 3, and the third resonance circuit X ₁ is adjusted via the second and third lead lines 3 and 4. Adjust ₃ (second step). Specifically, when the resonance waveform of the first resonance circuit X ₁ is monitored via the first and second lead lines 2 and 3, for example, it becomes as shown in FIG. 6 (a). As shown in FIG. 7B, the capacitor C ₁ (the front surface electrode P ₁ and the back surface electrode Pa is trimmed or the inductance of the coil L ₁ is adjusted so that the resonance point has a desired frequency, for example, 3.46 [MHz]. In addition, the third resonance circuit X is connected via the second and third lead lines 2 and 3.
_When the resonance waveform of ₃ is monitored, for example, it becomes as shown in FIG. 7 (a), so that the resonance point becomes a desired frequency, for example, 3.46 [MHz] as shown in FIG. 7 (b). The capacitor C ₃ (front surface electrode P ₅ , back surface electrode Pa) is trimmed or the inductance of the coil L ₃ is changed.

Next, the short circuit between the front surface electrodes belonging to the second resonance circuit, that is, the short circuit between the front surface electrode P ₃ and the back surface electrode Pa is released, and the first, second, and third lead wires 2, 3 are released. , 4 to adjust the _second resonance circuit X ₂ (third step).
Here, the short circuit between the front surface electrode P ₃ and the back surface electrode Pa is released by cutting off the plated portion of the cutout portion 7 as shown by the CUT in FIG. 1, for example. Also, the second
Specifically, the resonance circuit X ₂ is adjusted as follows. When a signal is input through the first and second lead lines 2 and 3 and the frequency of the input signal is swept, the monitor through the second and third lead lines 3 and 4 is, for example, the 8th.
As shown in FIG. 7A, the capacitor C ₂ (the front surface electrode P ₃ , the back surface electrode P ₃ and the back surface electrode P _{3 are} arranged symmetrically at a frequency of 3.65 [MHz] as shown in FIG.
Either trim a) or change the inductance of the coil L ₂ .

As described above, the electrical adjustment of the composite type circuit component is completed.
The product for which electrical adjustment has been completed is subjected to coating treatment with a resin or the like in the next step to be commercialized.

As described above, in this embodiment, the first and third resonance circuits X ₁ and X ₃ are adjusted with the front and back electrodes belonging to the second resonance circuit X ₂ being short-circuited in advance, and then the second resonance circuit X ₂ is adjusted. Resonance circuit X ₂
Release the short circuit between the front and back electrodes belonging to the second resonance circuit X
By adjusting ₂ , it is possible to obtain the final characteristics as a bandpass filter, for example, not by a method of attaching a lead wire used only for adjustment to the electrode belonging to the connection point between the resonance circuits. Therefore, the reliable adjustment can be performed quickly, the adjustment process can be standardized, and the product cost can be reduced by improving the productivity of the composite type circuit component.

Although one embodiment of the present invention has been described above, it is needless to say that the present invention is not limited to the above embodiment and can be appropriately modified within the scope of the gist of the present invention.

For example, in the above embodiment, the resonance frequencies of the first and third resonance circuits X ₁ and X ₃ are both adjusted to 3.46 [MHz], but the frequency is not limited to this frequency, and a bandpass filter is used. In order to satisfy the final characteristics of
The resonance frequencies of the resonance circuits X ₁ and X ₃ may differ.

[Effects of the Invention] As described in detail above, according to the present invention, it is possible to provide a method for manufacturing a composite circuit component capable of performing reliable adjustment quickly and improving productivity. , Can greatly contribute to the price reduction of products.

[Brief description of drawings]

FIG. 1 is a plan view showing an example of a composite circuit component to which the present invention is applied, FIG. 2 is an equivalent circuit diagram thereof, FIG. 3 is a plan view of a dielectric substrate, and FIG. 4 is a first diagram of the present invention. FIG. 5 is a plan view showing an example of a composite type circuit component in the step of FIG. 5, FIG. 5 is an equivalent circuit diagram thereof, FIGS. 6 (a), (b) and 7 (a), (b) and FIG. 8 (a). ) And (b) are characteristic diagrams for explaining the second and third steps of the present invention. 1 ... dielectric substrate, 2 ... first lead wire, 3: second lead wire, 4 ... third lead wire, P ₁ to P ₆ ... surface electrode, Pa to Pc ... back electrode, L ₁ ~L ₃ ... coil, X ₁ ... first resonant circuit, X ₂ ... second resonant circuit, X ₃ ... third resonant circuit.

Claims (1)

[Claims] 1. A first resonance circuit, a second resonance circuit connected to the first resonance circuit, and a second resonance circuit, wherein a plurality of coils are mounted and connected on a dielectric substrate forming a front surface electrode and a back surface electrode. In manufacturing a composite type circuit component that forms at least a third resonance circuit connected to a connection point of the first and second resonance circuits, a dielectric substrate in which front and back electrodes belonging to the second resonance circuit are short-circuited A first step of mounting and connecting a plurality of coils thereon and connecting the first, second, and third lead wires for each of the resonant circuits; and the first and second lead wires through the first step. The second step of adjusting the first resonance circuit and adjusting the third resonance circuit through the second and third lead wires and the short circuit between the front and back electrodes of the dielectric substrate are released. , The second resonance circuit via the first, second, and third lead wires. A third method of manufacturing a composite-type circuit component, characterized by a step of settling.