JPH0638534Y2 - Imaging device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to an image pickup apparatus using a solid-state image pickup element.

[Outline of the Invention] The present invention provides a solid-state imaging device by forming a first-stage amplifier circuit of a solid-state imaging device on a ceramic laminated substrate forming an electronic component, and integrally mounting the laminated substrate and the solid-state imaging device. Unlike the above, it is not necessary to separately configure the first-stage amplifier circuit, and the image pickup apparatus can be made compact.

[Prior Art] In an image pickup apparatus using a solid-state image pickup element, the output of the solid-state image pickup element is a weak signal, so if this is sent with a long code, the image becomes unstable. Therefore, in the image pickup apparatus, in addition to the solid-state image pickup element, it is necessary to provide a first stage amplifier circuit at least in the vicinity thereof.

A conventional image pickup device is shown in FIG. In FIG. 6, an element housing chamber 34 is formed in the mounting frame 33, and lead lead holes 35 penetrating from the inside of the element housing chamber 34 to the rear surface side.
Are formed. The solid-state image sensor 36 is the element storage chamber 34.
The lead portions 37 on both sides of the solid-state imaging device 36 housed inside project from the lead lead-out holes 35 to the back surface side. The protruding lead portion 37 is soldered to the electrode of the flexible substrate 38. The flexible substrate 38 is extended to the side of the mounting frame 33, and the first-stage amplifier circuit 39 is mounted on this extended portion. The first-stage amplifier circuit 39 is covered with a shield case 40 to prevent unnecessary radiation. An electrode 41 is provided at one end of the flexible substrate 38.
Are arranged in parallel, and the output of the first-stage amplifier circuit 39 is sent out through this.

[Problems to be Solved by the Invention] However, in the above-mentioned image pickup apparatus, the solid-state image pickup element is used.
Since the first stage amplifier circuit 39 is arranged separately from 36,
There is a drawback that the image pickup device becomes large.

Then, this invention aims at providing a compact imaging device.

[Means for Solving the Problems] The configuration of the present invention for achieving the above object has a solid-state imaging device having a plurality of electrodes on the rear surface and a plurality of electrodes connected to the plurality of electrodes on the front surface. Then
A laminated substrate made of laminated ceramics, wherein an electronic component is formed by the laminated ceramics, and a first-stage amplifier circuit is configured on the laminated substrate using at least the electronic component made of the ceramics, and a rear surface of the solid-state image sensor By being integrally contacted with the front surface of the laminated substrate, the plurality of electrodes of the both are mounted in a state of being connected to each other.

[Operation] Therefore, the laminated substrate partially or wholly constitutes the first-stage amplifier circuit and has few or no electronic components to be mounted on the laminated substrate. Therefore, the dimension of the laminated substrate is much larger than that of the solid-state imaging device. Therefore, the first-stage amplifier circuit is provided near the solid-state image sensor. If the solid-state image sensor is mounted at a predetermined position on the laminated substrate, both electrodes are connected.

[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.

In FIGS. 1 and 2, a spiral protrusion 3 is provided on the cylindrical portion 2 of the lens body 1, and the cylindrical portion 2 has a lens holder 4
Is screwed into the cylindrical portion 5. The lens holder 4 has the cylindrical portion 5 protruding from the front of the main body 6 and a positioning pin 7 protruding from the rear surface of the main body 6. Further, locking projections 8 are provided on the upper surface and the lower surface of the main body 6, and a mounting hole 9 is formed on the side of the main body 6, and the imaging device is mounted on the camera main body through the mounting hole 9. .

A step portion 10 is formed in the main body 6 in the direction from the rear to the front, and is surrounded by the step portion 10 to form a component storage chamber 11. The parts storage chamber 11 has an infrared cut filter 12 and a cushion rubber 13 in order from the front.
Also, the solid-state imaging block 14 is housed. The infrared cut filter 12 is positioned by the step portion 10 to block infrared rays and improve the sensitivity of the solid-state imaging device 26. The cushion rubber 13 is for preventing contact between the infrared cut filter 12 and the protective glass 25 of the solid-state imaging block 14. Further, the solid-state imaging block 14 is also positioned by the step portion 10 similarly to the infrared cut filter 12, and the specific configuration of the solid-state imaging block 14 will be described later.

The spacer 15 has a flat plate shape and is in contact with the rear surface of the solid-state imaging block 14. The spacer 15 has elongated holes 16 formed at two positions. A positioning hole 17 is formed in a side portion of the spacer 15, and the positioning pin 7 is inserted into the positioning hole 17 so that the spacer 15 is positioned with respect to the lens holder 4.

The elastic connector 18 has a large number of conductive needles embedded in the thickness direction of the elastic body and is arranged in the hole 16 of the spacer 15. Then, the solid-state imaging block 14 and the flexible substrate 19 are electrically connected. still,
The solid-state imaging block 14 and the flexible substrate 19 may be directly electrically connected without using the spacer 15 and the elastic connector 18.

A predetermined electrode is printed on the flexible substrate 19 and a positioning hole 21 is formed.
21 is a flexible board in which the positioning pin 7 is inserted.
19 is positioned with respect to the lens holder 4. That is, the solid-state imaging block 14, the spacer 15 for positioning the elastic connector 18, and the flexible substrate 19 are both positioned with respect to the lens holder 4,
Electrical contact between the flexible substrate 19 and the flexible substrate 19 is ensured.

The flexible substrate 19 is extended to one side, and the output signal of the first-stage amplifier circuit 29 described below is sent to another device through the flexible substrate 19.

The spring holder 22 is formed of a spring member in a substantially U shape, and the upper plate and the lower plate are provided with locking grooves 23. The locking groove 23 is engaged with the locking projection 8 of the lens holder 4, and the inner surface of the spring holder 22 has a flexible substrate 19.
Is pressed against. Then, the infrared cut filter 12, the cushion rubber 13, the solid-state imaging block 14 and the like described above are supported by this spring force by receiving a pressure contact force.

3 to 5, the detailed structure of the solid-state imaging block 14 is shown. The solid-state imaging block 14 includes a protective glass 25, a solid-state imaging device 26, a spacer 27, and a laminated substrate 28.
It consists of and.

The laminated substrate 28 has an off-square shape, and ceramics are laminated to form electronic components such as coils and capacitors, and resistors R and transistors Tr are mounted on both sides of the front face of the laminated substrate 28. The first-stage amplifier circuit 29 is composed of the electronic components of and the electronic components of the mount. The electronic components of the mount are placed in the space of the component storage chamber 11. still,
If the first-stage amplifier circuit 29 can be configured only with the laminated electronic components, it is not necessary to mount the electronic components, and if there is enough space, the circuits other than the first-stage amplifier circuit 29 can be mounted on the laminated substrate 28.
You may comprise. A large number of electrodes 30 are provided on the front surface of the laminated substrate 28.
Are arranged in parallel, and a large number of electrodes 31 (see FIG. 5) are also arranged in parallel on the rear surface. The electrode 30 on the front is the first-stage amplifier circuit
29 input terminals, and the electrode 31 on the rear surface is the first-stage amplifier circuit 29.
Of the output terminal of the flexible substrate 19, and the electrode 31 on the rear surface is in contact with the electrode of the flexible substrate 19 as described above.

The solid-state image pickup device 26 is well known and has a large number of electrodes (not shown) arranged in parallel on its rear surface. The solid-state imaging device 26 is mounted so that its rear surface is in contact with the front surface of the laminated substrate 28, and both electrodes are connected to each other. Spacer 27
Is fixed to a laminated substrate 28 surrounding the solid-state image sensor 26, and a protective glass 25 is fixed to the front surface of the spacer 27. Therefore, the solid-state image sensor 26 is a protective glass.
The periphery is protected by 25 and the spacer 27.

To assemble the above image pickup device, first, a solid-state image pickup block
Assemble 14 Next, the component storage chamber 11 of the lens holder 4
Infrared cut filter 12, cushion rubber 13, and solid-state imaging block 14 are inserted in this order. Further, the positioning hole 17 of the spacer 15 is inserted into the positioning pin 7 of the lens holder 4 to dispose the spacer 15 on the rear surface of the solid-state imaging block 14. Then, after inserting the elastic connector 18 into the hole 16 of the spacer 15, the positioning hole 21 of the flexible substrate 19 is inserted into the positioning pin 7.

Finally, the locking groove 23 of the spring holder 22 is engaged with the locking projection 8 of the lens holder 4 against the spring force of the spring holder 22, and the lens body 1 is screwed into the cylindrical portion 5 of the lens holder 4. Complete. According to this embodiment, the parts can be sequentially arranged at predetermined positions and the spring holder 22 can be mounted, so that the assembly can be very simple.

[Advantage of the Invention] As described above, according to the present invention, a solid-state imaging device having a plurality of electrodes on the rear surface and a plurality of electrodes connected to the plurality of electrodes on the front surface are laminated ceramics. An electronic component is formed of the laminated ceramics, and a first-stage amplifier circuit is formed on the laminated substrate using at least the electronic component of the ceramics, and the rear surface of the solid-state imaging device is the laminated substrate. Since the plurality of electrodes are attached to each other by being integrally contacted with the front surface, the solid state image pickup device and the laminated substrate having the first-stage amplifier circuit are simply assembled to be integrated with each other. Connection is performed and it is not necessary to bond wires for electrical connection between the solid-state image sensor and the laminated substrate, so assembly is simple and at the same time resistant to shocks and the like. . In addition, since the first-stage amplifier circuit is provided near the solid-state image sensor, the signal from the solid-state image sensor can be directly input to the first-stage amplifier circuit to perform ideal signal processing that is resistant to interference and simultaneously formed in the laminated substrate. Since the first-stage amplifier circuit is configured by the electronic components thus manufactured, there is an effect that the size can be reduced.

[Brief description of drawings]

1 to 5 show an embodiment of the present invention, FIG. 1 is an exploded perspective view of an image pickup device, FIG. 2 is a sectional view of the image pickup device, and FIG.
FIG. 4 is an exploded perspective view of the solid-state imaging block, FIG. 4 is a perspective view of the solid-state imaging block viewed from the front, FIG. 5 is a perspective view of the solid-state imaging block viewed from the rear, and FIG. 6 shows a conventional example. It is a partially exploded perspective view of a solid-state imaging device. 26,36 …… Solid-state image sensor, 28 …… Multilayer substrate, 29,39 …… First stage amplifier circuit.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mitsuhiro Shimada 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (56) Reference JP-A-60-86971 (JP, A) JP-A Sho 61-245772 (JP, A)

Claims (1)

[Scope of utility model registration request] 1. A solid-state image sensor having a plurality of electrodes on a rear surface, and a plurality of electrodes connected to the plurality of electrodes on a front surface,
A laminated substrate made of laminated ceramics, wherein an electronic component is formed by the laminated ceramics, and a first-stage amplifier circuit is configured on the laminated substrate using at least the electronic component made of the ceramics, and a rear surface of the solid-state image sensor Is attached to the front surface of the laminated substrate integrally with each other so that the plurality of electrodes are mounted in a state of being connected to each other.