JPH0642496B2 - Die bonding machine - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a pressure-sensitive adhesive sheet to which a wafer to be divided and arranged into pellets is adhered, and each pellet on the pressure-sensitive adhesive sheet is adsorbed, extracted, and adhered to a substrate. The present invention relates to a die bonding apparatus.

BACKGROUND ART As a conventional die bonding apparatus, for example, FIG.
There is one as shown in FIG.

FIG. 1 is a schematic sectional view showing a part of a conventional die bonding apparatus, and FIGS. 2 (A), (B) and FIG. , A cross-sectional view showing the process of forming a gap between the pellets,
FIG. 4 shows that a space is formed between the pellets on the adhesive sheet,
It is a perspective view showing the state where this pressure sensitive adhesive sheet was supported on a support ring.

A die bonding apparatus deposits a wafer, on which an element group such as a semiconductor element is two-dimensionally arranged and formed on the surface, onto an adhesive sheet, and cuts and separates the element group into pellets as element pieces. Then, each pellet on the adhesive sheet is adsorbed and extracted by a collet and adhered to the substrate. The die bonding apparatus 1 has an XY table 3 that moves in the XY directions with respect to the pedestal 2, and a support frame 4 fixed on the XY table 3 has an adhesive sheet 6 having a wafer 5 attached thereto. Support part 7 for supporting the outer peripheral part
The support ring 8 including the above is freely attachable. The collet 9 is located above the support ring 8 and has an adhesive sheet 6
It can be moved up and down in the direction of arrow A with respect to the upper wafer 5. The opening 10 at the tip of the collet 9 can hold the pellets 11 obtained by cutting and separating the wafer 5.
Air is sucked in the direction of arrow B by the vacuum pipe 12 so that the opening 10 has a rectangular shape matching the shape of each pellet 11, and each pellet 11 is adsorbed and extracted by the opening 10. When each pellet 11 is adsorbed by the opening 10, the collet 9 moves downward, and together with this, the needle 13 can be pushed up from the back surface of the adhesive sheet 6 to the pellet 11. That is, the needle 13 can be moved up and down in the direction of the arrow D on the back surface of the adhesive sheet 6, and by pushing up each pellet 11, the pellet 11 can be easily peeled from the adhesive sheet 6, and the pellet 11 of the collet 9 can be removed. Adsorption is facilitated.

The pellets 11 adhered to the pressure-sensitive adhesive sheet 6 are regularly arranged on the pressure-sensitive adhesive sheet 6 between the pellets 11 which are cut and separated in order to facilitate the suction work by the collet 9 or the work of selecting defective element pieces. Spaces need to be formed. That is, the wafer 5 is cut by a method in which after scribing with diamond points, the pellets 11 are fractured and separated, and no interval is formed between the pellets 11, and the wafer 5 is fractured as it is. This is because the fractured surface is irregular and, for example, when one pellet 11 is extracted, the surrounding pellets 11 are affected and the alignment of the pellets 11 is disturbed. Each pellet 1
First, as shown in FIG. 2 (A), the gap between the wafers 1 is formed by attaching the unbroken wafer 5 to the adhesive sheet 6, and
The outer peripheral portion of the adhered portion of the wafer 5 is clamped and fixed by a fixing jig 14 composed of a pair of upper and lower rings, and then the wafer 5 is broken and separated into each pellet 11. In this state, the pressure-sensitive adhesive sheet 6 is heated to 50 to 60 ° C., and immediately before it cools down, the pressure-sensitive adhesive sheet 6 is supported by the support portion 7 of the support ring 8 placed on the circular platform 15 as shown in FIG. 2 (B). The outer peripheral portion of the adhered portion of the wafer 5 is supported, and then pulled and stretched in the direction of arrow E. Further, as shown in FIG. 3, the outer peripheral portion of the stretched pressure-sensitive adhesive sheet 6 is chucked via the rubber ring 17 by the concave groove 16 formed in the side portion of the support ring 8, and then positioned below the rubber ring 17. The outer peripheral portion of the adhesive sheet 6 is cut off. As a result, the pressure-sensitive adhesive sheet 6 on the support ring 8 is uniformly stretched outward from the center to form uniform intervals between the pellets 11 as shown in FIG. XY table 3
If the pellets 11 are attached to the upper support frame 4 and the XY table 3 is moved and adjusted, the divided and aligned pellets 11 can be smoothly sucked and extracted by the collet 9. The collet that has adsorbed the pellet 11 is moved onto a substrate (not shown), adsorbed and released at a predetermined mount point of the substrate, and the pellet 11 is adhered to the predetermined mount point.

However, in the conventional die bonding apparatus 1 as described above, the work of stretching the adhesive sheet 6 having the wafer 5 adhered thereon is performed by the support ring 8 placed on the circular base 15.
Since the chucking work of the outer peripheral portion of the adhesive sheet 6 which is further stretched is performed through the concave groove 16 and the rubber ring 17 formed in the side portion of the support ring 8, much work is required for these works. And this series of work is
Since the die bonding apparatus 1 was performed in a different place, and after the series of operations described above, the support ring 8 supporting the adhesive sheet 6 had to be attached to the support frame 4 of the die bonding apparatus 1. However, the mounting work also required a lot of trouble.

An object of the present invention is to improve workability while reducing the size of the die bonding apparatus.

[Means for Solving the Problems] The present invention provides a die bonding apparatus in which a pellet adhered to an adhesive upper sheet is pushed up from below by a needle, and the pushed up pellet is adsorbed by a collet and extracted.
A hole is formed in the center, and an annular support portion protruding upward is formed on the outer peripheral portion of the upper end of the hole. A support ring on which the adhesive sheet is placed, and a support ring which is placed on the support ring by downward movement And a wafer ring attached to the outer peripheral portion of the adhesive sheet, and the wafer ring is moved downward outside the supporting portion to extend the adhesive sheet, and a clamper for maintaining this state, and a lifting and lowering of this clamper. The lifting means is a means for engaging with the clamper in the up-down direction and having an engaging portion that is relatively movable in the circumferential direction, and an angle adjusting means for rotating the support ring in the circumferential direction. is there.

[Operation] According to the present invention, there are the following operations.

By moving the clamper downward, the adhesive sheet is stretched,
This clamper also serves as a means for maintaining the stretched state of the adhesive sheet. Therefore, in order to maintain the stretched state of the pressure-sensitive adhesive sheet, it is possible to save the trouble of mounting the ring-shaped fixture on the outer peripheral portion of the pressure-sensitive adhesive sheet, and it is possible to improve the workability in the die bonding apparatus.

Since the support ring on which the adhesive sheet is placed has a hole formed in the center, this adhesive sheet stretching mechanism
It can be incorporated into a die bonding device of the type in which the pellet is pushed up from below with a needle. Therefore, the stretching of the adhesive sheet and the die bonding are performed at the same place, and as a result, the die bonding can be performed as it is after the stretching of the adhesive sheet, and the workability in the die bonding apparatus can be improved.

Since the support ring on which the adhesive sheet is placed can be rotated in the circumferential direction by the angle adjusting means, after easily adjusting the alignment angle of the pellets, each pellet can be adsorbed and extracted by the collet. Workability can be improved.

In the above, when the support ring is rotated in the circumferential direction by the angle adjusting means, the clamper that keeps the stretched state of the adhesive sheet together with the support ring engages with the elevating means in the vertical direction and in the circumferential direction. It is possible to rotate in the circumferential direction together with the support ring via the relatively movable engaging portion. In other words, the elevating means of the clamper can be fixedly arranged without rotating together with the supporting ring even when the supporting ring is rotated in the circumferential direction, and the weight of the portion to be rotated by the angle adjusting means is achieved. Therefore, it is possible to realize downsizing of the driving source (spreading the entire die bonding apparatus) and speeding up of the angle adjustment work.

DETAILED DESCRIPTION OF THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 5 is a schematic plan view showing the whole die bonding apparatus according to one embodiment of the present invention, and FIG. 6 is an enlarged plan view showing a part of the die bonding apparatus according to one embodiment of the present invention. FIG. 7 is a sectional equivalent view taken along the line VII-VII of FIG. 6, and FIGS. 8 and 9 show the main parts of FIG. 7, respectively, and FIG. 8 shows the state before stretching of the adhesive sheet. FIG. 9 is a sectional view showing a state in which the adhesive sheet is stretched by the chuck / stretching means.

In this die bonding apparatus, each pellet 32 divided and aligned on the XY table 23 is sucked and extracted by a collet 33, and the pellet 3 sucked by the collet 33 is picked up.
After transferring 2 onto the positioning table 18A of the positioning device 18,
The pellets 32 are aligned on the positioning table 18A, and the aligned pellets 32 are mounted on the mount position 21 on the substrate 20 transported on the transport line V by the mount unit 19 which can be driven in the XY directions. .

The XY table 23 of the die bonding apparatus is a pedestal 22.
The XY table 2 can be moved up and down in XY directions.
A support frame portion 2 that rotatably supports a support ring 24 on
The support frame base 26 provided with 5 is fixed by bolts 27. The support ring 24 supported by the support frame portion 25 has a hole formed in the center thereof, and an annular support portion 28 protruding upward is provided at an upper peripheral portion of the upper end of the hole.
Wafer 2 of adhesive sheet 30 to which wafer 29 formed by disposing and forming an element group such as a semiconductor element on the surface thereof at 7 is adhered
9 The outer peripheral portion of the adhered portion is supported.

The wafer 29 is attached to the adhesive sheet 30 and then scribed by using diamond points or the like.
Dicing is performed so that each element is broken and separated into each pellet as an element piece. A collet 33 is provided above the adhesive sheet 30 on which the wafer 29 is adhered so as to be movable up and down in the arrow F direction, and air is sucked by a vacuum pipe (not shown) to divide at the opening 34 at the tip. The aligned pellets 32 are adsorbed and extracted. When adsorbing each pellet 32 through the opening 34, the collet 33
Moves downward, and together with this, a needle 35 that can move up and down in the arrow G direction can push up the pellet 32 from the back surface of the adhesive sheet 30. The shape of the opening 34 is square according to the shape of each pellet 32, and the cross section is substantially trapezoidal.

A wafer ring 36 is attached to the outer peripheral portion of the portion of the adhesive sheet 30 supported by the support portion 28 of the support ring 24 while holding the outer peripheral portion. At the outer peripheral position of the support portion 28 of the support ring 24, the outer peripheral portions of the wafer ring 36 and the adhesive sheet 30 are chucked, and in the direction [H direction] substantially orthogonal to the support surface 37 of the support portion 28 of the support ring 24. A chuck / stretching unit 38 that relatively moves to stretch the adhesive sheet 30 is provided.

The chuck / stretching means 38 supports the outer peripheral portions of the wafer ring 36 and the adhesive sheet 30 from below, and moves up and down while contacting the outer peripheral side surface 39 of the support portion 28 of the support ring 24, and the wafer ring 36. And an outer ring 43 that moves up and down while being in contact with the outer peripheral side surface 42 of the inner ring 40, by including a clamper 41 that presses the outer peripheral portion of the adhesive sheet 30 from above and can sandwich them with the inner ring 40. Become.

The inner ring 40 is different from the support ring 24 in that the bolt 4
The inner ring 40 and the support ring 2 are attached via
The shaft 45 of the bolt 44 between the
Is installed. That is, the shaft 45 of the bolt 44 serves as a guide shaft for vertically moving the inner ring 40 with respect to the support ring 24. The outer ring 43 has an inner peripheral side surface 4.
7 is a contact surface with the outer peripheral side surface 42 of the inner ring 40,
A recess 49 is formed on the outer peripheral side surface 48. The concave portion 49 is a convex portion 53 formed at the tip of a clamp arm 52 (elevating means) that moves up and down by the driving force of a cylinder 51 attached to a cylinder bracket 50 that is supported and fixed to the support frame 26. The (engagement portion) can be fitted. That is, the clamp arm 52 has a convex portion 53 that engages with the concave portion 49 provided on the outer ring 43 integrated with the clamper 41 in the vertical direction and can move relative to the circumferential direction. The clamp arm 52 is rotatably supported by a bearing portion 54 supported by the support frame base 26, and the clamp arm 52 includes the outer ring 43.
The projections 53 formed along the outer peripheral side surface 48 of the clamp arm 52 at the two positions at the tip end of the clamp arm 52 are located in the recess 49 on the center line M of the outer ring 43. The clamp arm 52 has the bearing portion 54 as the center and the opposite side of the convex portion 53 from the cylinder rod 5 of the cylinder 51.
5, and an elongated hole 58 into which an engaging convex portion 57 formed at the tip of the cylinder rod 55 can be engaged is formed at the tip of the engaging arm portion 56. ,
The engagement arm portion 56 and the cylinder rod 55 are engaged with each other. The cylinder 51 can drive the cylinder rod 55 in the vertical direction [J direction], and can move the engagement convex portion 57 formed at the tip of the cylinder rod 55 in the vertical direction [J direction]. The cylinder bracket 50 is provided with a stopper 59 to prevent the cylinder rod 55 from moving upward more than necessary. The vertical movement of the cylinder rod 55 is transmitted to the clamp arm 52 side by engaging the engaging convex portion 57 with the elongated hole 58, and the convex portion 53 at the tip end portion of the clamp arm 52 can be moved vertically in the arrow K direction. There is. That is, the clamp arm 52 makes a lever movement with the bearing portion 54 as a fulcrum.
The vertical movement of the cylinder rod 55 is the vertical movement of the convex portion 53 of the clamp arm 52, and the outer ring 43 is vertically moved by the fitting of the convex portion 53 and the concave portion 49.

As a result, the outer peripheral portions of the wafer ring 36 and the adhesive sheet 30 are positioned in the gap W between the inner ring 40 and the clamper 41 as shown in FIG.
1 is driven and the cylinder rod 55 is moved upward, the convex portion 53 of the clamp arm 52 is moved downward around the bearing portion 54, and the support surface 3 of the support portion 28 of the support ring 24 is moved.
The outer ring 4 in a direction [H direction] substantially orthogonal to 7
3 can move downward. As a result, inner ring 4
0 and the clamper 41 clamp the outer peripheral portions of the wafer ring 36 and the adhesive sheet 30 to enable chucking of them, and by further driving the cylinder 51 and moving the convex portion 53 downward, the outer ring 43 and the inner ring 4 can be moved.
0 moves downward as shown in FIG. 9, and the chucked adhesive sheet 30 is stretched outward from the center P,
As shown in FIG. 7 and FIG. 7, a space is formed between the pellets 32, and the pellets 32 are divided and arranged on the adhesive sheet 30 at equal intervals.

The support frame base 26 on the XY table 23 includes the support frame base 26.
On the other hand, the support ring 24 is rotatable in the circumferential direction [L direction], and the rotation angle of the support ring 24 is adjusted to adjust the alignment angle θ of each pellet 32 adhered to the adhesive sheet 30. 61 is provided. The angle adjusting means 61 supports a stepping motor 63 on a motor bracket 62 fixed to the support frame 26, and a sector gear 64 provided at an outer peripheral position of the support ring 24.
And the pinion 66 attached to the motor shaft 65 are meshed with each other, and the support ring 24 is rotated with respect to the support frame portion 25 by the rotational force of the stepping motor 63. Thereby, the alignment angle θ of each pellet 32 is adjusted, and the collet 33 having the rectangular opening 34 facilitates the adsorption of each pellet 32 and the pellet 34 and the pellet 3.
The projected shapes viewed from the S direction of arrow 2 are made to match.

Next, the operation will be described.

First, the wafer 29 attached to the adhesive sheet 30 is broken into the pellets 32, and the wafer 29 on the adhesive sheet 30 is broken.
The wafer ring 36 is adhered to the outer position of the adhered part.
In this state, the pressure-sensitive adhesive sheet 30 is heated to 50 to 60 ° C., and immediately before cooling, the wafer ring 36 and the outer peripheral portion of the pressure-sensitive adhesive sheet 30 are positioned in the gap between the inner ring 40 and the clamper 41 from the direction of the arrow N. The adhesive sheet 30 is inserted onto the support ring 24. Next, the cylinder 51 is driven to push down the convex portion 53 of the tip end portion of the clamp arm 52 from the point Q in FIG. 7 to R, and the inner ring 40 and the outer ring 43 are moved to the support surface 37 of the support portion 28 of the support ring 24. Push down in the direction [H direction] substantially orthogonal to. As a result, as shown in FIG. 9, the outer peripheral portions of the wafer ring 36 and the adhesive sheet 30 are aligned with the inner ring 40 and the clamper 4.
1, the adhesive sheet 30 is stretched outward from the center P, and each pellet 32 on the adhesive sheet 30 is chucked.
A space is formed between them.

Next, the angle adjusting means 61 adjusts the alignment angle θ of each pellet 32. That is, for example, when the alignment angle is deviated from the reference line T by θ ° as shown in FIG. 6, the stepping motor 63 is operated to correct this deviation, and the pellets 32 are easily adsorbed by the collet 33. Put in a state. If the collet 33 is operated in this state, it is possible to adsorb and extract the pellets 32 in a stable state.

That is, according to the above embodiment, the following actions (1) to (4) are provided.

The adhesive sheet 30 is stretched by the downward movement of the clamper 41, and the clamper 41 also serves as a means for maintaining the stretched state of the adhesive sheet 30. Therefore, in order to maintain the stretched state of the adhesive sheet 30, the adhesive sheet 3
It is possible to save the trouble of mounting a ring-shaped fixture on the outer peripheral portion of No. 0, and improve the workability in the die bonding apparatus.

Since the support ring 24 on which the adhesive sheet 30 is placed has a hole formed in the center thereof, this adhesive sheet stretching mechanism can be incorporated into a die bonding apparatus of the type in which the pellet 32 is pushed up by the needle 35 from below. Therefore, stretching of the pressure-sensitive adhesive sheet 30 and die bonding are performed at the same place, and as a result, the pressure-sensitive adhesive sheet 30 is
After stretching, the die bonding can be performed as it is, and the workability in the die bonding apparatus can be improved.

The support ring 24 on which the adhesive sheet 30 is placed can be rotated in the circumferential direction by the angle adjusting means 61. Therefore, after easily adjusting the alignment angle of the pellets 32, each pellet 32 is sucked and extracted by the collet 33. Therefore, the workability of the die bonding apparatus can be improved.

In the above, the support ring 24 is the angle adjusting means 61.
When it is rotated in the circumferential direction by the support ring 24, the adhesive sheet 41 together with the support ring 24 is engaged with the clamp arm 52 as the ascending / descending means in the up-down direction, and the support ring is provided via the convex portion 53 which is relatively movable in the circumferential direction. It can rotate in the circumferential direction together with 24. In other words, the clamp arm 52 as the elevating means of the clamper 41 can be fixedly arranged without rotating together with the support ring 24 even when the support ring 24 is rotated in the circumferential direction. It is possible to reduce the weight of the portion to be rotated, and to use the stepping motor 63 as a driving source thereof.
It is possible to reduce the size of the entire die bonding apparatus and to speed up the angle adjustment work.

[Advantages of the Invention] As described above, according to the present invention, stretching of the pressure-sensitive adhesive sheet and its maintenance work can be facilitated, stretching of the pressure-sensitive adhesive sheet and die bonding can be performed at the same place, and the alignment angle of the pellets can be easily adjusted. It is possible to make adjustments, and it is possible to realize miniaturization of pellet alignment angle adjusting means and speeding up of the angle adjusting work. Therefore, it is possible to improve workability while reducing the size of the die bonding apparatus.

[Brief description of drawings]

FIG. 1 is a schematic sectional view showing a part of a conventional die bonding apparatus, and FIGS. 2 (A), (B) and FIG. FIG. 4 is a cross-sectional view showing a process of forming an interval between the pellets that are broken and separated, and FIG. 4 shows a state in which an interval is formed between the pellets on the adhesive sheet and the adhesive sheet is supported on a support ring. FIG. 5 is a schematic plan view showing the entire die bonding apparatus according to one embodiment of the present invention, and FIG. 6 is an enlarged view of a part of the die bonding apparatus according to one embodiment of the present invention. FIG. 7 is a plan view, FIG. 7 is a sectional equivalent view taken along the line VII-VII of FIG. 6, and FIGS. 8 and 9 show the main parts in FIG. 7, respectively, and FIG. Fig. 9 is a cross-sectional view showing a state before stretching, Fig. 9 shows a chuck / stretching means. It is a sectional view showing a state in which stretched landing sheet. 2, 22 ... Frame, 3, 23 ... XY table, 5, 29 ...
Wafer, 6, 30 ... Adhesive sheet, 7, 28 ... Supporting part,
8, 24 ... Support ring, 11, 32 ... Pellet, 36 ...
Wafer ring, 37 ... Support surface, 38 ... Chuck / expanding means, 41 ... Clamper, 52 ... Clamp arm (elevating means), 53 ... Convex portion (engaging portion), 61 ... Angle adjusting means, H ... Direction orthogonal to each other, L: circumferential direction, θ: alignment angle.

Claims (1)

[Claims] 1. A die bonding apparatus in which a pellet adhered on a pressure-sensitive adhesive sheet is pushed up from below by a needle, and the pushed-up pellet is adsorbed and extracted by a collet, and a hole is formed in the center and the hole is formed. A ring-shaped support portion projecting upward is formed on the outer peripheral portion of the upper end of the support ring, and the support ring on which the pressure-sensitive adhesive sheet is mounted, and the outer peripheral portion of the pressure-sensitive adhesive sheet mounted on the support ring by downward movement are attached. A wafer ring that is brought into contact with the wafer ring and moves the wafer ring downwards outside the supporting portion to stretch the adhesive sheet, and the clamper that maintains this state, and the lifting and lowering means for the clamper is the vertical direction. And an angle adjusting means for rotating the support ring in the circumferential direction. Die bonding apparatus.