JPH0645372U - Electronic component mounting structure - Google Patents

Abstract

(57) [Summary] [Object] To provide an electronic component mounting structure that absorbs a change in the thickness of a printed circuit board due to a temperature change and prevents stress from being applied to a soldering portion of an electronic component without increasing cost. [Structure] An elastic member 6 is interposed between a connector 1 as an electronic component and a printed circuit board 2, and a terminal 1 of the connector 1 is provided.
a through the guide hole 7 of the elastic member 6 to the printed circuit board 2
After being inserted into the through hole 3 of FIG.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an electronic component mounting structure for soldering various electronic components to a printed circuit board.

[0002]

[Prior art]

 Electronic devices are assembled by mounting various electronic components on a printed circuit board and then incorporating these printed circuit boards in the required arrangement. FIG. 4 is a cross-sectional view showing a conventional electronic component mounting structure. As shown in FIG. 5, the through hole 3 is provided in advance and the electronic pattern is provided above the printed circuit board 2 having the conductive pattern 4 on the back surface 2b thereof. After the terminal 1a of the connector 1 is inserted into the through hole 3 of the printed board 2 with the connector 1 as a component placed, the terminal 1a is connected to the conductive pattern 4 by the solder 5. .

In this case, the connector 1 is soldered with the terminal 1 a inserted into the through hole 3 until the bottom portion 1 b of the connector 1 comes into close contact with the insertion surface 2 a of the printed board 2. Mounting the electronic components so as to be in close contact with the printed circuit board 2 in this way makes it possible to stabilize the strength over a long period of time, particularly in the case of an electronic component such as the connector 1 in which conductor pieces are frequently inserted and removed from the outside. It is important to keep the same, and it is also necessary to improve the mounting position accuracy.

Here, as a material of the printed circuit board 2, a paper phenol material, an epoxy composite material or the like, which is generally low in cost, is used. Such an electronic component mounting structure is applied to various electronic devices including in-vehicle audio devices.In particular, when it is applied to in-vehicle audio devices, it depends on factors such as vehicle running conditions and seasonal conditions. You will always be exposed to considerable temperature changes.

[0005]

[Problems to be Solved by the Invention] By the way, in the conventional electronic component mounting structure, the thickness of the printed board changes when the temperature is repeatedly changed, and as a result, the soldering of the terminals of the electronic component is performed. There is a problem that stress is applied to a portion and a conduction failure easily occurs.

That is, in FIG. 4, the thickness t of the printed circuit board 2 changes to t ± Δt (Δt is an increment / decrement due to temperature change) due to the influence of temperature change. Therefore, in the connector 1 whose bottom portion 1b is in close contact with the insertion surface 2a of the printed board 2, stress is applied to the soldering point A of the terminal 1a, so that cracking or peeling may occur at this soldering point A. Therefore, poor conduction is likely to occur.

In order to avoid such an inconvenience, a material having a small dimensional change due to temperature change, such as a glass epoxy material, a ceramic material, or an aluminum material, may be used as the material of the printed board 2. When these materials are used, the cost of the print substrate 2 itself increases significantly.

The present invention has been made to address the above problems, and provides an electronic component mounting structure that prevents stress from being applied to soldering points of electronic component terminals without increasing cost. It is intended to be provided.

[0009]

[Means for Solving the Problems]

 In order to achieve the above object, the present invention is an electronic component mounting structure in which terminals of an electronic component are inserted into insertion holes of a printed circuit board and soldered to a conductive pattern formed on a surface opposite to an insertion surface of the printed circuit board. In the above, the elastic member is interposed between the electronic component and the printed board, and the terminal is inserted into the insertion hole through the elastic member.

[0010]

[Action]

 By interposing the elastic member between the electronic component and the printed circuit board, even if the thickness of the printed circuit board changes due to temperature change, this dimensional change is absorbed by the elasticity of the elastic member. Therefore, no stress is applied to the soldering points of the electronic component terminals.

[0011]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing an embodiment of an electronic component mounting structure of the present invention, in which a connector 1 as an electronic component has a plurality of terminals 1a, and each terminal 1a is a paper phenolic material, an epoxy composite material. Is inserted into a through hole 3 provided in a printed circuit board 2 made of, for example, and is connected to a conductive pattern 4 provided on a surface 2b opposite to the insertion surface 2a by solder 5.

Between the connector 1 and the printed circuit board 2, an elastic member 6 made of a material such as silicon rubber or neoprene rubber, which is small in size change due to temperature change, is interposed, and each terminal 1a of the connector 1 is elastic. It penetrates through the guide hole 7 of the member 6 and is inserted into the through hole 3 of the printed circuit board 2. When the thickness of the printed circuit board 2 changes due to temperature change, the elastic member 6 acts to absorb the dimensional change in this thickness.

According to the present embodiment as described above, the elastic member 6 is interposed between the connector 1 and the printed circuit board 2, and the terminal 1 a of the connector 1 is passed through the guide hole 7 of the elastic member 6 and the printed board. Since the terminals 1a are inserted into the through holes 3 of the connector 1 and the bottom portion 1b of the connector 1 is tightly adhered to the elastic member 6 and the terminals 1a are soldered to the conductive patterns 4, the thickness of the printed circuit board 2 varies depending on the temperature change. Even if the thickness changes, the change in the thickness dimension is absorbed by the elastic contraction of the elastic member 6. Therefore, no stress is applied to the soldered portion of the terminal 1a of the connector 1, so that no cracks or peeling occur and no conduction failure occurs. Moreover, as the material of the printed circuit board 2, the above-mentioned inexpensive materials such as the paper phenol material and the epoxy composite material can be used, so that the cost is not increased. Further, since the connector 1 is mounted so as to be in close contact with the printed circuit board 2 via the elastic member 6, it is possible to keep the strength stable over a long period of time and to secure the accuracy of the mounting position.

FIG. 2 shows another embodiment of the present invention, in which a detachable pin 19 is integrally or separately provided on the bottom surface of the elastic member 16 interposed between the connector 1 and the printed circuit board 2. is there. Reference numeral 17 is a guide hole for penetrating the terminal 1a, and reference numeral 18 is a guide piece for preventing the connector 1 from falling when the connector 1 is mounted.

As shown in FIG. 3, the elastic member 16 has the terminal 1 a of the connector 1 in a state where the attachment / detachment pin 19 is inserted into the guide hole 8 previously provided in the printed board 2 and fixed to the printed board 2. It penetrates through the guide hole 7. Then, the terminal 1a is inserted into the through hole 3 and soldered to the conductive pattern 4 of the printed board 2.

According to such an embodiment, in addition to the same effect as the above-described embodiment, the guide hole 17 of the elastic member 16 and the through hole 3 of the printed circuit board 2 can be reliably positioned. Therefore, there is an advantage that the mounting efficiency of the connector 1 can be improved. It should be noted that, in each of the embodiments, the connector is taken as an example of the electronic component, but the same effect can be obtained by applying the invention to not only the connector but also other electronic components including various active components and passive components. .

Further, it is not always necessary to provide the same number of guide holes for the elastic member as the terminals. For example, the elastic member may be shaped like a frame that supports only the peripheral edge of the bottom surface of the electronic component, and each terminal may be inserted through the inner hole. By doing so, the same effect can be obtained.

[0018]

[Effect of device]

 As described above, according to the present invention, the elastic member is interposed between the electronic component and the printed circuit board, and the terminal of the electronic component is inserted through the elastic member into the through hole of the printed circuit board. It is possible to prevent stress from being applied to the soldering points of the terminals of the electronic components without increasing the cost of the board, and cracks and peeling do not occur at the soldering points.

[Brief description of drawings]

FIG. 1 is a sectional view showing an embodiment of an electronic component mounting structure of the present invention.

FIG. 2 is a sectional view showing another embodiment of the present invention.

FIG. 3 is a sectional view illustrating a mounting method of the embodiment of FIG.

FIG. 4 is a cross-sectional view showing a conventional example.

FIG. 5 is a cross-sectional view illustrating a mounting method of a conventional example.

[Explanation of symbols]

 1 Connector (Electronic Component) 1a Terminal 2 Printed Circuit Board 2a Insertion Surface 2b Opposite Surface 3 Through Hole (Insertion Hole) 4 Conductive Pattern 5 Solder 6,16 Elastic Member 7,17 Guide Hole 18 Guide Piece

Claims (1)

[Scope of utility model registration request] 1. An electronic component mounting structure in which a terminal of an electronic component is inserted into an insertion hole of a printed circuit board and soldered to a conductive pattern formed on a surface opposite to an insertion surface of the printed circuit board. An electronic component mounting structure, wherein an elastic member is interposed between the printed board and the terminal, and the terminal is inserted into the insertion hole through the elastic member.