JPH0645405A - Apparatus and method for processing tape - Google Patents

Abstract

(57) [Summary] [Purpose] A plurality of processing units are arranged to enable continuous processing on tape. A buffer device 40 for slackening a tape 6 is arranged between a processing device 1 and a processing device 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape processing apparatus and a processing method, and more particularly to a tape processing apparatus and a processing method for arranging a plurality of processing apparatuses to continuously perform tape processing.

[0002]

2. Description of the Related Art For example, a manufacturing process of a semiconductor assembling apparatus using a tab tape includes the steps shown in FIG. First, the inner lead bonder 1 joins 11 the semiconductor chip to the tab tape. Thereafter, the bond checker 2 performs the bond inspection 12. Next, the potting device 3 drops 13 the element protection resin so as to cover the semiconductor chip, and subsequently it is dried 14 by the baking oven 4. After that, a mark 15a is put on the element protection resin by the marker device 5, and then the resin is cured by UV (ultraviolet lamp) 15b.

Incidentally, in manufacturing a semiconductor assembly device, there are the above-mentioned tape method and lead frame method. Since the lead frame is cut into strips, the individual lead frames can be sequentially fed and processed. Therefore, a buffer device can be provided between the devices arranged in plural units, and the lead frame can be temporarily stored in the buffer device, so that the continuous continuous production can be easily performed. However, since the tab tape is composed of a continuous tape in a band shape, it is impossible to absorb mutual interference between the tab tapes. Therefore, conventionally, in the processing using a tape, a tape supply unit and a tape storage unit are arranged on both sides of each device, and each process is performed independently. Further, as shown in JP-A-55-30810, after joining a chip to a long tape, the tape is cut into strips and accommodated in a buffer device. There is also known one that is sent to a processing device of the above for processing. However, this processing method is almost the same as the conventional method for manufacturing a semiconductor assembly device using a lead frame, and a long tape is not processed continuously by each processing device. In the method of manufacturing a semiconductor assembly device using a lead frame, a device provided with a buffer device between the devices is disclosed in, for example, Japanese Patent Laid-Open No. 62-126004.
JP-A-62-130907, JP-A-62-235
No. 108 publication is cited.

[0004]

Since the conventional tape processing apparatus is provided with a tape supply section and a tape storage section in each apparatus, a wide floor space is required and the entire apparatus becomes expensive. Further, since it is necessary to supply and store the tape for each device, there is a high possibility that the tape and the sample such as the semiconductor chip will be damaged. Further, an operator is required for each device, and the reel around which the tape is wound must be attached and detached in each device, resulting in a high cost of the product.

An object of the present invention is to provide a tape processing apparatus and a processing method capable of continuously processing a tape by arranging a plurality of processing apparatuses.

[0006]

A first means for achieving the above object is to dispose a buffer device for slackening a tape between a plurality of processing devices for processing the tape and continuously process the tape. Is characterized by.

A second means for achieving the above object is to:
In the buffer device of the first means, a pulley that can move up and down and biases the tape downward, a lower limit position detecting means for detecting the lower limit position of the pulley, and an upper limit position detecting means for detecting the upper limit position of the pulley. It is characterized in that it has a configuration including and.

A third means for achieving the above object is
The buffer device of the first means is configured to have a lower limit position detecting means for detecting a lower limit position of the slack of the tape and an upper limit position detecting means for detecting an upper limit position of the slack of the tape.

A fourth means for achieving the above object is to:
The tape tension is independently controlled for each processing device, and the tape is continuously processed by a plurality of processing devices.

[0010]

According to the first means, since the tape slack is provided between the processing devices by the buffer device, mutual interference of the processing devices can be absorbed by the tape slack of the buffer device.

According to the second means, when the tape is sent from the pre-processing device to the buffer device, the pulley urging downward is lowered, and the tape of the buffer device is pulled out from the post-processing device. Then, the pulley rises.
That is, the amount of slack changes as the pulley descends or rises. The lower limit position and the upper limit position of the pulley are detected by the lower limit position detecting means and the upper limit position detecting means, respectively, and the amount of slack is controlled within a certain fixed range.

According to the third means, when the tape is sent from the pre-processing device to the buffer device, the tape naturally hangs and the amount of slack increases, and when the tape is pulled out from the post-processing device. , The tape of the buffer device has less slack. Therefore, the lower limit position and the upper limit position of the lower end of the slack portion are detected by the lower limit position detecting means and the upper limit position detecting means. As a result, the amount of slack is controlled within a certain range as in the case of the second means.

According to the fourth means, the tension of the tape is independently controlled for each processing device, so that the entire feeding of the tape is stabilized.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. As shown in FIG. 1, an inner lead bonder 1, a bond checker 2, a potting device 3, a baking furnace 4, and a marker device 5 are arranged in this order from left to right. A tape supply section 20 is arranged on the left side of the inner lead bonder 1, and a tape storage section 30 is arranged on the right side of the marker device 5. A buffer device 40 is provided between the inner lead bonder 1 and the bond checker 2 and between the bond checker 2 and the potting device 3, respectively.
Are arranged. In addition, in the inner lead bonder 1, the bond checker 2, the potting device 3, and the marker device 5, 1a, 2a, 3a, and 5a engage with sprocket holes formed at equal intervals on the side end side of the tape 6 to form the tape 6 In the sprocket, the inner lead bonder 1 and the marker device 5, 1b and 5b are back tension rollers for applying tension to the tape portion in the bonding portion and the marking portion, and in the marker device 5, 5c is the tape portion in the baking oven 4. The forward tension roller for applying tension to each is shown.

The tape supply section 20 and the tape storage section 30
Has the following structure. A supply reel shaft 22 for mounting a tape supply reel 21 around which the tape 6 and the spacer tape 7 are wound and a take-up reel shaft 32 for mounting a tape take-up reel 31 for winding the tape 6 and the spacer tape 8 are respectively illustrated. Not driven by a motor that can rotate forward and backward. Similarly, a take-up reel shaft 24 for mounting a spacer tape take-up reel 23 for winding the spacer tape 7 and a supply reel shaft 34 for mounting a spacer tape supply reel 33 on which the spacer tape 8 is wound.
Are each driven by a variable torque motor (not shown). On the inner lead bonder 1 side of the tape supply unit 20, a guide member 25 that guides the tape 6 to the entrance side of the bonding section of the inner lead bonder 1 is provided. Similarly, a guide member 35 for guiding the tape 6 supplied from the marker device 5 to the tape storage portion 30 is also provided on the side of the marker storage device 30 of the tape storage portion 30.

Below the tape supply reel 21 and the tape take-up reel 31, respectively, light reflecting upper limit sensors 2 are provided.
Light reflection type lower limit sensors 27 and 37 similar to those of 6 and 36 are provided. Further, between the tape supply reel 21 and the spacer tape take-up reel 23 and between the tape take-up reel 31 and the spacer tape supply reel 33, the spacer tapes 7 and 8 are the upper limit sensors 26 and 36 and the lower limit sensors 27 and 37.
The guide rollers 28 and 38 are arranged so as not to come into contact with.

The buffer device 40 has a structure as shown in FIGS. Both side plates 41 of the box-shaped frame body 41
A pulley support plate 42 is fixed to a so as to have a vertical gap, and the pulley support plate 42 further includes the back plate 4 of the frame body 41.
It is reinforced by a reinforcing plate 43 fixed to 1b.
A guide rail 44 having a U-shaped cross section is vertically fixed to the center of the pulley support plate 42, and pulley support members 45 and 46 are fixed to both sides of the upper portion of the guide rail 44, respectively. The pulley shaft 4 is attached to the pulley supporting members 45 and 46.
7, 48 are rotatably supported, and pulleys 49, 50 are fixed to the pulley shafts 47, 48. The pulley support member 51 is vertically movable along the guide rail 44, and the pulley support member 51 is rotatably provided with rollers 52 arranged so as to sandwich the rising portions 44a on both sides of the guide rail 44 from both sides. It is supported. Pulley support member 5
1, a pulley shaft 53 is rotatably supported, and a pulley 54 is fixed to the pulley shaft 53. Here, the pulleys 49, 50, 54 are formed in a plurality of step portions so that they can be applied to the tapes 6 having different widths.

Above and below the guide rail 44, sprockets 62 and 63 are rotatably supported by sprocket support plates 60 and 61 fixed to the upper plate 41c and the bottom plate 41d of the frame 41, respectively. . On the sprocket support plates 60, 61, sprockets 64, 65 arranged on the back side of the sprockets 62, 63 are also rotatably supported. Further, one ends of chains 66 and 67 are fixed to the upper and lower ends of the pulley supporting member 51. The other end of the chain 66 is fixed to the hook portion 68a of the balance weight holding plate 68 through the sprockets 62 and 64, and the other end of the chain 67 is passed through the sprockets 63 and 65 to the hook portion 6 of the balance weight holding plate 68.
It is fixed to 8b. Balance weight holding plate 68
The pulley support member 51 and the pulley support member 51.
A balance weight 69 is placed to balance the pulley shaft 53, the pulley 54, and the like held by the. The pulley supporting member 51 is provided with a tension weight holding plate 7 for applying tension to the tape 6.
0 is fixed, and a tension weight 71 is placed on the tension weight holding plate 70.

Detection plates 75 are fixed to the left and right sides of the pulley supporting member 51. An upper limit sensor 76 and a lower limit sensor 77 that detect the upper limit position and the lower limit position of the pulley 54 corresponding to the detection plate 75 are disposed above and below the frame body 41 along the guide rail 44, and the upper limit is further increased. Above the sensor 76 and the lower limit sensor 77, safety over detection sensors 78 and 79 for preventing the pulley 54 from over rising and falling are provided.

Next, the operation will be described. First, the operation of each of the devices 1 to 5 will be described. In the inner lead bonder 1, when the bonding of the semiconductor chip is completed for one device portion formed on the tape 6,
The sprocket 1a is driven to send the next device portion of the tape 6 to the bonding portion, and the semiconductor chip is bonded to the device portion. By repeating this operation, the tape 6 is sequentially bonded. Similarly, in the bond checker 2, the tape 6 is intermittently sent by the sprocket 2a, and the bond inspection is performed every time the semiconductor chip portion is located in the inspection portion. In this case, the defective bond portion is stored in the storage device.

In the potting device 3, the tape 6 is intermittently fed by the sprocket 3a so that the bond portion is located at the potting portion. Therefore, when the bond portion is defective, the sprocket 3a is driven again by the signal from the above-mentioned bond checker 2 and the tape 6 is fed so that the good bond portion is positioned. Then, each time a non-defective bond portion is sent, the element protecting resin is dropped by the potting device 3 so as to cover the semiconductor chip. In the baking oven 4, the tape 6 is intermittently sent through the baking oven 4 by the sprocket 5a of the marker device 5 to dry the element protection resin covering the semiconductor chip. In the marker device 5, only the tape 6 is sent by the sprocket 5a, and the element protecting resin is dropped by the potting device 3 to give a mark, and then the resin is cured.

Next, the tape supply section 20 and the tape storage section 3
The operation of 0 will be described. Between the tape supply reel 21 and the guide member 25 and between the tape take-up reel 31 and the guide member 35, the tape 6 has slack portions 6a and 6b.
Are formed. That is, the tape supply unit 20
, The slack portion 6a of the tape 6 is in the state of a solid line, the tape 6 is intermittently fed by the sprocket 1a of the inner lead bonder 1 as described above, and the slack portion 6a is reduced as shown by the dotted line. When the absence of the tape 6 is detected, the motor for driving the tape supply reel 21 rotates the tape supply reel 21 by the detection signal and supplies the tape 6. Then, when the tape 6 is supplied and the slack portion 6a becomes large as shown by the solid line and the lower limit sensor 27 detects the tape 6, the motor for the tape supply reel 21 is stopped by the detection signal and the tape 6 is supplied. stop. In this way, the slack portion 6a corresponding to the range of the interval between the upper limit sensor 26 and the lower limit sensor 27 is always formed. Therefore, the tape 6 of the slack portion 6a
Must be equal to or larger than the pitch of the device parts formed on the tape 6.

On the contrary, in the tape accommodating section 30, the tape 6 is fed from the sprocket 5a and the slack section 6b is provided.
When the lower limit sensor 37 detects the tape 6 as indicated by the solid line, the motor for driving the tape take-up reel 31 rotates the tape take-up reel 31 by the detection signal, and the tape 6 is taken up. When the slack portion 6b of the tape 6 is reduced as indicated by the dotted line and the upper limit sensor 36 no longer detects the tape 6, the motor for the tape take-up reel 31 is stopped by the detection signal and the tape 6 is taken up. stop.

Next, the operation of the buffer device 40 will be described. Since the operation of the buffer device 40 between the inner lead bonder 1 and the bond checker 2 and the operation of the buffer device 40 between the bond checker 2 and the potting device 3 are the same, the operation between the bond checker 2 and the potting device 3 will be described below. In the pulley supporting member 51 that rotatably supports the pulley 54, the roller 52 can move up and down along the guide rail 44, and the pulley 54 is always loaded downward by the tension weight 71. Back tension is applied to the tape 6 portion of No. 3 by the tension weight 71. Then, the pulley 54 descends due to the load of the tension weight 71. Further, when the tape 6 in the buffer device 40 is pulled out by the sprocket 3a of the potting device 3 in the subsequent step, the pulley 54 is raised against the load of the tension weight 71.

The lower limit sensor 77 outputs a signal for stopping and starting the driving of the sprocket 2a of the bond checker 2 which is the previous process. That is, when the pulley 54 descends and the lower limit sensor 77 closes the detection plate 75, a signal for stopping the drive of the sprocket 2a of the bond checker 2 in the previous step is output. Then, when the sprocket 3a of the potting device 3 which is a post-process is driven from this state and the pulley 54 rises and the detection plate 75 moves away from the lower limit sensor 77, the drive of the sprocket 2a of the bond checker 2 in the previous process is started. Output a signal. The upper limit sensor 76 outputs a signal for stopping and starting the driving of the sprocket 3a of the potting device 3 in the subsequent process. That is, when the pulley 54 rises and the detection plate 75 closes the upper limit sensor 76, a signal for stopping the driving of the sprocket 3a of the potting device 3 in the subsequent step is output.
Then, from this state, when the sprocket 2a of the bond checker 2 in the previous process is driven and the pulley 54 descends and the detection plate 75 moves away from the upper limit sensor 76, a signal for starting the drive of the sprocket 3a of the potting device 3 in the subsequent process Is output. Therefore, the pulley 54 is the upper limit sensor 76.
Since it is possible to vertically move between the lower limit sensor 77 and the lower limit sensor 77, it is possible to store in the buffer device 40 a tape 6 portion having a length approximately twice the vertical moving distance. Therefore, the tape process can be continuously performed without stopping due to mutual interference due to the processes of the front and rear steps.

As described above, the buffer device 4 is used in the above embodiment.
In order to allow the slack of the tape 6 in 0, a pulley 54 for urging the tape 6 downward is provided so as to be movable up and down, and the upper limit position and the lower limit position of the pulley 54 are set to the upper limit sensor 7 respectively.
6 and the lower limit sensor 77, and the upper limit sensor 7
6 and the lower limit sensor 77 control the front and rear process equipment. For this reason, the processing device mutual interference is reduced by the buffer device
Since it can be absorbed by the tape slack inside,
The tape 6 can be continuously processed. Further, since it is not necessary to dispose the tape supply unit 20 and the tape storage unit 30 in each processing device, the floor space can be reduced, and
The device cost can be reduced. Further, since it is not necessary to supply the tape from the tape supply unit 20 and store the tape in the tape storage unit 30 for each processing device, damage to the sample is reduced, and the yield is improved by continuously processing a series of steps. In addition, it is possible to reduce the number of workers.

The tension of the tape 6 is controlled by the back tension roller 1b in the inner lead bonder 1 and is controlled by the buffer device 40 behind the bond checker 2 in the bond checker 2, and the potting device 3 is similarly controlled in the potting device 3. Rear buffer device 40
The marker device 5 is controlled by the back tension roller 5b and the forward tension roller 5c, respectively. In this way, since the processing devices 1 to 5 independently control the tension of the tape 6, the tape 6
The whole conveyance of is stabilized.

A dummy tape, a blank tape, a lead tape without a device, or the like is attached to the front or rear end of the tape 6, and a detection means for detecting the dummy tape is provided in the tape supply unit 20 and the tape storage unit 30. And the like are detected by the detecting means, a tape supply end or storage end signal can be obtained, and a worker can be notified by a buzzer or the like, and the work efficiency is improved. In this case, before the end of the tape being processed is supplied to the first processing device 1, the leading end of the tape of the new lot is connected to the tape of the lot being processed, so that the tape of the new lot is automatically processed. Since it is supplied to the processing devices 1 to 5, it is not necessary to pass the tape through each processing device, and the work efficiency is improved also from this point. Further, as described above, a dami tape or the like is provided at the front end or the rear end of the lot, or the lots are preliminarily connected with each other by a dami tape or the like, and further in the tape supply unit 20 or the tape storage unit 30.
If a tape cutting or connection processing unit is provided inside, management of each lot can be performed at the end of processing of one lot.

FIG. 5 shows another embodiment of the present invention. The buffer device 40 shown in the present embodiment is provided with only an upper limit sensor 80 and a lower limit sensor 81 that operate in the same manner as the upper limit sensor 76 and the lower limit sensor 77 of the above-described embodiment, and the tape 6 itself is protected by the upper limit sensor 80 and the lower limit sensor 81. It is configured to detect. That is, the upper limit sensor 80 and the lower limit sensor 81 are light reflection type or proximity sensors, and are arranged so as to detect the tape 6 itself. Therefore, in the case of this embodiment, for example, in the buffer device 40 between the bond checker 2 and the potting device 3, the sprocket 2 is used.
When a is driven and the tape 6 is fed into the buffer device 40, the tape 6 portion naturally hangs between the pulleys 49 and 50. Sprocket 3 of potting device 3
When a is driven, the tape 6 in the buffer device 40 is pulled out from the buffer device 40. Then, the lower limit position of the lower end portion of the tape 6 hanging down is detected by the lower limit sensor 81, and the upper limit position of the lower end portion of the tape 6 hanging down is detected by the upper limit sensor 80, respectively, as in the previous embodiment. The devices 2, 3 are controlled.

Even with this structure, the same effect as that of the above embodiment can be obtained. Further, in the case of this embodiment, the cost of the apparatus can be further reduced because it has a very simple structure in which only the upper limit sensor 80 and the lower limit sensor 81 are provided.

In each of the above embodiments, the case where a series of tape processes is performed has been described, but the present invention can be widely applied to a case where two or more processing devices are arranged for continuous processing.

[0032]

According to the present invention, between processing devices,
Since the buffer device has a slack in the tape,
The tape can be continuously processed by a plurality of processing devices. Further, since it is not necessary to dispose the tape supply unit and the tape storage unit in each processing apparatus, it is possible to reduce the processing apparatus cost and the floor space. In addition, it is not necessary to supply tape from the tape supply unit and store the tape in the tape storage unit for each processing device, reducing damage to the sample and improving yield by continuous processing, further reducing the number of workers It will be possible. Further, since the tension of the tape is independently controlled for each processing device, the entire feeding of the tape is stabilized.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of the present invention.

FIG. 2 is a front view of a buffer device.

3 is a cross-sectional view taken along the line AA of FIG.

FIG. 4 is an enlarged cross-sectional view taken along line BB of FIG.

FIG. 5 is a schematic configuration diagram showing another embodiment of the present invention.

FIG. 6 is a manufacturing process diagram of a semiconductor assembling apparatus using a tape.

[Explanation of symbols]

 1 Inner lead bonder 2 Bond checker 3 Potting device 6 Tape 40 Buffer device 44 Guide rail 51 Pulley support member 54 Pulley 71 Tension weight 75 Detection plate 76 Upper limit sensor 77 Lower limit sensor 80 Upper limit sensor 81 Lower limit sensor

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Michio Okamoto 5-20-1 Kamimizumoto-cho, Kodaira-shi, Tokyo Inside Musashi Plant, Hitachi, Ltd. (72) Kazuhiko Mitsui 5 Sanmizumoto-cho, Kodaira-shi, Tokyo 20-1 No. 1 In stock company Hitachi Ltd. Musashi factory

Claims (5)

[Claims] 1. A tape processing device, wherein a buffer device for slackening the tape is arranged between a plurality of processing devices for processing the tape, and the tape is continuously processed. 2. The buffer device according to claim 1, wherein the buffer device is vertically movable and biases the tape downward, a lower limit position detecting means for detecting a lower limit position of the pulley, and an upper limit position of the pulley. A tape processing apparatus comprising: an upper limit position detecting means. 3. The buffer device according to claim 1, further comprising: a lower limit position detecting means for detecting a lower limit position of the slack of the tape, and an upper limit position detecting means for detecting an upper limit position of the slack of the tape. Tape processing device. 4. The lower limit position detection means according to claim 2 or 3, wherein the lower limit position detection means controls the tape feed drive member of the processing apparatus of the previous process, and the upper limit position detection means controls the tape feed drive member of the post processing device. A tape processing device characterized by the above. 5. A tape processing method, wherein the tape tension is independently controlled for each processing device, and the tape is continuously processed by a plurality of processing devices.