JPH0645766A - Printed wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] To improve the insulation characteristics of the entire printed wiring board. [Structure] One of the via holes 7 is displaced from the intersection of the signal lines 2a and 2d to the outer position along the diagonal of the square, and the other is displaced from the intersection of the signal lines 2b and 2c to the outer position along the diagonal. The signal lines 2a and 2b which are adjacent to each other without protruding between the signal lines 2a and 2b and between the signal lines 2c and 2d.
The gap amount between c and 2d is averaged everywhere. Moreover, both of the via holes 7 and 7 and the insertion land 4 on the same diagonal line as the via hole in the square are separated by a substantially uniform distance from each other and the insertion land 4 on the diagonal line intersecting both the via holes. They will be separated by a substantially uniform distance.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board.

[0002]

2. Description of the Related Art A conventional printed wiring board is described in, for example, Japanese Utility Model Publication No. 57-52949 and is shown in FIG.
As shown in FIG. 3, 1 is a multilayer printed board, and 2 is an inner signal layer, which is formed from the signal line 2a. Reference numerals 3 and 4 are terminal insertion holes and component terminal insertion lands for mounting components, and are arranged on the intersection 5c of the main reference grid lines 5a and 5b in two directions (vertical and horizontal directions) orthogonal to each other. With the above configuration, for example, when the grating pitch P between the intersections 5c is set to 2.54 mm, the maximum number n of the signal lines 2a between one grating should be four, which was generally two in the past. Similarly, when the grating pitch P is set to 1.27 mm, the maximum number n of signal lines 2a between one grating is 0, which is not 0 in the past, but 1 or 2 can be passed. It will be possible. Therefore, the density of the printed wiring can be increased.

[0003]

In the above-mentioned printed wiring board of the prior art, although consideration is given to increasing the density of the printed wiring, the signal wiring for connecting the signal wirings of different signal layers to each other. When providing a via hole for connection only, the via hole must be arranged on the intersection 5c of the main reference lattice lines 5a and 5b, which hinders high densification, or between the main reference lattice lines 5a and 5b. Providing the holes results in making the gap amounts between the signal lines 2a non-uniform, and eventually, no consideration is given to the uniform gap amounts between the signal lines. Therefore, the insulation characteristics differ depending on the position of the printing plate 1, and the insulation characteristics of the whole are deteriorated.

In view of the above-mentioned problems of the prior art, an object of the present invention is to provide a uniform gap amount between signal lines of different signal layers even when a via hole is provided, and to provide a gap between each of the via hole and the signal layer. It is an object of the present invention to provide a printed wiring board in which the signal line and the land for inserting the component terminal can be made substantially uniform, and thereby the insulation characteristics of the whole can be surely improved.

[0005]

SUMMARY OF THE INVENTION In the present invention, a component terminal insertion land is provided at each intersection of main reference grid lines in two directions orthogonal to each other on the same plane, and has a mounting component terminal insertion hole. A first signal layer having first and second signal lines arranged in parallel with each other in one direction between main grids formed by four component terminal insertion lands, and the first signal layer Third and fourth signal lines that are formed in parallel with each other in different signal layers and that are arranged orthogonal to the first and second signal lines between the squares formed by the four component terminal insertion lands A second signal layer having, a first via hole electrically connecting the first signal line and the third signal line, and a second signal line and the fourth signal line are electrically connected appropriately. And a second bayer hole. The first via hole is arranged in a far distance direction with respect to the second signal line and the fourth signal line from the intersection of the first signal line and the third signal line, The bayer hole is arranged in a long distance direction with respect to the first signal line and the third signal line with respect to the intersection of the second signal line and the fourth signal line, and the first hole and the second signal line are displaced from each other. The via hole is separated from the grid by a substantially uniform distance from the component terminal insertion lands at both ends of a diagonal line between the first and second via holes, and
The component terminal insertion lands at both ends of a diagonal line that intersects with the second via holes are separated by a substantially uniform distance.

[0006]

As described above, the first via hole is arranged in the long distance direction with respect to the second signal line and the fourth signal line from the intersection of the first signal line and the third signal line. , The second via-hole is displaced from the intersection of the second signal line and the fourth signal line with respect to the first signal line and the third signal line in the long-distance direction. , The outer circumferences of both the second and the second via holes do not project between the first and second signal lines, and also do not project between the third and fourth signal lines. The gap amount between the first and second signal lines or between the third and fourth signal lines is averaged at any place. Moreover, both the via holes and the component terminal insertion lands that are on the same diagonal line as the via holes in the grid are separated from each other by a substantially uniform distance, and both the via holes and the diagonal line intersecting with the via holes are also separated. It is also separated from a certain component terminal insertion land by a substantially uniform distance. As a result, not only can the gap amount between the adjacent first and second signal lines and between the third and fourth signal lines be made uniform, but also the gap amount between both via holes and component terminal insertion lands can be obtained. Since it can be made uniform, the insulation characteristics of the printed wiring board can be reliably improved.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIG. FIG. 1 is a plan view of a printed wiring board showing an embodiment of the present invention, in which the same reference numerals as those in FIGS. 2 and 3 represent the same or corresponding components.
As shown in FIG. 1, at the intersection 5c of the main reference grid lines 5a and 5b in the vertical and horizontal directions perpendicular to each other, the terminal insertion hole 3 of the mounted component
Four component terminal insertion lands 4 having the above are arranged, and a square surrounded by the four component terminal insertion lands 4 is formed. Then, in the square, sub-lattice lines 6a and 6b are arranged at positions where the main reference lattice lines 5a and 5b between the component terminal insertion lands 4 are equally divided into five, and the sub-lattice lines 6a and 6b are adjacent to the center portion of the grid lines 2/5. And the signal lines 2a and 2b and the signal lines 2c and 2d are arranged on the 3/5 sub-lattice lines 6a and 6b. Next, at a position deviated from the intersection of the signal lines 2a, 2b, 2c, 2d by a certain dimension, a via hole 7 having a hole diameter smaller than the hole diameter of the terminal insertion 3 and the diameter of the component terminal insertion land 4 of the mounted component, 7 are provided respectively. The one via hole 7 is for connecting the signal line 2a and the signal line 2d, and the other via hole 7 is for connecting the signal line 2b and the signal line 2c. Here, the signal lines 2a and 2b are in the same signal layer, and the signal lines 2c and 2b are
In many cases, d is formed on a signal layer surface different from 2a and 2b, and in this example, d is also formed on a different signal layer surface.

Since the printed wiring board of the embodiment has the above-mentioned structure, the signal lines 2a, 2 on the sub-lattice lines 6a, 6b are not provided.
b and the signal lines 2c and 2d, and these signal lines 2a and 2b
And the conductor gap amount 2e between the signal lines 2c and 2d and the via hole 7 arranged near the intersection of the two signal lines 2a,
It is substantially equal to the gap amount 2f between 2b and the gap amount 2f between the two signal lines 2c and 2d. That is, in the via hole 7 connecting the signal lines 2a and 2d, the via hole 7 is arranged so as to be separated from the signal lines 2b and 2c from the intersection of the two lines 2a and 2d, and is displaced to the outer position along the diagonal line of the square, and the signal line 2b is also arranged. And 2c
In the via hole 7 for connecting with the both 2b, 2c
The outer periphery of the via hole 7 does not protrude between the signal lines 2a and 2b, because the outer periphery of the bayer hole 7 is arranged so as to be separated from the signal lines 2a and 2d from the intersection point of the above, along the diagonal line of the grid. It does not project between the signal lines 2c and 2d, so that the adjacent signal lines 2a and 2b,
Alternatively, the gap amount 2f between 2c and 2d is averaged at any place. Moreover, the distance between the one via hole 7 and the component terminal insertion land 4 closest thereto is 2 g.
And the distance h between the other via hole 7 and the component terminal insertion land 4 closest thereto are the same, and therefore,
Both of the via holes 7 and 7 and the component terminal insertion lands 4 which are substantially on the same diagonal line as the via holes in the grid can be separated from each other by substantially uniform distances 2g and 2h, and the distances 2g and 2h can be separated from each other. The conductor gap amount 2e can be made as close as possible. In addition to this, both the via holes and the component terminal insertion lands 4 on the diagonal line intersecting with the via holes are separated by a substantially uniform distance. as a result,
Not only can the gap amount 2f between the adjacent signal lines 2a, 2b and 2c, 2d be made uniform, but also the gap amount between the via hole 7 and the component terminal insertion land 4 can be made uniform. Insulation characteristics can be reliably improved. Further, even when a plurality of signal lines 2a, 2b, 2c, 2d are arranged between the terminal insertion hole 3 and the component terminal insertion land 4 of the mounted component to achieve high density of the printed wiring board, two adjacent signal lines It may be possible to apply a high voltage in between.

[0009]

As described above, according to the present invention, the via hole does not project between the signal lines of each signal layer,
Since the signal lines of one signal layer and the signal lines of the other signal layer are connected to each other, not only can the gap amount between the two signal lines be made uniform, but also the via hole and this It is possible to equalize the gap between the component terminal insertion land that surrounds the component and the difference in location in terms of insulation characteristics. As a result, it is possible to increase the density and increase the number of layers. There is an effect that the characteristics can be surely improved.

[Brief description of drawings]

FIG. 1 is a plan view showing a main part of a printed wiring board showing an embodiment of the present invention.

FIG. 2 is an explanatory plan view showing a conventional printed wiring board.

FIG. 3 is a sectional view of FIG. 2 showing a prior art printed wiring board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Multilayer printed board, 2 ... Signal layer, 2a, 2b ... Signal line of the same signal layer, 2c, 2d ... Signal line of different signal layer, 3 ... Terminal insertion hole of mounting components, 4 ... Component terminal insertion land, 5a ，
5b ... Main reference grid line, 6a, 6b ... Sub grid line, 7 ... Via hole, 2e ... Conductor gap amount, 2f ... Gap amount.

Claims (1)

[Claims] 1. A component terminal insertion land which is provided at each intersection of main reference grid lines in two directions orthogonal to each other on the same plane and has mounting component terminal insertion holes, and four component terminal insertion lands. Formed in parallel with each other in a signal layer different from the first signal layer, the first signal layer having first and second signal lines arranged in parallel with the main reference grid line in one direction between the adjacent grids. And a second signal layer having third and fourth signal lines arranged orthogonally to the first and second signal lines between the squares formed by the four component terminal insertion lands, and A first via hole for electrically connecting the one signal line and the third signal line, and a second via hole for electrically connecting the second signal line and the fourth signal line , The first via hole has a second signal line, a fourth signal line and a fourth signal line from an intersection of the first signal line and the third signal line. The second via-hole is displaced from the signal line of the first signal line to the third signal line from the intersection of the second signal line and the fourth signal line. Displaced in the long distance direction, the first via hole and the second via hole are substantially even with respect to the component terminal insertion lands at both ends of the diagonal line between the first and second via holes between the squares. With the distance of
A printed wiring board, characterized in that it has a substantially uniform distance from the component terminal insertion lands at both ends of a diagonal line that intersects between the first and second via holes.