JPH0648748B2 - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH0648748B2 JPH0648748B2 JP1077611A JP7761189A JPH0648748B2 JP H0648748 B2 JPH0648748 B2 JP H0648748B2 JP 1077611 A JP1077611 A JP 1077611A JP 7761189 A JP7761189 A JP 7761189A JP H0648748 B2 JPH0648748 B2 JP H0648748B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- substrate
- crack
- perforation
- perforations
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
Landscapes
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント基板特に製作後分割して使用される
複合基板の分割部に関する。Description: TECHNICAL FIELD The present invention relates to a divided portion of a printed board, particularly a composite board used by dividing after manufacturing.
プリント配線基板（ＰＣＢ）は部品のマウント作業上の
理由、経済上の理由で、ダミー部付設、複合化などが行
なわれている。複合基板では分割線で分割して個々に切
り離し、単体になった状態で使用するが、本発明はこの
分割部の構成に係るものである。A printed wiring board (PCB) is provided with a dummy part and is combined for reasons of mounting work of components and economic reasons. The composite substrate is divided by a dividing line and individually cut and used as a single unit. The present invention relates to the structure of the dividing portion.
複数基板の分割線には、ミシン目、Ｖカットなどが施さ
れるのが一般的である。第４図はミシン目を入れた例
で、１０は複合基板、１０ａ，１０ｂは個々のプリント
基板で、これらはミシン目部１２でつながっている。ミ
シン目部１２は基板に小間隔で複数個の小孔を一列に並
べて形成した部分で、その前後は長孔１４になってい
る。１６ａ，１６ｂはプリント板１０ａ，１０ｂに形成
された配線パターンであ。ミシン目部１２は、長孔１４
で結ばれて複数箇所にあることもある。Perforations, V-cuts, etc. are generally applied to the dividing lines of the plurality of substrates. FIG. 4 shows an example in which perforations are provided, 10 is a composite substrate, 10a and 10b are individual printed circuit boards, and these are connected by perforations 12. The perforation portion 12 is a portion formed by arranging a plurality of small holes in a row at a small interval on the substrate, and a long hole 14 is formed in the front and rear thereof. 16a and 16b are wiring patterns formed on the printed boards 10a and 10b. The perforation portion 12 has a long hole 14
Sometimes it is tied with and there are multiple locations.
このような複合基板は配線パターンの形成、部品取付け
などが済んだのちに、ミシン目部１２で折って個々の基
板１０ａ，１０ｂに分離し、単体になった状態で電子機
器筐体内などへ取付ける。分離作業は手作業で行なうこ
とが多く、第５図に示すようにＦ１方向に折曲し、また
Ｆ２方向に折曲し、これを数回繰り返す等の方法でミシ
ン目部１２で分離する。分離後は第４図(b)の状態にな
るが、このときクラック１８が入り、配線パターンが断
線、剥離することがある。After such a composite substrate has been formed with a wiring pattern and components are attached, it is folded at the perforations 12 to be separated into individual substrates 10a and 10b, which are attached to the inside of an electronic equipment casing or the like as a single unit. . Separation work is often done by hand, and as shown in FIG. 5, it is bent in the F 1 direction and also in the F 2 direction, and is separated several times at the perforation section 12 by repeating this several times. To do. After the separation, the state shown in FIG. 4 (b) is obtained. At this time, cracks 18 may be introduced, and the wiring pattern may be broken or peeled.
クラックが生じて配線パターンが断線、剥離する例は、
プリント基板にガラス繊維入り表面層がある場合などに
多い。このような表面層は引張りに強く、中々切れなく
て、内部は切れいるのにいわば皮だけでつながっている
状態になり、その皮（表面層）に亀裂が入っている状態
になり易い。第５図で言えばＦ１方向に折曲するとき表
面Ｓ１側で圧縮、裏面Ｓ２で引張りに、Ｆ２方向に折曲
するときこの逆になる。圧縮側では亀裂発生はないが、
引張りではそれに強い表面層が中々切れず、つながって
はいるがクラックが入っている状態になり易い。Examples of cracks and disconnection and peeling of wiring patterns are:
This is often the case when the printed circuit board has a surface layer containing glass fibers. Such a surface layer is strong in tension and is not broken so much that the inside of the surface layer is connected only by a skin, so that the skin (surface layer) is easily cracked. Speaking in FIG. 5, when bending in the F 1 direction, compression is performed on the front surface S 1 side, tension is applied on the back surface S 2 , and vice versa when bending in the F 2 direction. There are no cracks on the compression side,
In tension, the strong surface layer is not broken so much, but it is connected, but it tends to be in a cracked state.
クラック１８が入って配線パターン１６ｂに断線したも
のが生じると、勿論そのプリント基板は不良品になる。If a crack 18 is formed and the wiring pattern 16b is broken, the printed circuit board is of course defective.
これを避けるため従来は配線パターンをミシン目部から
離す、ミシン目部に近い配線パターンは幅の広いものに
する等の方法をとるが、基板面積の有効利用、高密度配
線などの観点から好ましいものではない。In order to avoid this, conventionally, the wiring pattern is separated from the perforated portion, and the wiring pattern near the perforated portion is widened. However, it is preferable from the viewpoint of effective use of the substrate area and high-density wiring. Not a thing.
本発明はかゝる点を改善し、簡単、廉価な手段で配線パ
ターンの断線、剥離を防止し、基板面積の有効利用を図
ることを目的とするものである。It is an object of the present invention to improve such points, prevent disconnection and peeling of a wiring pattern by a simple and inexpensive means, and effectively utilize a substrate area.
第１図に示すように本発明では複合基板１０のミシン目
部１２の両側に、クラック・剥離防止パターン２０ａ，
２０ｂを設ける。As shown in FIG. 1, according to the present invention, the crack / peeling prevention pattern 20a is formed on both sides of the perforation 12 of the composite substrate 10.
20b is provided.
クラック・剥離防止パターン２０ａ，２０ｂは図示のよ
うにミシン目部より長く、そして複数個のスルーホール
を備える。The crack / peeling prevention patterns 20a and 20b are longer than the perforated portion as shown in the drawing, and have a plurality of through holes.
クラックはミシン目の複数個の小孔の相互の間、および
該小孔と長孔１４との間の基板が切れていない部分から
発生するから、クラック・剥離防止パターン２０ａ，２
０ｂはこの部分を覆うように（該部分と１０ａ，１０ｂ
との間を遮るように）設ける。Since the cracks are generated between the plurality of small holes of the perforation and from the portion where the substrate is not cut between the small holes and the long hole 14, the crack / peeling prevention patterns 20a, 2
0b should cover this part (the part and 10a, 10b
It is installed so as to block the gap between
スルーホールＨは第１図(b)に示すように、基板表面と
裏面の導体層Ｃ（通常これは配線パターンであるが本発
明ではクラック・剥離防止パターン）を結ぶ筒状導体部
であり、両面に配線パターンがあるプリント基板ではそ
の両面の配線パターンの該当するもの同志を接続するの
に設けられる。クラック・剥離防止パターン２０ａ，２
０ｂはプリント基板の両面に設ける。As shown in FIG. 1 (b), the through hole H is a cylindrical conductor portion that connects the conductor layers C on the front and back surfaces of the substrate (usually this is a wiring pattern, but in the present invention, a crack / peeling prevention pattern), In a printed circuit board having wiring patterns on both sides, the wiring patterns on both sides are provided to connect corresponding wiring patterns. Crack / peeling prevention patterns 20a, 2
0b is provided on both sides of the printed circuit board.
全図を通してそうであるが他の図と同じ部分には同じ符
号が付してあり、従って１０ａ，１０ｂは個々のプリン
ト基板、１６ａ，１６ｂは該基板上の配線パターンであ
る。Like in all the drawings, the same parts as those in the other drawings are denoted by the same reference numerals. Therefore, 10a and 10b are individual printed boards, and 16a and 16b are wiring patterns on the boards.
〔作 用〕 この構成では、スルーホールＨの導体層とその周囲の基
板表面部の導体層Ｃがいわば鳩目金具となり、基板１０
ａ，１０ｂを表／裏面から締め付けることになり、この
部分（クラック・剥離防止パターン部）の基板強度を著
しく強める。従って第５図に示した要領で複合基板１０
を折曲し、個々の基板１０ａ，１０ｂに分離する際、ミ
シン目部１２でクラックが発生しても、クラック・剥離
防止パターン２０ａ，２０ｂによりその進行が阻止さ
れ、該パターン２０ａ，２０ｂの内側の配線パターン１
６ａ，１６ｂまでは延びて行かず従って配線パターンの
断線、剥離が回避される。[Operation] In this structure, the conductor layer of the through-hole H and the conductor layer C on the surface of the substrate around the through-hole H are so-called eyelet fittings.
The a and 10b are tightened from the front and back surfaces, and the substrate strength of this portion (crack / peeling prevention pattern portion) is significantly increased. Therefore, the composite substrate 10 is processed according to the procedure shown in FIG.
Even when a crack is generated in the perforated portion 12 when the substrate is bent and separated into the individual substrates 10a and 10b, the crack / separation prevention patterns 20a and 20b prevent the progress thereof, and the inside of the patterns 20a and 20b. Wiring pattern 1
Since it does not extend to 6a and 16b, disconnection and peeling of the wiring pattern are avoided.
このクラック・剥離防止パターンは通常の配線パターン
のスルーホール部と、表面形状を除いて格別異なるとこ
ろはなく、該スルーホール部と同じ工程で製作できるの
で、コストアップを招くことがない。This crack / peeling prevention pattern is not different from the through-hole portion of a normal wiring pattern except for the surface shape, and can be manufactured in the same process as the through-hole portion, so that the cost does not increase.
第２図に複合基板１０の断面構造の例を示す。１０Ａは
コア材で厚いエポキシ系基板で構成される。１０Ｂは表
／裏面層をなす薄いガラス繊維入り基板である。プリン
ト基板には、加工性、コスト、強度などから、かゝるコ
ンポジット材が使用されることが多い。Ｖカットでは表
／裏面にＶ溝を形成し、この際表面層１０Ｂは切断され
る。従ってコア材１０Ａでのみつながっているので、第
５図の如き折曲で、クラック発生なしで分割することが
できる。しかし基板形状によってはＶカットは採用でき
ない場合がある。この場合は、前述の分割孔を整列され
た割部（ミシン目部）を構成して分割を可能にするが、
この方法では前述のようにクラック発生、表面層や配線
パターンの剥離が発生し易い。FIG. 2 shows an example of a sectional structure of the composite substrate 10. 10A is a core material and is composed of a thick epoxy substrate. 10B is a thin glass fiber-containing substrate forming the front / back surface layers. Such composite materials are often used for printed circuit boards because of their workability, cost and strength. In the V-cut, V-grooves are formed on the front and back surfaces, and the surface layer 10B is cut at this time. Therefore, since they are connected only by the core material 10A, they can be divided by bending as shown in FIG. 5 without the occurrence of cracks. However, V-cut may not be adopted depending on the substrate shape. In this case, the division holes (perforations) arranged in the above-described division holes are configured to enable division.
In this method, cracking and peeling of the surface layer and the wiring pattern are likely to occur as described above.
第３図は複合基板１０の具体例を示す。この複合基板の
分割線は をなしており、Ｖカットは採用できない。ミシン目１２
も の一方の平坦部に設け、他方の平坦部は長孔１４だけと
する。しかしこれでは機械的に弱いのでダミー部１０ｄ
を設けて補強する。ミシン目を設けた側にもダミー部１
０ｃを設けているが、これはなくてもよい。プリント基
板１０ａ，１０ｂとダミー部１０ｃ，１０ｄとの分割線
は直線であるからＶカット２２が可能である。分割する
ときはダミー部１０ｃ，１０ｄを折曲、分離し、次いで
プリント基板１０ａ，１０ｂを折曲、分離する。FIG. 3 shows a specific example of the composite substrate 10. The dividing line of this composite board is The V-cut cannot be used. Perforation 12
Also One flat portion is provided, and the other flat portion is only the long hole 14. However, this is mechanically weak, so the dummy part 10d
To reinforce. Dummy part 1 on the side where the perforation is provided
Although 0c is provided, this may not be necessary. Since the dividing lines between the printed boards 10a and 10b and the dummy parts 10c and 10d are straight lines, the V cut 22 is possible. When dividing, the dummy parts 10c and 10d are bent and separated, and then the printed circuit boards 10a and 10b are bent and separated.
以上説明したように本発明では簡単な手段で、格別コス
トアップを招くことなく、複合基板のミシン目分割部か
らのクラック阻止、配線パターンの断線、剥離を防止で
き、甚だ有効である。クラック・剥離防止パターンはミ
シン目の両側かつプリント基板の両面に形成され、複数
個のスルーホールで連結されるので、ミシン目の両側で
両面から基板をしっかり抑え、分割時に発生するクラッ
クの伸張を確実に防止することができる。As described above, the present invention is very effective in that it is possible to prevent cracks from the perforated portion of the composite substrate and prevent disconnection and peeling of the wiring pattern by simple means without increasing the cost. The crack / peeling prevention pattern is formed on both sides of the perforation and on both sides of the printed circuit board, and is connected by multiple through holes, so the board is firmly held from both sides on the perforation, and the cracks that occur when dividing are expanded. It can be surely prevented.
第１図は本発明の原理説明図、 第２図はプリント基板の断面構造例の説明図、 第３図は本発明の実施例の説明図、 第４図は複合基板の分割とクラック発生の説明図、 第５図は複合基板の分割要領の説明図である。 第１図で１０は複合基板、１２はミシン目、１４は長
孔、１６は配線パターン、１８はクラックである。FIG. 1 is an explanatory view of the principle of the present invention, FIG. 2 is an explanatory view of an example of a cross-sectional structure of a printed circuit board, FIG. 3 is an explanatory view of an embodiment of the present invention, and FIG. Explanatory drawing, FIG. 5 is explanatory drawing of the division | segmentation method of a composite substrate. In FIG. 1, 10 is a composite substrate, 12 is a perforation, 14 is a long hole, 16 is a wiring pattern, and 18 is a crack.
Claims (1)
基板（10a,10b ）からなり、製作後、該ミシン目で折
曲、分離される複合型のプリント基板において、 該ミシン目の両側かつ両面に、１列に連なる複数個のス
ルーホールを持ち該ミシン目より長く延びるクラック・
剥離防止パターン（20a,20b ）を被着、形成してなるこ
とを特徴とするプリント基板。1. A composite printed circuit board, which comprises a plurality of printed circuit boards (10a, 10b) connected by perforations (12) and is bent and separated at the perforations after fabrication, wherein both sides of the perforations are provided. A crack that has a plurality of through holes in a row on both sides and extends longer than the perforation.
A printed circuit board characterized by being formed by depositing and forming peeling prevention patterns (20a, 20b).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077611A JPH0648748B2 (en) | 1989-03-29 | 1989-03-29 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077611A JPH0648748B2 (en) | 1989-03-29 | 1989-03-29 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02256289A JPH02256289A (en) | 1990-10-17 |
| JPH0648748B2 true JPH0648748B2 (en) | 1994-06-22 |
Family
ID=13638711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1077611A Expired - Lifetime JPH0648748B2 (en) | 1989-03-29 | 1989-03-29 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648748B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010287770A (en) * | 2009-06-12 | 2010-12-24 | Mitsubishi Electric Corp | Printed circuit board |
| JP2021174971A (en) * | 2020-04-30 | 2021-11-01 | ファナック株式会社 | Printed wiring board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115078A (en) * | 1979-02-26 | 1980-09-04 | Burtis Eric F | Device for learning reading |
| JPS6026904B2 (en) * | 1980-12-23 | 1985-06-26 | ミサワホ−ム株式会社 | How to install building units |
| JPS60121662A (en) * | 1983-12-02 | 1985-06-29 | Murata Mfg Co Ltd | Mass spectrometer |
| JPS6212975U (en) * | 1985-07-09 | 1987-01-26 | ||
| JPS6292672U (en) * | 1985-11-29 | 1987-06-13 | ||
| JPH0724327B2 (en) * | 1988-12-12 | 1995-03-15 | 松下電器産業株式会社 | Printed wiring board |
-
1989
- 1989-03-29 JP JP1077611A patent/JPH0648748B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02256289A (en) | 1990-10-17 |
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