JPH0648868Y2 - 半導体装置の冷却構造 - Google Patents

半導体装置の冷却構造

Info

Publication number
JPH0648868Y2
JPH0648868Y2 JP1989071921U JP7192189U JPH0648868Y2 JP H0648868 Y2 JPH0648868 Y2 JP H0648868Y2 JP 1989071921 U JP1989071921 U JP 1989071921U JP 7192189 U JP7192189 U JP 7192189U JP H0648868 Y2 JPH0648868 Y2 JP H0648868Y2
Authority
JP
Japan
Prior art keywords
cooling
semiconductor chips
refrigerant
cooling structure
coolant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989071921U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0310548U (cs
Inventor
貴志男 横内
光隆 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1989071921U priority Critical patent/JPH0648868Y2/ja
Publication of JPH0310548U publication Critical patent/JPH0310548U/ja
Application granted granted Critical
Publication of JPH0648868Y2 publication Critical patent/JPH0648868Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
JP1989071921U 1989-06-20 1989-06-20 半導体装置の冷却構造 Expired - Lifetime JPH0648868Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989071921U JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Publications (2)

Publication Number Publication Date
JPH0310548U JPH0310548U (cs) 1991-01-31
JPH0648868Y2 true JPH0648868Y2 (ja) 1994-12-12

Family

ID=31609388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989071921U Expired - Lifetime JPH0648868Y2 (ja) 1989-06-20 1989-06-20 半導体装置の冷却構造

Country Status (1)

Country Link
JP (1) JPH0648868Y2 (cs)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012138473A (ja) * 2010-12-27 2012-07-19 Zycube:Kk 半導体デバイス・電子部品の実装構造

Also Published As

Publication number Publication date
JPH0310548U (cs) 1991-01-31

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