JPH0652111U - Micro chip coil - Google Patents

Abstract

(57) [Summary] [Purpose] The size should be as small as possible to ensure the reliability of conduction. [Structure] A terminal plate (4) is erected on the outside of both end faces (3) of the bobbin (2) for the coil portion (1). Lead wires (13) at both ends of the coil portion (1) are led out between the end surface (3) and the terminal plate (4). Then, the lead wire (13) and the terminal plate (4) are soldered (11) from the outer surface of the terminal plate (4). Connect the base (5) of the terminal plate (4) to the end face (3).
The bottom surface (6) is exposed and buried in the side wall (3 ') integrated with
The standing portion (7) is bent with respect to the base portion (5), and the end face (3)
Stand upright with respect to. Connect the lead wire (13) to the rising portion.
It is sandwiched between (7) and the end face (3) and soldered to the standing portion (7). Notches (10) communicating with both inside and outside of the upright portion (7)
Alternatively, the introduction hole (12) is formed.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a microchip coil arranged on a printed board.

[0002]

[Prior art]

 In the conventional ultra-small chip coil, an insulation-coated wire (UEW) is wound around a bobbin, this is resin-molded, the lead wires at both ends are projected out of this mold, and the coating of these lead wires is removed to solder the board wire and solder. Attached.

[0003]

[Problems to be solved by the device]

 The size of various electric components provided on the printed wiring board has been further reduced, and the external dimensions of the coil itself have naturally been reduced. The conventional method of soldering the lead wire to the circuit does not always maintain a constant shape because the lead wire is easily bent, which not only hinders the automation of board mounting, but also takes time and effort. The present invention is intended to solve the above problem by soldering the lead wire between the terminal plate and the bobbin so that the lead wire is sandwiched between them.

[0004]

[Means for Solving the Problems]

 In the miniature chip coil according to the present invention, terminal plates are erected on the outside of both end surfaces of the coil bobbin. Then, the lead wires at both ends of the coil portion are led out between the end surface and the terminal plate, and the lead wire and the terminal plate are soldered from the outer surface of the terminal plate.

A base portion of the terminal plate is embedded in a side wall integrated with the end surface, with its bottom surface exposed. The upright portion is bent with respect to the base portion and is erected so as to be inclined with respect to the end face. The lead wire is soldered to the upright portion while being sandwiched between the end surface and the upright portion by pressing the upright portion. Notches are formed in the outer peripheral portion of the upright portion so as to communicate with both inner and outer surfaces thereof. The upright portion may be formed with an introduction hole communicating with both inner and outer surfaces thereof.

[0006]

[Action]

 A coil is wound around the bobbin to form a coil portion. Then, terminal plates are erected on both sides of the bobbin, and lead wires at both ends of the coil are led out between the end face and the terminal plate. This lead-out is performed from the notch of the side wall integrated with the end face. Press the lead wire that has been pulled out to the end face with the terminal plate, and pull the lead wire in the direction that makes an angle with the lead-out direction of the lead wire to cut it. This is because pulling in the pulling direction causes the lead wire to stretch and become thin, making it easy to break the wire.

A soldering iron is pressed against the outer surface of the terminal board to be soldered. The terminal board tilts toward the end surface, the insulation coating of the lead wire is burned down by the heat passing through the terminal board, and the solder goes around to the back of the terminal board and attaches the lead wire and the terminal board. By exposing a part of these terminal boards and covering them with a resin mold, a minute chip coil can be obtained.

A base portion of the terminal plate is embedded in a side wall integrated with the end surface with its bottom surface exposed, and its upright portion is bent with respect to the base portion and is erected inclining with respect to the end surface. Then, the lead wire is sandwiched between the end surface and the end surface only by slightly pressing the upright portion, and the cutting is facilitated.

When the lead wire is soldered to the upright portion while being sandwiched between the end surface and the upright portion by pressing the upright portion, the terminal plate and the lead wire are reliably soldered. . By forming notches and introduction holes that communicate with both the inner and outer surfaces of the upright portion, the conduction of heat for eliminating the coating of the lead wire is good, and the solder goes around the back surface of the upright portion to connect the lead wire and the upright portion. This increases the reliability of the product. Also, the Q of the coil becomes good.

[0010]

Embodiment 1 is a coil portion, and 2 is a coil bobbin having an end face 3. Reference numeral 4 denotes a terminal plate, the base portion 5 of which is embedded in the side wall 3'integrated with the end surface 3 with the bottom surface 6 thereof exposed and the upright portion 7 being bent with respect to the base portion 5 and being inclined toward the end surface 3. Set up.

A notch 10 communicating with the inner surface 8 and the outer surface 9 is formed in the outer peripheral portion of each upright portion 7 to facilitate the rotation of the paddle 11 toward the inner surface 8 side. The notch 10 may be an introduction hole 12 provided in the upright portion 7.

The lead wires 13 at both ends of the coil portion 1 are led out between the end surface 3 and the rising portion 7 of the terminal plate 4. A notch 14 is provided from the upper end in a side wall 3'integral with the end face 3 of the bobbin 2 for the coil portion 1, and the lead wire 13 is led out of the end face 3 from the notch 14. Then, the standing portion 7 is pressed in the direction of the end face 3, the lead wire 13 is sandwiched between the two, and the lead wire 13 is pulled in a direction forming an angle with the lead-out direction and cut. Since the lead-out portion of the lead wire 13 is not directly pulled, the lead wire 13 does not stretch and become thin, and the wire is not easily broken.

A soldering iron is applied to the outer surface 9 of the upright portion 7, and the upright portion 7 is pressed for soldering. The upright portion 7 holds the lead wire 13 between itself and the end face 3, heat is burned through the upright portion 7 to the coating of the lead wire 13, and a part of the solder 11 goes from around the upright portion 7 to the inner surface 8. Run down and attach the lead wire 13 and the upright portion 7 firmly. Here, if a part of the terminal board 4 is exposed and the bobbin 2 is covered with the mold M, the product is completed.

[0014]

[Effect of device]

 According to the present invention, since the lead wire is soldered while being sandwiched between the terminal plate and the end face, the total length of the product can be shortened, and the coating of the lead wire is not required to be peeled off, thereby improving the work efficiency. This can be done in a timely manner and the product unit price can be reduced and the product quality can be stabilized.

According to the second aspect of the present invention, since the upright portion of the terminal plate is inclined, the lead wire can be cooperated with the end surface by inserting the lead wire between the end surface and the upright portion and pressing the upright portion from the outer surface. Wires can be crimped and lead wires can be easily cut.

According to the third aspect, the lead wire is soldered in a state of being sandwiched between the end face and the rising portion, so that the soldering work is easy. According to claims 4 and 5, since the solder turns from the outer surface to the inner surface of the rising portion to connect the lead wire and the terminal plate, the reliability of the product is increased.

[Brief description of drawings]

FIG. 1 is a side view showing a specific example of an extremely small chip coil according to the present invention, in which a soldering portion is clearly shown by cutting out a part of a right end portion.

FIG. 2 is a plan view in which solder is omitted.

FIG. 3 is a side view of the same.

FIG. 4 is a side view of another example of FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 coil part 2 bobbin 3 end face 3'side wall 4 terminal plate 5 base part 6 bottom face 7 standing part 8 inner surface 9 outer surface 10 notch 11 solder 12 introduction hole 13 lead wire 14 notch M mold

Claims (5)

[Scope of utility model registration request] 1. A bobbin (2) for a coil portion (1) is provided with a terminal plate (4) standing on the outside of both end faces (3), and lead wires (13) at both ends of the coil portion (1) are attached. Lead out between the end face (3) and the terminal plate (4), and solder the lead wire (13) and the terminal plate (4) from the outer surface of the terminal plate (4) (1
1) A micro chip coil characterized by being attached. 2. A base portion (5) of the terminal plate (4) is embedded in a side wall (3 ′) integral with the end surface (3) with its bottom surface (6) exposed, and its upright portion (7) is The microchip coil according to claim 1, which is bent with respect to the base portion (5) and is erected so as to be inclined with respect to the end surface (3). 3. The lead wire (13) is soldered to the standing portion (7) while being sandwiched between the end surface (3) and the standing portion (7) by pressing the standing portion (7). The minimum chip coil according to claim 2. 4. The microchip coil according to claim 2, wherein a cutout (10) communicating with both inner and outer surfaces of the upright portion (7) is formed in an outer peripheral portion of the upright portion (7). 5. The microchip coil according to claim 2 or 3, wherein the upright portion (7) is formed with an introduction hole (12) communicating with both inner and outer surfaces thereof.