JPH0653092A - Electronic parts - Google Patents

Abstract

(57) [Abstract] [Purpose] An object of the present invention is to provide an electronic component that has a low profile and is stable when mounted on an electronic device, and that has little characteristic deterioration. [Structure] Component element 12 having a pair of lead members 13
And a bottomed metal case 1 incorporating this component element 12
1, a sealing member made of a hard material integrally formed with a surface mounting portion 15 for sealing the opening of the metal case 11 and for surface mounting on a mounting substrate, and a polymer material reservoir 16 for storing a polymer material. The pair of lead members 13 are inserted through the through holes 17 provided in the sealing member 14, and the tip ends thereof are bent along the surface mounting portion 15 and a part of the through holes 17 of the sealing member 14 is formed. The protrusion 19 that is in close contact with the lead member 13 that is inserted into the polymer is provided in the gap between the lead member 13 and the through hole 17, the polymer material reservoir 16, the opening of the metal case 11 and the sealing member 14. Material 2
By arranging 0 and performing the sealing, it is possible to provide an electronic component that has a low profile, is stable during surface mounting, and has little characteristic deterioration.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts, and more particularly to so-called leadless electronic parts.

In the following description, a chip type aluminum electrolytic capacitor will be described in detail, but the present invention is not limited to this chip type aluminum electrolytic capacitor, and the same applies to other electronic parts. .

[0003]

2. Description of the Related Art With the recent progress in miniaturization and thinning of electronic parts and the progress of high-density mounting technology, electronic parts are rapidly becoming chips.

The conventional chip-type aluminum electrolytic capacitor is constructed as shown in FIGS. That is, the metal case 2 made of aluminum, which constitutes the capacitor body 2a having the capacitor element 1 built therein, has a bottomed cylindrical shape, and a pair of lead electrodes 3 are led out from the capacitor element 1. Further, the opening of the metal case 2 is sealed by a sealing body 4 made of an elastic body, and an insulating plate 5 is arranged on the opening side of the metal case 2. Then, the pair of lead electrodes 3 are inserted through the inside of the sealing body 4 made of an elastic body, and the end faces thereof are exposed to the insulating plate 5 through the opening of the metal case 2.

The insulating plate 5 is provided with a pair of through holes 6 and a storage recess 7 continuous with the pair of through holes 6. And again, the pair of lead electrodes 3
The lead wire 8 having a flat tip end penetrates through a pair of through holes 6 provided in the insulating plate 5, and the tip end is bent along the bottom surface of the insulating plate 5, and the storage recess 7 is formed.
It was configured to be stored in.

A chip type aluminum electrolytic capacitor in which an elastic sealing member and an insulating plate are integrated by an elastic member has also been proposed (Japanese Patent Laid-Open No. 60-170926 and Japanese Utility Model Application Laid-Open No. 50-98).
233, Japanese Utility Model Publication No. 61-22336).

[0007]

However, in the conventional chip type aluminum electrolytic capacitors shown in FIGS. 6 to 8, since the sealing body 4 made of an elastic body and the insulating plate 5 are combined, the number of parts is increased. There was a problem. Further, although the height of the product is required to be reduced with the progress of the high-density mounting technology, the presence of the space 9 between the capacitor body 2a and the insulating plate 5 and elasticity when trying to secure the sealing performance. Since the thickness of the sealing body 4 made of a body cannot be made thinner than before, there is a problem that it is difficult to reduce the height further with the conventional chip type aluminum electrolytic capacitor.

Further, in the above-mentioned conventional chip type aluminum electrolytic capacitor in which the elastic sealing body and the insulating plate are integrated by the elastic body, when the chip type aluminum electrolytic capacitor is surface-mounted on the printed circuit board by the automatic mounting machine, a pair of flat plate When reflow-soldering a lead wire in a printed circuit board, the integrated elastic sealing body and insulating plate are deformed due to the temperature (~ 240 ° C) during reflow soldering, resulting in incomplete mounting on the printed circuit board. It had a problem that

Further, since the conventional sealing body 4 uses the elastic body, the driving electrolytic solution impregnated in the capacitor element 1 evaporates quickly and the characteristic deterioration of the capacitor is remarkable.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an electronic component which can achieve a low profile of the electronic component and a stabilization at the time of surface mounting on an electronic device, and which has little deterioration in characteristics. It is what

[0011]

In order to solve the above-mentioned problems, an electronic component of the present invention is a component element having a pair of lead members, a bottomed metal case containing the component element, and this metal case. And a sealing member made of a hard material integrally formed with a surface mount portion for surface mounting on a mounting substrate and a polymer material reservoir for storing a polymer material, and the pair of lead members. Is inserted through the through hole provided in the sealing member and bent at its tip along the surface mounting portion, and is in close contact with the convex portion provided in a part of the through hole of the sealing member, and the lead member and the through hole are formed. The polymer material is placed in the gap, the polymer material reservoir, and the gap between the opening of the metal case and the sealing member to perform sealing.

[0012]

With the above construction, conventionally, two members, that is, the elastic sealing member and the insulating plate are used, but can be constituted only by the sealing member having the surface mounting function, and the sealing member is made of the hard material. Therefore, the sealing member can be made thinner,
The size and height of electronic parts can be reduced. Also, because the sealing member is made of a hard material, even if reflow soldering is performed when this electronic component is surface-mounted on the mounting board with an automatic mounting machine, the sealing member will deform at the temperature during the reflow soldering. As a result, it is possible to stabilize the surface mounting of this electronic component on an electronic device.

Further, a polymer material is provided between the through-holes of the pair of lead members and the through-hole, and between the polymeric material reservoir of the sealing member and the sealing portion of the metal case and the sealing member. Since they are arranged and sealed, it is possible to significantly improve the sealing property between the two, and in the case of a chip type aluminum electrolytic capacitor in which component elements are impregnated with a driving electrolytic solution, a sealing member is required. Since the driving electrolyte can be prevented from evaporating due to the fact that it is made of a hard material, the deterioration of the characteristics of the capacitor can be suppressed and the life of the capacitor can be extended. Further, by providing a convex portion that partially comes into contact between the portion located in the through hole of the pair of lead members and the through hole, evaporation of the driving electrolyte solution is further reduced, and characteristic deterioration is significantly suppressed. Further, the life can be further extended, the lead member holding force of the sealing member can be further increased, and the surface mounting on the electronic device can be stabilized.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An electronic component according to an embodiment of the present invention will be described below with reference to the accompanying drawings. 1 and 2, reference numeral 11 denotes a metal case that constitutes a chip-type aluminum electrolytic capacitor body 11a having a built-in capacitor element 12. The metal case 11 is formed in a cylindrical shape with a bottom and is flat from the capacitor element 12. A pair of shaped lead members 13 are led out. The opening of the metal case 11 is sealed by a sealing member 14 made of a hard material. Further, the sealing member 14 has a chip-type aluminum electrolytic capacitor body 11a on the printed circuit board.
The surface mount portion 15 for surface mounting and the polymer material reservoir portion 16 for storing the polymer material are integrally formed of a hard material. The pair of lead members 13 are the sealing members 14
Penetrating through the inside of the through hole 17 provided in the surface mounting portion 15, the tip end thereof is bent along the surface of the surface mounting portion 15 of the sealing member 14, and is housed in the housing recess 18 provided in the surface mounting portion 15. .

Further, as shown in FIG. 3, a protrusion is formed by the welded portion 19 obtained by melting the protrusion 34 provided around the through hole 33 of the sealing member 31, and the through hole 17 of the pair of lead members 13 is formed. A part of the gap between the portion located at and the through hole 17 is in close contact. In addition to the above-described example, the method of closely contacting a part of the gap portion may be performed by providing a protrusion 43 inside the through hole 42 of the sealing member 41 as shown in FIG.
As shown in FIG. 5, a protrusion 53 is provided at a portion located in the through hole 52 of the pair of lead members 51, or a thermosetting polymer material or elastic material is provided at a portion located in the through hole 61 as shown in FIG. It is also possible to reduce the size of a part of the gap between the through hole 17 and the portion of the pair of lead members 13 located in the through hole 17 by providing the polymeric material 64 made of a body.

Further, the through hole 1 of the pair of lead members 13
A polymer material 20 made of a thermosetting polymer material or an elastic body is arranged in the gap between the portion located at 7 and the through hole 17 and the polymer material reservoir portion 16, and the lead member 13
And the sealing member 14 are sealed together, and a thermosetting polymeric material or a polymeric material 21 made of an elastic body is interposed between the metallic case 11 and the sealing member 14 so that the metallic case 11 is sealed. The airtightness of the chip-type aluminum electrolytic capacitor body 11a is maintained by drawing the opening. Also, one of the portion of the pair of lead members 13 located in the through hole 17 and the through hole 17,
Alternatively, both surfaces are subjected to one or both of a chemical treatment such as etching and sandblasting and a physical treatment, or both, to roughen the surface. A thermoplastic resin or a thermosetting resin is suitable as the hard material forming the sealing member 14.

The welded portion 19 is formed by ultrasonic waves, a laser, a heater trowel, etc., and the polymer material 20, 21,
Epoxy, silicone, acrylic, phenolic, urethane, and rubber are suitable as the thermosetting resin constituting 64, and ethylene propylene rubber is used as the elastic body constituting the polymeric materials 20, 21, 64. Butyl rubber, fluororubber, etc. are suitable.

As a concrete example of the present invention, the sealing member 14 is made of polyphenylene sulfide resin (PPS).
Resin), the metal case 11 is made of an aluminum material, and the polymer materials 20 and 21 are thermosetting epoxy resin to produce a chip-type aluminum electrolytic capacitor.

In the above embodiments, the chip type aluminum electrolytic capacitor was described as an example of the electronic component, but the present invention is not limited to the chip type aluminum electrolytic capacitor, and the same applies to other electronic components. It goes without saying that the above structure can be applied to.

[0020]

As described above, according to the electronic component of the present invention, the surface mounting portion for surface mounting on the mounting substrate is integrated with the sealing member made of a hard material for sealing the opening of the bottomed metal case. Since it is formed in a thin shape, the sealing member can be made thinner, and the size and height can be reduced.

Further, since the sealing member is made of a hard material, when the electronic component is surface-mounted on the mounting substrate by an automatic mounting machine, even if reflow soldering is performed, the sealing temperature is the temperature at the time of the reflow soldering. The member does not deform, and as a result, it is possible to stabilize the electronic component when it is surface-mounted on an electronic device.

Further, the pair of lead members led out from the component element penetrates the sealing member, bends the tip end portion thereof along at least the surface of the surface mounting portion of the sealing member facing the mounting substrate, and A polymer material is disposed between the portion of the lead member located in the through hole and the through hole and in the polymer material reservoir of the sealing member to perform sealing between the pair of lead members and the sealing member. Therefore, it is possible to remarkably improve the sealing property between the two.In this case, in the case of a chip type aluminum electrolytic capacitor in which a component element is impregnated with a driving electrolytic solution, the sealing member is made of a hard material. Together with this, it is possible to prevent the driving electrolytic solution from evaporating, so that the capacitor is less deteriorated in characteristics and can have a long life.

Further, since a part of the gap between the through hole of the pair of lead members and the through hole is made small, the evaporation of the driving electrolytic solution can be further reduced, and the characteristics Deterioration can be prevented, the life of the capacitor can be further extended, the lead member holding force of the sealing member can be further increased, and stabilization at the time of surface mounting on an electronic device can be achieved.

[Brief description of drawings]

FIG. 1 is a partially cutaway front view of a chip type aluminum electrolytic capacitor according to an embodiment of the present invention.

FIG. 2 is a perspective view of the same chip type aluminum electrolytic capacitor.

FIG. 3 is a perspective view showing a protrusion provided on the periphery of a through hole of the sealing member according to the embodiment.

FIG. 4 is a sectional view showing a protrusion provided inside a through hole of the sealing member according to the embodiment.

FIG. 5 is a cross-sectional view showing a protrusion provided in a portion that is inserted into a through hole of the lead member according to the embodiment.

FIG. 6 is a cross-sectional view showing a state in which a polymer material is arranged in a through hole of the sealing member according to the example.

FIG. 7 is a partially cutaway front view of a conventional chip-type aluminum electrolytic capacitor.

FIG. 8 is a perspective view of the conventional chip-type aluminum electrolytic capacitor.

[Explanation of symbols]

 11 Metal Case 11a Chip-type Aluminum Electrolytic Capacitor Main Body 12 Capacitor Element 13 Pair of Lead Members 14 Sealing Member 15 Surface Mounting Section 16 Polymer Material Reservoir 17 Through Hole 18 Recessed Recess 19 Weld Section 20 Polymer Material 21 Polymer Material 31 Sealing member 32 Pair of lead members 33 Through hole 34 Projection 35 Polymer material reservoir 41 Sealing member 42 Through hole 43 Projection 44 Pair of lead member 45 Polymer material reservoir 51 Pair of lead member 52 Through hole 53 Projection 54 Sealing Member 55 Polymer Material Reservoir 61 Through Hole 62 Pair of Lead Members 63 Sealing Member 64 Polymer Material 65 Polymer Material Reservoir

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kunio Hirao 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (4)

[Claims] 1. A surface mount for mounting a component element having a pair of lead members, a bottomed metal case containing the component element, an opening of the metal case and surface mounting on a mounting substrate. And a sealing member made of a hard material integrally formed with a polymeric material reservoir for accumulating the polymeric material, wherein the pair of lead members are inserted into a through hole provided in the sealing member, and the tips thereof are surface-mounted parts. Along with the convex portion provided in a part of the through hole of the sealing member, and the gap between the lead member and the through hole and the polymeric material reservoir and the opening and sealing of the metal case. An electronic component in which a polymer material is placed in the space between the members and sealed. 2. The convex portion, which is provided in a part of the through hole of the sealing member and is in close contact with the lead member, is formed by melting a protrusion provided at the periphery of the through hole of the sealing member. Electronic components. 3. The electronic component according to claim 1, wherein the lead member and the through hole are partially brought into close contact with each other by a protrusion provided on a part of the insertion portion of the lead member which is inserted through the through hole of the sealing member. 4. The electronic component according to claim 1, wherein a polymer material is arranged in the through hole of the sealing member having the pair of lead members inserted therethrough, and the lead member and the through hole are partially brought into close contact with each other.