JPS6158227A - Chip type electrolytic condenser - Google Patents
Chip type electrolytic condenserInfo
- Publication number
- JPS6158227A JPS6158227A JP59181275A JP18127584A JPS6158227A JP S6158227 A JPS6158227 A JP S6158227A JP 59181275 A JP59181275 A JP 59181275A JP 18127584 A JP18127584 A JP 18127584A JP S6158227 A JPS6158227 A JP S6158227A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electrolytic capacitor
- type electrolytic
- heat
- elastic sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Double-Layer Capacitors Or The Like (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明はりフローはんだ付は方式などにより印刷基板上
に取付けできるチップ形電解コンデンサに関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a chip type electrolytic capacitor that can be mounted on a printed circuit board by a beam flow soldering method or the like.
従来の技術
近年、電そ機器の小形化、軽量化、高密度化、高信頼度
化指向が進展するなかで、印刷基板においてもより薄く
、またフレシキブルなもの、熱電導のよい金属板を用い
るものなどが開発され利用されるようになってきた。Conventional technology In recent years, as electrical equipment has become smaller, lighter, more dense, and more reliable, printed circuit boards have become thinner and more flexible, and metal plates with good thermal conductivity are being used. Things have started to be developed and used.
また電子部品においてもチップ部品が開発され、上述の
印刷基板に取付けられるコンデンサにおいては積層セラ
ミックコンデンサ、タンタルコンデンサはチップ形が増
加して来ている。そして電解コンデンサにおいては、コ
ンデンサ素子に電解液が含浸されているため、アルミケ
ースに収納したものをさらにモールド成形して樹脂外装
する、樹脂で21!外装するなど2重外装したものが考
案されている。Chip components have also been developed in electronic components, and chip-type multilayer ceramic capacitors and tantalum capacitors are increasingly being used as capacitors to be attached to the above-mentioned printed circuit boards. In electrolytic capacitors, the capacitor element is impregnated with electrolyte, so the capacitor element is housed in an aluminum case and then molded and covered with resin. A double exterior has been devised.
また一方第3図および第4図、に示すように円筒状金属
ケース5に収納した電解コンデンサの引出リード2.3
を根元で折曲げたチップ形電解コンデンサが考案されて
いる。7は耐熱性絶縁台である。(実開昭50−982
33号公報など)発明が解決しようとする問題点
上述の2重外装した電解コンデンサにおいては、生産性
も低く外形寸法が大きく高価になる問題があった。また
第3図のような電解コンデンサにおいては、折曲げたリ
ードFIIA2.3と金属ケース5が短絡し易い、リー
ド線2.3を折曲げる際弾性封口体4を通じて電極箔に
応力が加わり、漏れ電流が増加するなどの問題があった
。また第4図のような従来の構造においては、耐熱性絶
縁台7の厚みの分だけ製品高さが大きくなり、そのため
弾性封口体4.の厚みを薄くすると、長期間高温で使用
中電解液が漏出し容量減少、損失増加など信鯨性に欠け
る問題があった。On the other hand, as shown in FIGS. 3 and 4, the lead 2.3 of an electrolytic capacitor housed in a cylindrical metal case 5
A chip-type electrolytic capacitor has been devised in which the base is bent. 7 is a heat-resistant insulating stand. (Jitsukai 50-982
33 etc.) Problems to be Solved by the Invention The double-exposed electrolytic capacitor described above has the problems of low productivity, large external dimensions, and high cost. In addition, in the electrolytic capacitor shown in Fig. 3, the bent lead FIIA 2.3 and the metal case 5 are likely to short-circuit, and when the lead wire 2.3 is bent, stress is applied to the electrode foil through the elastic sealing member 4, causing leakage. There were problems such as increased current. Furthermore, in the conventional structure as shown in FIG. 4, the product height increases by the thickness of the heat-resistant insulating base 7, so that the elastic sealing member 4. If the thickness of the battery is made thinner, the electrolyte may leak during use at high temperatures for a long period of time, resulting in a decrease in capacity and an increase in loss, resulting in a lack of reliability.
問題点を解決するための手段
本発明は上述の問題を解消したもので、コンデンサ素子
より同一方向に導出しかつ一端にリード端子を溶接した
引出リードを、弾性封口体に設けたリード挿通孔に挿入
し、これを円筒状金属ケースに収納し、該ケースの開口
部を締付は密閉してなる電解コンデンサにおいて、上記
引出しリードとリード端子との溶接部を弾性封口体の外
方に突き出させて締付けると共に耐熱性絶縁台に設けた
貫通孔または切欠内に上記突き出た溶接部を埋設し、上
記リード端子を耐熱性絶縁台の外面に配設したことを特
徴とするチップ形電解コンデンサである。Means for Solving the Problems The present invention solves the above-mentioned problems by inserting lead-out leads led out from the capacitor element in the same direction and having a lead terminal welded to one end into the lead insertion hole provided in the elastic sealing body. In an electrolytic capacitor, the welded part between the drawer lead and the lead terminal protrudes outward from the elastic sealing body. The chip-type electrolytic capacitor is characterized in that the protruding welded portion is buried in a through hole or notch provided in a heat-resistant insulating base, and the lead terminal is arranged on the outer surface of the heat-resistant insulating base. .
作用
引出しリードとリード端子との溶接部を弾性封口体の外
方に突き出させて締付けると共に、耐熱性絶縁台に設け
た貫通孔または切欠内に上記突き出た溶接部を埋設し、
耐熱性絶縁台の外面に上記リード端子を配設しているの
で、変形した溶接部は弾性封口体の中には存在せず、引
出しリードは均一に締付けられ、気密性が著しく向上す
る作用を有する。The welded part between the working lead and the lead terminal is made to protrude outward from the elastic sealing body and tightened, and the protruded welded part is buried in a through hole or notch provided in the heat-resistant insulating base,
Since the lead terminals are arranged on the outer surface of the heat-resistant insulating stand, the deformed welds do not exist inside the elastic sealing body, and the lead-out leads are tightened uniformly, resulting in a significantly improved airtightness. have
実施例
以下、本発明を第1図および第2図に示す実施例により
説明する。EXAMPLES Hereinafter, the present invention will be explained with reference to examples shown in FIGS. 1 and 2.
第1図はチッラ°形電解コンデンサの断面図で、まずコ
ンデンサ素子1より同一方向に導出した引出リード2.
3を弾性封口体4に設けたリード挿通孔に挿入し、これ
を金属ケース5に収納して該ケース5の開口部を締付は
密閉する。このとき引出リード2.3の各々一端に溶接
されたはんだ付は可能なリード端子2a、3aの溶接部
2b、3bは弾性封口体4の外方に突き出させて締付け
られている。次に予め成形されたPBT、PET。FIG. 1 is a cross-sectional view of a chiller-type electrolytic capacitor. First, lead leads 2 and 2 led out from a capacitor element 1 in the same direction.
3 is inserted into the lead insertion hole provided in the elastic sealing body 4, and is housed in the metal case 5, and the opening of the case 5 is tightened and sealed. At this time, the welded portions 2b and 3b of the solderable lead terminals 2a and 3a, which are welded to one end of each of the lead-out leads 2.3, are made to protrude outward from the elastic sealing member 4 and are tightened. Next, pre-formed PBT, PET.
ABS、PPS、エポキシ樹脂アルミナ基板などの耐熱
性樹脂台8に設けた貫通孔3a、8bまたは切欠内に上
述の突き出た溶接部2b、3bを埋設し、耐熱性絶縁台
8の外面に沿ってリード端子2a、3aを折曲げ完成す
る。なお、第2図はチップ形電解コンデンサの他の実施
例で、耐熱性絶縁台9には貫通孔9a、9bまたは切欠
きが設けられ、その外面に金属板を一体に成形したり、
金属を蒸着、印刷したりして導体層9C19dを形成し
たものを用いる。この場合溶接部2b、3bは貫通孔9
a、9b内に埋設し、リード端子2a、3aは耐熱性絶
縁台9の外面で切断して導体層9c、9dにはんだ付け
、レーザー溶接などにより接続し完成する。The above-mentioned protruding welding parts 2b, 3b are buried in the through holes 3a, 8b or notches provided in the heat-resistant resin base 8, such as ABS, PPS, epoxy resin alumina substrate, etc. The lead terminals 2a and 3a are bent and completed. In addition, FIG. 2 shows another embodiment of a chip type electrolytic capacitor, in which a heat-resistant insulating base 9 is provided with through holes 9a, 9b or notches, and a metal plate is integrally formed on the outer surface of the through holes 9a, 9b or notches.
A conductor layer 9C19d formed by vapor deposition or printing of metal is used. In this case, the welded parts 2b and 3b are the through holes 9
The lead terminals 2a and 3a are cut at the outer surface of the heat-resistant insulating base 9 and connected to the conductor layers 9c and 9d by soldering, laser welding, etc. to complete the process.
発明の効果
本発明のチップ形電解コンデンサは、以上のようにして
生産されるので、上述の作用により気密性が著しく向上
し、弾性封口体4の厚みを薄くできて製品を小形化にで
きると共に、2恵外装する必要もなく生産性を著しく向
上させることができ、工業的ならびに実用的価値の極め
て大なるものである。Effects of the Invention Since the chip type electrolytic capacitor of the present invention is produced in the manner described above, the airtightness is significantly improved due to the above-mentioned effects, the thickness of the elastic sealing body 4 can be reduced, and the product can be made smaller. 2) Productivity can be significantly improved without the need for exterior packaging, and it is of great industrial and practical value.
第1図は本発明のチップ形電解コンデンサの一実施例の
断面図、第2図は本発明のチップ形電解コンデンサの他
の実施例の断面図、第3図および第4図は従来の各々異
なるチップ形電解コンデンサの断面図である。
l:コンデンサ素子 2.3:引出リード2a、3a:
リード端子
2b、3b=溶接部 4:弾性材ロ体
5:金属ケース 8.9:耐熱性絶縁台8 a、8 b
:貫通孔FIG. 1 is a cross-sectional view of one embodiment of the chip-type electrolytic capacitor of the present invention, FIG. 2 is a cross-sectional view of another embodiment of the chip-type electrolytic capacitor of the present invention, and FIGS. 3 and 4 are each of the conventional chip-type electrolytic capacitors. FIG. 3 is a cross-sectional view of a different chip-type electrolytic capacitor. l: Capacitor element 2.3: Output leads 2a, 3a:
Lead terminals 2b, 3b = welded part 4: Elastic material body 5: Metal case 8.9: Heat-resistant insulating stand 8 a, 8 b
:Through hole
Claims (1)
端子を溶接した引出しリードを、弾性封口体に設けたリ
ード挿通孔に挿入し、これを円筒状金属ケースに収納し
、該ケースの開口部を締付け密閉してなる電解コンデン
サにおいて、上記引出しリードとリード端子との溶接部
を弾性封口体の外方に突き出させて締付けると共に、耐
熱性絶縁台に設けた貫通孔または切欠内に上記突き出た
溶接部を埋設し、上記リード端子を耐熱性絶縁台の外面
に配設したことを特徴とするチップ形電解コンデンサ。A drawer lead drawn out in the same direction from the capacitor element and with a lead terminal welded to one end is inserted into the lead insertion hole provided in the elastic sealing body, housed in a cylindrical metal case, and the opening of the case is tightened to seal it. In the electrolytic capacitor, the welded portion between the drawer lead and the lead terminal is made to protrude outward from the elastic sealing body and tightened, and the protruded welded portion is inserted into the through hole or notch provided in the heat-resistant insulating base. A chip-type electrolytic capacitor characterized in that the lead terminals are embedded and arranged on the outer surface of a heat-resistant insulating stand.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59181275A JPS6158227A (en) | 1984-08-29 | 1984-08-29 | Chip type electrolytic condenser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59181275A JPS6158227A (en) | 1984-08-29 | 1984-08-29 | Chip type electrolytic condenser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6158227A true JPS6158227A (en) | 1986-03-25 |
| JPH0363805B2 JPH0363805B2 (en) | 1991-10-02 |
Family
ID=16097844
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59181275A Granted JPS6158227A (en) | 1984-08-29 | 1984-08-29 | Chip type electrolytic condenser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6158227A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009013943A1 (en) * | 2007-07-20 | 2009-01-29 | Sanyo Electric Co., Ltd. | Electrolytic capacitor |
| JPWO2018079358A1 (en) * | 2016-10-31 | 2019-09-12 | パナソニックIpマネジメント株式会社 | Electrolytic capacitor |
-
1984
- 1984-08-29 JP JP59181275A patent/JPS6158227A/en active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009013943A1 (en) * | 2007-07-20 | 2009-01-29 | Sanyo Electric Co., Ltd. | Electrolytic capacitor |
| JPWO2018079358A1 (en) * | 2016-10-31 | 2019-09-12 | パナソニックIpマネジメント株式会社 | Electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0363805B2 (en) | 1991-10-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |