JPH065376U - Brushless motor - Google Patents

Brushless motor

Info

Publication number
JPH065376U
JPH065376U JP4195992U JP4195992U JPH065376U JP H065376 U JPH065376 U JP H065376U JP 4195992 U JP4195992 U JP 4195992U JP 4195992 U JP4195992 U JP 4195992U JP H065376 U JPH065376 U JP H065376U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
package
drive circuit
stator yoke
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4195992U
Other languages
Japanese (ja)
Inventor
和人 梅林
弘志 池野
豊 鴨木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP4195992U priority Critical patent/JPH065376U/en
Publication of JPH065376U publication Critical patent/JPH065376U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【目的】 安価かつ部品実装工程効率のよい部品を使用
し、部品実装高さを低くおさえながら十分な放熱効果を
得る構成のブラシレスモータを提供する。 【構成】 駆動回路IC1はプリント基板3に表面実装
されており、プリント基板3の実装面はICパッケージ
下面より高い位置にある。駆動回路IC1はプリント基
板3に設けられた穴にパッケージの一部を埋設するとと
もに、パッケージ下面にある放熱用金属板をステータヨ
ーク4に接触させて発熱を伝導し、ICの実装高さを低
くしながらステータヨーク4によって十分な放熱効果を
得る。
(57) [Summary] [Object] To provide a brushless motor that is inexpensive and has a high component mounting process efficiency, and that has a sufficient heat dissipation effect while keeping the component mounting height low. [Structure] The drive circuit IC1 is surface-mounted on a printed circuit board 3, and the mounting surface of the printed circuit board 3 is at a position higher than the lower surface of the IC package. In the drive circuit IC1, a part of the package is embedded in a hole provided in the printed circuit board 3, and a heat radiating metal plate on the lower surface of the package is brought into contact with the stator yoke 4 to conduct heat generation, thereby reducing the mounting height of the IC. At the same time, a sufficient heat radiation effect is obtained by the stator yoke 4.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案は、プリント基板に表面実装された駆動回路ICを持つブラシレスモー タに関する。 The present invention relates to a brushless motor having a drive circuit IC surface-mounted on a printed circuit board.

【0002】[0002]

【従来の技術】[Prior art]

近年、ICを封止するパッケージは小型化が進み、表面実装に対応するパッケ ージも多く使われるようになった。特にモータ内部に実装されるICは小型化の 要求から前記の表面実装対応のパッケージが使われる例が増えている。しかしモ ータで使われるICは比較的大きな許容消費電力が要求されるため実装に工夫が 必要だった。以下に従来のブラシレスモータの駆動回路ICの放熱構造について 説明する。 In recent years, miniaturization of IC encapsulation packages has progressed, and many packages for surface mounting have been used. In particular, for the IC mounted inside the motor, the surface mountable package is increasingly used due to the demand for miniaturization. However, ICs used in motors require relatively large permissible power consumption, so some ingenuity was required for mounting. The heat dissipation structure of the conventional brushless motor drive circuit IC will be described below.

【0003】 図4は従来の駆動回路ICの放熱構造を示すものである。1は駆動回路IC、 2は金属ベースプリント基板である。このような構造は金属ベースプリント基板 が電気配線と放熱の両方を同時に行うため、効率の良い構成であり一般に用いら れている。また、図5は従来の駆動回路ICの放熱構造の他の例を示すものであ る。図5において1は駆動回路IC、3はプリント基板、4はステータヨークで 駆動回路IC1のパッケージが来る位置にプリント基板の厚さに相当する隆起部 が設けてある。5は取付ねじである。プリント基板3には駆動回路IC1のパッ ケージが来る位置に穴があけてあり、この穴の中へステータヨーク4の隆起部を 入りこませることにより駆動回路IC1とステータヨーク4を接触させ取付ねじ によって締め付けることにより放熱を行う構成である。なお8はセットのメカシ ャーシ、9はこのセットに使用される他のプリント基板である。FIG. 4 shows a heat dissipation structure of a conventional drive circuit IC. Reference numeral 1 is a drive circuit IC, and 2 is a metal base printed circuit board. Such a structure is generally used because it has an efficient structure because the metal-based printed circuit board performs both electrical wiring and heat dissipation at the same time. Further, FIG. 5 shows another example of the conventional heat dissipation structure of the drive circuit IC. In FIG. 5, 1 is a drive circuit IC, 3 is a printed circuit board, 4 is a stator yoke, and a raised portion corresponding to the thickness of the printed circuit board is provided at a position where the package of the drive circuit IC1 comes. Reference numeral 5 is a mounting screw. A hole is formed in the printed circuit board 3 at a position where the package of the drive circuit IC1 comes, and by inserting the raised portion of the stator yoke 4 into this hole, the drive circuit IC1 and the stator yoke 4 are brought into contact with each other and a mounting screw is attached. It is configured to radiate heat by tightening with. Reference numeral 8 is a set mechanism, and reference numeral 9 is another printed circuit board used in this set.

【0004】[0004]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら図4に示す従来の構成では、高価な金属ベースプリント基板が必 要であり、かつ金属ベースプリント基板は同一形状のプリント基板を多数個連結 したプリント基板を電子部品を実装した後に個々に分割するという組立方法を使 用することがきわめて難しいので個々の基板ごとに電子部品を実装しなければな らない。そのため電子部品実装に時間がかかるという問題があった。また図5に 示す従来の構成では、駆動回路ICの実装高さがプリント基板の厚さ分だけ高く なるのでそれだけ空間が不足してこのセットに使用する他のプリント基板9をモ ータ周辺に配置できないという問題があった。 However, in the conventional configuration shown in FIG. 4, an expensive metal-based printed circuit board is required, and the metal-based printed circuit board is formed by connecting a number of printed circuit boards of the same shape to each other and then dividing them into individual parts. Since it is extremely difficult to use this assembly method, electronic components must be mounted on each individual board. Therefore, there is a problem that it takes time to mount electronic components. Further, in the conventional configuration shown in FIG. 5, the mounting height of the drive circuit IC is increased by the thickness of the printed circuit board, so the space is insufficient and another printed circuit board 9 used for this set is placed around the motor. There was a problem that it could not be placed.

【0005】 本考案は上記従来の問題点を解決するもので、安価かつ部品実装時間の短い部 品を使用し、IC実装部の部品実装高さを低くおさえながら十分な放熱効果が得 られる構成のブラシレスモータを提供することを目的とする。The present invention solves the above-mentioned problems of the related art, and uses a component that is inexpensive and has a short component mounting time, and a sufficient heat dissipation effect can be obtained while keeping the component mounting height of the IC mounting portion low. It aims at providing the brushless motor of.

【0006】[0006]

【課題を解決するための手段】[Means for Solving the Problems]

この目的を達成するために本考案のブラシレスモータは、駆動回路ICを実装 したプリント基板と、このプリント基板を密着的に支持するとともにプリント基 板をへだててロータマグネットと対向しロータマグネットの磁束通路を形成する 平板状のステータヨークとを備えた軸方向空隙形のブラシレスモータであって、 駆動回路ICは端子部分と、パッケージと、パッケージ下面に固着された放熱用 金属板とを備えかつパッケージ下面は端子部分のプリント基板への実装面より下 側にある構成であり、プリント基板は駆動回路ICのパッケージが通過できる穴 を備えている。 In order to achieve this object, the brushless motor of the present invention has a printed circuit board on which a drive circuit IC is mounted and a printed circuit board that closely adheres to the printed circuit board and extends the printed circuit board so as to face the rotor magnet and to face the magnetic flux path of the rotor magnet. An axial air gap type brushless motor including a flat plate-shaped stator yoke, the drive circuit IC including a terminal portion, a package, and a heat dissipation metal plate fixed to the package lower surface, and the package lower surface. Is located below the mounting surface of the terminal portion on the printed circuit board, and the printed circuit board has holes through which the package of the drive circuit IC can pass.

【0007】[0007]

【作用】[Action]

上記構成により、実装された駆動回路ICのパッケージ下面はプリント基板の 穴を通ってステータヨークに接触し、放熱用金属板を通して駆動回路ICの発熱 をステータヨークに伝導する。 With the above configuration, the lower surface of the package of the mounted drive circuit IC contacts the stator yoke through the hole of the printed circuit board, and the heat generated by the drive circuit IC is conducted to the stator yoke through the metal plate for heat dissipation.

【0008】[0008]

【実施例】【Example】

(実施例1) 以下本考案の一実施例について、図面により説明する。図1において1は表面 実装された駆動回路IC、3はプリント基板、4はステータヨーク、5は取付ね じである。駆動回路IC1の端子部分のプリント基板3への実装面はパッケージ 下面より高い位置にある。駆動回路ICはパッケージ下面放熱用金属板が固着さ れており穴のあけられたプリント基板3に表面実装されており、パッケージの一 部をこのプリント基板の穴に埋めこむとともに、パッケージ下面の放熱用金属板 をステータヨーク4に接触させている。この両金属の密着度を上げて熱伝導を良 くするために取付ねじにより駆動回路IC1とステータヨーク4を締め付けてい る。 (Embodiment 1) An embodiment of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a surface-mounted drive circuit IC, 3 is a printed circuit board, 4 is a stator yoke, and 5 is a mounting screw. The mounting surface of the terminal portion of the drive circuit IC1 on the printed circuit board 3 is located higher than the lower surface of the package. The drive circuit IC is surface-mounted on the printed circuit board 3 with a hole in which a heat radiating metal plate on the lower surface of the package is fixed, and a part of the package is embedded in the hole of this printed circuit board and the heat radiation on the lower surface of the package is performed. The metal plate for use is in contact with the stator yoke 4. The drive circuit IC 1 and the stator yoke 4 are fastened with mounting screws in order to increase the degree of adhesion between the two metals and improve heat conduction.

【0009】 このように本実施例のブラシレスモータは駆動回路IC1の発熱を直接ステー タヨーク4に伝導するので紙フェノール等のプリント基板を使用でき、安価であ るのみならず同一形状のプリント基板を多数個連結したプリント基板を作成し、 電子部品を実装した後にプリント基板を個片に分割するという組立方法が可能な ため電子部品実装工程の所要時間が大幅に短縮できる。As described above, in the brushless motor of the present embodiment, the heat generated by the drive circuit IC1 is directly transmitted to the status yoke 4, so that a printed circuit board made of paper phenol or the like can be used. Since an assembly method is possible in which a printed circuit board with a large number of connections is created and the electronic circuit board is mounted and then the printed circuit board is divided into individual pieces, the time required for the electronic component mounting process can be greatly reduced.

【0010】 また、プリント基板3に設けた穴にICパッケージの一部を埋設するため、I Cの実装高さを低くおさえることができるという効果もある。Further, since a part of the IC package is embedded in the hole provided in the printed circuit board 3, there is also an effect that the mounting height of IC can be kept low.

【0011】 以上のように本実施例によれば、駆動回路IC1はパッケージ下面に固着され た放熱用金属板を備えかつパッケージ下面はプリント基板3の実装面より下側に あり、プリント基板3には駆動回路IC1のパッケージが通過できる穴があり、 実装された駆動回路IC1のパッケージ下面はこの穴を通ってステータヨーク4 に接触し、放熱用金属板を通して発熱をステータヨーク4に伝導する。As described above, according to the present embodiment, the drive circuit IC1 includes the metal plate for heat dissipation fixed to the lower surface of the package, and the lower surface of the package is below the mounting surface of the printed circuit board 3, Has a hole through which the package of the drive circuit IC1 can pass, the lower surface of the package of the mounted drive circuit IC1 contacts the stator yoke 4 through this hole, and conducts heat to the stator yoke 4 through the metal plate for heat dissipation.

【0012】 (実施例2) 以下本考案の第2の実施例について、図面により説明する。図2は本考案の他 の実施例の断面図である。図1と同じ働きをする部品には同じ番号を付してある 。6は熱伝導率の高い粘弾性材料または接着剤である。図2において、熱伝導率 の高い粘弾性材料または接着剤6が駆動回路IC1の放熱用金属板とステータヨ ーク4の間に挟みこまれて変形することにより接触面積が広くなるため、外部よ り締付けることなく前記両金属間の熱伝導率を上げることができ、十分な放熱効 果を得ることができる。Second Embodiment A second embodiment of the present invention will be described below with reference to the drawings. FIG. 2 is a sectional view of another embodiment of the present invention. Parts having the same functions as in FIG. 1 are given the same numbers. 6 is a viscoelastic material or adhesive having high thermal conductivity. In FIG. 2, a viscoelastic material or adhesive 6 having a high thermal conductivity is sandwiched between the heat radiating metal plate of the drive circuit IC1 and the stator yoke 4 to be deformed, so that the contact area is widened. The thermal conductivity between the two metals can be increased without tightening, and a sufficient heat radiation effect can be obtained.

【0013】 (実施例3) 以下本考案の第3の実施例について、図面により説明する。図3は本考案の他 の実施例の断面図である。図1と同じ働きをする部品には同じ番号を付してある 。7は金属製の板ばねまたは金属製繊維、箔等の充填材である。図3において金 属製の板ばねまたは金属製繊維、箔等の充填材7は駆動回路IC1の放熱用金属 板とステータヨーク4の間に挟みこまれることにより弾性変形または塑性変形し 前記両金属と接触するため、外部より締付けることなく両金属間の熱伝導率を上 げることができ、十分な放熱効果を得ることができる。Third Embodiment A third embodiment of the present invention will be described below with reference to the drawings. FIG. 3 is a sectional view of another embodiment of the present invention. Parts having the same functions as in FIG. 1 are given the same numbers. Reference numeral 7 is a metal leaf spring or a filler such as metal fiber or foil. In FIG. 3, a metal leaf spring or a filler 7 such as metal fiber or foil is elastically or plastically deformed by being sandwiched between the heat radiating metal plate of the drive circuit IC1 and the stator yoke 4, and the metal Since it comes into contact with the metal, the thermal conductivity between the two metals can be increased without tightening from the outside, and a sufficient heat radiation effect can be obtained.

【0014】[0014]

【考案の効果】[Effect of device]

以上のように本考案は、駆動回路ICの放熱用金属板をステータヨークに接触 させて発熱を伝導することにより良好な冷却を得、さらに安価かつ電子部品実装 工程の効率のよい紙フェノール等のプリント基板を使用しながらICの実装高さ を低くでき、優れたブラシレスモータを提供するものである。 As described above, the present invention obtains good cooling by bringing the heat radiating metal plate of the drive circuit IC into contact with the stator yoke and conducting heat generation. Further, the cost is low and paper phenol or the like which is efficient in the electronic component mounting process is used. It is possible to reduce the mounting height of an IC while using a printed circuit board, and to provide an excellent brushless motor.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案ブラシレスモータの第1の実施例の断面
FIG. 1 is a sectional view of a brushless motor according to a first embodiment of the present invention.

【図2】本考案ブラシレスモータの第2の実施例の断面
FIG. 2 is a sectional view of a brushless motor according to a second embodiment of the present invention.

【図3】本考案ブラシレスモータの第3の実施例の断面
FIG. 3 is a sectional view of a brushless motor according to a third embodiment of the present invention.

【図4】従来のブラシレスモータ用ICの放熱構造を示
す断面図
FIG. 4 is a cross-sectional view showing a heat dissipation structure of a conventional brushless motor IC.

【図5】従来のブラシレスモータの他の放熱構造を表わ
す断面図
FIG. 5 is a sectional view showing another heat dissipation structure of a conventional brushless motor.

【符号の説明】[Explanation of symbols]

1 駆動回路IC 3 プリント基板 4 ステータヨーク 6 熱伝導率の高い粘弾性材料または接着剤 7 金属製の板ばねまたは金属製繊維、箔等の充填材 1 Drive Circuit IC 3 Printed Circuit Board 4 Stator Yoke 6 Viscoelastic Material or Adhesive with High Thermal Conductivity 7 Metal Leaf Spring or Metal Fiber, Filler such as Foil

Claims (3)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】駆動回路ICを実装したプリント基板と、
このプリント基板を密着的に支持するとともにプリント
基板をへだててロータマグネットと対向しロータマグネ
ットの磁束通路を形成する平板状のステータヨークとを
備えた軸方向空隙形のブラシレスモータにおいて、上記
駆動回路ICは端子部分と、パッケージと、パッケージ
下面に固着された放熱用金属板とを備えかつパッケージ
下面は端子部分のプリント基板への実装面より下側にあ
り、上記プリント基板は駆動回路ICのパッケージが通
過できる穴を備え、実装された駆動回路ICのパッケー
ジ下面はこの穴を通ってステータヨークに接触し、放熱
用金属板を通して駆動回路ICの発熱をステータヨーク
に伝導するブラシレスモータ。
1. A printed circuit board on which a drive circuit IC is mounted,
In the brushless motor of the axial gap type, which closely supports the printed circuit board and extends the printed circuit board to face the rotor magnet, and a flat plate-shaped stator yoke that forms a magnetic flux path of the rotor magnet, the drive circuit IC Is provided with a terminal portion, a package, and a heat-dissipating metal plate fixed to the lower surface of the package, and the lower surface of the package is below the mounting surface of the terminal portion on the printed circuit board. A brushless motor that has a hole through which the package lower surface of the mounted drive circuit IC comes into contact with the stator yoke through this hole and conducts the heat generated by the drive circuit IC to the stator yoke through the metal plate for heat dissipation.
【請求項2】放熱用金属板とステータヨークとの間に介
在する熱伝導率の高い粘弾性材料または接着剤を備えた
請求項1記載のブラシレスモータ。
2. The brushless motor according to claim 1, further comprising a viscoelastic material having a high thermal conductivity or an adhesive which is interposed between the heat radiating metal plate and the stator yoke.
【請求項3】放熱用金属板とステータヨークとの間に挿
入された金属製の板ばねまたは金属製繊維、箔等の充填
材を備えた請求項1記載のブラシレスモータ。
3. A brushless motor according to claim 1, further comprising a metal leaf spring inserted between the heat radiating metal plate and the stator yoke, or a filler such as metal fiber or foil.
JP4195992U 1992-06-18 1992-06-18 Brushless motor Pending JPH065376U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4195992U JPH065376U (en) 1992-06-18 1992-06-18 Brushless motor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4195992U JPH065376U (en) 1992-06-18 1992-06-18 Brushless motor

Publications (1)

Publication Number Publication Date
JPH065376U true JPH065376U (en) 1994-01-21

Family

ID=12622733

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4195992U Pending JPH065376U (en) 1992-06-18 1992-06-18 Brushless motor

Country Status (1)

Country Link
JP (1) JPH065376U (en)

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