JPH065463A - Resin composition for capacitor - Google Patents
Resin composition for capacitorInfo
- Publication number
- JPH065463A JPH065463A JP16093392A JP16093392A JPH065463A JP H065463 A JPH065463 A JP H065463A JP 16093392 A JP16093392 A JP 16093392A JP 16093392 A JP16093392 A JP 16093392A JP H065463 A JPH065463 A JP H065463A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor
- resin composition
- zinc
- film
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 32
- 239000011342 resin composition Substances 0.000 title claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims abstract description 14
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 14
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims abstract description 7
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052725 zinc Inorganic materials 0.000 abstract description 12
- 239000011701 zinc Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000002184 metal Substances 0.000 abstract description 10
- 229910045601 alloy Inorganic materials 0.000 abstract description 8
- 239000000956 alloy Substances 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 238000007789 sealing Methods 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000007740 vapor deposition Methods 0.000 description 11
- 238000005260 corrosion Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000004382 potting Methods 0.000 description 3
- 239000000080 wetting agent Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- HTZCNXWZYVXIMZ-UHFFFAOYSA-M benzyl(triethyl)azanium;chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC1=CC=CC=C1 HTZCNXWZYVXIMZ-UHFFFAOYSA-M 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- LWMIDUUVMLBKQF-UHFFFAOYSA-N 4-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound CC1CC=CC2C(=O)OC(=O)C12 LWMIDUUVMLBKQF-UHFFFAOYSA-N 0.000 description 1
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 229920006397 acrylic thermoplastic Polymers 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- WHHGLZMJPXIBIX-UHFFFAOYSA-N decabromodiphenyl ether Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1OC1=C(Br)C(Br)=C(Br)C(Br)=C1Br WHHGLZMJPXIBIX-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 235000010215 titanium dioxide Nutrition 0.000 description 1
Landscapes
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はコンデンサ用樹脂組成物
に関する。特に、金属蒸着膜に対する耐腐食性のよいコ
ンデンサ用エポキシ樹脂組成物に関する。FIELD OF THE INVENTION The present invention relates to a resin composition for capacitors. In particular, the present invention relates to an epoxy resin composition for capacitors which has good corrosion resistance to a metal vapor deposition film.
【０００２】[0002]
【従来の技術】一般に金属蒸着化プラスチックフィルム
コンデンサ等のコンデンサは、外的衝撃から保護するた
め樹脂によって封止されている。封止は、通常エポキシ
樹脂やフェノール樹脂を用いてディッピングやポッティ
ングによって行われる。このうちエポキシ樹脂は、電気
特性や信頼性が優れているため主流となっている。例え
ば、特開昭５９−１４４１１９号公報には、芳香族系エ
ポキシ樹脂からなる主剤と、硬化剤として酸無水物ある
いは芳香族アミンをそれぞれ用いてなる２液混合型エポ
キシ樹脂で封止した金属蒸着化フィルムコンデンサが開
示されている。また、特開平３−２４６８１３号公報に
は、亜鉛蒸着膜に対する耐腐食性に優れ、しかも指触硬
化性や濡れ性に優れたフィルムコンデンサ用樹脂組成物
が開示されている。このフィルムコンデンサ用樹脂組成
物は、主剤のエポキシ樹脂に消泡剤と湿潤剤を配合する
ことによってフィルムへの濡れ性は向上したものの、亜
鉛蒸着膜への耐腐食性は必ずしも充分ではなかった。す
なわち、この樹脂組成物を用いて封止した金属蒸着化プ
ラスチックフィルムコンデンサは、アルミニウム蒸着膜
に対しては腐食が起らなかったが、亜鉛蒸着膜や亜鉛−
アルミニウム合金蒸着膜に対しては部分的に腐食溶解が
起り、耐湿信頼性試験後のコンデンサ容量変化率が大き
いという欠点があった。2. Description of the Related Art Generally, a capacitor such as a metal vapor-deposited plastic film capacitor is sealed with a resin to protect it from external impact. The sealing is usually performed by dipping or potting using an epoxy resin or a phenol resin. Of these, epoxy resins have become the mainstream because of their excellent electrical characteristics and reliability. For example, JP-A-59-144119 discloses a metal vapor deposition which is sealed with a two-component mixed type epoxy resin containing a base compound made of an aromatic epoxy resin and an acid anhydride or an aromatic amine as a curing agent. Film capacitors are disclosed. Further, Japanese Patent Laid-Open No. 3-246813 discloses a resin composition for a film capacitor, which has excellent corrosion resistance to a zinc vapor-deposited film and also has excellent finger-curing property and wettability. Although the resin composition for a film capacitor has improved wettability to a film by mixing an antifoaming agent and a wetting agent into an epoxy resin as a main component, its corrosion resistance to a zinc vapor deposition film is not always sufficient. That is, the metal vapor-deposited plastic film capacitor sealed with this resin composition did not corrode the aluminum vapor-deposited film, but the zinc vapor-deposited film or zinc-
The aluminum alloy vapor-deposited film was partially corroded and dissolved, and there was a drawback that the rate of change in capacitor capacity after the moisture resistance reliability test was large.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、上記の欠点
を解消するためになされたもので、亜鉛、アルミニウ
ム、これらの合金等の金属層（特に蒸着面）を有するコ
ンデンサの封止等により、その層を腐触させないコンデ
ンサ用エポキシ樹脂組成物を提供することを目的とす
る。The present invention has been made to solve the above-mentioned drawbacks, and is achieved by sealing a capacitor having a metal layer (in particular, a vapor deposition surface) of zinc, aluminum, an alloy thereof, or the like. An object of the present invention is to provide an epoxy resin composition for capacitors that does not corrode the layer.
【０００４】[0004]
【課題を解決するための手段】本発明におけるコンデン
サ用樹脂組成物は、（Ａ）エポキシ樹脂、（Ｂ）硬化剤
としてメチルテトラヒドロ無水フタル酸、及び（Ｃ）硬
化促進剤として２，４，６−トリス（ジメチルアミノメ
チル）フェノールを含有してなるものである。The resin composition for capacitors according to the present invention comprises (A) an epoxy resin, (B) a curing agent, methyltetrahydrophthalic anhydride, and (C) a curing accelerator, 2,4,6. -It contains tris (dimethylaminomethyl) phenol.
【０００５】本発明に用いるエポキシ樹脂としては、一
分子中に２個以上のエポキシ基を有する化合物であり、
たとえばビスフェノールＡのジグリシジルエーテル、ビ
スフェノールＦのジグリシジルエーテル、ノボラック樹
脂のポリグリシジルエーテル、多価アルコールのポリグ
リシジルエーテル、ポリカルボン酸のポリグリシジルエ
ステル、ポリグリシジルアミン、脂肪族環状エポキシな
どがある。これらはそれぞれ単独で、あるいは複数混合
して使用することができる。また必要に応じて一分子中
に１個のエポキシ基を有する化合物を一分子中に２個以
上のエポキシ基を有する化合物１００重量部に対して０
〜５０重量部添加してもよい。The epoxy resin used in the present invention is a compound having two or more epoxy groups in one molecule,
Examples thereof include diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, polyglycidyl ether of novolac resin, polyglycidyl ether of polyhydric alcohol, polyglycidyl ester of polycarboxylic acid, polyglycidyl amine, and aliphatic cyclic epoxy. These may be used alone or in combination of two or more. Further, if necessary, the compound having one epoxy group in one molecule is 0 with respect to 100 parts by weight of the compound having two or more epoxy groups in one molecule.
˜50 parts by weight may be added.
【０００６】本発明の硬化剤として用いるメチルテトラ
ヒドロ無水フタル酸としては４−メチルテトラヒドロ無
水フタル酸、３−メチルテトラヒドロ無水フタル酸等が
あり、これらの混合物が好ましい。特に、室温で液状の
異性体混合物が好ましい。メチルテトラヒドロ無水フタ
ル酸としては、ＨＮ−２０００、ＨＮ−２２００及びＨ
Ｎ−２２００Ｒ（いずれも日立化成工業株式会社商品
名）等の市販品が使用できる。Examples of methyltetrahydrophthalic anhydride used as the curing agent of the present invention include 4-methyltetrahydrophthalic anhydride and 3-methyltetrahydrophthalic anhydride, and a mixture thereof is preferable. Particularly, an isomer mixture which is liquid at room temperature is preferable. Methyltetrahydrophthalic anhydride includes HN-2000, HN-2200 and HN-2000.
Commercial products such as N-2200R (all are trade names of Hitachi Chemical Co., Ltd.) can be used.
【０００７】メチルテトラヒドロ無水フタル酸は、エポ
キシ樹脂のエポキシ基１当量に対して０．６〜１．０モ
ル使用するのが好ましく、特に０．８〜０．９モル使用
するのが好ましい。Methyltetrahydrophthalic anhydride is preferably used in an amount of 0.6 to 1.0 mol, particularly preferably 0.8 to 0.9 mol, based on 1 equivalent of epoxy groups of the epoxy resin.
【０００８】本発明の硬化促進剤として用いる２，４，
６−トリス（ジメチルアミノメチル）フェノールの使用
量は、フィルムコンデンサの硬化性や硬化特性と樹脂組
成物のポットライフとのバランスによって決るため一概
に言えないが、エポキシ樹脂１００重量部に対して０．
１〜３．０重量部の範囲で使用することが好ましい。2,4 used as the curing accelerator of the present invention
The amount of 6-tris (dimethylaminomethyl) phenol used is uncertain because it is determined by the balance between the curability of the film capacitor and the curing characteristics and the pot life of the resin composition, but it cannot be stated unconditionally. ．
It is preferably used in the range of 1 to 3.0 parts by weight.
【０００９】本発明のフィルムコンデンサ用樹脂組成物
には、必要に応じて他の添加剤等を配合することもでき
る。そのような添加剤としては、シリカ、アルミナ、水
和アルミナ、クレー等の無機フィラー、カーボンブラッ
ク、ベンガラ、チタンホワイト等の顔料、シリコーン系
や弗素系等の消泡剤、アルキルカルボン酸エステルやア
クリルのポリリン酸エステル等の湿潤剤、ヘキサブロム
ベンゼンやデカブロムジフェニルエーテル等の難燃剤等
が挙げられる。If desired, the resin composition for a film capacitor of the present invention may contain other additives. Such additives include inorganic fillers such as silica, alumina, hydrated alumina, and clay, pigments such as carbon black, red iron oxide, and titanium white, antifoaming agents such as silicone-based and fluorine-based agents, alkylcarboxylic acid esters and acrylics. Examples thereof include wetting agents such as polyphosphoric acid esters and flame retardants such as hexabromobenzene and decabromodiphenyl ether.
【００１０】本発明におけるコンデンサ用樹脂組成物
は、亜鉛、アルミニウム、これらの合金等の金属の層
（特に、蒸着面）を有するコンデンサ、特に、フィルム
コンデンサの封止等に使用される。封止方法としては、
ポッティング、ディッピング等があり、ディッピングに
おいて上記樹脂組成物は、含浸用又は外装用として使用
できる。また、上記金属層に上記樹脂組成物をコーティ
ングしてもよい。The resin composition for capacitors in the present invention is used for sealing a capacitor having a metal layer (in particular, a vapor-deposited surface) of zinc, aluminum or an alloy thereof, particularly a film capacitor. As a sealing method,
There are potting, dipping, and the like, and in the dipping, the resin composition can be used for impregnation or for exterior. Further, the metal layer may be coated with the resin composition.
【００１１】[0011]
【実施例】次に本発明を実施例によって説明するが、本
発明はこれらの実施例によって限定されるものではな
い。以下の実施例及び比較例において、「部」とは「重
量部」を意味する。EXAMPLES Next, the present invention will be described with reference to examples, but the present invention is not limited to these examples. In the following Examples and Comparative Examples, "part" means "part by weight".
【００１２】実施例１ エピコート８１５（油化シェルエポキシ株式会社商品
名、エポキシ樹脂）１００部、ＨＮ−２２００Ｒ（日立
化成工業株式会社商品名、液状メチルテトラヒドロ無水
フタル酸）８０部、硬化促進剤として２，４，６−トリ
ス（ジメチルアミノメチル）フェノール２部、ＴＳＡ７
２０（東芝シリコーン株式会社商品名、消泡剤）０．１
部、モダフロー（モンサント製湿潤剤）０．５部、及び
ＲＤ−８（株式会社龍森商品名、溶融シリカ）１００部
を均一に混合し、フィルムコンデンサ用樹脂組成物を作
成した。これを脱泡し、巻回した亜鉛蒸着ポリエステル
フィルムコンデンサ（亜鉛蒸着膜がポリエチレンテレフ
タレートフィルムに表面抵抗値が３．５〜４Ωとなるよ
うに真空蒸着により形成されている）をケースに入れて
真空下ポッテイングし、８０℃で３時間、ついで１００
℃で３時間の加熱条件で硬化させ封止を完了した。この
後、封止樹脂を砕いて除去した後、フィルムコンデンサ
をひろげて観察したところ、亜鉛蒸着面の腐食溶解は全
く認められなかった。Example 1 Epicoat 815 (Okaka Shell Epoxy Co., Ltd., trade name, epoxy resin) 100 parts, HN-2200R (Hitachi Chemical Co., Ltd. trade name, liquid methyltetrahydrophthalic anhydride) 80 parts, as a curing accelerator 2,4,6-Tris (dimethylaminomethyl) phenol 2 parts, TSA7
20 (Toshiba Silicone Co., Ltd. product name, antifoaming agent) 0.1
Part, modaflow (Monsanto product wetting agent) 0.5 part, and RD-8 (Tatsumori Co., Ltd. trade name, fused silica) 100 parts were uniformly mixed to prepare a resin composition for film capacitors. This is degassed, and a zinc-deposited polyester film capacitor wound (the zinc-deposited film is formed on the polyethylene terephthalate film by vacuum vapor deposition so that the surface resistance value is 3.5 to 4Ω) is put in a case and vacuumed. Potting down, 80 ° C for 3 hours, then 100
The sealing was completed by curing under heating conditions of 3 ° C. for 3 hours. After this, the sealing resin was crushed and removed, and then the film capacitor was expanded and observed, and no corrosive dissolution of the zinc vapor deposition surface was observed.
【００１３】実施例２ 実施例１において亜鉛蒸着ポリエステルフィルムコンデ
ンサの代わりに、亜鉛−アルミニウムアロイ蒸着ポリエ
ステルフィルムコンデンサ〔亜鉛−アルミニウム合金を
ポリエチレンテレフタレートフィルムの表面に表面抵抗
値が３．５〜４Ωとなるように真空蒸着したもの、亜鉛
／アルミニウム＝９０／１０（重量比）〕を使用したこ
と以外は実施例１に準じて行った。この結果、亜鉛−ア
ルミニウムアロイ蒸着面の腐触溶解は全く認められなか
った。Example 2 Instead of the zinc vapor-deposited polyester film capacitor in Example 1, a zinc-aluminum alloy vapor-deposited polyester film capacitor [zinc-aluminum alloy on the surface of a polyethylene terephthalate film has a surface resistance value of 3.5 to 4Ω]. As in Example 1, except that the vacuum-deposited product, zinc / aluminum = 90/10 (weight ratio)] was used. As a result, corrosion dissolution on the zinc-aluminum alloy vapor deposition surface was not observed at all.
【００１４】実施例３ 実施例１において亜鉛蒸着ポリエステルフィルムコンデ
ンサの代わりにアルミニウム蒸着ポリエステルフィルム
コンデンサ（アルミニウムをポリエチレンテレフタレー
トフィルムの表面に表面抵抗値が３．５〜４Ωとなるよ
うに真空蒸着したもの）を使用したこと以外は実施例１
に準じて行った。この結果、アルミニウム蒸着面の腐触
溶解は全く認められなかった。Example 3 An aluminum-deposited polyester film capacitor was used instead of the zinc-deposited polyester film capacitor in Example 1 (aluminum was vacuum-deposited on the surface of a polyethylene terephthalate film so that the surface resistance value was 3.5 to 4Ω). Example 1 except that
It was carried out according to. As a result, corrosion dissolution on the aluminum vapor deposition surface was not observed at all.
【００１５】比較例１ 硬化促進剤として２，４，６−トリス（ジメチルアミノ
メチル）フェノールの代わりに１−シアノエチル−２−
エチル−４−メチルイミダゾールを２部使用し、実施例
１又は実施例２に準じて行った。この結果、いずれの場
合も、亜鉛蒸着面又は亜鉛−アルミニウムアロイ蒸着面
が部分的に腐触溶解していた。COMPARATIVE EXAMPLE 1 As a curing accelerator, 1-cyanoethyl-2- was used instead of 2,4,6-tris (dimethylaminomethyl) phenol.
It carried out according to Example 1 or Example 2 using 2 parts of ethyl-4-methylimidazole. As a result, in all cases, the zinc vapor deposition surface or the zinc-aluminum alloy vapor deposition surface was partially corroded and dissolved.
【００１６】比較例２ 硬化促進剤として２，４，６−トリス（ジメチルアミノ
メチル）フェノールの代わりにベンジルジメチルアミ
ン、２−エチル−４−メチルイミダゾール又はベンジル
トリエチルアンモニウムクロライドをそれぞれ別々に２
部使用し、他は実施例１に準じて行った。この結果、い
ずれの場合も亜鉛蒸着面が完全に腐触溶解していた。Comparative Example 2 Instead of 2,4,6-tris (dimethylaminomethyl) phenol as a curing accelerator, benzyldimethylamine, 2-ethyl-4-methylimidazole or benzyltriethylammonium chloride was used separately for 2 times.
Part was used, and the others were carried out according to Example 1. As a result, in all cases, the zinc vapor deposition surface was completely corroded and dissolved.
【００１７】[0017]
【発明の効果】請求項１におけるコンデンサ用樹脂組成
物は、金属層を腐触させないため亜鉛、アルミニウム等
又はこれらの合金からなる金属層を有するコンデンサの
封止、保護に適している。The resin composition for a capacitor according to claim 1 is suitable for sealing and protecting a capacitor having a metal layer made of zinc, aluminum or the like or an alloy thereof because it does not corrode the metal layer.
Claims (1)
てメチルテトラヒドロ無水フタル酸、及び（Ｃ）硬化促
進剤として２，４，６−トリス（ジメチルアミノメチ
ル）フェノールを含有してなるコンデンサ用樹脂組成
物。1. A capacitor containing (A) an epoxy resin, (B) a curing agent, methyltetrahydrophthalic anhydride, and (C) a curing accelerator, 2,4,6-tris (dimethylaminomethyl) phenol. Resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16093392A JPH065463A (en) | 1992-06-19 | 1992-06-19 | Resin composition for capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16093392A JPH065463A (en) | 1992-06-19 | 1992-06-19 | Resin composition for capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH065463A true JPH065463A (en) | 1994-01-14 |
Family
ID=15725386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16093392A Pending JPH065463A (en) | 1992-06-19 | 1992-06-19 | Resin composition for capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065463A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013094028A1 (en) * | 2011-12-20 | 2015-04-27 | トヨタ自動車株式会社 | Semiconductor module |
-
1992
- 1992-06-19 JP JP16093392A patent/JPH065463A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013094028A1 (en) * | 2011-12-20 | 2015-04-27 | トヨタ自動車株式会社 | Semiconductor module |
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