JPH0656165A - Embossed tape for semiconductor device transportation - Google Patents
Embossed tape for semiconductor device transportationInfo
- Publication number
- JPH0656165A JPH0656165A JP20486992A JP20486992A JPH0656165A JP H0656165 A JPH0656165 A JP H0656165A JP 20486992 A JP20486992 A JP 20486992A JP 20486992 A JP20486992 A JP 20486992A JP H0656165 A JPH0656165 A JP H0656165A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- tape
- embossed tape
- magnet
- embossed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
- H10P72/741—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including a cavity for storing a finished or partly finished device during manufacturing or mounting, e.g. for an IC package or for a chip
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packages (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
(57)【要約】
【目的】 半導体デバイスを汚すことなく、永久的に使
用できる半導体デバイス搬送用エンボステープを提供す
る。
【構成】 テープ本体部６に複数のくぼみ部７を設け、
前記くぼみ部７の底部にはおのおの磁石９が設置され、
半導体デバイス８を磁石により吸着して固定・収納する
ことができる。
(57) [Abstract] [Purpose] To provide an embossed tape for transporting a semiconductor device, which can be used permanently without contaminating the semiconductor device. [Structure] The tape body 6 is provided with a plurality of recesses 7,
Each magnet 9 is installed on the bottom of the hollow portion 7,
The semiconductor device 8 can be attracted by a magnet to be fixed and housed.
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体デバイスの搬送
用に使用するエンボステープに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed tape used for carrying semiconductor devices.
【０００２】[0002]
【従来の技術】従来より半導体デバイスの搬送用として
は、マガジン・トレー・テープがあった。テープにはエ
ンボステープ紙テープなどがある。2. Description of the Related Art Conventionally, magazine tray tapes have been used for transporting semiconductor devices. Tapes include embossed tape and paper tape.
【０００３】以下、従来のエンボステープについて説明
する。図２は従来のエンボステープの断面図であり、テ
ープ本体部１に半導体デバイス２を収納するくぼみ部３
が設けられ、前記くぼみ部３の底部には隆起部４が設け
られている。そして前記隆起部４上には、粘着テープ５
が設けられている。The conventional embossed tape will be described below. FIG. 2 is a cross-sectional view of a conventional embossed tape, in which a tape body 1 is provided with a recess 3 for housing a semiconductor device 2.
Is provided, and a raised portion 4 is provided at the bottom of the recess 3. Then, an adhesive tape 5 is provided on the raised portion 4.
Is provided.
【０００４】以上のように構成されたエンボステープに
ついて、以下、その動作について説明する。The operation of the embossed tape having the above structure will be described below.
【０００５】まず、本体１は、半導体デバイス２を収納
しやすいように半導体デバイス２の大きさに合わせ、く
ぼみ部３をつくる。くぼみ部３の底部には、半導体デバ
イス２が動きにくいように、隆起部４を形成している。
隆起部４になった底部の表面には、粘着テープ５が設け
られており、これで半導体デバイス２が固定される。First, the main body 1 is formed with a recess 3 in accordance with the size of the semiconductor device 2 so that the semiconductor device 2 can be easily housed. A ridge 4 is formed on the bottom of the recess 3 so that the semiconductor device 2 is hard to move.
An adhesive tape 5 is provided on the surface of the bottom that has become the raised portion 4, and the semiconductor device 2 is fixed by this.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の構成では粘着テープを使用しているため、組立て時
に半導体デバイスに粘着テープが付着するという課題が
あった。又、粘着テープを使用しているため、永久的に
使用するということは不可能である。However, since the above-mentioned conventional structure uses the adhesive tape, there is a problem that the adhesive tape adheres to the semiconductor device during assembly. Moreover, since the adhesive tape is used, it cannot be used permanently.
【０００７】本発明は、上記従来の課題を解決するもの
で、半導体デバイスに粘着テープが付着することなく、
永久的に使用できる半導体デバイス搬送用エンボステー
プを提供することを目的とする。The present invention solves the above-mentioned problems of the prior art, in which an adhesive tape is not attached to a semiconductor device,
An object of the present invention is to provide an embossed tape for semiconductor device transportation that can be used permanently.
【０００８】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明の半導体デバイス搬送用エンボステープは、粘
着テープの代わりに磁石を使用している。In order to achieve this object, the semiconductor device carrying embossed tape of the present invention uses a magnet instead of an adhesive tape.
【０００９】[0009]
【作用】この構成によって、磁石が半導体デバイスを固
定するため、粘着テープが付着することなく組立てが行
なえ、エンボステープは永久的に使用することができ
る。With this structure, since the magnet fixes the semiconductor device, the assembly can be performed without attaching the adhesive tape, and the embossed tape can be used permanently.
【００１０】[0010]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１１】図１は、本発明の一実施例における半導体
デバイス搬送用エンボステープの断面図を示すものであ
る。FIG. 1 is a sectional view of an embossed tape for carrying a semiconductor device according to an embodiment of the present invention.
【００１２】図１において、テープ本体部６には複数の
くぼみ部７が形成されており、前記くぼみ部７の底部に
は半導体デバイス８の大きさに合わせた磁石９が設置さ
れている。In FIG. 1, a plurality of recesses 7 are formed in the tape body 6, and a magnet 9 matching the size of the semiconductor device 8 is installed on the bottom of the recesses 7.
【００１３】以上のように構成された本実施例の半導体
デバイス搬送用エンボステープについて、以下その動作
について説明する。The operation of the embossed tape for carrying a semiconductor device of the present embodiment having the above-described structure will be described below.
【００１４】まず図１において、本体部６に半導体デバ
イス８を収納するためのくぼみ部７がある。くぼみ部７
の底部に半導体デバイス固定用の磁石９を付ける。半導
体デバイス８底部にある磁石９は、半導体デバイス８の
ダイスパッド（鉄）と引き付け合い、半導体デバイス８
は固定される。又、磁石９の厚みは半導体デバイス８の
アウターリードとモールド樹脂底部の間隔と同一にする
と、半導体デバイス８はより固定される。First, in FIG. 1, the main body 6 has a recess 7 for accommodating the semiconductor device 8. Hollow 7
A magnet 9 for fixing the semiconductor device is attached to the bottom of the. The magnet 9 at the bottom of the semiconductor device 8 attracts the die pad (iron) of the semiconductor device 8, and the semiconductor device 8
Is fixed. Further, when the thickness of the magnet 9 is made equal to the distance between the outer lead of the semiconductor device 8 and the bottom of the molding resin, the semiconductor device 8 is more fixed.
【００１５】[0015]
【発明の効果】本発明は、テープ本体部に形成したくぼ
み部に磁石を設けることにより従来のように組立て時に
粘着テープが付着せず、エンボステープを永久的に使用
することができる優れた半導体デバイス搬送用エンボス
テープを実現できるものである。As described above, the present invention provides an excellent semiconductor in which the embossed tape can be used permanently because the adhesive tape is not attached during assembly as in the prior art by providing the magnet in the recess formed in the tape body. An embossed tape for device transportation can be realized.
【図１】本発明の一実施例における半導体デバイス搬送
用エンボステープの断面図FIG. 1 is a cross-sectional view of an embossed tape for carrying a semiconductor device according to an embodiment of the present invention.
【図２】従来の半導体デバイス搬送用エンボステープの
断面図FIG. 2 is a sectional view of a conventional embossed tape for transporting semiconductor devices.
１ 本体部 ２ 半導体デバイス ３ くぼみ部 ４ 隆起部 ５ 粘着テープ ６ 本体部 ７ くぼみ部 ８ 半導体デバイス ９ 磁石 DESCRIPTION OF SYMBOLS 1 Main body 2 Semiconductor device 3 Recessed portion 4 Raised portion 5 Adhesive tape 6 Main body portion 7 Recessed portion 8 Semiconductor device 9 Magnet
Claims (1)
ぼみ部の底部に半導体デバイスの大きさに合わせた磁石
とを有することを特徴とする半導体デバイス搬送用エン
ボステープ。1. An embossed tape for transporting a semiconductor device, wherein the tape body has a plurality of recesses and a bottom portion of the recesses has a magnet adapted to the size of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20486992A JPH0656165A (en) | 1992-07-31 | 1992-07-31 | Embossed tape for semiconductor device transportation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20486992A JPH0656165A (en) | 1992-07-31 | 1992-07-31 | Embossed tape for semiconductor device transportation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0656165A true JPH0656165A (en) | 1994-03-01 |
Family
ID=16497750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20486992A Pending JPH0656165A (en) | 1992-07-31 | 1992-07-31 | Embossed tape for semiconductor device transportation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0656165A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110155465A (en) * | 2019-06-13 | 2019-08-23 | 武汉华星光电半导体显示技术有限公司 | A kind of turnover pallet |
-
1992
- 1992-07-31 JP JP20486992A patent/JPH0656165A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110155465A (en) * | 2019-06-13 | 2019-08-23 | 武汉华星光电半导体显示技术有限公司 | A kind of turnover pallet |
| CN110155465B (en) * | 2019-06-13 | 2021-06-01 | 武汉华星光电半导体显示技术有限公司 | Turnover tray |
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