JPH065654B2 - Adhesion method between chip coil or transformer and substrate - Google Patents
Adhesion method between chip coil or transformer and substrateInfo
- Publication number
- JPH065654B2 JPH065654B2 JP29433490A JP29433490A JPH065654B2 JP H065654 B2 JPH065654 B2 JP H065654B2 JP 29433490 A JP29433490 A JP 29433490A JP 29433490 A JP29433490 A JP 29433490A JP H065654 B2 JPH065654 B2 JP H065654B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ferrite core
- adhesive
- transformer
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 62
- 238000000034 method Methods 0.000 title claims description 12
- 229910000859 α-Fe Inorganic materials 0.000 claims description 44
- 239000000853 adhesive Substances 0.000 claims description 36
- 230000001070 adhesive effect Effects 0.000 claims description 36
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】 〔発明の目的〕 （産業上の利用分野） 本発明はチップコイルまたはトランストと基板との接着
方法に係り、例えば、ビデオカメラなどに組込まれるチ
ップコイルまたはトランスとコイルの引出し線を接続す
る基板とを接着する方法に関する。The present invention relates to a method of adhering a chip coil or a transformer and a substrate, and for example, a chip coil or a transformer and a coil incorporated in a video camera or the like. The present invention relates to a method of adhering a lead wire to a substrate for connection.
（従来の技術） 近時電子機器の小形化の傾向が著しく、例えば、ビデオ
カメラに組込まれるチップコイルまたはトランスも小形
化が要請され、このようなチップコイル、またこのチッ
プコイルを用いたトランスはコイルの引出し線を接続す
る基盤に固着するようにしている。そして、従来、この
種のチップコイルまたはトランスは、コイルを巻回した
フェライトコアにコイルと配線とを接続する電極を形成
した基板を固着するために、基板に樹脂系の接着剤を定
量吐出器、注射器などを用いて塗布し、この接着剤でフ
ェライトコアと基板とを接着固定する方法が採られてい
る。(Prior Art) Recently, there is a remarkable tendency toward downsizing of electronic devices, and for example, a chip coil or a transformer incorporated in a video camera is also required to be downsized, and such a chip coil and a transformer using this chip coil are The lead wire of the coil is fixed to the connecting base. In the past, this type of chip coil or transformer fixedly dispenses a resin-based adhesive on the substrate in order to fix the substrate on which the electrode connecting the coil and the wiring is formed to the ferrite core around which the coil is wound. A method is adopted in which the ferrite core and the substrate are adhered and fixed with this adhesive, which is applied using a syringe or the like.
（発明が解決しようとする課題） この種のチップコイルまたはトランスは機器に組込むの
に、基板を組込むためのスペース、搭載過程での作業性
の厳格な寸法精度が要求されるが、従来の方法では、基
板に均一に接着剤を塗布することが困難で、接着強度を
損ねたり、基板の剥離などが生じたり、接着剤のはみ出
しによる寸法精度の誤差から搭載ができなくなるという
不具合が生じ、さらに、接着剤の嵌挿効果の過程でフェ
ライトコアが位置ずれし、接着剤の塗布作業、乾燥硬化
に手数が掛り、歩留まりが低く、コストアップとなるな
どの問題が生じている。(Problems to be Solved by the Invention) When this type of chip coil or transformer is installed in a device, a space for installing a substrate and strict dimensional accuracy of workability in the mounting process are required. Then, it is difficult to apply the adhesive uniformly to the substrate, and the adhesive strength is impaired, the substrate is peeled off, and the problem that the mounting becomes impossible due to the dimensional accuracy error due to the protrusion of the adhesive occurs. In the process of inserting the adhesive, the ferrite core is displaced, and the adhesive coating work and the drying and curing are troublesome, resulting in a low yield and an increase in cost.
本発明は上記問題点に鑑みなされたもので、基板に均一
な厚みに接着剤を塗布でき、この接着剤で基板に接着し
たフェライトコアを磁石ににて吸着保持して接着剤を乾
燥硬化して接着剤のはみだしがなく、寸法精度が高めら
れ、基板剥がれのない、製造効率のよいチップコイルま
たはトランスと基板との接着方法を提供するものであ
る。The present invention has been made in view of the above problems, the substrate can be coated with an adhesive with a uniform thickness, and the ferrite core adhered to the substrate with this adhesive is adsorbed and held by a magnet to dry and cure the adhesive. The present invention provides a method for adhering a chip coil or a transformer to a substrate, which does not stick out of the adhesive, has high dimensional accuracy, does not peel off the substrate, and has good manufacturing efficiency.
（課題を解決するための手段） 本発明のチップコイルまたはトランスと基板との接着方
法は、コイルを巻回したフェライトコアとこのフェライ
トコアに巻回したコイルの引出し線を接続する基板とを
接着するチップコイルまたはトランスと基板との接着方
法であって、前記基板の表面のフェライトコアを接着す
る部分にスクリーンを介して接着剤を塗布し、この接着
剤にて前記基板にフェライトコアを接着し、この基板の
背面側から磁石にて表面に接着されたフェライトコアを
吸着して前記接着剤を乾燥硬化するものである。(Means for Solving the Problem) A method of bonding a chip coil or a transformer and a substrate of the present invention is to bond a ferrite core around which a coil is wound and a substrate to which a lead wire of the coil around the ferrite core is connected. A method of adhering a chip coil or a transformer to a substrate, wherein an adhesive is applied to a portion of the surface of the substrate where the ferrite core is adhered through a screen, and the ferrite core is adhered to the substrate with this adhesive. The ferrite core adhered to the surface by a magnet is adsorbed from the back side of the substrate to dry and cure the adhesive.
（作用） 本発明のチップコイルまたはトランスと基板との接着方
法は、基板の表面のフェライトコアを接着する部分にス
クリーンを介して接着剤を塗布することにより基板に必
要箇所に均一の厚みに接着剤を塗布でき、この基板に塗
布した接着剤にてこの基板の表面にフェライトコアを接
着し、この基板の背面側から表面に接着されたフェライ
トコアを磁石にて吸着して接着剤を乾燥硬化することに
より、基板とフェライトコアとの位置ずれがなく、基板
とフェライトコアとの接着強度が高められ、寸法精度も
向上できる。(Operation) According to the bonding method of the chip coil or the transformer of the present invention and the substrate, an adhesive is applied to a portion of the surface of the substrate where the ferrite core is bonded through a screen so that the substrate is bonded to a required portion with a uniform thickness. Agent can be applied, the ferrite core is adhered to the surface of this substrate with the adhesive applied to this substrate, the ferrite core adhered to the surface from the back side of this substrate is adsorbed with a magnet, and the adhesive is dried and cured. By doing so, there is no positional deviation between the substrate and the ferrite core, the adhesive strength between the substrate and the ferrite core is increased, and the dimensional accuracy can be improved.
（実施例） 本発明の一実施例を図面について説明する。Embodiment An embodiment of the present invention will be described with reference to the drawings.
第３図において、１はチップコイルのフェライトコア
で、円柱状のコイル巻回部２とこのコイル巻回部２の両
端にそれぞれ一体に設けられた円盤状のフランジ部３，
４とからなり、この一方のフランジ部３の外面中心部に
は円盤状の嵌合突部５が一体に突設されている。In FIG. 3, reference numeral 1 denotes a ferrite core of a chip coil, which is a cylindrical coil winding portion 2 and a disk-shaped flange portion 3, which is integrally provided at each end of the coil winding portion 2.
4, the disc-shaped fitting projection 5 is integrally provided at the center of the outer surface of the one flange 3.
また、第４図において、６は合成樹脂またはセラミック
などにて成形された基板で、この基板６の両端部には前
記フェライトコア１に巻回されたコイル７の引出し線お
よび外部導線を接続する電極部８がそれぞれ形成され、
また、この基板６の中心部には前記フェライトコア１の
嵌合突部５を嵌合するコア嵌合凹部９が形成されてい
る。Further, in FIG. 4, reference numeral 6 denotes a substrate formed of synthetic resin or ceramics, and the lead wire of the coil 7 wound around the ferrite core 1 and the external lead wire are connected to both ends of the substrate 6. The electrode portions 8 are respectively formed,
Further, a core fitting recess 9 into which the fitting protrusion 5 of the ferrite core 1 is fitted is formed in the center of the substrate 6.
次に、第５図において、10はステンレスにて形成された
マスキングパターンスクリーンで、所定間隔ごとに前記
基板６の嵌合凹部９の当接部11の周囲にはそれぞれ正方
形状の180メッシュの塗布部12が形成されている。この
塗布部12の対角線と寸法Ｌは前記フェライトコア１のフ
ランジ部３，４の直径Ｒより短く形成されている。Next, in FIG. 5, 10 is a masking pattern screen made of stainless steel, and a square mesh of 180 mesh is applied around the contact portion 11 of the fitting concave portion 9 of the substrate 6 at predetermined intervals. The part 12 is formed. The diagonal line and the dimension L of the coating portion 12 are formed to be shorter than the diameter R of the flange portions 3 and 4 of the ferrite core 1.
第４図に示すように、16は治具基板で、この治具基板16
上には基板固定治具17が固定されている。また、この治
具基板16には前記基板固定治具17の一側に沿ってスティ
18が固定されている。このスティ18にはスクリーン枠19
が前記基板固定治具17の上面に軸支具20にて開閉自在に
取付けられている。また、このスクリーン枠19には前記
基板固定治具17の上面に所定間隔ごとに形成した基板嵌
合部21に対向するスキージ嵌合孔22が形成されている。
そして、このスクリーン枠19の内面には前記スクリーン
10が取付けられている。そして、このスクリーン枠19を
閉じた状態で、スキージ嵌合孔22が前記基板固定治具17
の基板嵌合部21に対向され、このスクリーン枠19に取付
けたスクリーン10は当接部11が前記基板嵌合部21に嵌合
保持した基板６嵌合凹部９に対向するとともに塗布部12
が基板６のフランジ部３に対向される。As shown in FIG. 4, 16 is a jig substrate.
A board fixing jig 17 is fixed on the top. In addition, the jig board 16 is attached with a stick along one side of the board fixing jig 17.
18 is fixed. This stay 18 has a screen frame 19
Is attached to the upper surface of the board fixing jig 17 by a shaft support 20 so as to be openable and closable. Further, the screen frame 19 is provided with squeegee fitting holes 22 facing the board fitting portions 21 formed on the upper surface of the board fixing jig 17 at predetermined intervals.
And, on the inner surface of the screen frame 19, the screen
10 is installed. Then, with the screen frame 19 closed, the squeegee fitting hole 22 is inserted into the board fixing jig 17.
The screen 10 mounted on the screen frame 19 faces the board fitting portion 21 of the substrate 10, and the contact portion 11 faces the board 6 fitting concave portion 9 fitted and held in the board fitting portion 21 and the coating portion 12
Are opposed to the flange portion 3 of the substrate 6.
また、前記基板固定治具17の基板嵌合部21の内底面には
基板６の嵌合凹部９の嵌合突部５を嵌合したフェライト
コア１を基板６の背面側から吸着する永久磁石25が埋め
込み固定されている。A permanent magnet that attracts the ferrite core 1 having the fitting projection 5 of the fitting recess 9 of the board 6 fitted to the inner bottom surface of the board fitting portion 21 of the board fixing jig 17 from the back side of the board 6. 25 is embedded and fixed.
そして、前記基板固定治具17の基板嵌合部21にそれぞれ
表面を上側にして基板６を嵌合保持し、スクリーン枠19
を閉じて基板６の表面にスクリーン10を当接し、このス
クリーン10のスキージ嵌合孔22にスキージ24を嵌合して
合成樹脂系の接着剤26を注入すると、接着剤26は基板６
の嵌合凹部５の周囲に対向するスクリーン10の塗布部12
から基板６の表面に形成されている嵌合凹部９の周囲に
均一に塗布される。そして、スクリーン枠19を開き、基
板６の嵌合凹部９にフェライトコア１の嵌合突部５を嵌
合すると、フランジ部３が接着剤26にて基板６に接着さ
れる。この状態で接着剤26が塗布される範囲は、フェラ
イトコア１のフランジ部３が当接される面積より少ない
範囲のため、接着剤26はフェライトコア１の接着部分よ
りはみ出ることがない。そして、フェライトコア１は基
板６の背面側から永久磁石25にて吸着保持され、この状
態で、接着剤26は乾燥硬化され、基板６はフェライトコ
ア１に固着される。そして、基板６に固着されたフェラ
イトコア１に巻回されているコイル７の引出し線を電極
部８に接続する。Then, the board 6 is fitted and held with the board fitting portion 21 of the board fixing jig 17 with the front surface facing upward, and the screen frame 19
Is closed, the screen 10 is brought into contact with the surface of the substrate 6, the squeegee 24 is fitted into the squeegee fitting hole 22 of the screen 10, and the synthetic resin adhesive 26 is injected.
Coating part 12 of the screen 10 facing the periphery of the fitting recess 5 of
Is uniformly applied around the fitting recess 9 formed on the surface of the substrate 6. When the screen frame 19 is opened and the fitting projection 5 of the ferrite core 1 is fitted into the fitting recess 9 of the substrate 6, the flange portion 3 is bonded to the substrate 6 with the adhesive 26. Since the area where the adhesive 26 is applied in this state is smaller than the area where the flange portion 3 of the ferrite core 1 is in contact, the adhesive 26 does not protrude from the adhesive portion of the ferrite core 1. Then, the ferrite core 1 is adsorbed and held by the permanent magnet 25 from the back side of the substrate 6, and in this state, the adhesive 26 is dried and hardened, and the substrate 6 is fixed to the ferrite core 1. Then, the lead wire of the coil 7 wound around the ferrite core 1 fixed to the substrate 6 is connected to the electrode portion 8.
次にこの実施例の作用を説明する。Next, the operation of this embodiment will be described.
基板６の表面のフェライトコア１を接着する部分にスク
リーン10の塗布部12から接着剤を塗布することにより基
板６の表面にはフェライトコア１を接着するに必要な箇
所に均一の厚みに接着剤26を塗布でき、この基板６に塗
布した接着剤26にてこの基板６の表面にフェライトコア
１を接着でき、この基板６の背面側から表面に接着され
たフェライトコア１を永久磁石25にて吸着して接着剤26
を乾燥硬化することにより、基板とフェライトコアとの
位置ずれがなく、基板６とフェライトコア１との寸法精
度が高められるとともに接着強度が高められ、基板剥離
が確実に防止できるとともに歩留まりが向上され、製造
効率も高められ、生産性の向上が図られる。By applying an adhesive from the application portion 12 of the screen 10 to a portion of the surface of the substrate 6 to which the ferrite core 1 is adhered, an adhesive having a uniform thickness is formed on the surface of the substrate 6 where necessary to adhere the ferrite core 1. 26 can be applied, and the ferrite core 1 can be adhered to the surface of the substrate 6 with the adhesive 26 applied to the substrate 6, and the ferrite core 1 adhered to the surface from the back side of the substrate 6 can be applied with the permanent magnet 25. Adsorb and glue 26
By drying and curing, the substrate and the ferrite core are not displaced, the dimensional accuracy of the substrate 6 and the ferrite core 1 is improved, and the adhesive strength is increased, so that the substrate peeling can be reliably prevented and the yield is improved. In addition, manufacturing efficiency is improved and productivity is improved.
前記実施例ではチップコイルについて説明したが、この
チップコイルを用いたトランスにも適用できる。Although the chip coil has been described in the above embodiment, the present invention can also be applied to a transformer using this chip coil.
本発明によれば、基板の表面のフェライトコアを接着す
る部分にスクリーンを用いて接着剤を塗布するため、基
板に必要箇所に均一に厚みに接着剤を塗布でき、この基
板に塗布した接着剤にてこの基板の表面にフェライトコ
アを接着した状態で、この基板の背面側から表面に接着
されたフェライトコアを磁石にて吸着して保持した状態
で、接着剤を乾燥硬化することにより、基板とフェライ
トコアとの位置ずれがなく、基板とフェライトコアとの
接着強度が高められ、基板剥離が確実に防止でき、寸法
精度も向上できる。According to the present invention, since the adhesive is applied to the portion of the surface of the substrate to which the ferrite core is adhered by using the screen, the adhesive can be evenly applied to a required portion of the substrate with a uniform thickness. With the ferrite core adhered to the surface of this board, the ferrite core adhered to the surface from the back side of this board is adsorbed and held by a magnet, and the adhesive is dried and hardened. There is no displacement between the ferrite core and the ferrite core, the adhesive strength between the substrate and the ferrite core is enhanced, the peeling of the substrate can be reliably prevented, and the dimensional accuracy can be improved.
第１図は本発明の一実施例を示すチップコイルまたはト
ランスと基板との接着装置の縦断面説明図、第２図は同
上乾燥工程の状態を示す縦断面説明図、第３図はフェラ
イトコアの斜視図、第４図は基板の斜視図、第５図はス
クリーンの平面図である。 １・・フェライトコア、６・・基板、７・・コイル、10
・・スクリーン、25・・磁石、26・・接着剤。FIG. 1 is a vertical cross-sectional explanatory view of a bonding apparatus for a chip coil or a transformer and a substrate, showing an embodiment of the present invention, FIG. 2 is a vertical cross-sectional explanatory view showing a state of the same drying process, and FIG. 3 is a ferrite core. FIG. 4 is a perspective view of the substrate, and FIG. 5 is a plan view of the screen. 1 ... Ferrite core, 6 ... Substrate, 7 ... Coil, 10
..Screens, 25 ... Magnets, 26 ... Adhesives
Claims (1)
ェライトコアに巻回したコイルの引出し線を接続する基
板とを接着するチップコイルまたはトランスと基板との
接着方法であって、 前記基板の表面のフェライトコアを接着する部分にスク
リーンを介して接着剤を塗布し、 この接着剤にて前記基板にフェライトコアを接着し、 この基板の背面側から磁石にて表面に接着されたフェラ
イトコアを吸着して前記接着剤を乾燥硬化する ことを特徴とするチップコイルまたはトランスと基板と
の接着方法。1. A method of adhering a chip coil or a transformer to a substrate, which comprises adhering a ferrite core wound with a coil and a substrate connecting a lead wire of the coil wound around the ferrite core, the surface of the substrate being provided. Adhesive is applied through the screen to the part to which the ferrite core of is adhered, the ferrite core is adhered to the substrate with this adhesive, and the ferrite core adhered to the surface is adsorbed from the back side of the substrate with a magnet. A method of adhering a chip coil or a transformer to a substrate, characterized by dry-curing the adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29433490A JPH065654B2 (en) | 1990-10-31 | 1990-10-31 | Adhesion method between chip coil or transformer and substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29433490A JPH065654B2 (en) | 1990-10-31 | 1990-10-31 | Adhesion method between chip coil or transformer and substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04167505A JPH04167505A (en) | 1992-06-15 |
| JPH065654B2 true JPH065654B2 (en) | 1994-01-19 |
Family
ID=17806361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29433490A Expired - Lifetime JPH065654B2 (en) | 1990-10-31 | 1990-10-31 | Adhesion method between chip coil or transformer and substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH065654B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003100538A (en) * | 2001-09-20 | 2003-04-04 | Murata Mfg Co Ltd | Method for manufacturing coil part |
-
1990
- 1990-10-31 JP JP29433490A patent/JPH065654B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04167505A (en) | 1992-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR20030023471A (en) | Manufacturing method of wound coil component, and the coil component | |
| JPH04167505A (en) | Method for bonding chip coil or transformer to substrate | |
| JP2000058336A (en) | Mold structure of electronic component | |
| JPH0538108A (en) | Coil structure and manufacturing method thereof | |
| JPS61121390A (en) | Method of mounting electronic part | |
| KR100294508B1 (en) | A method and apparatus for securing a chip on a circuit board | |
| JP2978862B2 (en) | LOC semiconductor device and method of manufacturing the same | |
| JP3496317B2 (en) | Speaker manufacturing method | |
| KR0147768B1 (en) | Method of adhesion of heat sink for semiconductor package | |
| JPH01124273A (en) | Mounting structure of magnetoelectric transducer | |
| JP3409413B2 (en) | Rotary drum device | |
| JPH06233382A (en) | Manufacture of speaker | |
| JP3917280B2 (en) | Dielectric resonator mounting method and dielectric resonator mounting structure | |
| JPH05206350A (en) | Method of joining metal frame to ceramic substrate | |
| TW202418900A (en) | Electronic device and preparation method thereof | |
| JPS62133796A (en) | Electronic parts mounting | |
| JPS6351376B2 (en) | ||
| JPH087639Y2 (en) | Semiconductor module | |
| JPH0734034B2 (en) | Magnetoresistive sensor and its manufacturing method | |
| JPH0334552A (en) | Semiconductor bare chip | |
| JPH01293637A (en) | Manufacture of semiconductor module | |
| JP2000121757A (en) | Coil winding core for clock, connection structure of circuit substrate, and its connection method | |
| JPS62259413A (en) | Manufacture of inductor | |
| JPH08180309A (en) | Magnetic head | |
| JPH11135705A (en) | Lead frame, semiconductor device and method of manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080119 Year of fee payment: 14 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090119 Year of fee payment: 15 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 15 Free format text: PAYMENT UNTIL: 20090119 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 16 Free format text: PAYMENT UNTIL: 20100119 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 17 Free format text: PAYMENT UNTIL: 20110119 |
|
| EXPY | Cancellation because of completion of term |