JPH0657183A - Conductive paste - Google Patents
Conductive pasteInfo
- Publication number
- JPH0657183A JPH0657183A JP4209018A JP20901892A JPH0657183A JP H0657183 A JPH0657183 A JP H0657183A JP 4209018 A JP4209018 A JP 4209018A JP 20901892 A JP20901892 A JP 20901892A JP H0657183 A JPH0657183 A JP H0657183A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- resinate
- conductive
- copper powder
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 6
- 229910052802 copper Inorganic materials 0.000 claims abstract description 6
- 239000010949 copper Substances 0.000 claims abstract description 6
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 6
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 6
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 6
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 6
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 6
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 7
- 239000011572 manganese Substances 0.000 claims description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 5
- 239000011777 magnesium Substances 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 239000011701 zinc Substances 0.000 claims description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 239000011651 chromium Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 abstract description 12
- 239000002966 varnish Substances 0.000 abstract description 3
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 125000002524 organometallic group Chemical group 0.000 description 10
- 238000011156 evaluation Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 description 1
- 235000007173 Abies balsamea Nutrition 0.000 description 1
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004857 Balsam Substances 0.000 description 1
- 244000018716 Impatiens biflora Species 0.000 description 1
- 229910006776 Si—Zn Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 150000001845 chromium compounds Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000005609 naphthenate group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Paints Or Removers (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えば、セラミック電
子部品の内部電極形成用として用いられる導電性ペース
トに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive paste used for forming internal electrodes of ceramic electronic parts, for example.
【０００２】[0002]
【従来の技術】導電性ペーストを用いて製造されるセラ
ミック電子部品の一例としては、小型かつ大容量という
要求を比較的容易に満足しうるとして需要の多い積層チ
ップ型磁器コンデンサが知られている。そして、図示し
ていないが、この磁器コンデンサを製造するにあたって
は、まず、内部コンデンサ電極（導電性被膜）となる導
電性ペーストが表面上に印刷されてなるセラミックグリ
ーン（生）シートを含む複数枚のセラミックグリーンシ
ート同士を互いに積み重ねて圧着することによって一体
化された積層体を作成した後、この未焼成状態にある積
層体を所定の形状及び大きさごとに分断し、分断したチ
ップ素体のそれぞれを所定温度条件下で焼成することに
より、セラミックグリーンシートの焼成、および導電性
ペーストの焼き付けを同時に行うようになっている。な
お、焼成されたチップ素体の両側端面それぞれには、そ
の後、内部コンデンサ電極と導通する外部取り出し電極
が形成されることになる。2. Description of the Related Art As an example of a ceramic electronic component manufactured by using a conductive paste, a multilayer chip type porcelain capacitor which is in great demand because it can relatively easily meet the requirements of small size and large capacity is known. . Then, although not shown, in manufacturing this porcelain capacitor, first, a plurality of sheets including a ceramic green (raw) sheet in which a conductive paste serving as an internal capacitor electrode (conductive coating) is printed on the surface. After creating an integrated laminated body by stacking and pressing the ceramic green sheets of one another, the unfired laminated body is divided into predetermined shapes and sizes, and the divided chip body By firing each under a predetermined temperature condition, the firing of the ceramic green sheet and the firing of the conductive paste are simultaneously performed. It should be noted that, on each of both end surfaces of the fired chip element body, thereafter, external lead-out electrodes electrically connected to the internal capacitor electrodes are formed.
【０００３】ところで、このようにして製造された磁器
コンデンサにおいては、焼成済みとなったチップ素体に
反りやクラック（割れ）、デラミネーション（層間剥
離）などが発生する問題があった。これは、セラミック
グリーンシートと導電性ペーストとの間に熱収縮率の相
異があるためであり、このような熱収縮率の相異が存在
するのは、導電性ペーストがガラスフリットを含んでい
るためであることが分かってきた。By the way, the porcelain capacitor manufactured in this way has a problem that the fired chip element body is warped, cracked, or delaminated. This is because there is a difference in heat shrinkage between the ceramic green sheet and the conductive paste, and such a difference in heat shrinkage exists when the conductive paste contains glass frit. It turned out that it was because it was.
【０００４】そこで、磁器コンデンサのような電子部品
の内部電極に用いられる導電性ペーストには、ガラスフ
リットを含まないフリットレスの導電性ペーストが用い
られるようになってきた。Therefore, a fritless conductive paste containing no glass frit has come to be used as a conductive paste used for an internal electrode of an electronic component such as a ceramic capacitor.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、フリッ
トレスの導電性ペーストには、セラミックグリーンシー
トに対する接着強度が低いために、電極剥離などの起こ
す問題があった。However, since the fritless conductive paste has a low adhesive strength with respect to the ceramic green sheet, there is a problem that electrode peeling occurs.
【０００６】本発明は、このような問題に鑑みてなされ
たものであって、ガラスフリットを含まなくとも、接着
強度が高い内部電極をセラミック電子部品に形成しうる
導電性ペーストの提供を目的としている。The present invention has been made in view of the above problems, and an object thereof is to provide a conductive paste capable of forming an internal electrode having high adhesive strength on a ceramic electronic component without containing a glass frit. There is.
【０００７】[0007]
【課題を解決するための手段】本発明は、上記目的を達
成するために、銅粉末に対して、亜鉛，銅，チタン，ア
ルミニウム，マグネシウム，パラジウム，イリジウム，
クロム，およびマンガンのうちの少なくとも一つを含ん
だ有機金属レジネートを添加してガラスフリットが含ま
れない、銅粉末を含む導電性ペーストを構成した。In order to achieve the above object, the present invention provides zinc powder, zinc, copper, titanium, aluminum, magnesium, palladium, iridium,
An organometallic resinate containing at least one of chromium and manganese was added to form a conductive paste containing copper powder and containing no glass frit.
【０００８】[0008]
【実施例】以下、本発明の実施例を説明する。まず、銅
粉末、ナフサ系ワニス、および有機金属レジネートを用
意する。有機金属レジネートとしては、表１に示すよう
に、本発明の範疇である亜鉛，銅，チタン，アルミニウ
ム，マグネシウム，パラジウム，イリジウム，クロム，
およびマンガンの有機レジネートを評価用試料として用
意する。これらレジネートは亜鉛、銅およびマンガンの
レジネートがナフテン酸塩の化合物であり、チタンのレ
ジネートはテトラエチルチタネートであり、アルミニウ
ムとマグネシウムとはオクチルアルコレートの化合物で
あり、イリジウムは硫化バルサムの化合物であり、パラ
ジウムとクロムとはアビエチン酸（Ｃ20Ｈ29Ｏ2）ｎの
化合物である。また、表１に示すように本発明の範疇外
の有機金属レジネートも参考品として用意する。なお、
表中、＃印を付けたものが本発明の範疇品である。EXAMPLES Examples of the present invention will be described below. First, copper powder, naphtha-based varnish, and organometallic resinate are prepared. As the organic metal resinate, as shown in Table 1, zinc, copper, titanium, aluminum, magnesium, palladium, iridium, chromium, which fall within the scope of the present invention,
An organic resinate of manganese and manganese is prepared as a sample for evaluation. These resinates are zinc, copper and manganese resinates which are compounds of naphthenates, titanium resinates are tetraethyl titanates, aluminum and magnesium are compounds of octyl alcoholates, iridium is a compound of balsam sulfide, palladium and the chromium compounds of the abietic acid (C 20 H 29 O 2) n. Further, as shown in Table 1, organometallic resinates outside the scope of the present invention are also prepared as reference products. In addition,
In the table, items marked with # are categories of the present invention.
【０００９】[0009]
【表１】 [Table 1]
【００１０】そして、銅粉末、ナフサ系ワニス、および
各有機金属レジネートを所定量づつ加え合わせたうえで
混練してそれぞれの導電性ペーストを作成する。なお、
これら導電性ペーストはフリットレスであり、ガラスフ
リットは加えられない。このとき、導電性ペースト中の
金属成分全体に対して有機金属レジネートの金属成分が
占める割合が０．５重量％になるように、各導電性ペー
スト中の有機金属レジネートの配合量を設定する。Then, a predetermined amount of copper powder, naphtha varnish and each organometallic resinate are added together and kneaded to prepare respective conductive pastes. In addition,
These conductive pastes are fritless and no glass frit is added. At this time, the compounding amount of the organometallic resinate in each conductive paste is set so that the ratio of the metal component of the organometallic resinate to the total metal components in the conductive paste is 0.5% by weight.
【００１１】このようにして作成した導電性ペーストを
用いてＢａ−Ｓｉ−Ｚｎからなるセラミックグリーン
（生）シート上に導電性被膜を印刷する。そして、（Ｎ
2，Ｈ2Ｏ，Ｈ2）雰囲気下、ピーク温度１０００℃で約
１時間かけて焼成し、さらに焼成したものを所定の大き
さに分断して評価用基板を作成する。A conductive coating is printed on the ceramic green (raw) sheet made of Ba-Si-Zn using the conductive paste thus prepared. And (N
2 , H 2 O, H 2 ) atmosphere at a peak temperature of 1000 ° C. for about 1 hour, and the baked product is cut into a predetermined size to prepare a substrate for evaluation.
【００１２】作成した各評価用基板の導電性被膜に０．
８ｍｍ径のＬ字型軟銅線を半田付けにて取り付ける。半
田付けには銀２％を含有した鉛４０：錫６０の半田を用
いる。そして、Ｌ型軟銅線を取り付けた評価用基板にヒ
ートショックテストを施すとともに、導電性被膜のオー
トグラフ引張強度をテスト前後で測定したところ、表２
のような結果が得られた。ここでいうヒートショックテ
ストとは、（−５５℃〜＋１２５℃）のヒートサイクル
を１００ないし２００サイクル繰り返すことをいう。ま
た、導電性被膜の膜厚は焼成後表面粗さ計にて物理厚を
測定したものをいう。さらに、有機金属レジネートを全
く含有しない導電性ペーストで導電性被膜を形成した評
価用基板もモニターとしてテストした。なお、表２中の
評価用基板のＮｏ．は表１中の試料のＮｏ．に応じて付
与されており、また、表中、＃印をつけたものが本発明
の範疇品である。The conductive film of each of the evaluation substrates thus prepared has a thickness of 0.
Attach an L-shaped annealed copper wire with a diameter of 8 mm by soldering. For soldering, lead 40: tin 60 solder containing 2% of silver is used. Then, a heat shock test was performed on the evaluation substrate having the L-type annealed copper wire attached thereto, and the autograph tensile strength of the conductive film was measured before and after the test.
The result is as follows. The heat shock test here means to repeat a heat cycle of (-55 ° C to + 125 ° C) 100 to 200 cycles. Further, the film thickness of the conductive coating refers to the one obtained by measuring the physical thickness with a surface roughness meter after firing. Furthermore, an evaluation substrate having a conductive coating formed of a conductive paste containing no organometallic resinate was also tested as a monitor. In addition, the evaluation board No. Is the sample No. in Table 1. The items marked with # in the table are in the category of the present invention.
【００１３】[0013]
【表２】 [Table 2]
【００１４】この測定結果から明らかなように、本発明
の導電性ペースト（亜鉛，銅，チタン，アルミニウム，
マグネシウム，パラジウム，イリジウム，クロム，およ
びマンガンを含んだ有機金属レジネートを添加したも
の）で導電性被膜を形成した評価用基板では、２００サ
イクルのヒートショックテストを受けた後でも、ほぼ１
ｋｇｆ／２×２ｍｍ2の引張強度を保持しているのがわ
かる。これに対して、本発明の範疇外の有機金属レジネ
ートを添加した導電性ペーストや全く有機金属レジネー
トを添加していない導電性ペーストで導電性被膜を形成
した評価用基板（モニター）では、１００サイクルのヒ
ートショックテスト後ではある程度の引張強度を保持し
ているものの、２００サイクルのヒートショックテスト
後では、測定できない程、引張強度が弱まっていること
がわかる。As is clear from the measurement results, the conductive paste of the present invention (zinc, copper, titanium, aluminum,
The evaluation substrate having a conductive film formed of an organometallic resinate containing magnesium, palladium, iridium, chromium, and manganese) has a conductivity of about 1 even after a 200-cycle heat shock test.
It can be seen that the tensile strength of kgf / 2 × 2 mm 2 is maintained. On the other hand, in the evaluation substrate (monitor) in which the conductive coating film is formed by the conductive paste to which the organic metal resinate outside the scope of the present invention is added or the conductive paste to which no organic metal resinate is added is 100 cycles It can be seen that although the tensile strength is maintained to some extent after the heat shock test, the tensile strength is weakened to such an extent that it cannot be measured after the 200 cycles of the heat shock test.
【００１５】なお、上記実施例では、導電性ペースト全
体の金属成分中において有機金属レジネート中の金属成
分が占める割合を０．５重量％に統一していたが、これ
に限るわけではなく、この割合は０．０５重量％〜５．
００重量％の間であればよい。これは次のように理由に
よる。すなわち、有機金属レジネートの金属成分が占め
る割合を金属成分全体の０．０１重量％以下にしてしま
うと導電性ペーストの接着強度を補強することができな
くなる。また、５．００重量％を越えるとペースト粘度
が低下し、印刷塗布後の滲み等印刷精度劣化の原因にな
る。くわえて、５．００重量％を越えると導電性ペース
ト中における有機物の量が多くなり過ぎて焼成中に完全
に燃焼させることが困難になる結果、有機物が残留カー
ボンとして焼成後も残ることになる。このような残留カ
ーボンは強度劣化の原因となる。In the above examples, the proportion of the metal component in the organometallic resinate in the metal component of the entire conductive paste was unified to 0.5% by weight, but the present invention is not limited to this. The ratio is 0.05% by weight to 5.
It may be between 00% by weight. This is due to the following reasons. That is, if the ratio of the metal component of the organometallic resinate to 0.01% by weight or less of the entire metal component, the adhesive strength of the conductive paste cannot be reinforced. On the other hand, if it exceeds 5.00% by weight, the viscosity of the paste is reduced, which causes deterioration of printing accuracy such as bleeding after printing. In addition, if it exceeds 5.00% by weight, the amount of organic substances in the conductive paste becomes too large and it becomes difficult to completely burn it during firing. As a result, the organic substances remain as residual carbon even after firing. . Such residual carbon causes strength deterioration.
【００１６】[0016]
【発明の効果】以上のように、本発明の導電性ペースト
を用いれば、ガラスフリットを加えなくとも、セラミッ
ク焼結体に対する接着強度の高い導電性被膜を成するこ
とが可能になる結果、電極剥離といった不都合の発生を
招くことがなくなり、セラミック電子部品の信頼性の向
上を図ることができるという効果が得られる。As described above, the use of the conductive paste of the present invention makes it possible to form a conductive coating having a high adhesive strength with respect to a ceramic sintered body without adding a glass frit. The inconvenience such as peeling is not caused, and the effect that the reliability of the ceramic electronic component can be improved can be obtained.
Claims (1)
含む導電性ペーストであって、 前記銅粉末に対して、亜鉛，銅，チタン，アルミニウ
ム，マグネシウム，パラジウム，イリジウム，クロム，
およびマンガンのうちの少なくとも一つを含んだ有機金
属レジネートが添加されていることを特徴とする導電性
ペースト。1. A conductive paste containing copper powder, which does not contain glass frit, wherein zinc, copper, titanium, aluminum, magnesium, palladium, iridium, chromium,
And an organic metal resinate containing at least one of manganese and manganese.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209018A JPH0657183A (en) | 1992-08-05 | 1992-08-05 | Conductive paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4209018A JPH0657183A (en) | 1992-08-05 | 1992-08-05 | Conductive paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0657183A true JPH0657183A (en) | 1994-03-01 |
Family
ID=16565909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4209018A Pending JPH0657183A (en) | 1992-08-05 | 1992-08-05 | Conductive paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657183A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5814248A (en) * | 1996-05-24 | 1998-09-29 | Murata Manufacturing Co., Ltd. | Conductive paste composition and method for producing a ceramic substrate |
| JP2010108696A (en) * | 2008-10-29 | 2010-05-13 | Mitsuboshi Belting Ltd | Resistive paste, and resistor |
| US7935279B2 (en) | 2008-01-30 | 2011-05-03 | Basf Se | Glass frits |
| WO2012067327A1 (en) * | 2010-11-18 | 2012-05-24 | Kcc Corporation | Back contact composition for solar cell |
| US8308993B2 (en) | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
| US8383011B2 (en) | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
| CN103773233A (en) * | 2014-01-20 | 2014-05-07 | 南通耀华机电有限公司 | Shielding coating for low-frequency transformer |
| KR101412812B1 (en) * | 2012-07-18 | 2014-06-27 | 삼성전기주식회사 | Conductive cupper paste composition and method for forming metal thin layer using the same |
| JP2016021569A (en) * | 2015-07-06 | 2016-02-04 | 株式会社マテリアル・コンセプト | Electronic component and manufacturing method thereof |
| JP2019041022A (en) * | 2017-08-25 | 2019-03-14 | 日本特殊陶業株式会社 | Method for manufacturing wiring board and conductive paste |
-
1992
- 1992-08-05 JP JP4209018A patent/JPH0657183A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5814248A (en) * | 1996-05-24 | 1998-09-29 | Murata Manufacturing Co., Ltd. | Conductive paste composition and method for producing a ceramic substrate |
| US5891283A (en) * | 1996-05-24 | 1999-04-06 | Murata Manufacturing Co., Ltd. | Conductive paste composition and method for producing a ceramic substrate |
| US7935279B2 (en) | 2008-01-30 | 2011-05-03 | Basf Se | Glass frits |
| US8308993B2 (en) | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
| US8383011B2 (en) | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
| JP2010108696A (en) * | 2008-10-29 | 2010-05-13 | Mitsuboshi Belting Ltd | Resistive paste, and resistor |
| WO2012067327A1 (en) * | 2010-11-18 | 2012-05-24 | Kcc Corporation | Back contact composition for solar cell |
| KR101412812B1 (en) * | 2012-07-18 | 2014-06-27 | 삼성전기주식회사 | Conductive cupper paste composition and method for forming metal thin layer using the same |
| CN103773233A (en) * | 2014-01-20 | 2014-05-07 | 南通耀华机电有限公司 | Shielding coating for low-frequency transformer |
| JP2016021569A (en) * | 2015-07-06 | 2016-02-04 | 株式会社マテリアル・コンセプト | Electronic component and manufacturing method thereof |
| JP2019041022A (en) * | 2017-08-25 | 2019-03-14 | 日本特殊陶業株式会社 | Method for manufacturing wiring board and conductive paste |
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