JPH065725B2 - Contact type image sensor - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a contact-type image sensor for image reading of a fax machine.

[Background of the Invention]

A conventional contact image sensor for image reading by Faximili is, for example, “Nikkei Electronics” April 1982 2
As shown in P.149 of the 6th issue, it has an integral structure in the main scanning direction, and therefore has a function of forming an image sensor with various reading line lengths by dividing it. Absent. For this reason, the sensor substrate, which has defective parts such as defective characteristics of the photoelectric conversion element and disconnection or short circuit of the wiring pattern, becomes totally unusable, and there is a problem that productivity is lowered due to yield and cost is increased. It was

[Object of the Invention]

The present invention solves the above-mentioned problems of the prior art, divides the sensor substrate having defective parts such as defective characteristics of the photoelectric conversion element and disconnection or short circuit of the wiring pattern, and various read line lengths can be obtained by combining only good products. An object is to provide a contact-type image sensor that can be configured and can improve productivity by improving yield and reduce cost.

[Outline of Invention]

The present invention sequentially arranges, on a substrate made of a non-flexible material, sensor units each including a photoelectric conversion element, a wiring pattern, and a drive circuit component along the longitudinal direction, and each sensor on the substrate is arranged. A space for cutting and dividing the substrate of the defective sensor part is provided between the parts, and the space is necessary for cutting and polishing the substrate of the defective sensor part between the wiring patterns of the sensor part and the adjacent sensor part. It is characterized by having various dimensions. This allows
If there is a defective part in the board, it can be cut / divided and the good parts of the divided boards can be combined with the good parts obtained from other sensors to make various reading line lengths, and the yield can be improved. It is an improved contact image sensor.

Example of Invention

An embodiment of the present invention will be described below with reference to FIG. First
FIG. 1 is a plan view showing an embodiment of a direct drive type contact image sensor according to the present invention.

In FIG. 1, 1 is a photoelectric conversion element (column), 2 is a wiring pattern, 3 is a substrate, and 4 is a driver IC. This contact-type image sensor has a driver IC on a glass or ceramic substrate 3 on which a photoelectric conversion element (column) 1 such as an amorphous silicon film and a large number of wiring patterns (columns) 2 are formed.
4 is installed. With this configuration, according to the present invention, between the photoelectric conversion elements and the photoelectric conversion elements at the cutting points 7 to 15 can be cut as needed to divide the substrate 3, so that the wiring patterns 5 and 6 adjacent to the cutting points are provided. A pattern is formed with a distance l required for cutting and polishing. The space consisting of this dimension 1 is the size required for cutting and polishing the substrate 3. In this way, when there is a defective portion such as a characteristic defect of the photoelectric conversion element 1 or a disconnection or a short circuit of the wiring pattern 2 in a part of the contact image sensor, the cutting portion 7
By cutting / dividing any one of ~ 15, removing the defective part, and joining only the normal part as necessary, alone or in multiples, or by joining with the normal part of other sensor obtained beforehand, It is possible to form a contact type image sensor having a reading line length of, and the yield can be improved.

With such a structure, for example, when there is some defect in the portion of the substrate 3 on which the driver IC 4e is mounted, the cutting points 11 and 12 are cut and divided, and the portion between them is removed to cut the normal portion. By polishing the surfaces of the points 11 and 12 and joining them, a contact type image sensor having a size corresponding to the reading line length of 7 blocks of the driver IC 4 can be constructed. Further, by cutting the cut portion 7 or 15 of the non-defective sensor and joining it with another non-defective sensor obtained in advance, it is possible to obtain a contact type image sensor having a larger reading line length. In the present embodiment, the maximum number of driver ICs can be divided into eight, and the same effect can be expected. Furthermore, the substrate 3 is made of a non-flexible material such as glass or ceramic,
Since only the sensor portion including the photoelectric conversion element 1, the wiring pattern 2, and the driver IC 4 is provided on the substrate 3 along the longitudinal direction of the substrate, the number of steps may be increased or the order of steps may be changed. In addition, since the sensor unit may be inspected after each sensor unit is formed, only one inspection is required. Therefore, since the conventional efficient formation and inspection of the sensor portion can be utilized, the sensor portion can be easily formed.

A space having a dimension 1 consisting of a dimension required to cut the substrate 3 and a dimension required to polish the substrate 3 between the wiring patterns of the sensor portion on the substrate 3 and the sensor portion adjacent thereto. Therefore, even if cutting and polishing are performed to remove a defective sensor section, the wiring pattern of the adjacent normal portion is not broken, and therefore, the adjacent sensor section is not likely to be damaged.

〔The invention's effect〕

As described above, according to the present invention, a space having a size required for cutting and polishing the substrate is provided between each wiring pattern between the sensor units arranged on the substrate made of the non-flexible material. With this configuration, only the defective sensor portion can be removed, and the adjacent sensor portions are not damaged. Therefore, defective portions can be removed in drive circuit unit units, resulting in high yield of the contact image sensor. It is possible to expect productivity improvement and cost reduction because it can be secured, and there is an effect that various reading line lengths can be configured. Moreover, by simply providing the sensor section on the substrate, the conventional efficient sensor section can be obtained. Can be formed and inspected, and there is also an effect that the sensor portion can be easily formed.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a contact type image sensor according to the present invention. 1 ... Photoelectric conversion element (row) 2 ... Wiring pattern 3 ... Substrate 4 ... Driver IC 5,6 ... Wiring pattern (adjacent to cutting point) 7 to 15 ... Cutting point l ... Dimensions required for cutting / polishing

Claims (1)

[Claims] 1. A contact type image sensor in which a photoelectric conversion element, a wiring pattern and a drive circuit component are provided on a substrate, and the substrate is formed of a non-flexible material into a strip shape, and the non-flexible material is used. A sensor unit including a photoelectric conversion element, a wiring pattern, and a driving circuit component is sequentially arranged on the substrate in the longitudinal direction, and a substrate of a defective sensor unit is provided between the respective sensor units on the substrate. A space for cutting and dividing is provided, and the space has a dimension required for cutting and polishing the substrate between each wiring pattern of the sensor section and the sensor section adjacent to the sensor section. Image sensor.