JPH0657395A - Corrosion preventing method for product forming hot-melt-spray coating film - Google Patents
Corrosion preventing method for product forming hot-melt-spray coating filmInfo
- Publication number
- JPH0657395A JPH0657395A JP21440292A JP21440292A JPH0657395A JP H0657395 A JPH0657395 A JP H0657395A JP 21440292 A JP21440292 A JP 21440292A JP 21440292 A JP21440292 A JP 21440292A JP H0657395 A JPH0657395 A JP H0657395A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- etching
- underlayer
- electrolytic
- thermal spray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Coating By Spraying Or Casting (AREA)
Abstract
(57)【要約】
【目的】 メッキ下地層の形成によって表面凹凸が消滅
することによる溶射皮膜との密着性低下を有効に防止す
るための手段を見出すこと。
【構成】 溶射基材に耐食性金属のメッキによる下地層
を施したのち、この下地層表面にエッチング処理による
凹凸面を形成することにより、この凹凸面に施される溶
射粒子との接合性が極めて良好となる。溶射基材が鉄材
の場合、耐食性金属としてはＮｉ、Ｃｒあるいはこれら
の合金等が好適に使用できる。メッキ方法としては、電
解法あるいは無電解法のいずれでもよいが、所定の膜厚
を任意に短時間で形成し易いという点から電解法が好ま
しい。メッキ面への凹凸の形成のためのエッチングとし
ては、酸浸漬法あるいは電解エッチング法のいずれでも
よいが、クロムメッキ処理後、メッキ液に浸漬したまま
でエッチング可能な電解エッチング法が簡便に目的を達
成できる。(57) [Abstract] [Purpose] To find a means for effectively preventing a decrease in adhesion to a thermal spray coating due to the disappearance of surface irregularities due to the formation of a plating underlayer. [Structure] By forming an underlayer by plating a corrosion-resistant metal on a thermal spray base material and then forming an uneven surface by an etching treatment on the surface of this underlayer, the bondability with the spray particles applied to the uneven surface is extremely improved. It will be good. When the thermal spray base material is an iron material, Ni, Cr or alloys thereof can be preferably used as the corrosion resistant metal. The plating method may be either an electrolytic method or an electroless method, but the electrolytic method is preferable from the viewpoint that a predetermined film thickness can be easily formed in an arbitrary short time. The etching for forming the unevenness on the plated surface may be either an acid immersion method or an electrolytic etching method, but after the chrome plating treatment, an electrolytic etching method capable of etching while being immersed in the plating solution is simply aimed. Can be achieved.
Description
【０００１】[0001]
【産業上の技術分野】本発明は、例えば、溶射皮膜を設
けた印刷用ローラのように、溶射皮膜を有する製品の耐
食性向上技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for improving the corrosion resistance of a product having a thermal spray coating, such as a printing roller provided with the thermal spray coating.
【０００２】[0002]
【従来の技術】従来から、基材あるいは溶射皮膜の表面
状態を改善するとともに、使用雰囲気による腐食を防止
するために、溶射皮膜に必然的に存在する気孔を閉塞す
ることが行われている。その手段としては、合成樹脂、
水ガラス等を浸透させる封孔処理などがある。2. Description of the Related Art Conventionally, in order to improve the surface condition of a base material or a thermal spray coating, and to prevent corrosion due to the atmosphere in which it is used, pores that are inevitably present in the thermal spray coating have been closed. As the means, synthetic resin,
There is a sealing treatment for permeating water glass or the like.
【０００３】しかしながら、かかる封孔処理は基本的に
は溶射皮膜の表面気孔を閉塞するのみで、溶射基材に到
るまでの封孔は困難であって、使用中の皮膜表面の摩耗
等によって封孔状態が破壊され、腐食雰囲気が基材にま
で浸透して、基材の腐食を引き起し、製品そのものの耐
用性を低下している。However, such a sealing treatment basically only closes the surface pores of the sprayed coating, and it is difficult to seal up to the sprayed base material, and due to abrasion of the coating surface during use or the like. The sealed state is destroyed, and the corrosive atmosphere penetrates into the base material, causing the base material to corrode and reducing the durability of the product itself.
【０００４】また、基材への溶射処理を施すに当たっ
て、特公昭５６−１９７８号公報、特公昭５３−４０５
６７号公報に開示された、溶射材と基材との接合性を改
善するために基材上に溶射下地層をメッキによって形成
する方法がある。そして、このメッキ下地層が結果的に
基材の耐食性を向上している場合がある。このメッキに
よる下地層に積極的に耐食機能を持たせるためには相当
の厚みのメッキ層を形成する必要がある。Further, in performing thermal spraying treatment on a substrate, Japanese Patent Publication No. 56-1978 and Japanese Patent Publication No. 53-405.
There is a method disclosed in Japanese Patent Publication No. 67, in which a thermal spraying base layer is formed on a base material by plating in order to improve the bondability between the thermal spray material and the base material. In some cases, this plating underlayer eventually improves the corrosion resistance of the base material. It is necessary to form a plating layer having a considerable thickness in order to positively impart the corrosion resistance function to the underlayer formed by this plating.
【０００５】しかしながら、このメッキ下地層を厚く形
成することは、溶射皮膜との密着性を向上するための事
前処理、たとえばブラストにより基材上に形成した凹凸
の効果を低下させ、溶射皮膜の基材への接合性を低下さ
せるという新たな問題を生じることになる。However, the formation of a thick plating underlayer reduces the effect of pre-treatment for improving the adhesion to the thermal spray coating, for example, the ruggedness formed on the substrate by blasting, and the base of the thermal spray coating. This causes a new problem of lowering the bondability to the material.
【０００６】また、溶射材との接合性を維持するために
メッキ後、メッキ層表面に凹凸面を形成するためにブラ
スト処理を行うためには、ブラスト処理によるメッキ層
の破壊を防止するために、必要以上のメッキ層の形成を
必要するという問題が生じる。Further, in order to prevent the destruction of the plating layer due to the blast treatment, in order to perform the blast treatment for forming the uneven surface on the surface of the plating layer after the plating in order to maintain the bondability with the thermal spray material. However, there arises a problem that it is necessary to form more plating layers than necessary.
【０００７】[0007]
【発明が解決しようとする課題】本発明の目的は、メッ
キ下地層の形成による溶射皮膜を有する基材の耐食性を
向上するに当たって、メッキ下地層の形成によって表面
凹凸が消滅することによる溶射皮膜との密着性低下を有
効に防止するための手段を見出すことにある。SUMMARY OF THE INVENTION An object of the present invention is to improve the corrosion resistance of a base material having a sprayed coating by forming a plating underlayer, and to form a sprayed coating by eliminating surface irregularities due to the formation of the plating underlayer. The purpose is to find a means for effectively preventing the deterioration of the adhesiveness.
【０００８】[0008]
【課題を解決するための手段】本発明は、溶射基材に耐
食性金属のメッキによる下地層を施したのち、この下地
層表面にエッチング処理による凹凸面を形成し、その下
地層の上に溶射皮膜を形成することによってその目的を
達成した。According to the present invention, a thermal sprayed substrate is provided with an underlayer by plating with a corrosion-resistant metal, and then an uneven surface is formed by etching on the surface of the underlayer, and the thermal spraying is performed on the underlayer. The purpose was achieved by forming a film.
【０００９】溶射基材が鉄材の場合、耐食性金属とし
て、Ｎｉ、Ｃｒあるいはこれらの合金等が一般の腐食雰
囲気中においても変質しにくく、溶射時に密着性の不良
を起こしにくい点から好適に使用できる。When the thermal spraying base material is an iron material, Ni, Cr or alloys thereof, etc., which are corrosion-resistant metals, are not easily deteriorated even in a general corrosive atmosphere, and can be suitably used because they are unlikely to cause poor adhesion during thermal spraying. .
【００１０】また、メッキ方法としては、電解法あるい
は無電解法のいずれでもよいが、所定の膜厚を任意に短
時間で形成し易いという点から電解法を、また、最も一
般的に工業化されているという点から、Ｃｒメッキ法を
採用して、７０μｍ程度の厚みに形成することが望まし
い。The plating method may be either an electrolytic method or an electroless method, but the electrolytic method is the most commonly industrialized one because it is easy to form a predetermined film thickness in an arbitrary short time. In view of this, it is desirable to adopt the Cr plating method to form a film having a thickness of about 70 μm.
【００１１】さらに、メッキ面への凹凸の形成のための
エッチングとしては、酸浸漬法あるいは電解エッチング
法のいずれでもよいが、クロムメッキ処理後、メッキ液
に浸漬したままでエッチング可能な電解エッチング法が
簡便に目的を達成できる。Further, the etching for forming irregularities on the plating surface may be either an acid immersion method or an electrolytic etching method, but after the chrome plating treatment, an electrolytic etching method capable of etching while being immersed in the plating solution However, the purpose can be easily achieved.
【００１２】また、エッチング時間を長くとり過ぎる
と、メッキ厚みを越えて素地まで達し、耐食性を害する
こととなるので、メッキ厚さに応じた適正な電流値と電
解時間を設定することが重要である。Further, if the etching time is too long, it will reach the substrate beyond the plating thickness and impair the corrosion resistance. Therefore, it is important to set an appropriate current value and electrolysis time according to the plating thickness. is there.
【００１３】[0013]
【作用】メッキ層のエッチング処理により形成された凹
凸面は、その凹凸面に施される溶射粒子との接合性が極
めて良好で、この凹凸面形成のためのエッチングは、メ
ッキ厚みを越えて基材にまで及ぶことはない。[Function] The uneven surface formed by the etching treatment of the plating layer has a very good bondability with the spray particles applied to the uneven surface, and the etching for forming the uneven surface exceeds the plating thickness. It does not extend to wood.
【００１４】[0014]
【実施例】以下に、本発明を印刷用ローラにセラミック
ス溶射皮膜を施すための下地層形成に適用した例につい
て説明する。EXAMPLE An example in which the present invention is applied to the formation of a base layer for applying a ceramic sprayed coating to a printing roller will be described below.
【００１５】まず、以下の条件により、試料を作成し密
着力試験を実施した。First, a sample was prepared under the following conditions and an adhesion test was conducted.
【００１６】（１）試験片材質・寸法： ＳＳ４１ 直
径２５．４ｍｍ 長さ４０ｍｍ （２）メッキ及び溶射皮膜施工面： 横断面（直径２
５．４ｍｍ） （３）メッキ皮膜施工条件： 表１に示す （４）溶射施工条件 溶射法：プラズマ溶射 皮膜厚：ボンド溶射（メタル溶射） Ｎｉ−Ｃｒ×１５
０μｍ トップ溶射（セラミック溶射） Ａｌ2 Ｏ3 ×２００μ
ｍ これを接着剤（エポキシ系二液性）にて接合した丸棒試
験片で引張試験を行った結果を表１に示す。(1) Material and dimensions of test piece: SS41 Diameter 25.4 mm Length 40 mm (2) Plating and spray coating surface: Cross section (diameter 2
5.4 mm) (3) Plating coating application conditions: shown in Table 1 (4) Thermal spraying application conditions Thermal spraying method: Plasma thermal spraying Coating thickness: Bond thermal spraying (metal thermal spraying) Ni-Cr x 15
0μm Top spraying (ceramic spraying) Al 2 O 3 × 200μ
m Table 1 shows the results of a tensile test conducted on a round bar test piece bonded with an adhesive (epoxy two-component).
【００１７】つぎに、溶射皮膜に剥離の生じなかった条
件について同様の条件にて実ローラに施工を実施し、３
％ＮａＣｌ（４０℃）に浸漬し耐食性の評価を実施し
た。この結果もあわせて表１に示す。Next, the actual roller was applied under the same conditions as described above under the condition that the thermal spray coating did not peel off.
It was dipped in NaCl (40 ° C.) to evaluate the corrosion resistance. The results are also shown in Table 1.
【００１８】また、上記（４）の皮膜構成のうち、ボン
ド溶射（メタル溶射）を省略し、トップ溶射（セラミッ
ク溶射）Ａｌ2 Ｏ3 ×３００μｍのみ実施した試料をＮ
ｏ．１１として追加した。In the coating composition of the above (4), the bond spraying (metal spraying) was omitted, and the top spraying (ceramic spraying) of Al 2 O 3 × 300 μm was performed on the sample N.
o. Added as 11.
【００１９】[0019]
【表１】 ブラスト処理後メッキを実施した場合は、溶射の密着性
に必要な凹凸がメッキにより消去され、必要な密着性を
得られない。密着性を確保するためには、メッキ厚さは
５μｍ以下が好ましいが、耐食性が確保できない。[Table 1] When plating is performed after the blast treatment, the unevenness necessary for the adhesiveness of thermal spraying is erased by the plating, and the required adhesiveness cannot be obtained. In order to secure the adhesion, the plating thickness is preferably 5 μm or less, but the corrosion resistance cannot be secured.
【００２０】メッキ処理後ブラスト処理を実施すると密
着力は確保できるが、ブラストによりメッキ層が破壊さ
れ、耐食性に劣る。耐食性を確保するためには、少なく
とも１５０μｍ程度以上の膜厚が必要とされ、不経済で
ある。If a blast treatment is performed after the plating treatment, the adhesion can be secured, but the blast destroys the plating layer, resulting in poor corrosion resistance. In order to secure the corrosion resistance, a film thickness of at least about 150 μm or more is required, which is uneconomical.
【００２１】メッキ後電解エッチングを施したものは、
密着性及び耐食性とも良好であるが、メッキ自体の貫通
部を防止するために少なくとも２０μｍ程度以上の膜厚
が必要と推定できる。Those plated with electrolytic etching are:
It has good adhesion and corrosion resistance, but it can be estimated that a film thickness of at least about 20 μm or more is necessary to prevent the penetration portion of the plating itself.
【００２２】また、このケースにおいて、ボンド溶射を
省略しても、充分な密着力と耐食性が確保可能であるこ
とも確認した。It was also confirmed that, in this case, sufficient adhesion and corrosion resistance could be secured even if bond spraying was omitted.
【００２３】[0023]
【発明の効果】本発明によって以下の効果を奏する。The present invention has the following effects.
【００２４】（１）溶射皮膜を形成した製品の耐食性が
格段に改善される。(1) The corrosion resistance of a product having a sprayed coating is remarkably improved.
【００２５】（２）電解エッチング法によって、耐食性
に必要なメッキ厚さを任意に選定でき、しかも、充分な
密着力を確保できる。(2) By the electrolytic etching method, the plating thickness required for corrosion resistance can be arbitrarily selected and sufficient adhesion can be secured.
【００２６】（３）腐食雰囲気において使用される溶射
皮膜製品の素材は、本方法を採用することにより、安価
な鋼材にてまかなうことが可能となり、経済性に優れ
る。(3) By using this method, the material of the thermal spray coating product used in a corrosive atmosphere can be covered by an inexpensive steel material, which is excellent in economic efficiency.
【００２７】（３）溶射の下地処理のブラスト処理が不
要となる。(3) The blast treatment of the thermal spraying base treatment is unnecessary.
【００２８】（４）耐食性及び密着性を向上させる目的
で通常セラミック溶射の下地として溶射するボンド溶射
を省略しても実用上問題がない。(4) For the purpose of improving corrosion resistance and adhesion, there is no practical problem even if the bond spraying which is usually sprayed as a base of ceramic spraying is omitted.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 杉崎 孝継 東京都千代田区大手町二丁目６番３号 新 日本製鐵株式会社内 (72)発明者 大塚 登 大阪府豊中市新千里南町２−22−11 (72)発明者 大坪 文明 兵庫県姫路市大津区恵美酒町２−83 ─────────────────────────────────────────────────── --- Continuation of the front page (72) Inventor Takatsugu Sugisaki 2-6-3 Otemachi, Chiyoda-ku, Tokyo Within Nippon Steel Corporation (72) Inventor Noboru Otsuka 2-22 Shinsenri-cho, Toyonaka City, Osaka Prefecture −11 (72) Inventor Bunmei Otsubo 2-83 Emi-Sho, Otsu-ku, Himeji City, Hyogo Prefecture
Claims (1)
地層を施したのち、この下地層表面にエッチング処理に
よる凹凸面を形成し、その下地層の上に溶射皮膜を形成
することを特徴とする溶射皮膜を形成した製品の腐食防
止方法。1. A thermal sprayed base material is provided with an underlayer by plating with a corrosion-resistant metal, and then an uneven surface is formed on the surface of this underlayer by etching, and a thermal spray coating is formed on the underlayer. Corrosion prevention method for products with thermal spray coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21440292A JPH0657395A (en) | 1992-08-11 | 1992-08-11 | Corrosion preventing method for product forming hot-melt-spray coating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21440292A JPH0657395A (en) | 1992-08-11 | 1992-08-11 | Corrosion preventing method for product forming hot-melt-spray coating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0657395A true JPH0657395A (en) | 1994-03-01 |
Family
ID=16655202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21440292A Withdrawn JPH0657395A (en) | 1992-08-11 | 1992-08-11 | Corrosion preventing method for product forming hot-melt-spray coating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0657395A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100683271B1 (en) * | 2004-12-18 | 2007-02-20 | 김경민 | Solar electric car toys |
-
1992
- 1992-08-11 JP JP21440292A patent/JPH0657395A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100683271B1 (en) * | 2004-12-18 | 2007-02-20 | 김경민 | Solar electric car toys |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991102 |