JPH0658729B2 - Method of manufacturing thin film magnetic head - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a method for manufacturing a thin film magnetic head suitable for use in a magnetic disk device. The thin film magnetic head used in the apparatus is constructed so as to float on the surface of the rotated magnetic disk with a minute gap so that recording / reproducing can be performed on the magnetic disk. Further, in order to perform recording / reproducing accurately, it is necessary to have desired electric characteristics and magnetic characteristics.

Therefore, in the conventional thin film magnetic head, as shown in FIG. 7, the conductor coil 3 having a predetermined pattern is laminated on the gear tape material 2 laminated on the lower magnetic film 1, and the conductor coil 3 is formed on the gear tape material 2. An insulating film 4 that covers the coil 3 is laminated. A tapered surface 5 is formed around the insulating film 4 by etching, and when the upper magnetic film 6 is laminated on the insulating film 4 and the gear material 2, the upper magnetic film 6 is also formed on the tapered surface 5. By connecting the portion of the upper magnetic film 6 located on the insulating film 4 and the portion of the upper magnetic film 6 located on the insulating film 4, a desired magnetic circuit is formed to improve the electrical characteristics. . The insulating film 4 electrically insulates the conductor coil 3 and the upper magnetic film 6 from each other, and is made of an organic resin having a good film forming property on the conductor coil 3.

By the way, when an insulating film made of an organic resin is used, the angle of the tapered surface of the insulating film greatly affects the electrical characteristics of the magnetic head, and therefore it is necessary to keep the angle constant.

However, in the above-described conventional example, when the tapered surface of the insulating film 4 is formed by etching, the angle of the tapered surface cannot be formed constant, and the angle of each tapered surface varies during mass production. It was happening.

Japanese Unexamined Patent Publication (Kokai) No. 58-111116 discloses that an interlayer insulating layer made of an organic resin is deposited on an interlayer insulating layer made of an inorganic insulating material, but does not disclose a tapered surface of the organic resin.

[Object of the Invention]

In view of the above circumstances, an object of the present invention is to use an organic resin insulating film, to easily and reliably hold down the angle of the taper surface, and to easily obtain a desired angle. Accordingly, it is an object of the present invention to provide a method of manufacturing a thin film magnetic head capable of improving electric characteristics.

[Outline of Invention]

As a result of various experiments and examinations, the present inventor has noticed that when the time (or temperature) when the organic resin insulating material is thermoset is increased, the etching at the time of etching is delayed, and the organic resin The insulating material is laminated in at least two layers in sequence, and when the upper insulating material is thermally cured, the lower insulating material is thermally cured again by that amount of time. Make a difference. And
When the etching process is performed, the etching rate of the lower layer insulating material becomes slower than that of the upper layer insulating material, so that the tapered surface is gradually expanded as the upper layer insulating material progresses to the lower layer insulating material.

Example of Invention

An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.

In the method of manufacturing a thin film magnetic head, as shown in FIG. 1, a gap material 12 is laminated on a lower magnetic film 11 forming a lower core by sputtering, vapor deposition or the like. The gear material 12 is made of, for example, silicon oxide or aluminum oxide. The lower magnetic film 11 is made of permalloy, ferrite, or the like, and has a lower surface on which a base film 13 made of an insulating material is formed.
Substrate 14 is laminated via.

Further, as shown in FIG.
The insulating gap 16 is formed, and the conductor coil 15 is laminated on the first insulating film 16. The first insulating film 16 is made of a polyimide-based organic resin so that the conductor coil 15 and the magnetic film 11 can be electrically insulated together with the gear material 12. The conductor coil 15 has a predetermined pattern, is formed by sputtering, vapor deposition, or the like, and is made of, for example, copper, silver, or the like.

Further, the second and third insulating films 17 and 18 are sequentially laminated on the first insulating film 15 to cover the conductor coil 15 as shown in FIG. Is formed.

The second and third insulating films 17 and 18 are respectively the first insulating film.
Similar to 16, it is made of polyimide-based organic resin, and is formed by applying a spin coat method to an appropriate thickness and then thermosetting at a predetermined temperature and time (300 ° C x 1h). Are sequentially stacked. Therefore, when the second insulating film 17 is thermally cured, the first insulating film 16 is again thermally cured for the thermal curing time, and the third insulating film 17 is also thermally cured.
When 18 is heat-cured, the second insulating film for the heat-curing time
Since the first insulating film 16 is further thermally cured at the same time that the first insulating film 16 is thermally cured again, the relationship of the respective thermal histories is that the third insulating film 18 <the second insulating film 17 <second 1 insulating film
16

Thereafter, an etching resist 20 is laminated on the third insulating film 18 of the flat plate-like laminate 19 at a position above the conductor coil 15 as shown in FIG. As the resist 20, in the illustrated example, a negative photoresist is used for the photo-etching treatment, and the negative photoresist is applied on the flat plate-like laminate 19 by a spin coating method and prebaked, and then exposed. It is developed and formed into a desired pattern.

Next, the flat plate-shaped laminate 19 having the resist 20 is post-baked and then subjected to etching treatment. As the etching treatment, for example, an etching liquid obtained by mixing 7 volumes of hydrazine hydrate and 3 volumes of ethylenediamine is used at a temperature of 35 ° C.
The temperature of the plate-like laminated body 19 is adjusted to 15 with this etching liquid.
Min soaked.

When the etching process is performed in this manner, the etching liquid permeates the resist 20 and the third, second and first insulating films 18, 17,
Corrodes 16 but at that time, the heat history is
Since the insulating film 18 <the second insulating film 17 <the first insulating film 16 has the relationship of etching rates, the third insulating film 18> the second insulating film 17> the first insulating film It becomes the film 16. That is, the erosion of the third insulating film 18 is the fastest, and the erosion of the second and first insulating films 17 and 16 is gradually delayed.
As shown in FIG. 5, a tapered surface 30 is formed on the peripheral portion of the resist 20 of the first to third insulating films 16-18. This taper surface
30 has a shape that is gradually expanded from the upper layer to the lower layer, and is formed by changing the film thickness and thermal history of the first to third insulating films 16 to 18 and the film thickness of the resist 20. Therefore, it is selected at an arbitrary angle.

Then, after the tapered surface 30 is formed by the etching process, the resist 20 is peeled off from the third insulating film 18, and thereafter, as shown in FIG. The upper magnetic film 21 so as to cover the third insulating film 18.
Is laminated, and the protective film 22 is laminated on the upper magnetic film 21 to form a thin film magnetic head. The upper magnetic film 21 forms an upper core and is made of permalloy, ferrite, or the like, like the lower magnetic film 11.

According to the method of the present invention, as described above, when the respective insulating films 16 to 18 are sequentially laminated and subjected to the etching treatment, the respective insulating films 16 to 18 are
Since the etching rate changes depending on 18,
The tapered surface 30 provided on the periphery of the insulating films 16 to 18 can be uniformly formed.

Therefore, as compared with the conventional example in which the insulating film 4 of the organic resin is further provided, the tapered surface 30 can be formed smoothly and the tapered surface 30 can be prevented from being varied during mass production. Moreover, since the taper surface 30 can be selected at various angles depending on the insulating film thickness, thermal history, etc., a desired angle can be easily obtained.

Further, in the illustrated embodiment, the conductor coil 15 is provided in the first insulation gap 16, so that the conductor coil 15 and the lower magnetic film 11 can be reliably electrically connected by both the first insulation film 16 and the gear material 12. Since the conductor coil 15 can be insulated, and the conductor coil 15 is sandwiched by the first insulating film 16 and the second insulating film 17 laminated on the first insulating film 16, both the insulating films 16 and 17 cover the conductor coil 15. You can enhance your sexuality so much.

In the illustrated embodiment, the conductor coil 15 is provided between the first insulating film 16 and the second insulating film 17 as described above, but the method of the present invention is not limited thereto. Not a thing. That is, in the method of the present invention, contrary to the effect of the above-mentioned embodiment, the first insulating film 16 is not necessary if the thickness of the gear member is such that the material can be reliably electrically insulated. The above effect can be achieved by sequentially stacking at least two insulating films to cover the insulating films.

〔The invention's effect〕

As described above, according to the method of the present invention, the conductor coil is laminated on the gap material laminated on the lower magnetic film, and the insulating film made of an organic resin covering the conductor coil is formed on at least two layers on the gear material. Separately and sequentially laminated to form a flat plate-like laminated body, a resist is applied on the upper layer insulating film of the flat plate-like laminated body at a position above the conductor coil, and the flat plate-like laminated body is subjected to etching treatment to form an upper layer and Since the tapered surface corresponding to the etching rate is formed around the resist of the lower insulating film, the angle of the tapered surface can be easily and surely kept constant and the desired angle can be easily formed. In addition, since the insulating films of the same material, which are sequentially stacked, are simply etched in a batch, the resist forming conditions and etching processing contents are not complicated. Therefore, according to the method of the present invention, it is possible to surely and easily improve the electric characteristics, and it is possible to sufficiently utilize the good characteristics of the organic resin insulating film.

[Brief description of drawings]

1 to 6 show an embodiment embodying the method for manufacturing a thin film magnetic head of the present invention. FIG. 1 is a sectional view showing a laminated state of a gear material, and FIG. 2 is a laminated state of a conductor coil. FIG. 3 is a cross-sectional view showing a flat plate-shaped laminated body, FIG.
FIG. 7 is a sectional view showing a laminated state of resist, FIG. 5 is a sectional view showing a state where a tapered surface is formed by etching, FIG. 6 is a sectional view showing a thin film magnetic head, and FIG. FIG. 3 is a cross-sectional view showing a configuration example of a thin film magnetic head. 11 …… Lower magnetic film, 12 …… Gear material, 15 …… Conductor coil, 16 …… First insulating film, 17 …… Second insulating film, 18 ……
Third insulating film.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenji Sugimoto 2880 Kunizu, Odawara-shi, Kanagawa Stock company Hitachi Ltd. Odawara factory (72) Inventor Shunichiro Hozuka, 2880 Kunizu, Odawara, Kanagawa Hitachi Odawara In the factory (56) References JP-A-59-165220 (JP, A) JP-A-58-108019 (JP, A)

Claims (1)

[Claims] 1. A conductor coil is laminated in a predetermined pattern on a gap material film laminated on a lower magnetic film, and an insulating film made of an organic resin for covering the conductor coil is divided into at least two layers on the gear material film. Sequentially laminating to form a flat plate-like laminated body, and then a resist is applied to the upper layer insulating film of the flat plate-like laminated body at a position above the conductor coil to etch the flat plate-like laminated body to insulate the upper and lower layers. A method of manufacturing a thin film magnetic head, characterized in that a tapered surface is formed in the peripheral portion of a resist material of the film according to a difference in etching rate between an upper insulating film and a lower insulating film.